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市场调查报告书
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1496041

半导体记忆体市场：2024年至2029年预测

Semiconductor Memory Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 115 Pages | 商品交期: 最快1-2个工作天内

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简介目录

半导体记忆体市场预计将从 2022 年的 1,556.8 亿美元增至 2029 年的 1,634.13 亿美元，预测期内复合年增长率为 0.69%。

半导体元件在汽车、家用电器和 IT/通讯等各个行业中的使用不断增加，预计将推动该市场的全球成长。半导体是重要的电子设备，使用积体电路 (IC) 技术充当电脑记忆体和晶片。半导体技术的进步，例如精製程序、能源效率和晶片容量的优化，为适合各行业的创新记忆体解决方案打开了大门。

此外，随着智慧型手机和其他行动装置的普及，高效能可以透过提供无缝的用户体验、快速的应用程式载入时间和无缝的多工功能来满足现代用户不断变化的需求和愿望，对晶片的需求前所未有。例如，根据国际数据公司（IDC）全球季度手机追踪报告，印度智慧型手机市场2023年出货量为1.46亿部，名目与前一年同期比较为1%。上半年大幅下降10%，但下半年年增11%。 23年第4季出货量为3,700万台，较去年同期成长26%。这主要是由于下半年出货量高于预期，包括推出多款新车型。

此外，穿戴式装置、智慧型手机和电子产品等创新产品中积极采用以记忆体为中心的组件也推动了市场成长。此外，电子和汽车产业对 DRAM 和快闪 ROM 等半导体元件日益依赖也明显的推动了对整合晶片和装置的需求。全球对智慧型设备、消费性电子产品、智慧型手机和工作站的需求强调了对具有先进技术的晶片的需求。因此，市场正在经历一个显着扩张的时期，为涉足该领域的公司提供了许多商机。

汽车行业不断增长的需求预计将推动市场成长。

由于其卓越的性能和低功耗，记忆体解决方案越来越多地用于汽车安全系统。记忆体解决方案对于开发自动驾驶功能至关重要，尤其是全面的汽车资讯娱乐 (IVI) 系统和车联网 (V2X) 连线。这些技术需要强大的记忆体解决方案，而三星等公司处于领先地位。因此，这些因素预计将在预测期内推动全球半导体记忆体市场的成长。

此外，由于现代汽车中软体和电子元件的使用不断增加，市场正在扩大。随着汽车日益互联并与智慧技术集成，对大容量记忆体解决方案的需求不断增加，从而推动了市场成长。由于混合动力汽车和电动车 (EV) 的普及，市场正在不断扩大，这需要先进的记忆体系统来提高能源效率和电池管理。例如，根据国际能源总署的数据，美国纯电动汽车保有量从2021年的150万辆增加到2022年的210万辆。

此外，人工智慧（AI）和机器学习（ML）在汽车系统中越来越多地用于自动驾驶和预测性维护等应用，也是市场成长的积极因素。此外，製造商的最新创新使他们能够在快速变化的市场中保持竞争力。例如，2023年7月，全球大型公司的尖端半导体技术供应商三星电子宣布推出专为汽车资讯娱乐（IVI）系统设计的新型汽车通用快闪记忆体（UFS）3.1记忆体解决方案。这项新解决方案具有业界最低的消费量，使汽车製造商能够为其客户提供最佳的行动体验。为了满足不同客户的需求，UFS 3.1提供128GB、256GB和512GB系列。该产品线的增强将使电动车和无人驾驶汽车等未来汽车应用中的电池寿命管理更加有效。

半导体记忆体市场的 NAND 领域预计将推动市场成长。

NAND快闪记忆体快闪记忆体是非易失性存储，无需电源即可保留资料。 NAND快闪记忆体进步的主要目标是降低每位元的成本并增加晶片的容量，使其能够与硬碟等磁性储存竞争。 NAND快闪记忆体存在定期上传或交换大型檔案的装置中很受欢迎，例如 MP3 播放器、数位相机和 USB 随身碟。

NAND快闪记忆体以区块的形式储存资料，并使用电路来储存资料。当断电时，金属氧化物半导体（通常是浮动栅电晶体（FGT））向储存单元提供额外的电荷并储存资料。这些 FGT 的结构与 NAND 逻辑闸类似。 NAND 储存单元由两种类型的闸组成：控制闸和浮动闸门，两者都控制资料流。若要对单元进行编程，请向控制闸极施加电压。

韩国在记忆体晶片生产中占据主导地位，三星电子和SK海力士占据全球DRAM市场的73%和NAND快闪记忆体市场的51%。然而，对于微处理器和感测器等不同的半导体产品，韩国公司依靠政府主导来加强该产业。

半导体记忆体市场 NAND 领域的产业参与企业正专注于併购以扩大供应链。

两家公司都寻求获得必要的政府批准。在获得这些核准后，SK海力士以70亿美元的首期付款收购了NAND​​ SSD业务（包括相关IP和员工）和大连工厂。剩余资产，包括与NAND快闪记忆体晶圆製造和设计相关的智慧财产权、研发员工以及大连工厂的员工，在最终交割后由 SK 海力士以 20 亿美元的额外价格收购。根据协议，英特尔将继续在大连内存製造厂生产 NAND 晶圆，并保留与NAND快闪记忆体晶圆製造和设计相关的所有智慧财产权，直至最终交割。

预计美洲地区市场将会成长。

由于多种因素，包括技术创新和对高效能运算的需求不断增长，美国半导体记忆体市场预计将成长。这种高效能运算包括资料中心、人工智慧、边缘运算等多个领域所使用的服务。

美国半导体产业对 2021 年 GDP附加价值毛额(GVA) 的贡献显着，总计 2,464 亿美元。其中直接 GVA 为 558 亿美元，间接 GVA 为 986 亿美元，诱导 GVA 为 920 亿美元。半导体产业的强劲表现反映了其在美国经济中的重要地位，并对预测期内半导体记忆体市场的提振发挥了重要作用。

此外，对高效能运算的需求不断增长以及5G服务使用量的快速增加正在进一步推动半导体记忆体市场。例如，欧盟委员会于 2020 年 10 月普及服务基金，为通讯业者提供高达90 亿美元的资金，用于在美国农村提供先进的5G 行动无线服务（高达60 亿美元用于在部落地区部署） 。此外，该基金明确授权至少 10 亿美元用于支持精密农业需求的部署。

半导体产业受到美国政府国内重点的影响较大。 2020年至2022年，美国和国际公司进行了超过2,000亿美元的私人投资，以提高16个州的半导体製造、设备和材料的国内製造能力。最大的投资是位于亚利桑那州、德克萨斯、爱达荷州、俄亥俄州和纽约州的逻辑和储存晶片製造设施。

此外，主要市场参与者的各种产品发布和创新也进一步推动了市场的发展。例如，2022 年 7 月，尖端NAND快闪记忆体和 DRAM 记忆体设计先驱 NEO Semiconductor 宣布推出第二代 X-NAND架构。此外，2022年8月，全球最大的半导体公司之一、唯一总部位于美国的记忆体製造商美光科技宣布，将在未来10年投资400亿美元开发尖端技术，并已宣布有意向在美国建立不同阶段的记忆体生产。总体而言，这些创新策略在该国推出了各种产品，并对市场产生了积极影响。

主要市场开拓：

  • 2020年10月20日，SK海力士与英特尔宣布达成协议，SK海力士将以90亿美元收购英特尔的NAND记忆体和储存业务。其中包括 NAND SSD 业务、NAND 元件和晶圆业务以及位于中国的大连 NAND 记忆体製造厂。英特尔计划将其英特尔(R) OptaneTM 业务分开。

主要参与者

  • 三星的 DRAM 技术推动了从个人电脑到先进人工智慧伺服器等各种运算解决方案的创新并提高了效能。三星提供多种 DRAM 产品以满足不同需求。例如，三星的 DDR 解决方案针对高效能伺服器、桌上型电脑、笔记型电脑和其他装置进行了最佳化。
  • 东芝开发了 128 GB嵌入式NAND快闪记忆体模组，树立了新的产业容量标准。此模组符合 e*MMCTM 标准，适用于智慧型手机、平板电脑和数位摄影机等各种数位消费产品。东芝提供单封装嵌入式NAND快闪记忆体闪存，容量范围从​​ 2GB 到 128GB。
  • SK 海力士提供多种 DRAM 产品，满足各种需求。其中包括用于伺服器的 RDIMM 和 LRDIMM，以及用于 PC 的 UDIMM 和 SODIMM。该公司的 DDR 解决方案可确保快速计算和可靠的资料传输。该公司的 GDDR 记忆体有助于快速渲染复杂图形，提供逼真的视觉体验。

目录

第一章简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益

第二章调查方法

  • 研究设计
  • 调查过程

第三章执行摘要

  • 主要发现
  • 分析师观点

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析
  • 分析师观点

第五章半导体记忆体市场：按类型

  • 介绍
  • NAND
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力
  • DRAM
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力

第六章半导体记忆体市场：依行业分类

  • 介绍
  • 家用电器
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力
  • 通讯科技
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力
  • 车
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力
  • 製造业
    • 市场趋势和机会
    • 成长前景
    • 地域获利能力

第七章半导体记忆体市场：按地区

  • 介绍
  • 美洲
    • 按类型
    • 按行业分类
    • 按国家/地区
  • 欧洲、中东/非洲
    • 按类型
    • 按行业分类
    • 按国家/地区
  • 亚太地区
    • 按类型
    • 按行业分类
    • 按国家/地区

第八章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第九章 公司简介

  • Samsung Corporation
  • Intel Corporation
  • Micron Technology
  • SK Hynix
  • Western Digital Corporation
  • Toshiba Corporation
  • ATP Electronics
  • Taiwan Semiconductor Manufacturing Company Limited
  • Texas Instruments Incorporated
  • Infineon Technologies AG
  • IBM Corporation
简介目录
Product Code: KSI061612437

The semiconductor memory market is anticipated to grow at a compound annual growth rate (CAGR) of 0.69% over the forecast period to reach US$163.413 billion by 2029, increasing from US$155.68 billion in 2022.

The growing use of semiconductor components in a variety of industries, such as automotive, consumer electronics, and IT & telecom, is expected to propel the market''s growth on a global basis. It is a necessary electronic device that uses integrated circuit (IC) technology to function as computer memory or chips. The development of semiconductor technology, which includes refining procedures, energy efficiency, and chip capacity optimization, has opened the door for innovative memory solutions suited to various industries.

Moreover, the widespread use of smartphones and other portable devices has created an unprecedented demand for high-performance chips that can meet the changing needs and aspirations of modern users by providing seamless user experiences, quick app loading times, and seamless multitasking capabilities. For instance, in 2023, the smartphone market in India shipped 146 million units, exhibiting a nominal year-over-year (YoY) growth of 1%, as per the International Data Corporation's (IDC) Worldwide Quarterly Mobile Phone Tracker. After a steep 10% drop in the first half of the year, the second half of the year grew by 11% YoY in 2H23. With 37 million units shipped, 4Q23 grew by 26% YoY. This was largely due to stronger-than-expected shipments in the second half of the quarter, which included the launch of several new models.

Additionally, the market's growth is also being driven by the dynamic adoption of memory-centric components in innovative products like wearables, smartphones, and electronic gadgets. In addition, the growing dependence of the electronics and automotive industries on semiconductor devices-such as DRAM and Flash ROM-is clearly driving up demand for integrated chips and devices. The demand for smart devices, consumer electronics, smartphones, and workstations across the globe emphasizes the need for chips with advanced technology. As a result, the market is experiencing a remarkable period of expansion, offering numerous opportunities for companies involved in this sector.

Growing demand from the automotive industry is anticipated to propel market growth.

Memory solutions are increasingly being used in automotive safety systems due to their excellent performance and low power consumption benefits. Memory solutions are essential to the development of autonomous driving capabilities, especially for comprehensive in-vehicle infotainment (IVI) systems and vehicle-to-everything (V2X) connectivity. Power memory solutions are needed for these technologies, and Samsung and other companies are leading the charge. Consequently, during the projected period, these factors are anticipated to fuel the growth of the global semiconductor memory market.

Moreover, the market is also growing due to the increasing use of software and electronic components in modern vehicles. Accordingly, as cars get increasingly linked and integrated with smart technologies, there is an increasing need for high-capacity memory solutions, which is driving up market growth. The market is expanding due to the increased use of hybrid and electric vehicles (EVs), which need sophisticated memory systems for energy efficiency and battery management. For instance, according to the International Energy Agency, the stock of battery electric vehicles increased in the United States from 1.5 million in 2021 to 2.1 million in 2022.

Additionally, a favorable outlook for market growth is being created by the growing use of artificial intelligence (AI) and machine learning (ML) in automotive systems for applications like autonomous driving and predictive maintenance. Moreover, modern innovations from manufacturers are enable to keep a competitive edge in a market that is changing rapidly. For instance, in July 2023, a leading global provider of cutting-edge semiconductor technology, Samsung Electronics, announced that mass production of its new automotive Universal Flash Storage (UFS) 3.1 memory solution, which is designed for in-car infotainment (IVI) systems, has begun. With the lowest energy consumption in the industry, the new solution enables automakers to give customers the best possible mobility experience. To accommodate varying customer needs, the UFS 3.1 lineup was made available in 128, 256, and 512 gigabytes (GB) variants. The improved lineup enables future automotive applications, like electric or driverless vehicles, to manage battery life more effectively.

The NAND segment of the semiconductor memory market is anticipated to propel market growth.

NAND flash memory is a non-volatile storage that preserves data without needing power. A key aim in NAND flash advancement has been to lower the cost per bit and boost chip capacity, allowing it to compete with magnetic storage like hard disks. It NAND flash is popular in devices where large files, such as MP3 players, digital cameras, and USB flash drives, are regularly uploaded and swapped out,

NAND flash stores data in blocks and utilizes electric circuits for data storage. When power is disconnected, a metal-oxide-semiconductor, usually a floating-gate transistor (FGT), supplies additional charge to the memory cell, preserving the data. These FGTs resemble NAND logic gates in structure. NAND memory cells consist of two kinds of gates: control gates and floating gates, both of which regulate data flow. To program a cell, a voltage charge is applied to the control gate.

South Korea dominates memory chip production, with Samsung Electronics and SK Hynix holding 73% of the global DRAM market and 51% of the NAND flash market. However, for different semiconductor products like microprocessors and sensors, South Korean firms depend on various government-led initiatives to strengthen the industry .

Industry participants in the NAND segment of the semiconductor memory market concentrate on mergers and acquisitions to expand their supply chain.

Both companies aimed to secure necessary governmental approvals. After obtaining those approvals, SK Hynix purchased the NAND SSD business (including associated IP and employees) and the Dalian facility for an initial payment of $7 billion. The remaining assets, including IP related to NAND flash wafer manufacturing and design, R&D employees, and the Dalian fab workforce, were acquired by SK Hynix upon a final closing, with a further payment of $2 billion. According to the agreement, Intel will continue producing NAND wafers at the Dalian Memory Manufacturing Facility and retain all IP related to NAND flash wafer manufacturing and design until the final closing.

The market is projected to grow in the America's region.

The United States, semiconductor memory market is anticipated to grow owing to various factors, including technological innovation, and growing demand for high-performance computing. This high-performance computing includes services used in multiple sectors including data centers, artificial AI, and edge computing.

With a total of $246.4 billion in 2021, the semiconductor sector in the United States contributed significantly to the GDP's Gross Value Added (GVA). This included $55.8 billion in direct GVA, $98.6 billion in indirect GVA, and $92.0 billion in induced GVA. The semiconductor industry's strong performance is a reflection of its vital position in the American economy and plays a significant role in fueling the semiconductor memory market during the forecast period.

Furthermore, the increasing need for high-performance computing and the burgeoning use of 5G services are further driving the semiconductor memory market. For instance, to provide carriers with up to $9 billion in Universal Service Fund funding to provide advanced 5G mobile wireless services in rural America (including up to $680 million for deployment on tribal territories), the Commission created the 5G Fund for Rural America in October 2020. Additionally, the Fund allows at least $1 billion expressly for deployments supporting the requirements of precision agriculture .

The semiconductor industry is greatly impacted by the growing focus of the United States government on in the nation. Over $200 billion in private investments were made by American and international companies between 2020 and 2022 to increase domestic manufacturing capacities for semiconductor fabrication, equipment, and materials across 16 states. The largest investments went towards logic and memory chip fabrication facilities in Arizona, Texas, Idaho, Ohio, and New York.

Furthermore, various product launches and innovations by key market players are further boosting the market. For instance, in July 2022, NEO Semiconductor, a pioneer in the creation of cutting-edge NAND flash and DRAM memory designs, announced the availability of its second-generation X-NAND architecture. Furthermore, in August 2022, one of the biggest semiconductor firms in the world and the only memory maker with headquarters in the United States, Micron Technology, Inc. revealed its intentions to invest $40 billion by the end of the decade to establish state-of-the-art memory production in various stages in the United States. Comprehensively, these innovative strategies lead to various product launches in the nation, impacting the market positively.

Key Market Developments:

  • October 20, 2020, SK Hynix and Intel announced a deal where SK Hynix would acquire Intel's NAND memory and storage business for $9 billion. This included the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel plans to keep its Intel(R) OptaneTM business separate.

Key Players:

  • Samsung's DRAM technology fuels innovation and boosts performance across a range of computing solutions, spanning from personal computers to advanced AI servers. Samsung offers a diverse collection of DRAM products tailored to meet different needs. For instance, Samsung's DDR solutions are optimized for high-performance servers, desktops, laptops, and other devices. These solutions prioritize both high bandwidth and energy efficiency, delivering enhanced performance.
  • Toshiba Corporation developed a 128-gigabyte (GB) embedded NAND flash memory module, setting a new industry standard for capacity. The module adhered to the e*MMCTM standard and is intended for use in various digital consumer products like smartphones, tablet PCs, and digital video cameras. Toshiba offers a wide range of single-package embedded NAND Flash memories with capacities ranging from 2GB to 128 GB .
  • SK Hynix provides a diverse selection of DRAM products catering to various needs. These include RDIMM and LRDIMM, which are for server applications, and UDIMM and SODIMM designed for personal computer usage. Their DDR solutions ensure swift computing and reliable data transfers. Their GDDR memory facilitates the rapid rendering of complex graphics, delivering realistic visual experiences .

Segmentation:

By Type:

  • NAND
  • DRAM

By Industry Vertical:

  • Consumer Electronics
  • Communication & Technology
  • Automotive
  • Manufacturing

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • UK
  • Germany
  • France
  • Italy
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key Benefits for the Stakeholders

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SEMICONDUCTOR MEMORY MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. NAND
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness
  • 5.3. DRAM
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness

6. SEMICONDUCTOR MEMORY MARKET BY INDUSTRY VERTICAL

  • 6.1. Introduction
  • 6.2. Consumer Electronics
    • 6.2.1. Market Trends and Opportunities
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness
  • 6.3. Communication & Technology
    • 6.3.1. Market Trends and Opportunities
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness
  • 6.4. Automotive
    • 6.4.1. Market Trends and Opportunities
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness
  • 6.5. Manufacturing
    • 6.5.1. Market Trends and Opportunities
    • 6.5.2. Growth Prospects
    • 6.5.3. Geographic Lucrativeness

7. SEMICONDUCTOR MEMORY MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. Americas
    • 7.2.1. By Type
    • 7.2.2. By Industry Vertical
    • 7.2.3. By Country
      • 7.2.3.1. United States
        • 7.2.3.1.1. Market Trends and Opportunities
        • 7.2.3.1.2. Growth Prospects
      • 7.2.3.2. Canada
        • 7.2.3.2.1. Market Trends and Opportunities
        • 7.2.3.2.2. Growth Prospects
      • 7.2.3.3. Brazil
        • 7.2.3.3.1. Market Trends and Opportunities
        • 7.2.3.3.2. Growth Prospects
      • 7.2.3.4. Others
        • 7.2.3.4.1. Market Trends and Opportunities
        • 7.2.3.4.2. Growth Prospects
  • 7.3. Europe, Middle East, and Africa
    • 7.3.1. By Type
    • 7.3.2. By Industry Vertical
    • 7.3.3. By Country
      • 7.3.3.1. Germany
        • 7.3.3.1.1. Market Trends and Opportunities
        • 7.3.3.1.2. Growth Prospects
      • 7.3.3.2. France
        • 7.3.3.2.1. Market Trends and Opportunities
        • 7.3.3.2.2. Growth Prospects
      • 7.3.3.3. United Kingdom
        • 7.3.3.3.1. Market Trends and Opportunities
        • 7.3.3.3.2. Growth Prospects
      • 7.3.3.4. Italy
        • 7.3.3.4.1. Market Trends and Opportunities
        • 7.3.3.4.2. Growth Prospects
      • 7.3.3.5. Others
        • 7.3.3.5.1. Market Trends and Opportunities
        • 7.3.3.5.2. Growth Prospects
  • 7.4. Asia Pacific
    • 7.4.1. By Type
    • 7.4.2. By Industry Vertical
    • 7.4.3. By Country
      • 7.4.3.1. China
        • 7.4.3.1.1. Market Trends and Opportunities
        • 7.4.3.1.2. Growth Prospects
      • 7.4.3.2. Japan
        • 7.4.3.2.1. Market Trends and Opportunities
        • 7.4.3.2.2. Growth Prospects
      • 7.4.3.3. India
        • 7.4.3.3.1. Market Trends and Opportunities
        • 7.4.3.3.2. Growth Prospects
      • 7.4.3.4. Taiwan
        • 7.4.3.4.1. Market Trends and Opportunities
        • 7.4.3.4.2. Growth Prospects
      • 7.4.3.5. Others
        • 7.4.3.5.1. Market Trends and Opportunities
        • 7.4.3.5.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Samsung Corporation
  • 9.2. Intel Corporation
  • 9.3. Micron Technology
  • 9.4. SK Hynix
  • 9.5. Western Digital Corporation
  • 9.6. Toshiba Corporation
  • 9.7. ATP Electronics
  • 9.8. Taiwan Semiconductor Manufacturing Company Limited
  • 9.9. Texas Instruments Incorporated
  • 9.10. Infineon Technologies AG
  • 9.11. IBM Corporation