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市场调查报告书
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1465122

半导体和IC封装材料市场：按类型、技术和最终用途划分 - 2024-2030 年全球预测

Semiconductor & IC Packaging Materials Market by Type (Bonding wires, Ceramic Packages, Die Attach Materials), Technology (Dual Flat No-leads, Dual-in-line, Grid Array), End-use - Global Forecast 2024-2030
出版日期: | 出版商: 360iResearch | 英文 186 Pages | 商品交期: 最快1-2个工作天内

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预计2023年半导体和IC封装材料市场规模为384.4亿美元，2024年达421.6亿美元，2030年达766.4亿美元，复合年增长率为10.35%。

半导体和积体电路 (IC) 封装材料包括用于封装和保护电子电路和半导体的各种材料和组件。这些材料可作为物理屏蔽，在散热、电绝缘以及提高半导体可靠性和性能方面发挥重要作用。其应用的扩展主要是由家用电子电器、通讯设备和汽车电子需求的快速成长所推动的。随着技术进步和电子设备变得更小、更强大，对高效、耐用和耐热包装材料的需求不断增加。然而，该行业面临挑战，特别是一些包装材料对环境的影响，以及寻找能够在越来越高的温度下承受恶劣工作条件的材料。解决这些缺点需要持续研究和开发，以发现更永续的材料和创新的包装技术，以减少废弃物并提高性能。然而，5G 技术、物联网 (IoT)、人工智慧 (AI) 的出现以及电动车 (EV) 的日益普及预计将刺激进一步增长。此外，具有更强运算能力的较小设备的趋势表明，对能够适应这些趋势的先进封装解决方案的需求不断增加。材料科学的创新，例如开发环保和高导热材料，有望满足技术环境不断变化的需求，并为该产业扩张开闢新途径。

主要市场统计
基准年[2023] 384.4亿美元
预测年份 [2024] 421.6亿美元
预测年份 [2030] 766.4亿美元
复合年增长率（%） 10.35%

陶瓷封装类型对于高效能和高可靠性应用的适用性

键合线是细金属线，通常由金、铝或铜製成，用于在半导体装置内进行电气连接。它们在半导体的功能中发挥关键作用，促进晶片内部和外部世界之间的电讯号和电力的流动。陶瓷封装是一种封装半导体晶片的保护壳，可提供高水准的保护，免受潮湿、温度变化和物理应力等环境因素的影响。陶瓷具有优异的热绝缘性能和电绝缘性能，适合高性能、高可靠性应用。连接材料是用于将半导体晶粒（或晶片）黏合到基板或封装黏剂或金属合金。它对于机械支撑和温度控管都很重要，可确保晶粒牢固固定，同时促进晶片散热。

封装树脂是用于封装和保护半导体晶片及其内部连接的聚合物。导线架是半导体封装内的金属结构，用于机械支撑并电连接硅晶片和外部电路。导线架对于向晶片分配电源和讯号至关重要，并且在设备的整体性能中起着关键作用。有机基板用作建构半导体装置的基础层。这些基板由有机聚合物製成，旨在支援各种电子元件，为半导体封装内的互连提供平台，影响最终产品。球栅阵列 (BGA) 封装中使用的焊球是小型焊球，形成半导体封装和印刷电路基板(PCB) 之间的电气连接。焊球对于在晶片封装与其外部环境之间建立可靠的实体和电气介面至关重要。热感界面材料 (TIM) 是插入半导体装置及其散热器之间以促进热传递的物质。透过提高从晶片到散热组件的热传递效率，TIM 在管理半导体装置的动作温度并将其保持在安全工作范围内发挥至关重要的作用。

最终用途 由于出色的电绝缘性和温度控管，在家用电子电器中普及

在航太和国防领域，所使用的半导体封装材料必须能够承受高辐射、极端温度和机械应力等恶劣条件。高性能陶瓷和坚固的复合材料通常用于确保航太和国防应用中半导体的使用寿命和可靠性。这些材料在导航、通讯和监视系统中发挥重要作用。随着汽车中使用的电子元件数量不断增加，汽车产业正在经历一场变革。汽车产业的包装材料必须确保车辆在整个生命週期（通常是在恶劣的环境下）的高可靠性。所使用的材料必须能够承受振动、高温和潮湿。硅胶和先进聚合物因其耐用性和耐热性而被广泛使用。智慧型手机、笔记型电脑和穿戴式装置等家用电器需要能够实现轻量、紧凑和高效设计的半导体封装材料。这里的重点是提高性能，同时最大限度地减少空间。环氧树脂和塑胶化合物因其优异的电绝缘性和温度控管性能而成为首选。在医疗保健领域，半导体有着广泛的应用，从诊断设备到穿戴式健康监视器。医疗器材的包装材料必须符合严格的生物相容性、灭菌相容性和可靠性标准。对人体安全且在医疗环境中可靠工作的特殊聚合物和陶瓷是保护和提高医疗设备中使用的半导体性能的关键。在 IT 和通讯领域，对更快资料处理和通讯的需求正在推动对先进半导体封装材料的需求。这些材料必须支援高速讯号传输，同时有效散热以防止过热。高导热材料（包括碳化硅和先进聚合物）用于满足这些需求，并确保资料中心、伺服器和通讯设备可靠且有效率的运作。

区域洞察

在美洲，美国凭藉先进的研发能力和主要半导体製造商的存在，在半导体封装材料市场中占据主导地位。在对更高性能、更小和更节能设备的需求的推动下，该地区正在转向更复杂的封装解决方案。硅树脂、塑胶和玻璃等材料经常与先进复合材料一起使用。对可再生能源和电动车的投资增加也影响了该地区对半导体封装材料的需求。由于不同国家的经济和技术成熟度不同，欧洲、中东和非洲地区呈现多种情境。欧洲处于领先地位，拥有强大的汽车和工业部门，需要高可靠性的半导体封装。特别需要能够承受恶劣环境的先进封装技术。中东和非洲虽然正在成长，但仅占全球市场的一小部分，但随着对通讯和基础设施的投资，它们正在快速发展。在中国、韩国、台湾和日本等国家的推动下，亚太地区是半导体和IC封装材料最具活力和成长最快的地区。这些国家是一些世界上最大的电子产品製造商的所在地，并推动了对各种包装材料的需求。该地区市场的特点是消费性电子产品数量庞大，包括智慧型手机、平板电脑和其他行动装置，需要经济高效且高效能的创新封装解决方案。

FPNV定位矩阵

FPNV定位矩阵对于评估半导体和IC封装材料市场至关重要。我们检视与业务策略和产品满意度相关的关键指标，以对供应商进行全面评估。这种深入的分析使用户能够根据自己的要求做出明智的决策。根据评估，供应商被分为四个成功程度不同的像限：前沿（F）、探路者（P）、利基（N）和重要（V）。

市场占有率分析

市场占有率分析是一种综合工具，可以对半导体和IC封装材料市场供应商的现状进行深入而深入的研究。全面比较和分析供应商在整体收益、基本客群和其他关键指标方面的贡献，以便更好地了解公司的绩效及其在争夺市场占有率时面临的挑战。此外，该分析还提供了对该行业竞争特征的宝贵见解，包括在研究基准年观察到的累积、分散主导地位和合併特征等因素。这种详细程度的提高使供应商能够做出更明智的决策并制定有效的策略，从而在市场上获得竞争优势。

该报告对以下几个方面提供了宝贵的见解：

1. 市场渗透率：提供有关主要企业所服务的市场的全面资讯。

2. 市场开拓：我们深入研究利润丰厚的新兴市场，并分析其在成熟细分市场的渗透率。

3. 市场多元化：提供有关新产品发布、开拓地区、最新发展和投资的详细资讯。

4. 竞争评估和情报：对主要企业的市场占有率、策略、产品、认证、监管状况、专利状况和製造能力进行全面评估。

5. 产品开发与创新：提供对未来技术、研发活动和突破性产品开发的见解。

本报告解决了以下关键问题：

1.半导体/ IC封装材料市场规模及预测如何？

2.半导体和IC封装材料市场预测期间需要考虑投资的产品、细分市场、应用和领域有哪些？

3.半导体/ IC封装材料市场的技术趋势和法规结构是什么？

4.半导体/ IC封装材料市场主要厂商的市场占有率是多少？

5.进入半导体/ IC封装材料市场的合适型态和策略手段是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 家用电子电器对半导体和IC封装材料的需求增加
      • 支持创新包装材料的技术不断进步
      • 电子设备领域小型化、高密度化进展
    • 抑制因素
      • 半导体产业外包和测试中的智慧财产权问题
    • 机会
      • 与先进技术融合
      • 介绍 5G 和自动驾驶汽车
    • 任务
      • 加强有关材料使用和处置的环境法规
  • 市场区隔分析
    • 类型：陶瓷封装，适合高效能、高可靠性应用
    • 最终用途：具有良好电绝缘性和良好温度控管的家用电子电器的普及
  • 市场扰动分析
  • 波特五力分析
  • 价值炼和关键路径分析
  • 价格分析
  • 技术分析
  • 专利分析
  • 贸易分析
  • 法规结构分析

第六章半导体/ IC封装材料市场：依类型

  • 键合线
  • 陶瓷封装
  • 晶片贴装材料
  • 封装树脂
  • 导线架
  • 有机基材
  • 焊球
  • 导热材料

第七章半导体/ IC封装材料市场：依技术分类

  • 双扁平无引线
  • 双列直插式
  • 网格阵列
  • 四方扁平无引线
  • 四方扁平封装
  • 小外形封装

第八章半导体/ IC封装材料市场：依最终用途分类

  • 航太和国防
  • 车
  • 家用电器
  • 卫生保健
  • 资讯科技和通讯

第九章 美洲半导体/ IC封装材料市场

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第十章亚太半导体/ IC封装材料市场

  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第十一章 欧洲、中东、非洲半导体/ IC封装材料市场

  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十二章竞争格局

  • 2023 年市场占有率分析
  • FPNV 定位矩阵，2023
  • 竞争情境分析
    • Amkor 与 Apple 结成策略联盟，建造最大的先进半导体封装厂
    • Resonac 在硅谷开设新的封装解决方案中心，为半导体创新奠定基础
    • 半导体封装的策略扩张与创新
  • 战略分析和建议

第13章竞争产品组合

  • 主要企业简介
  • 主要产品系列
Product Code: MRR-7A22CB0E5917

[186 Pages Report] The Semiconductor & IC Packaging Materials Market size was estimated at USD 38.44 billion in 2023 and expected to reach USD 42.16 billion in 2024, at a CAGR 10.35% to reach USD 76.64 billion by 2030.

Semiconductor and Integrated Circuit (IC) packaging materials include a broad range of substances and components used to encase and protect electronic circuits or semiconductors. These materials serve as a physical shield and play critical roles in heat dissipation, electrical insulation, and enhancing the reliability and performance of the semiconductors. The expansion in their use is primarily driven by the burgeoning demand for consumer electronics, telecommunications equipment, and automotive electronics. As technology advances and electronic devices become more compact and powerful, the need for efficient, durable, and heat-resistant packaging materials has escalated. However, the industry faces challenges, notably concerning the environmental impact of some packaging materials and the quest for materials that can withstand increasingly high temperatures and harsh operating conditions. Addressing these disadvantages requires ongoing research and development to discover more sustainable materials and innovative packaging techniques that reduce waste and enhance performance. Nevertheless, the advent of 5G technology, the Internet of Things (IoT), artificial intelligence (AI), and the increasing adoption of electric vehicles (EVs) are expected to spur further growth. Moreover, the drive towards miniaturized devices with higher computing power signals a growing demand for advanced packaging solutions that can accommodate these trends. Innovations in materials science, such as the development of eco-friendly and high thermal conductivity materials, are poised to open new avenues for industry expansion, catering to the evolving needs of the technology landscape.

KEY MARKET STATISTICS
Base Year [2023] USD 38.44 billion
Estimated Year [2024] USD 42.16 billion
Forecast Year [2030] USD 76.64 billion
CAGR (%) 10.35%

Type: Suitability of ceramic packages for high-performance and high-reliability applications

Bonding wires are thin metal wires, often made from gold, aluminum, or copper, used to create electrical connections within a semiconductor device. They play a critical role in the functionality of the semiconductor, facilitating the flow of electrical signals and power within the chip and between the chip and the outside world. Ceramic packages are protective casings used to enclose semiconductor chips, offering high levels of protection against environmental factors such as moisture, temperature changes, and physical stress. Ceramics are preferred for their excellent thermal and electrical insulation properties, making them suitable for high-performance and high-reliability applications. Attach materials are adhesives or metal alloys used to bind the semiconductor die (or chip) to the substrate or package. They are crucial for both mechanical support and thermal management, ensuring the die remains firmly in place while also facilitating heat dissipation away from the chip.

Encapsulation resins are polymers used to encapsulate and protect the semiconductor chip and its internal connections. Leadframes are the metal structures within a semiconductor package that provide mechanical support and electrical connections between the silicon chip & the external circuitry. They are essential for the distribution of power and signals to and from the chip, playing a significant role in the device's overall performance. An organic substrate acts as the base layer upon which semiconductor devices are built. Made from organic polymers and designed to support various electronic components, these substrates offer a platform for interconnections within the semiconductor package, influencing the electrical performance and integration level of the final product. Solder balls, used in ball grid array (BGA) packaging, are tiny spheres of solder that form the electrical connections between the semiconductor package and the printed circuit board (PCB). They are critical for establishing a reliable physical and electrical interface between the chip package and its external environment. Thermal interface materials (TIMs) are substances inserted between the semiconductor device and its heat sink to enhance thermal conduction. By improving heat transfer efficiency from the chip to the heat-dissipating components, TIMs play a pivotal role in managing the operational temperature of semiconductor devices, ensuring they remain within safe operating limits.

End-use: Proliferation in consumer electronics for excellent electrical insulation and good thermal management

In the Aerospace & Defense sector, Semiconductor packaging materials used need to withstand extreme conditions, such as high radiation, extreme temperatures, and mechanical stress. High-performance ceramics and robust compound materials are commonly utilized to ensure the longevity and reliability of semiconductors in aerospace and defense applications. These materials enable crucial functions in navigation, communication, and surveillance systems. The automotive industry is witnessing a transformation with the increase in electronic components used in vehicles. Packaging materials in the automotive sector must ensure high reliability over the vehicle's lifespan, often in harsh environments. Materials used must resist vibrations, high temperatures, and moisture. Silicones and advanced polymers, known for their durability and heat resistance, are widely used. Consumer electronics, including smartphones, laptops, and wearables, demand semiconductor packaging materials that allow for lightweight, compact, and efficient designs. The focus here is on enhancing performance while minimizing space. Epoxy resins and plastic compounds, offering excellent electrical insulation and good thermal management, are preferred. In the healthcare sector, semiconductors are used in a wide array of applications, from diagnostic equipment to wearable health monitors. Packaging materials in healthcare devices must meet stringent criteria for biocompatibility, sterilization compatibility, and reliability. Specialized polymers and ceramics, safe for human exposure and capable of operating reliably in medical environments, are key to protecting and enhancing the performance of semiconductors in medical devices. In IT & telecommunications, the demand for faster data processing and communication drives the need for advanced semiconductor packaging materials. These materials must support high-speed signal transmission while dissipating heat efficiently to prevent overheating. High thermal conductivity materials including silicon carbide and advanced polymers are used to meet these needs, ensuring reliable and efficient operation of data centers, servers, and telecommunication equipment.

Regional Insights

In the Americas, the United States plays a leading role in the semiconductor packaging materials market in the face of advanced R&D capabilities and the presence of major semiconductor manufacturers. The region is experiencing a shift towards more sophisticated packaging solutions, driven by the demand for higher performance and smaller, more energy-efficient devices. Materials such as silicon, plastic, and glass, along with advanced composites, are heavily used. Increased investment in renewable energy & electric vehicles is also shaping the demand for semiconductor packaging materials in this region. The EMEA region presents a diverse scenario due to its varied economic and technological maturity across countries. Europe is at the forefront, characterized by its robust automotive and industrial sectors, which demand high-reliability semiconductor packages. Advanced packaging technologies that can withstand harsh environments are particularly in demand. The Middle East and Africa, though growing, represent a smaller segment of the global market but are rapidly evolving with investments in telecommunications and infrastructure development. The Asia Pacific region showcases the most dynamic and fastest-growing landscape for semiconductor and IC packaging materials, led by countries including China, South Korea, Taiwan, and Japan. These countries host some of the world's largest electronics manufacturers, driving the demand for a wide range of packaging materials. The region's market is characterized by a high volume of consumer electronics production, including smartphones, tablets, and other portable devices, requiring innovative packaging solutions that are cost-effective yet high-performing.

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Semiconductor & IC Packaging Materials Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Semiconductor & IC Packaging Materials Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Semiconductor & IC Packaging Materials Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Advanced Semiconductor Engineering Inc, AMETEK Electronic Components & Packaging, Amtech Microelectronics, Inc., ASE Group, California Fine Wire Co., Canatu Oy, Ceramtec GmbH, Chipbond Technology Corporation, Chipmos Technologies Inc., Deca Technologies, FlipChip International LLC, Fujitsu Semiconductor Limited, Henkel AG & Co. KGaA, Intel Corporation, Interconnect Systems Inc. (ISI), Kyocera Chemical Corporation, Microchip Technology, Powertech Technology, Inc., Samsung Electronics Co. Ltd, Siemens AG, Sumitomo Chemical Co., Ltd., Taiwan Semiconductor Manufacturing Company, Tianshui Huatian Technology Co., Ltd., Toray Industries, Inc., Unisem Berhad, and UTAC Group.

Market Segmentation & Coverage

This research report categorizes the Semiconductor & IC Packaging Materials Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Type
    • Bonding wires
    • Ceramic Packages
    • Die Attach Materials
    • Encapsulation Resins
    • Leadframes
    • Organic substrate
    • Solder Balls
    • Thermal Interface Materials
  • Technology
    • Dual Flat No-leads
    • Dual-in-line
    • Grid Array
    • Quad Flat no-leads
    • Quad Flat Packages
    • Small Outline Package
  • End-use
    • Aerospace & Defense
    • Automotive
    • Consumer Electronics
    • Healthcare
    • IT & Telecommunication
  • Region
    • Americas
      • Argentina
      • Brazil
      • Canada
      • Mexico
      • United States
        • California
        • Florida
        • Illinois
        • New York
        • Ohio
        • Pennsylvania
        • Texas
    • Asia-Pacific
      • Australia
      • China
      • India
      • Indonesia
      • Japan
      • Malaysia
      • Philippines
      • Singapore
      • South Korea
      • Taiwan
      • Thailand
      • Vietnam
    • Europe, Middle East & Africa
      • Denmark
      • Egypt
      • Finland
      • France
      • Germany
      • Israel
      • Italy
      • Netherlands
      • Nigeria
      • Norway
      • Poland
      • Qatar
      • Russia
      • Saudi Arabia
      • South Africa
      • Spain
      • Sweden
      • Switzerland
      • Turkey
      • United Arab Emirates
      • United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Semiconductor & IC Packaging Materials Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Semiconductor & IC Packaging Materials Market?

3. What are the technology trends and regulatory frameworks in the Semiconductor & IC Packaging Materials Market?

4. What is the market share of the leading vendors in the Semiconductor & IC Packaging Materials Market?

5. Which modes and strategic moves are suitable for entering the Semiconductor & IC Packaging Materials Market?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Rising demand for semiconductor and IC packaging materials for consumer electronics
      • 5.1.1.2. Relentless advancement in technology supporting innovative packaging materials
      • 5.1.1.3. Growing miniaturization and densification in electronic sector
    • 5.1.2. Restraints
      • 5.1.2.1. IP Concerns of semiconductor industry in outsourcing and testing
    • 5.1.3. Opportunities
      • 5.1.3.1. Integration with advance technologies
      • 5.1.3.2. Adoption of 5G and autonomous vehicles
    • 5.1.4. Challenges
      • 5.1.4.1. Increasing environmental regulations regarding the use and disposal of materials
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Type: Suitability of ceramic packages for high-performance and high-reliability applications
    • 5.2.2. End-use: Proliferation in consumer electronics for excellent electrical insulation and good thermal management
  • 5.3. Market Disruption Analysis
  • 5.4. Porter's Five Forces Analysis
    • 5.4.1. Threat of New Entrants
    • 5.4.2. Threat of Substitutes
    • 5.4.3. Bargaining Power of Customers
    • 5.4.4. Bargaining Power of Suppliers
    • 5.4.5. Industry Rivalry
  • 5.5. Value Chain & Critical Path Analysis
  • 5.6. Pricing Analysis
  • 5.7. Technology Analysis
  • 5.8. Patent Analysis
  • 5.9. Trade Analysis
  • 5.10. Regulatory Framework Analysis

6. Semiconductor & IC Packaging Materials Market, by Type

  • 6.1. Introduction
  • 6.2. Bonding wires
  • 6.3. Ceramic Packages
  • 6.4. Die Attach Materials
  • 6.5. Encapsulation Resins
  • 6.6. Leadframes
  • 6.7. Organic substrate
  • 6.8. Solder Balls
  • 6.9. Thermal Interface Materials

7. Semiconductor & IC Packaging Materials Market, by Technology

  • 7.1. Introduction
  • 7.2. Dual Flat No-leads
  • 7.3. Dual-in-line
  • 7.4. Grid Array
  • 7.5. Quad Flat no-leads
  • 7.6. Quad Flat Packages
  • 7.7. Small Outline Package

8. Semiconductor & IC Packaging Materials Market, by End-use

  • 8.1. Introduction
  • 8.2. Aerospace & Defense
  • 8.3. Automotive
  • 8.4. Consumer Electronics
  • 8.5. Healthcare
  • 8.6. IT & Telecommunication

9. Americas Semiconductor & IC Packaging Materials Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Semiconductor & IC Packaging Materials Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Semiconductor & IC Packaging Materials Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
    • 12.3.1. Amkor and Apple Forge Strategic Alliance to Build Largest Advanced Semiconductor Packaging Facility
    • 12.3.2. Resonac Sets Foundation for Semiconductor Innovation with New Packaging Solution Center in Silicon Valley
    • 12.3.3. Strategic Expansion and Innovation in Semiconductor Packaging
  • 12.4. Strategy Analysis & Recommendation

13. Competitive Portfolio

  • 13.1. Key Company Profiles
  • 13.2. Key Product Portfolio

LIST OF FIGURES

  • FIGURE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET RESEARCH PROCESS
  • FIGURE 2. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2023 VS 2030 (%)
  • FIGURE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET DYNAMICS
  • FIGURE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
  • FIGURE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2023 VS 2030 (%)
  • FIGURE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 13. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 14. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 15. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 16. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 17. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 18. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 20. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 21. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 22. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2023 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2024-2030 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 6. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BONDING WIRES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BONDING WIRES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CERAMIC PACKAGES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CERAMIC PACKAGES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH MATERIALS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH MATERIALS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULATION RESINS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULATION RESINS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADFRAMES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADFRAMES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 19. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ORGANIC SUBSTRATE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 20. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ORGANIC SUBSTRATE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 21. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALLS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 22. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALLS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 23. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY THERMAL INTERFACE MATERIALS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 24. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY THERMAL INTERFACE MATERIALS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 25. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 26. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 27. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DUAL FLAT NO-LEADS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 28. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DUAL FLAT NO-LEADS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 29. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DUAL-IN-LINE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 30. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DUAL-IN-LINE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 31. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY GRID ARRAY, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 32. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY GRID ARRAY, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 33. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT NO-LEADS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 34. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT NO-LEADS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 35. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT PACKAGES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 36. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT PACKAGES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 37. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMALL OUTLINE PACKAGE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 38. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMALL OUTLINE PACKAGE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 39. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 40. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 41. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 42. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 43. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 44. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 45. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 46. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 47. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 48. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 49. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IT & TELECOMMUNICATION, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 50. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IT & TELECOMMUNICATION, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 51. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 52. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 53. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 54. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 55. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 56. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 57. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
  • TABLE 58. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
  • TABLE 59. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 60. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 61. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 62. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 63. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 64. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 65. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 66. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 67. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 68. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 69. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 70. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 71. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 72. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 73. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 74. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 75. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 76. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 77. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 78. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 79. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 80. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 81. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 82. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 83. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 84. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 85. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 86. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 87. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 88. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 89. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2018-2023 (USD MILLION)
  • TABLE 90. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2024-2030 (USD MILLION)
  • TABLE 91. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 92. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 93. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 94. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 95. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 96. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 97. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
  • TABLE 98. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
  • TABLE 99. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 100. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 101. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 102. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 103. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 104. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 105. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 106. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 107. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 108. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 109. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 110. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 111. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 112. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 113. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 114. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 115. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 116. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 117. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 118. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 119. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 120. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 121. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 122. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 123. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 124. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 125. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 126. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 127. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 128. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 129. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 130. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 131. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 132. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 133. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 134. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 135. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 136. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 137. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 138. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 139. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 140. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 141. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 142. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 143. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 144. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 145. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 146. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 147. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 148. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 149. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 150. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 151. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 152. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 153. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 154. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 155. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 156. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 157. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 158. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 159. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 160. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 161. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 162. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 163. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 164. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 165. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 166. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 167. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 168. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 169. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 170. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 171. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 172. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 173. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 174. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 175. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 176. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 177. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
  • TABLE 178. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
  • TABLE 179. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 180. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 181. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 182. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 183. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 184. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 185. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 186. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 187. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 188. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 189. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 190. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 191. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 192. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 193. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 194. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 195. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 196. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 197. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 198. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 199. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 200. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 201. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 202. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 203. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 204. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 205. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 206. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 207. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 208. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 209. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 210. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 211. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 212. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 213. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 214. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 215. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 216. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 217. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 218. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 219. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 220. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 221. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 222. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 223. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 224. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 225. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 226. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 227. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 228. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 229. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 230. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 231. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 232. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 233. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 234. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 235. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 236. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 237. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 238. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 239. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 240. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 241. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 242. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 243. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 244. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 245. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 246. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 247. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 248. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 249. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 250. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 251. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 252. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 253. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 254. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 255. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 256. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 257. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 258. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 259. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 260. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 261. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 262. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 263. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 264. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 265. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 266. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 267. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 268. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 269. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 270. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 271. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 272. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 273. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 274. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 275. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 276. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 277. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 278. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 279. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 280. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 281. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 282. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 283. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 284. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 285. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 286. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 287. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 288. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 289. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 290. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 291. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 292. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 293. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 294. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 295. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 296. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 297. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 298. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARK