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市场调查报告书
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1808866

先进积体电路载板市场（按类型、按封装技术、按材料、按最终用途、按国家和地区）－2025 年至 2032 年全球产业分析、市场规模、市场份额及预测

Advanced IC Substrates Market, By Type, By Packaging Technology, By Material, By End Use, By Country, and By Region - Global Industry Analysis, Market Size, Market Share & Forecast from 2025-2032
出版日期: | 出版商: AnalystView Market Insights | 英文 311 Pages | 商品交期: 2-3个工作天内

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简介目录

2024 年先进 IC 载板市场规模价值为 227.9209 亿美元，2025 年至 2032 年的复合年增长率为 11.91%。

IC载板市场涵盖高密度互连平台的设计、生产和销售。这些平台可作为半导体晶片和印刷电路板 (PCB) 之间的实体连接，为积体电路提供机械支撑、讯号路由和电源分配。这在智慧型手机、伺服器、AI加速器和汽车电子产品等高效能应用中尤其重要。该市场采用先进的封装形式，例如倒装晶片球栅阵列 (FCBGA)、晶片级封装 (CSP) 和系统级封装 (SiP)。对更小尺寸、更高I/O密度以及更佳热性能和电气性能的需求正在推动材料和载板设计的创新。

先进IC载板市场-市场动态

高效能运算和人工智慧晶片的需求不断增长

随着人工智慧演算法、大规模云端运算和快速资料分析的日益复杂，人们对晶片的需求也随之增加，这些晶片能够更快地处理资讯、处理更多输入/输出，并更好地管理热量。传统的封装平台无法满足这些效能标准。先进的IC载板，例如FC-BGA（倒装晶片球栅阵列）和2.5D/3D封装，能够提供高密度连接和更佳的讯号传输。这些特性对于未来的计算工作负载至关重要。

NVIDIA、AMD 和 Intel 等顶级晶片製造商正在越来越多地使用先进封装来提升 GPU 和 CPU 的效能，尤其是在训练和使用 AI 模型方面。这些基板可以支援更大的晶片尺寸，整合堆迭内存，并改善散热性能。这在严苛的运算环境中能够提高可靠性。此外，亚马逊网路服务和Google云端等公司正在敦促基板供应商开发更好的封装解决方案，以满足其资料中心日益增长的需求。因此，上游在基板技术、材料创新和产能提升方面投入了大量资金。

例如，

2024年1月，英特尔宣布在其下一代至强和AI加速器中扩展其EMIB（嵌入式多晶片互连桥接）和Foveros 3D封装技术。这些先进的IC基板支援垂直堆迭和高密度互连，这对于高效能运算和AI晶片封装至关重要。

先进IC载板市场－关键洞察

根据我们的研究分析师的分析，预测期内（2025-2032 年）全球市场预计年复合成长率约为 11.91%

根据类型细分，预计倒装晶片球栅阵列 (FCBGA) 将在 2024 年占据最大市场份额

根据封装技术细分，2D倒装晶片是2024年领先的封装技术

根据材料细分，FR-4 是 2024 年的主导资料

从最终用途来看，半导体是 2024 年最主要的最终用途

按地区划分，亚太地区是 2024 年的主要收入来源

先进IC载板市场-細項分析：

全球先进积体电路载板市场根据类型、封装技术、材料、最终用途和地区进行细分。

市场根据类型分为五类：倒装晶片球栅阵列 (FCBGA) 基板、倒装晶片晶片级封装 (FCCSP) 基板、嵌入式基板、引线键合基板及其他。倒装晶片球栅阵列 (FCBGA) 领域占据市场主导地位，因为它们能够处理高输入/输出 (I/O) 密度、具有更好的散热性能，并允许细间距布线。这些特性对于资料中心处理器、AI 加速器和高阶显示卡至关重要。英特尔和 AMD 等公司在其顶级 CPU 和 GPU 设计中使用 FCBGA，因为它能够在紧凑的布局中有效地管理热量和电讯号。异构整合和 2.5D/3D 封装的持续发展进一步增加了先进半导体应用对 FCBGA 基板的需求。

根据最终用途，市场可分为五类：半导体、电脑硬体、医疗设备、家用电器和行动装置。受晶体管节点的不断扩展以及高密度高速运算需求激增的推动，半导体领域仍然是先进积体电路载板市场的主导力量。这些载板构成了逻辑晶片、记忆体模组和异质整合平台先进封装的支柱。英特尔、AMD 和台积电等公司广泛使用 FCBGA 和嵌入式桥接结构等高效能载板来支援人工智慧加速器、资料中心处理器和 5G 调变解调器。对讯号完整性、功率传输和小型化日益增长的需求，使得先进载板在现代晶片架构中不可或缺，从而巩固了该领域的领先地位。

先进IC载板市场-地理洞察

在 2024 年的预测期内，亚太地区将主导全球先进 IC 载板市场。

亚太地区凭藉其在台湾、韩国、日本和中国大陆的强大半导体封装基础设施，成为半导体封装市场的主要主导地区。欣兴电子、景硕科技、揖斐电和新光电机等公司为台积电、三星和SK海力士等主要厂商提供FCBGA和FCCSP等高品质基板。台湾地区对全球基板製造产能贡献巨大。该地区在印刷电路板（SLP）等基板和基于晶片的封装方面投入了大量资金。中国「中国製造2025」的国家政策着重于提升国内晶片和基板的生产能力，这进一步巩固了亚太地区的领先地位。经济实惠的製造成本、熟练的工人以及一体化的电子生态系统使亚太地区始终保持领先地位。

预计在 2024 年预测期内，北美将在先进 IC 载板市场中实现最高的复合年增长率。

由于政策变化和新技术的使用，北美正成为成长最快的地区。 《晶片与科学法案》已提供超过 500 亿美元的联邦激励措施。这些资金正在推动基础设施建设和基板研发。例如，英特尔正在扩建其位于俄亥俄州的晶圆厂和位于俄勒冈州的研发中心。他们正在采用新的基板技术，如 EMIB（嵌入式多晶片互连桥接）和用于 3D 堆迭的 Foveros Direct。此外，NVIDIA 和 AMD 等美国 AI 晶片製造商正在创造对超高密度基板的更高需求，以支援多晶片设计。将封装能力带回美国的地方倡议，加上国防、航太和 AI 云端基础设施日益增长的需求，正在推动该地区市场的快速成长。

先进积体电路载板市场-竞争格局：

先进积体电路载板市场高度整合，少数几家关键厂商控制全球供应，尤其是在亚太地区。揖斐电、新光马达、欣兴电子和三星马达等领先公司正专注于下一代载板技术，例如倒装晶片球栅阵列 (FCBGA) 和嵌入式走线载板。这些公司正在投资高层数载板、微型化和热性能改进，以支援用于人工智慧、5G 和高效能运算 (HPC) 应用的先进处理器。与英特尔、AMD 和 NVIDIA 等晶片製造商的策略合作伙伴关係正在推动晶片整合和异质封装领域的创新。

奥特斯（奥地利）和真鼎科技（中国）等公司正透过新的投资和区域成长积极拓展其製造能力。奥特斯透过在东南亚建立新的积体电路载板工厂，在高效能运算（HPC）领域取得了进展，而真鼎则作为中国半导体自力更生计画的一部分，正在迅速扩张。竞争优势日益基于精细布线、低翘曲和介电材料进步等能力。製造商正在竞相满足超紧凑、高速半导体元件的封装需求。

最新动态：

2024年5月，三星马达宣布投资11亿美元扩建位于韩国和越南的FC-BGA基板生产线。此次扩建旨在满足伺服器、AI和HPC处理器日益增长的需求，这些处理器需要复杂的多层基板。

2024年7月，三星马达与AMD合作，为其釜山和越南工厂供应超高层FCBGA基板。这些基板支援更大的晶片表面积和更密集的互连，适用于超大规模资料中心的GPU和CPU。三星马达已投资约1.9兆韩元，用于扩大下一代AI和伺服器处理器的生产。

2024年12月，为因应英伟达、英特尔和AMD等客户对AI晶片基板需求的激增，揖斐电株式会社正加速产能扩张。预计到2025年底，位于岐阜县的新基板工厂将以25%的产能投入运营，2026年3月将达到50%。管理层正在探索如何尽快将剩余产能投入营运以满足需求。

2024年10月，KLA推出了一系列IC载板产品，以开发半导体封装技术。该产品组合包括检测、测量和资料分析解决方案，旨在满足复杂的IC载板生产流程的需求。这些改进旨在解决先进封装应用中的挑战，例如係统级封装设计和异构集成，重点是提高良率、性能和可靠性。

2023年9月，BIWIN推出AP860，一款全新的无DRAM PCIe 4.0 SSD，适用于桌上型电脑、笔记型电脑和一体机系统。继2022年PCIe SSD价格下降之后，高性能SSD的价格也在下降。这一趋势提升了客户PCIe 4.0 SSD的市场份额，并增加了其在PC OEM市场的使用率。

目录

第一章：先进积体电路载板市场概述

  • 研究范围
  • 市场估计年限

第二章：执行摘要

  • 市场片段
    • 先进积体电路载板市场类型摘要
    • 先进IC载板市场（依封装技术）
    • 先进积体电路载板市场（按材料）
    • 先进积体电路载板市场片段（依最终用途）
    • 先进积体电路载板市场（按国家/地区）
    • 先进积体电路载板市场（按地区）
  • 竞争洞察

第三章：先进积体电路载板关键市场趋势

  • 先进积体电路载板市场驱动因素
    • 市场驱动因素的影响分析
  • 先进IC载板市场限制因素
    • 市场限制的影响分析
  • 先进积体电路载板市场机会
  • 先进IC载板市场未来趋势

第四章：先进积体电路载板产业研究

  • PESTEL分析
  • 波特五力分析
  • 成长前景图
  • 规范架构分析

第五章：先进积体电路载板市场：地缘政治紧张局势升级的影响

  • COVID-19 疫情的影响
  • 俄乌战争的影响
  • 中东衝突的影响

第六章：先进IC载板市场格局

  • 2024年先进IC载板市占率分析
  • 按主要製造商分類的细分数据
    • 成熟玩家分析
    • 新兴企业分析

第七章：先进积体电路载板市场－依类型

  • 概述
    • 按类型分類的细分市场占有率分析
    • 倒装晶片球栅阵列 (FCBGA) 基板
    • 倒装晶片晶片级封装 (FCCSP) 基板
    • 嵌入式基板
    • 引线键结基板
    • 其他的

第八章：先进IC载板市场-按封装技术

  • 概述
    • 按封装技术分類的细分市场份额分析
    • 二维倒装晶片
    • 2.5D中介层
    • 系统级封装/模组
    • 扇出型晶圆级封装
    • 3D积体电路/晶片积体电路

第九章：先进积体电路载板市场－依材料

  • 概述
    • 按材料细分的份额分析
    • 聚酰亚胺
    • FR-4
    • 硅
    • 低温共烧陶瓷
    • 高频层压板

第十章：先进积体电路载板市场－依最终用途

  • 概述
    • 按最终用途分類的细分市场份额分析
    • 半导体
    • 电脑硬体
    • 医疗保健设备
    • 家用电器
    • 行动装置

第 11 章：先进 IC 载板市场 - 按地区

  • 介绍
    • 按地区分類的细分市场占有率分析
  • 北美洲
    • 概述
    • 北美先进积体电路载板主要製造商
    • 北美市场规模及预测（按国家/地区）
    • 北美市场规模和预测（按类型）
    • 北美市场规模及预测（依封装技术）
    • 北美市场规模及预测（按材料）
    • 北美市场规模和预测，按最终用途
    • 我们
    • 加拿大
  • 欧洲
    • 概述
    • 欧洲先进积体电路载板主要製造商
    • 欧洲市场规模及预测（按国家/地区）
    • 欧洲市场规模与预测（按类型）
    • 欧洲市场规模及预测（依包装技术）
    • 欧洲市场规模及预测（按材料）
    • 欧洲市场规模和预测，按最终用途
    • 德国
    • 英国
    • 法国
    • 义大利
    • 西班牙
    • 荷兰
    • 瑞典
    • 俄罗斯
    • 波兰
    • 欧洲其他地区
  • 亚太地区 (APAC)
    • 概述
    • 亚太地区先进积体电路载板主要製造商
    • 亚太地区市场规模及预测（依国家）
    • 亚太地区市场规模及预测（按类型）
    • 亚太地区市场规模及预测（依封装技术）
    • 亚太地区市场规模及预测（依材料）
    • 亚太地区市场规模及预测（依最终用途）
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲
    • 印尼
    • 泰国
    • 菲律宾
    • 亚太地区其他地区
  • 拉丁美洲（LATAM）
    • 概述
    • 拉丁美洲先进积体电路载板主要製造商
    • 拉丁美洲市场规模及预测（按国家/地区）
    • 拉丁美洲市场规模及预测（按类型）
    • 拉丁美洲市场规模及预测（按封装技术）
    • 拉丁美洲市场规模及预测（按材料）
    • 拉丁美洲市场规模及预测（依最终用途）
    • 巴西
    • 墨西哥
    • 阿根廷
    • 哥伦比亚
    • 拉丁美洲其他地区
  • 中东和非洲（MEA）
    • 概述
    • 中东和非洲先进积体电路载板主要製造商
    • MEA 市场规模及预测（依国家/地区）
    • MEA 市场规模和预测（按类型）
    • MEA 市场规模及预测（依封装技术）
    • MEA 市场规模及预测（按材料）
    • MEA 市场规模及预测（依最终用途）
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 以色列
    • 土耳其
    • 阿尔及利亚
    • 埃及
    • MEA 其余地区

第十二章：先进IC载板产业关键供应商分析

  • 竞争基准化分析
    • Competitive Dashboard
    • Competitive Positioning
  • 公司简介
    • Amkor Technology
    • ASE Technology Holding Co.
    • Broadcom Inc.
    • Fujitsu
    • Ibiden Co. Ltd
    • Intel Corporation
    • Kinsus Interconnect Technology Corp.
    • LG Innotek
    • Murata Manufacturing Co.
    • Nanya Technology Corporation
    • Osram Licht AG
    • Powertech Technology Inc.
    • Samsung ElectroMechanics
    • Sankoh Co., Ltd.
    • Shinko Electric Industries
    • Taiwan Semiconductor Manufacturing Company
    • Unimicron Technology Corp.
    • Yizumi Technology
    • Eastern
    • Semco
    • Others

第 13 章：360 度分析师视角

第 14 章：附录

  • 研究方法
  • 参考
  • 缩写
  • 免责声明
  • 联络我们
简介目录
Product Code: ANV5470

Advanced IC substrates market size was valued at US$ 22,792.09 Million in 2024, expanding at a CAGR of 11.91% from 2025 to 2032.

The IC substrates market includes the design, production, and sale of high-density interconnect platforms. These platforms act as the physical connection between semiconductor chips and printed circuit boards (PCBs). They provide mechanical support, signal routing, and power distribution for integrated circuits. This is especially important in high performance applications such as smartphones, servers, AI accelerators, and automotive electronics. The market features advanced packaging formats like flip-chip ball grid array (FCBGA), chip-scale package (CSP), and system-in-package (SiP). The need for smaller sizes, higher I/O density, and better thermal and electrical performance is driving innovation in materials and substrate designs.

Advanced IC Substrates Market- Market Dynamics

Rising Demand for High-Performance Computing and AI Chips

The increasing complexity of AI algorithms, large-scale cloud computing, and fast data analysis has created a need for chips that can process information more quickly, handle more input/output, and manage heat better. Traditional packaging platforms cannot meet these performance standards. Advanced IC substrates like FC-BGA (Flip Chip Ball Grid Array) and 2.5D/3D packages provide high-density connections and better signal transmission. These features are essential for the computing workloads of the future.

Top chip makers such as NVIDIA, AMD, and Intel are using advanced packaging more often to boost the performance of GPUs and CPUs, particularly for training and using AI models. These substrates can support larger chip sizes, integrate stacked memory, and improve heat dissipation. This leads to higher reliability in demanding computing situations. Additionally, companies like Amazon Web Services and Google Cloud are urging substrate suppliers to develop better packaging solutions that can meet the rising needs of their data centers. Consequently, there is significant investment upstream in substrate technologies, material innovation, and increasing manufacturing capacity.

For Instance,

In January 2024, Intel announced expanded deployment of its EMIB (Embedded Multi-die Interconnect Bridge) and Foveros 3D packaging technologies in its next-gen Xeon and AI accelerators. These advanced IC substrates allow vertical stacking and high density interconnects, critical for high performance computing and AI chip packaging.

Advanced IC Substrates Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 11.91% over the forecast period (2025-2032)

Based on type segmentation, flip chip ball grid array (FCBGA) was predicted to show maximum market share in the year 2024

Based on packaging technology segmentation, 2D flip-chip was the leading packaging technology in 2024

Based on material segmentation, FR-4 was the leading material in 2024

Based on end use, semiconductors was the leading end use in 2024

On the basis of region, Asia Pacific was the leading revenue generator in 2024

Advanced IC Substrates Market- Segmentation Analysis:

The global advanced IC substrates market is segmented on the basis of type, packaging technology, material, end use, and region.

The market is divided into five categories based on type: flip chip ball grid array (FCBGA) substrates, flip chip chip scale package (FCCSP) substrates, embedded substrates, wire bond substrates, others. The flip chip ball grid array (FCBGA) sector dominates the market. Due to they can handle high input/output (I/O) density, have better thermal performance, and allow for fine-pitch routing. These features are important for data center processors, AI accelerators, and high-end graphics cards. Companies like Intel and AMD use FCBGA in their top CPU and GPU designs since it effectively manages heat and electrical signals in compact layouts. The ongoing move toward heterogeneous integration and 2.5D/3D packaging further increases the demand for FCBGA substrates in advanced semiconductor applications.

The market is divided into five categories based on end use: semiconductors, computer hardware, healthcare equipment, home appliances, mobile devices. The semiconductor segment remains the dominant force in the Advanced IC Substrates Market, driven by the continual scaling of transistor nodes and the surge in demand for high-density, high-speed computing. These substrates form the backbone of advanced packaging for logic chips, memory modules, and heterogeneous integration platforms. Companies such as Intel, AMD, and TSMC extensively use high-performance substrates like FCBGA and embedded bridge structures to support AI accelerators, data center processors, and 5G modems. The increasing need for signal integrity, power delivery, and miniaturization has made advanced substrates indispensable in modern chip architectures, sustaining the segment's leadership.

Advanced IC Substrates Market- Geographical Insights

Asia Pacific dominates the global advanced IC substrates market during the forecast period in 2024.

Asia Pacific is the dominating region because of its strong semiconductor packaging infrastructure in Taiwan, South Korea, Japan, and China. Companies like Unimicron Technology, Kinsus Interconnect, Ibiden, and Shinko Electric provide high-quality substrates such as FCBGA and FCCSP to major players like TSMC, Samsung, and SK Hynix. Taiwan contributes significantly to global substrate manufacturing capacity. The region has made large investments in substrate like PCBs (SLPs) and chiplet-based packaging. China's national policies under "Made in China 2025" focus on boosting domestic chip and substrate production, which further strengthens regional leadership. Affordable manufacturing, skilled workers, and integrated electronics ecosystems keep Asia Pacific at the forefront.

North America is estimated to register the highest CAGR in the advanced IC substrates market during the forecast period in 2024.

North America is becoming the fastest-growing region because of policy changes and the use of new technology. The CHIPS and Science Act has made over USD 50 billion available in federal incentives. This funding is driving infrastructure development and substrate research and development. For example, Intel is expanding its fab in Ohio and its R&D center in Oregon. They are incorporating new substrate technologies such as EMIB (Embedded Multi-die Interconnect Bridge) and Foveros Direct for 3D stacking. Also, U.S. based AI chip makers like NVIDIA and AMD are creating a higher demand for ultra high density substrates to support multi-chiplet designs. Local initiatives to bring packaging capabilities back to the U.S., along with the growing demand in defence, aerospace, and AI cloud infrastructure, are driving rapid market growth in the region.

Advanced IC Substrates Market- Competitive Landscape:

The Advanced IC Substrates Market is highly consolidated, with a few key players controlling global supply, especially in Asia Pacific. Leading companies like Ibiden, Shinko Electric, Unimicron, and Samsung Electro-Mechanics are focusing on next-generation substrate technologies such as Flip Chip Ball Grid Array (FCBGA) and embedded trace substrates. These firms are investing in high layer count substrates, miniaturization, and improvements in thermal performance to support advanced processors used in AI, 5G, and high-performance computing (HPC) applications. Strategic partnerships with chipmakers like Intel, AMD, and NVIDIA are driving innovation in chiplet integration and heterogeneous packaging.

Companies such as AT&S (Austria) and Zhen Ding Technology (China) are actively expanding their manufacturing capabilities through new investments and regional growth. AT&S is making progress in the HPC space by establishing new IC substrate fabs in Southeast Asia, while Zhen Ding is quickly expanding as part of China's initiative for semiconductor self reliance. Competitive differentiation is increasingly based on capabilities such as fine line routing, low warpage, and advancements in dielectric materials. Manufacturers are racing to meet the packaging needs of ultra compact, high speed semiconductor devices.

Recent Developments:

In May 2024, Samsung Electro-Mechanics announced a USD 1.1 billion investment to expand its FC-BGA substrate manufacturing lines in Korea and Vietnam. The expansion aims to support increased demand for server, AI, and HPC processors requiring complex, multilayer substrates

In July 2024, Samsung Electro-Mechanics partnered with AMD to supply ultra-high-layer FCBGA substrates built in plants across Busan and Vietnam. These substrates support larger chip surface areas and denser interconnects for hyperscale data center GPUs and CPUs. SEMCO has invested approximately KRW 1.9 trillion to scale production for next-gen AI and server processors

In December 2024, Ibiden is accelerating capacity expansion in response to surging demand for AI chip substrates from clients such as Nvidia, Intel, and AMD. A new substrate factory in Gifu Prefecture is expected to run at 25% capacity by late 2025 and reach 50% by March 2026. Management is exploring ways to bring remaining capacity online sooner to meet demand

In October 2024, KLA launched a broad range of IC substrates to develop semiconductor packaging technology. This portfolio includes inspection, measurement, and data analysis solutions aimed at meeting the needs of complex IC substrate production processes. The improvements tackle challenges in advanced packaging applications, such as system in package designs and heterogeneous integration, by focusing on improving yield, performance, and reliability

In September 2023, the AP860, a new DRAM-free PCIe 4.0 SSD from BIWIN, is made for desktops, laptops, and all in one system. The price of high-performance SSDs is declining, following the drop in PCIe SSD prices in 2022. This trend has boosted the market share of customer PCIe 4.0 SSDs and increased their use in the PC OEM market

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL ADVANCED IC SUBSTRATES MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS

  • Amkor Technology
  • ASE Technology Holding Co.
  • Broadcom Inc.
  • Fujitsu
  • Ibiden Co. Ltd
  • Intel Corporation
  • Kinsus Interconnect Technology Corp.
  • LG Innotek
  • Murata Manufacturing Co.
  • Nanya Technology Corporation
  • Osram Licht AG
  • Powertech Technology Inc.
  • Samsung ElectroMechanics
  • Sankoh Co., Ltd.
  • Shinko Electric Industries
  • Taiwan Semiconductor Manufacturing Company
  • Unimicron Technology Corp.
  • Yizumi Technology
  • Eastern
  • Semco
  • Others

GLOBAL ADVANCED IC SUBSTRATES MARKET, BY TYPE- MARKET ANALYSIS, 2019 - 2032

  • Flip Chip Ball Grid Array (FCBGA) Substrates
  • Flip Chip Chip Scale Package (FCCSP) Substrates
  • Embedded Substrates
  • Wire Bond Substrates
  • Others

GLOBAL ADVANCED IC SUBSTRATES MARKET, BY PACKAGING TECHNOLOGY- MARKET ANALYSIS, 2019 - 2032

  • 2D Flip-Chip
  • 2.5D Interposer
  • SiP / Module
  • Fan-Out WLP
  • 3D-IC / SoIC

GLOBAL ADVANCED IC SUBSTRATES MARKET, BY MATERIAL- MARKET ANALYSIS, 2019 - 2032

  • Polyimide
  • FR-4
  • Silicon
  • Low-Temperature Co-fired Ceramics
  • High-Frequency Laminates

GLOBAL ADVANCED IC SUBSTRATES MARKET, BY END USE- MARKET ANALYSIS, 2019 - 2032

  • Semiconductors
  • Computer Hardware
  • Healthcare Equipment
  • Home Appliances
  • Mobile Devices

GLOBAL ADVANCED IC SUBSTRATES MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032

  • North America
  • U.S.
  • Canada
  • Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • The Netherlands
  • Sweden
  • Russia
  • Poland
  • Rest of Europe
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Indonesia
  • Thailand
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Advanced IC Substrates Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Advanced IC Substrates Market Snippet by Type
    • 2.1.2. Advanced IC Substrates Market Snippet by Packaging Technology
    • 2.1.3. Advanced IC Substrates Market Snippet by Material
    • 2.1.4. Advanced IC Substrates Market Snippet by End Use
    • 2.1.5. Advanced IC Substrates Market Snippet by Country
    • 2.1.6. Advanced IC Substrates Market Snippet by Region
  • 2.2. Competitive Insights

3. Advanced IC Substrates Key Market Trends

  • 3.1. Advanced IC Substrates Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Advanced IC Substrates Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Advanced IC Substrates Market Opportunities
  • 3.4. Advanced IC Substrates Market Future Trends

4. Advanced IC Substrates Industry Study

  • 4.1. PESTEL Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Advanced IC Substrates Market: Impact of Escalating Geopolitical Tensions

  • 5.1. Impact of COVID-19 Pandemic
  • 5.2. Impact of Russia-Ukraine War
  • 5.3. Impact of Middle East Conflicts

6. Advanced IC Substrates Market Landscape

  • 6.1. Advanced IC Substrates Market Share Analysis, 2024
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Advanced IC Substrates Market - By Type

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Type, 2024 & 2032 (%)
    • 7.1.2. Flip Chip Ball Grid Array (FCBGA) Substrates
    • 7.1.3. Flip Chip Chip Scale Package (FCCSP) Substrates
    • 7.1.4. Embedded Substrates
    • 7.1.5. Wire Bond Substrates
    • 7.1.6. Others

8. Advanced IC Substrates Market - By Packaging Technology

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By Packaging Technology, 2024 & 2032 (%)
    • 8.1.2. 2D Flip-Chip
    • 8.1.3. 2.5D Interposer
    • 8.1.4. SiP / Module
    • 8.1.5. Fan-Out WLP
    • 8.1.6. 3D-IC / SoIC

9. Advanced IC Substrates Market - By Material

  • 9.1. Overview
    • 9.1.1. Segment Share Analysis, By Material, 2024 & 2032 (%)
    • 9.1.2. Polyimide
    • 9.1.3. FR-4
    • 9.1.4. Silicon
    • 9.1.5. Low-Temperature Co-fired Ceramics
    • 9.1.6. High-Frequency Laminates

10. Advanced IC Substrates Market - By End Use

  • 10.1. Overview
    • 10.1.1. Segment Share Analysis, By End Use, 2024 & 2032 (%)
    • 10.1.2. Semiconductors
    • 10.1.3. Computer Hardware
    • 10.1.4. Healthcare Equipment
    • 10.1.5. Home Appliances
    • 10.1.6. Mobile Devices

11. Advanced IC Substrates Market- By Geography

  • 11.1. Introduction
    • 11.1.1. Segment Share Analysis, By Geography, 2024 & 2032 (%)
  • 11.2. North America
    • 11.2.1. Overview
    • 11.2.2. Advanced IC Substrates Key Manufacturers in North America
    • 11.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.2.4. North America Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.2.5. North America Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 11.2.6. North America Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
    • 11.2.7. North America Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.2.8. U.S.
      • 11.2.8.1. Overview
      • 11.2.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.2.8.3. U.S. Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.2.8.4. U.S. Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.2.8.5. U.S. Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.2.8.6. U.S. Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.2.9. Canada
      • 11.2.9.1. Overview
      • 11.2.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.2.9.3. Canada Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.2.9.4. Canada Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.2.9.5. Canada Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.2.9.6. Canada Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 11.3. Europe
    • 11.3.1. Overview
    • 11.3.2. Advanced IC Substrates Key Manufacturers in Europe
    • 11.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.3.4. Europe Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.3.5. Europe Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 11.3.6. Europe Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
    • 11.3.7. Europe Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.8. Germany
      • 11.3.8.1. Overview
      • 11.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.8.3. Germany Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.8.4. Germany Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.8.5. Germany Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.8.6. Germany Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.9. UK
      • 11.3.9.1. Overview
      • 11.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.9.3. UK Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.9.4. UK Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.9.5. UK Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.9.6. UK Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.10. France
      • 11.3.10.1. Overview
      • 11.3.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.10.3. France Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.10.4. France Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.10.5. France Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.10.6. France Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.11. Italy
      • 11.3.11.1. Overview
      • 11.3.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.11.3. Italy Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.11.4. Italy Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.11.5. Italy Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.11.6. Italy Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.12. Spain
      • 11.3.12.1. Overview
      • 11.3.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.12.3. Spain Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.12.4. Spain Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.12.5. Spain Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.12.6. Spain Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.13. The Netherlands
      • 11.3.13.1. Overview
      • 11.3.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.13.3. The Netherlands Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.13.4. The Netherlands Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.13.5. The Netherlands Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.13.6. The Netherlands Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.14. Sweden
      • 11.3.14.1. Overview
      • 11.3.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.14.3. Sweden Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.14.4. Sweden Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.14.5. Sweden Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.14.6. Sweden Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.15. Russia
      • 11.3.15.1. Overview
      • 11.3.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.15.3. Russia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.15.4. Russia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.15.5. Russia Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.15.6. Russia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.16. Poland
      • 11.3.16.1. Overview
      • 11.3.16.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.16.3. Poland Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.16.4. Poland Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.16.5. Poland Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.16.6. Poland Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.17. Rest of Europe
      • 11.3.17.1. Overview
      • 11.3.17.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.17.3. Rest of the Europe Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.17.4. Rest of the Europe Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.17.5. Rest of the Europe Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.17.6. Rest of the Europe Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 11.4. Asia Pacific (APAC)
    • 11.4.1. Overview
    • 11.4.2. Advanced IC Substrates Key Manufacturers in Asia Pacific
    • 11.4.3. APAC Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.4.4. APAC Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.4.5. APAC Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 11.4.6. APAC Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
    • 11.4.7. APAC Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.8. China
      • 11.4.8.1. Overview
      • 11.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.8.3. China Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.8.4. China Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.8.5. China Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.8.6. China Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.9. India
      • 11.4.9.1. Overview
      • 11.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.9.3. India Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.9.4. India Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.9.5. India Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.9.6. India Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.10. Japan
      • 11.4.10.1. Overview
      • 11.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.10.3. Japan Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.10.4. Japan Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.10.5. Japan Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.10.6. Japan Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.11. South Korea
      • 11.4.11.1. Overview
      • 11.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.11.3. South Korea Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.11.4. South Korea Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.11.5. South Korea Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.11.6. South Korea Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.12. Australia
      • 11.4.12.1. Overview
      • 11.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.12.3. Australia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.12.4. Australia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.12.5. Australia Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.12.6. Australia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.13. Indonesia
      • 11.4.13.1. Overview
      • 11.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.13.3. Indonesia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.13.4. Indonesia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.13.5. Indonesia Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.13.6. Indonesia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.14. Thailand
      • 11.4.14.1. Overview
      • 11.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.14.3. Thailand Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.14.4. Thailand Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.14.5. Thailand Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.14.6. Thailand Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.15. Philippines
      • 11.4.15.1. Overview
      • 11.4.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.15.3. Philippines Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.15.4. Philippines Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.15.5. Philippines Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.15.6. Philippines Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.16. Rest of APAC
      • 11.4.16.1. Overview
      • 11.4.16.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.16.3. Rest of APAC Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.16.4. Rest of APAC Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.16.5. Rest of APAC Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.16.6. Rest of APAC Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 11.5. Latin America (LATAM)
    • 11.5.1. Overview
    • 11.5.2. Advanced IC Substrates Key Manufacturers in Latin America
    • 11.5.3. LATAM Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.5.4. LATAM Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.5.5. LATAM Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 11.5.6. LATAM Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
    • 11.5.7. LATAM Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.5.8. Brazil
      • 11.5.8.1. Overview
      • 11.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.8.3. Brazil Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.8.4. Brazil Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.5.8.5. Brazil Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.5.8.6. Brazil Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.5.9. Mexico
      • 11.5.9.1. Overview
      • 11.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.9.3. Mexico Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.9.4. Mexico Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.5.9.5. Mexico Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.5.9.6. Mexico Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.5.10. Argentina
      • 11.5.10.1. Overview
      • 11.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.10.3. Argentina Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.10.4. Argentina Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.5.10.5. Argentina Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.5.10.6. Argentina Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.5.11. Colombia
      • 11.5.11.1. Overview
      • 11.5.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.11.3. Colombia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.11.4. Colombia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.5.11.5. Colombia Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.5.11.6. Colombia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.5.12. Rest of LATAM
      • 11.5.12.1. Overview
      • 11.5.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.12.3. Rest of LATAM Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.12.4. Rest of LATAM Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.5.12.5. Rest of LATAM Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.5.12.6. Rest of LATAM Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 11.6. Middle East and Africa (MEA)
    • 11.6.1. Overview
    • 11.6.2. Advanced IC Substrates Key Manufacturers in Middle East and Africa
    • 11.6.3. MEA Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.6.4. MEA Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.6.5. MEA Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 11.6.6. MEA Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
    • 11.6.7. MEA Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.8. Saudi Arabia
      • 11.6.8.1. Overview
      • 11.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.8.3. Saudi Arabia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.8.4. Saudi Arabia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.8.5. Saudi Arabia Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.8.6. Saudi Arabia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.9. United Arab Emirates
      • 11.6.9.1. Overview
      • 11.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.9.3. United Arab Emirates Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.9.4. United Arab Emirates Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.9.5. United Arab Emirates Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.9.6. United Arab Emirates Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.10. Israel
      • 11.6.10.1. Overview
      • 11.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.10.3. Israel Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.10.4. Israel Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.10.5. Israel Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.10.6. Israel Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.11. Turkey
      • 11.6.11.1. Overview
      • 11.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.11.3. Turkey Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.11.4. Turkey Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.11.5. Turkey Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.11.6. Turkey Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.12. Algeria
      • 11.6.12.1. Overview
      • 11.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.12.3. Algeria Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.12.4. Algeria Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.12.5. Algeria Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.12.6. Algeria Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.13. Egypt
      • 11.6.13.1. Overview
      • 11.6.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.13.3. Egypt Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.13.4. Egypt Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.13.5. Egypt Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.13.6. Egypt Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.14. Rest of MEA
      • 11.6.14.1. Overview
      • 11.6.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.14.3. Rest of MEA Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.14.4. Rest of MEA Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.14.5. Rest of MEA Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.14.6. Rest of MEA Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)

12. Key Vendor Analysis- Advanced IC Substrates Industry

  • 12.1. Competitive Benchmarking
    • 12.1.1. Competitive Dashboard
    • 12.1.2. Competitive Positioning
  • 12.2. Company Profiles
    • 12.2.1. Amkor Technology
    • 12.2.2. ASE Technology Holding Co.
    • 12.2.3. Broadcom Inc.
    • 12.2.4. Fujitsu
    • 12.2.5. Ibiden Co. Ltd
    • 12.2.6. Intel Corporation
    • 12.2.7. Kinsus Interconnect Technology Corp.
    • 12.2.8. LG Innotek
    • 12.2.9. Murata Manufacturing Co.
    • 12.2.10. Nanya Technology Corporation
    • 12.2.11. Osram Licht AG
    • 12.2.12. Powertech Technology Inc.
    • 12.2.13. Samsung ElectroMechanics
    • 12.2.14. Sankoh Co., Ltd.
    • 12.2.15. Shinko Electric Industries
    • 12.2.16. Taiwan Semiconductor Manufacturing Company
    • 12.2.17. Unimicron Technology Corp.
    • 12.2.18. Yizumi Technology
    • 12.2.19. Eastern
    • 12.2.20. Semco
    • 12.2.21. Others

13. 360 Degree Analyst View

14. Appendix

  • 14.1. Research Methodology
  • 14.2. References
  • 14.3. Abbreviations
  • 14.4. Disclaimer
  • 14.5. Contact Us