Embedded World 2023：物联网芯片组和边缘的最新趋势

示例视图

这份报告全面总结了 Embedded World 2023 的主要嵌入式亮点和对关键领域的深入见解。

该报告包括：

• 2023 年嵌入式世界博览会：19 大亮点
• 10 条详细见解：示例/证明点和访谈要点
• 总结和要点：总体印象、参展商情绪、最热门的技术话题、主要演讲等。
• 硬件和芯片组洞察：AI 芯片组、基于 AI 的机器视觉、SDV（软件定义车辆）、电源管理 IC
• 连通性见解：OPC-UA、TSN、单对以太网、Matter 标准
• Security Insights：安全标准 IEC 62443 后量子安全
• 更多见解：RTOS/硬件问题

内容

• 1.概述
• 2.总结和主要亮点
• 3. 硬件和芯片组见解
• 4. 连通性见解
• 5.安全洞察
• 6.其他见解
• 7. 附录

36-page report highlighting key insights from one of the world's leading fairs for the embedded community

SAMPLE VIEW

A comprehensive summary of 19 key highlights and 10 in-depth insights assembled by the IoT Analytics team at the Embedded World fair, 2023. These insights are based on >75 booth visits, >50 individual interviews, and attendance at several presentations. Three analysts were present for a total of three days.

The main purpose of this document is for our readers to keep up with the latest IoT developments related to hardware and embedded topics and to stay ahead of the tidal changes regarding current market trends.

The report includes:

• 19 key highlights from the Embedded World fair 2023.

• 10 in-depth insights with examples/proof-points and interview highlights.

• Summary & Key Highlights (General impressions, exhibitor sentiment, most discussed tech topics, key announcements)

• Hardware and Chipset Insights (AI Chipsets, AI-based Machine Vision, Software Defined Vehicles, Power Management IC's).

• Connectivity Insights (OPC-UA, TSN, Single-Pair Ethernet, Matter standard)

• Security Insights (Security Standards IEC 62443, Post-quantum security)

• Other Insights (RTOS, Hardware issues)

Table of Contents

• 1. Overview

• 2. Summary and Key Highlights

• 3. Hardware and Chipset Insights

• 4. Connectivity Insights

• 5. Security Insights

• 6. Other Insights

• 7. Appendix