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市场调查报告书
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1596385

半导体封装材料市场：按类型、封装技术划分 - 2025-2030 年全球预测

Semiconductor Packaging Materials Market by Type (Bonding Wires, Ceramic Packages, Die Attach Materials), Packaging Technology (Dual Flat No Leads, Dual In Line Package, Grid Array) - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 192 Pages | 商品交期: 最快1-2个工作天内

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2023年半导体封装材料市场规模为406亿美元，预计2024年将达450.8亿美元，复合年增长率为11.53%，预计2030年将达871.6亿美元。

半导体封装材料在封装、保护和连接积体电路和其他半导体元件方面发挥至关重要的作用。包括有机基板、键合线、导线架、封装、底部填充材料和晶片连接材料等材料。这些材料对于保护敏感电子元件免受环境损害、提供电气连接和辅助温度控管至关重要，这使得它们在从家用电子电器到汽车再到工业领域的广泛应用中变得至关重要。通讯、航太、汽车和医疗等最终用途产业正在迅速发展，导致对稳健和创新包装解决方案的需求不断增长。市场成长很大程度上受到对更小、更复杂电子设备的需求不断增长、物联网应用的快速增长以及3D封装、系统级封装（SiP）和小晶片异质整合等先进封装技术的开拓的影响。然而，严格的环境法规、高製造成本和供应链中断等挑战是限制因素。此外，市场还面临与材料相容性和热耐久性相关的技术挑战。生物分解性材料和先进奈米材料的创新为市场差异化提供了潜在的机会。智慧聚合物化合物和软性电子产品等领域的研究和开发可以释放新的可能性。为了利用这些机会，企业应该投资于永续材料的开发，并加强与环保实践的合作。此外，与技术创新者的合作和伙伴关係可以加快新颖解决方案的上市时间。儘管存在固有的挑战，半导体封装材料市场本质上是动态的，并受到不断发展的技术趋势和不断增长的全球电子产品渗透率的推动。因此，利用尖端研发并策略性地专注于永续实践的公司可以从该细分市场的新成长轨迹中受益。

主要市场统计
基准年[2023] 406亿美元
预测年份 [2024] 450.8亿美元
预测年份 [2030] 871.6亿美元
复合年增长率（%） 11.53%

市场动态：揭示快速发展的半导体封装材料市场的关键市场洞察

半导体封装材料市场正因供需的动态交互作用而转变。透过了解这些不断变化的市场动态，公司可以准备好做出明智的投资决策、完善策略决策并抓住新的商机。全面了解这些趋势可以帮助企业降低政治、地理、技术、社会和经济领域的风险，同时也能帮助企业了解消费行为及其对製造业的影响。

  • 市场驱动因素
    • 对消费性电子产品和穿戴式装置的需求增加
    • 製造业快速数位化
    • 加大半导体製造投资
  • 市场限制因素
    • 半导体封装材料价格波动
  • 市场机会
    • 透过研发改良半导体封装技术
    • 设备和电子元件小型化的需求
  • 市场问题
    • 封装技术复杂性

波特五力：驾驭半导体封装材料市场的策略工具

波特的五力框架是了解市场竞争格局的重要工具。波特的五力框架描述了评估公司竞争和探索策略机会的清晰方法。该框架可帮助公司评估市场动态并确定新业务的盈利。这些见解使公司能够利用自己的优势，解决弱点并避免潜在的挑战，从而确保更强大的市场地位。

PESTLE分析：了解半导体封装材料市场的外部影响

外部宏观环境因素对半导体封装材料市场的表现动态起着至关重要的作用。对政治、经济、社会、技术、法律和环境因素的分析提供了应对这些影响所需的资讯。透过调查 PESTLE 因素，公司可以更了解潜在的风险和机会。这种分析可以帮助公司预测法规、消费者偏好和经济趋势的变化，并帮助他们做出积极主动的决策。

市场占有率分析：了解半导体封装材料市场竞争格局

对半导体封装材料市场的详细市场占有率分析可以对供应商绩效进行全面评估。公司可以透过比较收益、客户群和成长率等关键指标来揭示其竞争地位。该分析揭示了市场集中、细分和整合的趋势，为供应商提供了製定策略决策所需的洞察力，使他们能够在日益激烈的竞争中占有一席之地。

FPNV定位矩阵：半导体封装材料市场供应商绩效评估

FPNV定位矩阵是评估半导体封装材料市场供应商的重要工具。此矩阵允许业务组织根据供应商的商务策略和产品满意度评估供应商，从而做出符合其目标的明智决策。这四个象限使您能够清晰、准确地划分供应商，并确定最能满足您的策略目标的合作伙伴和解决方案。

策略分析与建议：规划半导体封装材料市场的成功之路

对于旨在加强其在全球市场的影响力的公司来说，对半导体封装材料市场的策略分析至关重要。透过审查关键资源、能力和绩效指标，公司可以识别成长机会并努力改进。这种方法使您能够克服竞争格局中的挑战，利用新的商机并取得长期成功。

该报告对涵盖关键焦点细分市场的市场进行了全面分析。

1. 市场渗透率：详细检视当前市场环境，主要企业的广泛资料，评估其在市场中的影响力和整体影响力。

2. 市场开拓：辨识新兴市场的成长机会，评估现有细分市场的扩张潜力，并提供未来成长的策略蓝图。

3. 市场多元化：分析近期产品发布、开拓地区、主要产业进展、塑造市场的策略投资。

4. 竞争评估与情报：彻底分析竞争格局，检验市场占有率、业务策略、产品系列、认证、监理核准、专利趋势、主要企业的技术进步等。

5. 产品开发与创新：重点在于有望推动未来市场成长的最尖端科技、研发活动和产品创新。

我们也回答重要问题，以帮助相关人员做出明智的决策。

1.目前的市场规模和未来的成长预测是多少？

2. 哪些产品和地区提供最佳投资机会？

3.塑造市场的关键技术趋势和监管影响是什么？

4.主要厂商的市场占有率和竞争地位如何？

5. 推动供应商市场进入和退出策略的收益来源和策略机会是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 对消费性电子产品和穿戴式装置的需求增加
      • 製造业快速数位化
      • 增加半导体生产投资
    • 抑制因素
      • 半导体封装材料价格波动
    • 机会
      • 透过研究开发和改进半导体封装技术
      • 设备及电子元件小型化的需求
    • 任务
      • 封装技术涉及的技术复杂性
  • 市场区隔分析
  • 波特五力分析
  • PESTEL分析
    • 政治
    • 经济
    • 社会
    • 科技
    • 法律
    • 环境

第六章半导体封装材料市场：依类型

  • 介绍
  • 键合线
  • 陶瓷封装
  • 晶片贴装材料
  • 封装树脂
  • 导线架
  • 有机基材物
  • 焊球
  • 导热材料

第七章半导体封装材料市场：依封装技术分类

  • 介绍
  • 双扁平无引线
  • 双列直插式封装
  • 网格阵列
  • 四方扁平封装
  • 小外形封装

第八章美洲半导体封装材料市场

  • 介绍
  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第九章亚太半导体封装材料市场

  • 介绍
  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第十章欧洲/中东/非洲半导体封装材料市场

  • 介绍
  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十一章竞争格局

  • 2023 年市场占有率分析
  • FPNV 定位矩阵，2023
  • 竞争情境分析
  • 战略分析和建议

公司名单

  • Amkor Technology Inc.
  • ChipMOS Technologies Inc.
  • DuPont de Nemours Inc.
  • Henkel AG & Co. KGaA
  • Heraeus Holding GmbH
  • Hitachi Ltd.
  • Honeywell International Inc.
  • Indium Corporation
  • IQE PLC
  • Kyocera Corp.
  • LG Innotek
  • Nan Ya PCB Co. Ltd.
  • Nippon Steel Corp.
  • Powertech Technology Inc.
  • Shin Etsu Chemical Co., Ltd.
Product Code: MRR-957C47F929D9

The Semiconductor Packaging Materials Market was valued at USD 40.60 billion in 2023, expected to reach USD 45.08 billion in 2024, and is projected to grow at a CAGR of 11.53%, to USD 87.16 billion by 2030.

Semiconductor packaging materials play a critical role in the encapsulation, protection, and connection of integrated circuits and other semiconductor devices. The scope encompasses materials such as organic substrates, bonding wires, lead frames, encapsulants, underfill materials, and die-attach materials, among others. These materials are essential for safeguarding sensitive electronic components from environmental damages, providing electrical connections, and aiding thermal management, making them indispensable in applications ranging from consumer electronics to automotive and industrial sectors. End-use industries such as telecommunication, aerospace, automotive, and healthcare are advancing rapidly, contributing to the heightened demand for robust and innovative packaging solutions. Market growth is significantly influenced by the rising demand for miniaturized and sophisticated electronic devices, the surge in IoT applications, and developments in advanced packaging technologies like 3D packaging, System-in-Package (SiP), and chiplet heterogenous integration. Nonetheless, challenges including stringent environmental regulations, high production costs, and supply chain disruptions pose limitations. Moreover, the market faces technical difficulties related to material compatibility and thermal endurance. Innovations in biodegradable materials and advanced nanomaterials present potential opportunities for differentiation within the market. R&D in areas such as smart polymer compounds and flexible electronics could unlock new potentials. To tap into these opportunities, businesses should invest in sustainable material development and enhance their alignment with eco-friendly practices. Furthermore, collaborations and partnerships with technology innovators can accelerate time-to-market for novel solutions. Despite its inherent challenges, the semiconductor packaging materials market is inherently dynamic, driven by evolving technology trends and increasing electronic device penetration globally. Therefore, businesses positioned to leverage cutting-edge R&D, along with a strategic focus on sustainable practices, stand to gain from emerging growth trajectories in this sector.

KEY MARKET STATISTICS
Base Year [2023] USD 40.60 billion
Estimated Year [2024] USD 45.08 billion
Forecast Year [2030] USD 87.16 billion
CAGR (%) 11.53%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Semiconductor Packaging Materials Market

The Semiconductor Packaging Materials Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Increasing demand for consumer electronic and wearable devices
    • Rapid digitalization of manufacturing sectors
    • Rising investments in semiconductor production
  • Market Restraints
    • Price volatility of semiconductor packaging materials
  • Market Opportunities
    • Developments and improvements in semiconductor packaging technology through research
    • Demand for miniaturization of devices and electronic components
  • Market Challenges
    • Technical complexities involved in packaging technologies

Porter's Five Forces: A Strategic Tool for Navigating the Semiconductor Packaging Materials Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Semiconductor Packaging Materials Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Semiconductor Packaging Materials Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Semiconductor Packaging Materials Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Semiconductor Packaging Materials Market

A detailed market share analysis in the Semiconductor Packaging Materials Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Semiconductor Packaging Materials Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Semiconductor Packaging Materials Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Semiconductor Packaging Materials Market

A strategic analysis of the Semiconductor Packaging Materials Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Semiconductor Packaging Materials Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology Inc., ChipMOS Technologies Inc., DuPont de Nemours Inc., Henkel AG & Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corporation, IQE PLC, Kyocera Corp., LG Innotek, Nan Ya PCB Co. Ltd., Nippon Steel Corp., Powertech Technology Inc., and Shin Etsu Chemical Co., Ltd..

Market Segmentation & Coverage

This research report categorizes the Semiconductor Packaging Materials Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across Bonding Wires, Ceramic Packages, Die Attach Materials, Encapsulation Resins, Leadframes, Organic Substrates, Solder Balls, and Thermal Interface Materials.
  • Based on Packaging Technology, market is studied across Dual Flat No Leads, Dual In Line Package, Grid Array, Quad Flat Package, and Small Outline Package.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Increasing demand for consumer electronic and wearable devices
      • 5.1.1.2. Rapid digitalization of manufacturing sectors
      • 5.1.1.3. Rising investments in semiconductor production
    • 5.1.2. Restraints
      • 5.1.2.1. Price volatility of semiconductor packaging materials
    • 5.1.3. Opportunities
      • 5.1.3.1. Developments and improvements in semiconductor packaging technology through research
      • 5.1.3.2. Demand for miniaturization of devices and electronic components
    • 5.1.4. Challenges
      • 5.1.4.1. Technical complexities involved in packaging technologies
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Semiconductor Packaging Materials Market, by Type

  • 6.1. Introduction
  • 6.2. Bonding Wires
  • 6.3. Ceramic Packages
  • 6.4. Die Attach Materials
  • 6.5. Encapsulation Resins
  • 6.6. Leadframes
  • 6.7. Organic Substrates
  • 6.8. Solder Balls
  • 6.9. Thermal Interface Materials

7. Semiconductor Packaging Materials Market, by Packaging Technology

  • 7.1. Introduction
  • 7.2. Dual Flat No Leads
  • 7.3. Dual In Line Package
  • 7.4. Grid Array
  • 7.5. Quad Flat Package
  • 7.6. Small Outline Package

8. Americas Semiconductor Packaging Materials Market

  • 8.1. Introduction
  • 8.2. Argentina
  • 8.3. Brazil
  • 8.4. Canada
  • 8.5. Mexico
  • 8.6. United States

9. Asia-Pacific Semiconductor Packaging Materials Market

  • 9.1. Introduction
  • 9.2. Australia
  • 9.3. China
  • 9.4. India
  • 9.5. Indonesia
  • 9.6. Japan
  • 9.7. Malaysia
  • 9.8. Philippines
  • 9.9. Singapore
  • 9.10. South Korea
  • 9.11. Taiwan
  • 9.12. Thailand
  • 9.13. Vietnam

10. Europe, Middle East & Africa Semiconductor Packaging Materials Market

  • 10.1. Introduction
  • 10.2. Denmark
  • 10.3. Egypt
  • 10.4. Finland
  • 10.5. France
  • 10.6. Germany
  • 10.7. Israel
  • 10.8. Italy
  • 10.9. Netherlands
  • 10.10. Nigeria
  • 10.11. Norway
  • 10.12. Poland
  • 10.13. Qatar
  • 10.14. Russia
  • 10.15. Saudi Arabia
  • 10.16. South Africa
  • 10.17. Spain
  • 10.18. Sweden
  • 10.19. Switzerland
  • 10.20. Turkey
  • 10.21. United Arab Emirates
  • 10.22. United Kingdom

11. Competitive Landscape

  • 11.1. Market Share Analysis, 2023
  • 11.2. FPNV Positioning Matrix, 2023
  • 11.3. Competitive Scenario Analysis
  • 11.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Amkor Technology Inc.
  • 2. ChipMOS Technologies Inc.
  • 3. DuPont de Nemours Inc.
  • 4. Henkel AG & Co. KGaA
  • 5. Heraeus Holding GmbH
  • 6. Hitachi Ltd.
  • 7. Honeywell International Inc.
  • 8. Indium Corporation
  • 9. IQE PLC
  • 10. Kyocera Corp.
  • 11. LG Innotek
  • 12. Nan Ya PCB Co. Ltd.
  • 13. Nippon Steel Corp.
  • 14. Powertech Technology Inc.
  • 15. Shin Etsu Chemical Co., Ltd.

LIST OF FIGURES

  • FIGURE 1. SEMICONDUCTOR PACKAGING MATERIALS MARKET RESEARCH PROCESS
  • FIGURE 2. SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 11. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 13. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. ASIA-PACIFIC SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 15. ASIA-PACIFIC SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. SEMICONDUCTOR PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 19. SEMICONDUCTOR PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR PACKAGING MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. SEMICONDUCTOR PACKAGING MATERIALS MARKET DYNAMICS
  • TABLE 7. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY BONDING WIRES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY CERAMIC PACKAGES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH MATERIALS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULATION RESINS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY LEADFRAMES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY ORGANIC SUBSTRATES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALLS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY THERMAL INTERFACE MATERIALS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY DUAL FLAT NO LEADS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY DUAL IN LINE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY GRID ARRAY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY SMALL OUTLINE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 22. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 23. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 24. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 25. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 26. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 27. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 28. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 29. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 30. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 31. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 32. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 33. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 34. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 35. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 36. ASIA-PACIFIC SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 37. ASIA-PACIFIC SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 38. ASIA-PACIFIC SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 39. AUSTRALIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 40. AUSTRALIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 41. CHINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 42. CHINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 43. INDIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 44. INDIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 45. INDONESIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 46. INDONESIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 47. JAPAN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 48. JAPAN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 49. MALAYSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 50. MALAYSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 51. PHILIPPINES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 52. PHILIPPINES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 53. SINGAPORE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 54. SINGAPORE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 55. SOUTH KOREA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 56. SOUTH KOREA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 57. TAIWAN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 58. TAIWAN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 59. THAILAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 60. THAILAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 61. VIETNAM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 62. VIETNAM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 63. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 64. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 65. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 66. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 67. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 68. EGYPT SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 69. EGYPT SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 70. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 71. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 72. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 73. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 74. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 75. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 76. ISRAEL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 77. ISRAEL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 78. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 79. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 80. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 81. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 82. NIGERIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 83. NIGERIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 84. NORWAY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 85. NORWAY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 86. POLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 87. POLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 88. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 89. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 90. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 91. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 92. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 93. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 94. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 95. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 96. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 97. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 98. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 99. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 100. SWITZERLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 101. SWITZERLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 102. TURKEY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 103. TURKEY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 104. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 105. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 106. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 107. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 108. SEMICONDUCTOR PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 109. SEMICONDUCTOR PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023