先进半导体基板市场：未来预测（2025-2030）

预计2025-2030年预测期内全球半导体先进基板市场将以8.65%的复合年增长率成长。

印刷基板（PCB）和半导体晶片透过先进的半导体基板连接，该基板充当基板。它具有出色的散热性、成本效益、坚固、轻巧且节能。此外，它还提高了 PCB 的功能性和尺寸控制，减少了 PCB 的整体重量，并提供了卓越的可靠性和出色的电气品质。因此，它现在被广泛用于製造具有现代功能的小型电器。

市场趋势：

• 半导体产业对小型化的需求不断增长：半导体先进基板市场受到快速技术进步推动，小型化趋势日益增强。这些技术创新使得将多种功能整合到单一平台上以满足广泛的应用成为可能。运算、网路、通讯和消费性电子产品的扩展推动了对小型、可靠半导体元件的需求。
• 此外，便携式电子设备需要更小、更薄的封装解决方案，以节省空间并降低成本。改善电气性能以最大限度地减少噪音干扰对于航太和家用电子电器等领域的高度整合、高速应用尤为重要。
• 物联网设备製造应用的不断增长：全球消费和工业领域物联网应用的激增正在推动对专用晶片组的需求。供应商正在开发用于物联网应用的专用晶片组，主要参与者包括 Altea、华为、英特尔、高通、三星和 Sierra。随着物联网设备数量的不断增长，物联网开发所使用的晶片的需求预计也将大幅增加。随着晶片的小型化，降低能耗的创新将成为製造商关注的重点，进一步推动半导体先进基板市场的成长。
• 按地区分類的市场：半导体先进基板市场细分为美洲、欧洲、中东和非洲以及亚太地区。预计亚太地区将在预测期内占据市场主导地位，其中台湾凭藉其众多製造商和对半导体行业的大量投资将发挥关键作用。日月光集团、欣兴电子、景硕等主要製造商的总部均设在台湾，生产力高。台湾的积体电路产业拥有从上游设计到下游IDM、IC封装和测试的完整供应链，并由熟练的劳动力支撑。台湾也正在推动5G基础建设。例如，中华电信宣布加速部署5G基地台，目标是实现全国96%的人口覆盖率。

本报告涉及的主要参与者包括日月光集团、富士通有限公司、IBIDEN电株式会社、景硕互联股份有限公司、景硕互联科技有限公司、韩国电路株式会社、京瓷株式会社、LG Innotek 株式会社、南亚 PCB 科技有限公司、TTM 科技有限公司。

本报告的主要优点

• 深刻分析：获得涵盖主要地区和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、垂直行业和其他子区隔。
• 竞争格局：了解全球主要企业所采用的策略策略，并了解正确策略带来的潜在市场渗透。
• 市场驱动因素和未来趋势：探索动态因素和关键市场趋势以及它们将如何影响市场的未来发展。
• 可行的建议：利用洞察力进行策略决策，在动态环境中开闢新的业务流和收益。
• 适用范围广：对于新兴企业、研究机构、顾问公司、中小企业和大型企业来说，它都是实用且具有成本效益的。

它有什么用途？

产业与市场洞察、商业机会评估、产品需求预测、打入市场策略、地理扩张、资本支出决策、法律规范与影响、新产品开发、竞争影响

分析范围

• 历史资料（2022-2024）和预测资料（2025-2030）
• 成长机会、挑战、供应链前景、法规结构、顾客行为、趋势分析
• 竞争对手定位、策略和市场占有率分析
• 按部门和地区（国家）分類的收益成长和预测分析
• 公司概况（策略、产品、财务资讯、主要趋势等）

半导体先进基板市场分析涵盖以下几个部分：

按类型

• 先进IC基板
• FC BGA
• FC CSP
• SLP (Substrate-like PCB)
• 嵌入式晶粒

按包装类型

• SiP (System in Package)
• QFP (Quad Flat Package)
• BG (Ball Grid Array)
• CSP (Chip Scale Packaging)
• 其他的

按应用

• 家电
• 汽车和运输机械
• 资讯科技/通讯
• 其他的

按地区

• 美洲
• 美国
• 欧洲、中东和非洲
• 德国
• 荷兰
• 其他的
• 亚太地区
• 中国
• 日本
• 台湾
• 韩国
• 其他的

目录

第一章 引言

• 市场概览
• 市场定义
• 分析范围
• 市场区隔
• 货币
• 先决条件
• 基准年和预测年时间表
• 相关人员的主要利益

第二章分析方法

• 分析设计
• 分析过程

第三章执行摘要

• 主要发现
• 分析师观点

第四章 市场动态

• 市场驱动因素
• 市场限制
• 波特五力分析
• 产业价值链分析

第五章半导体先进基板市场（按类型）

• 介绍
• 先进IC基板
  • FC BGA
  • FC CSP
• SLP (Substrate-like-PCB)
• 嵌入式晶粒

第六章 半导体先进基板市场（依封装类型）

• 介绍
• SiP (System in Package)
• QFP (Quad Flat Package)
• BG (Ball Grid Array)
• CSP (Chip Scale Packaging)
• 其他的

第七章半导体先进基板市场（依应用）

• 介绍
• 家电
• 汽车和运输机械
• 资讯科技/通讯
• 其他的

第八章半导体先进基板市场（按区域）

• 世界概况
• 美洲
  • 美国
• 欧洲、中东和非洲
  • 德国
  • 荷兰
  • 其他的
• 亚太地区
  • 中国
  • 日本
  • 台湾
  • 韩国
  • 其他的

第九章竞争格局及分析

• 主要企业和策略分析
• 市场占有率分析
• 企业合併、协议、商业合作
• 竞争仪錶板

第十章 公司简介

• ASE Group
• Fujitsu Limited
• Ibiden Co. Ltd.
• Kinsus Interconnect Technology Corp.
• Korea Circuit Co. Ltd.
• KYOCERA Corporation
• LG Innotek Co. Ltd.
• Nan Ya PCB Co. Ltd.
• TTM Technologies Inc.
• Unimicron Technology Corporation

The global semiconductor advanced substrate market is expected to grow at a CAGR of 8.65% during the forecast period between 2025 and 2030.

The printed circuit boards (PCBs) and semiconductor chips are connected by an advanced semiconductor substrate, which serves as a baseboard. It has great heat dissipation performance and is cost-effective, strong, lightweight, and energy-efficient. Additionally, it boosts PCB functionality and dimensional control, reduces overall PCB weight, and offers excellent dependability and exceptional electrical qualities. Because of this, it is now commonly employed to create miniaturized electrical goods with the newest features.

Market Trends:

• Growing demand for miniaturization in the semiconductor industry: The semiconductor advanced substrate market is being driven by the increasing trend of miniaturization, fueled by rapid technological advancements. These innovations have enabled the integration of multiple functionalities onto a single platform, catering to diverse applications. The expansion of computing, networking, communications, and consumer electronics has heightened the need for compact, reliable semiconductor devices. This, in turn, has increased the demand for materials used in producing high-performance semiconductor components.
• Additionally, portable electronic devices require smaller and thinner packaging solutions to save space and reduce costs. Enhancing electrical performance to minimize noise interference is particularly critical for highly integrated, high-speed applications in sectors like aerospace and consumer electronics.
• Rising adoption in IoT equipment manufacturing: The global surge in IoT adoption across consumer and industrial sectors is driving demand for specialized chipsets. Vendors are developing chipsets specifically designed for IoT applications, with key players including Altair, Huawei, Intel, Qualcomm, Samsung, and Sierra. As the number of IoT devices continues to grow, the demand for chips used in IoT development is expected to rise significantly. Alongside chip miniaturization, innovations aimed at reducing energy consumption will be a key focus for manufacturers, further propelling the growth of the semiconductor advanced substrate market.
• Regional market segmentation: The semiconductor advanced substrate market is segmented into the Americas, Europe, the Middle East and Africa, and Asia Pacific. Asia Pacific is expected to dominate the market during the forecast period, with Taiwan playing a significant role due to its large number of manufacturers and substantial investments in the semiconductor industry. Major producers such as ASE Group, Unimicron, and Kinsus are headquartered in Taiwan and operate at high production rates. Taiwan's IC industry boasts a comprehensive supply chain, spanning upstream design, downstream IDM, IC packaging, and testing, supported by a skilled workforce. The country is also advancing in 5G infrastructure development. For example, Chunghwa Telecom Co., Ltd. has announced plans to accelerate 5G base station deployment, aiming for 96% population coverage nationwide.

Some of the major players covered in this report include ASE Group, Fujitsu Limited, Ibiden Co. Ltd., Kinsus Interconnect Technology Corp., Korea Circuit Co. Ltd., KYOCERA Corporation, LG Innotek Co. Ltd., Nan Ya PCB Co. Ltd., TTM Technologies Inc., Unimicron Technology Corporation, among others.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

The Semiconductor Advanced Substrate Market is analyzed into the following segments:

By Type

• Advanced IC Substrate
• FC BGA
• FC CSP
• Substrate-like-PCB
• Embedded Die

By Packaging Type

• System in Package(SiP)
• Quad Flat Package (QFP)
• Ball Grid Array (BG)
• Chip Scale Packaging( CSP)
• Others

By Application

• Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Others

By Geography

• Americas
• § US
• Europe, the Middle East, and Africa
• § Germany
• § Netherlands
• § Others
• Asia Pacific
• § China
• § Japan
• § Taiwan
• § South Korea
• § Others

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Market Overview
• 1.2. Market Definition
• 1.3. Scope of the Study

1.4. Market Segmentation

• 1.5. Currency
• 1.6. Assumptions
• 1.7. Base and Forecast Years Timeline
• 1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

• 2.1. Research Design
• 2.2. Research Process

3. EXECUTIVE SUMMARY

• 3.1. Key Findings
• 3.2. Analyst View

4. MARKET DYNAMICS

• 4.1. Market Drivers
• 4.2. Market Restraints
• 4.3. Porter's Five Forces Analysis
  • 4.3.1. Bargaining Power of Suppliers
  • 4.3.2. Bargaining Power of Buyers
  • 4.3.3. The Threat of New Entrants
  • 4.3.4. Threat of Substitutes
  • 4.3.5. Competitive Rivalry in the Industry
• 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY TYPE

• 5.1. Introduction
• 5.2. Advanced IC Substrate
  • 5.2.1. FC BGA
  • 5.2.2. FC CSP
• 5.3. Substrate-like-PCB (SLP)
• 5.4. Embedded Die

6. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY PACKAGING TYPE

• 6.1. Introduction
• 6.2. System in Package (SiP)
• 6.3. Quad Flat Package (QFP)
• 6.4. Ball Grid Array (BG)
• 6.5. Chip Scale Packaging (CSP)
• 6.6. Others

7. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY APPLICATION

• 7.1. Introduction
• 7.2. Consumer Electronics
• 7.3. Automotive and Transportation
• 7.4. IT and Telecom
• 7.5. Others

8. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY GEOGRAPHY

• 8.1. Global Overview
• 8.2. Americas
  • 8.2.1. US
• 8.3. Europe, Middle East, and Africa
  • 8.3.1. Germany
  • 8.3.2. Netherlands
  • 8.3.3. Others
• 8.4. Asia-Pacific
  • 8.4.1. China
  • 8.4.2. Japan
  • 8.4.3. Taiwan
  • 8.4.4. South Korea
  • 8.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 9.1. Major Players and Strategy Analysis
• 9.2. Market Share Analysis
• 9.3. Mergers, Acquisitions, Agreements, and Collaborations
• 9.4. Competitive Dashboard

10. COMPANY PROFILES

• 10.1. ASE Group
• 10.2. Fujitsu Limited
• 10.3. Ibiden Co. Ltd.
• 10.4. Kinsus Interconnect Technology Corp.
• 10.5. Korea Circuit Co. Ltd.
• 10.6. KYOCERA Corporation
• 10.7. LG Innotek Co. Ltd.
• 10.8. Nan Ya PCB Co. Ltd.
• 10.9. TTM Technologies Inc.
• 10.10. Unimicron Technology Corporation