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市场调查报告书
商品编码
1866528

全球模塑互连装置 (MID) 市场 - 2025-2030 年预测

Global Molded interconnect devices Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

预计到 2025 年，模塑互连装置 (MID) 市场规模将达到 15.41 亿美元，到 2030 年将达到 29.74 亿美元，复合年增长率为 14.06%。

模塑互连装置 (MID) 因其在各行业实现小型化和高级功能方面发挥的作用而备受关注。在家用电子电器领域，尤其是在开发中国家，智慧型手机的普及和小型化设备的趋势正在推动市场需求。在汽车行业，车载电子设备的日益增多为 MID 製造商创造了商机，因为製造商正致力于提升用户体验和便利性。此外，MID 能够支援先进医疗设备的开发，这推动了医疗保健领域的需求，展现出巨大的市场潜力。主要供应商不断增加研发投入以推动 MID 技术发展，也将在预测期内进一步推动市场成长。然而，熟练劳动力短缺是限制市场扩张的显着阻碍因素。

市场的主要驱动因素包括MID设计灵活性，它能够实现创新且紧凑的解决方案，以及各种应用领域对装置小型化的持续关注。一个关键的阻碍因素因素是MID技术熟练专业人员的短缺，这可能会阻碍扩充性和普及。

本研究检验了当前市场需求、供应和销售趋势，以及影响医疗器材市场发展的最新动态。研究全面分析了关键驱动因素、限制因素和机会，并深入探讨了行业趋势、政策和区域法规，使相关人员能够深入了解法规结构和影响市场环境的关键因素。

我们的竞争情报是基于广泛的二手资料研究，旨在识别关键产业参与者及其收入贡献。资讯来源包括产业协会调查、分析师报告、投资者报告、新闻稿和学术期刊。我们采用由下而上和自上而下的方法计算了整个医疗器材产业及其主要细分市场的市场规模。所有数据均透过全球医疗器材价值链相关人员的第一手资讯进行检验。我们全面的市场分析整合了各种资讯来源和专有资料集，并运用资料三角验证技术，以提供准确的市场区隔和预测。

本市场分析报告透过分析叙述、图表和图形呈现，旨在有效理解全球MID市场的市场动态。主要参与者包括TE Con​​nectivity、LPKF Laser & Electronics、LANXESS、Multiple Dimensions AG等。

本报告为业内人士提供关于市场趋势、监管环境和竞争动态的关键洞察。报告重点阐述了小型化趋势、汽车技术进步和医疗设备创新带来的成长机会，同时也探讨了技术纯熟劳工短缺带来的挑战。报告采用严谨的调查方法，结合一手和二手数据，确保了洞察的可靠性，使相关人员能够妥善应对复杂的监管环境、竞争压力和投资重点，从而在一个透过技术创新和不断拓展的应用领域实现增长的市场中占据有利地位。

本报告的主要优势：

  • 深入分析：取得以客户群、政府政策和社会经济因素、消费者偏好、垂直产业和其他细分市场为重点的深入市场洞察，涵盖主要地区和新兴地区。
  • 竞争格局：了解主要企业采取的策略倡议，并了解透过正确的策略打入市场的潜力。
  • 市场驱动因素与未来趋势：探索动态因素和关键市场趋势，以及它们将如何塑造未来的市场发展。
  • 可执行的建议：利用洞察力为策略决策提供讯息，从而在动态环境中开拓新的业务管道和收入来源。
  • 受众范围广：对新兴企业、研究机构、顾问公司、中小企业和大型企业都有益处且经济高效。

它是用来做什么的？

产业与市场洞察、商业机会评估、产品需求预测、打入市场策略、地理扩张、资本投资决策、法律规范及其影响、新产品开发、竞争影响

分析范围

  • 历史资料（2022-2024 年）和预测资料（2025-2030 年）
  • 成长机会、挑战、供应链前景、法规结构、客户行为和趋势分析
  • 竞争对手定位、策略和市场占有率分析
  • 按业务板块和地区（国家）分類的收入成长和预测分析
  • 公司概况（策略、产品、财务资讯、关键趋势等）

目录

第一章执行摘要

第二章市场概述

  • 市场概览
  • 市场定义
  • 分析范围
  • 市场区隔

第三章 商业情境

  • 市场驱动因素
  • 市场限制
  • 市场机会
  • 波特五力分析
  • 产业价值链分析
  • 政策和法规
  • 策略建议

第四章 技术展望

第五章 全球模塑互连装置 (MID) 市场（依製程划分）

  • 介绍
  • LDS (Laser Direct Structuring)
  • 双色注塑成型
  • 薄膜技术

第六章 全球模塑互连装置 (MID) 市场：依产品类型划分

  • 介绍
  • 天线和连接模组
  • 感应器
  • 连接器和开关
  • 照明
  • 其他的

第七章 全球模塑互连装置 (MID) 市场按应用划分

  • 介绍
  • 通讯
  • 家用电子电器
  • 车
  • 医疗设备
  • 其他的
  • 製造商
  • 其他的

第八章 全球模塑互连装置 (MID) 市场（按地区划分）

  • 介绍
  • 北美洲
    • 透过流程
    • 依产品类型
    • 透过使用
    • 按国家/地区
      • 美国
      • 加拿大
      • 墨西哥
  • 南美洲
    • 透过流程
    • 依产品类型
    • 透过使用
    • 按国家/地区
      • 巴西
      • 阿根廷
      • 其他的
  • 欧洲
    • 透过流程
    • 依产品类型
    • 透过使用
    • 按国家/地区
      • 英国
      • 德国
      • 法国
      • 义大利
      • 其他的
  • 中东和非洲
    • 透过流程
    • 依产品类型
    • 透过使用
    • 按国家/地区
      • 沙乌地阿拉伯
      • 阿拉伯聯合大公国
      • 其他的
  • 亚太地区
    • 透过流程
    • 依产品类型
    • 透过使用
    • 按国家/地区
      • 日本
      • 中国
      • 印度
      • 韩国
      • 台湾
      • 其他的

第九章：竞争格局与分析

  • 主要企业和策略分析
  • 市占率分析
  • 企业合併、协议、商业合作
  • 竞争对手仪錶板

第十章：公司简介

  • TE Connectivity Ltd.
  • LPFK Laser and Electronics AG
  • Molex, LLC
  • MID Solutions GmbH
  • Lanxess AG
  • MacDermid, Inc.
  • RTP Company
  • Smart Plastic Products（S2P）
  • Harting Technology Group
  • Cicor Management AG
  • Amphenol Corporation

第十一章 分析方法

简介目录
Product Code: KSI061611939

The Molded Interconnect Devices Market is anticipated to increase from USD 1.541 billion in 2025 to USD 2.974 billion by 2030, registering a 14.06% CAGR.

Molded interconnect devices (MIDs) are gaining traction due to their role in enabling miniaturization and advanced functionality across industries. The consumer electronics sector, particularly in developing economies, drives demand through widespread smartphone adoption and the trend toward compact devices. In the automotive industry, manufacturers' focus on enhancing user experience and convenience has increased in-vehicle electronic content, creating revenue opportunities for MID manufacturers. Additionally, MIDs' ability to support the development of sophisticated medical devices bolsters their demand in the healthcare sector, presenting significant market potential. Rising research and development investments by key vendors to advance MID technology further propel market growth over the forecast period. However, a shortage of skilled labor poses a notable constraint on market expansion.

Key market drivers include the flexibility of MID design, which allows for innovative and compact solutions, and the ongoing emphasis on device miniaturization across applications. The primary restraint is the limited availability of skilled professionals capable of working with MID technology, which may hinder scalability and adoption.

This research examines current trends in demand, supply, and sales, alongside recent developments shaping the MID market. It provides a comprehensive analysis of key drivers, restraints, and opportunities. The study details industry trends, policies, and regulations across geographical regions, offering stakeholders a thorough understanding of the regulatory framework and critical factors influencing the market environment.

Competitive intelligence identifies major industry players and their revenue contributions, derived from extensive secondary research. Sources include industry association studies, analyst reports, investor presentations, press releases, and journals. Market size for the overall MID sector and its key segments was determined using both bottom-up and top-down methodologies. Values were validated with primary inputs from stakeholders in the global MID value chain. Comprehensive market engineering integrated data from diverse sources and proprietary datasets, employing data triangulation for accurate market breakdown and forecasting.

Market insights are presented through analytical narratives, charts, and graphics, enabling efficient comprehension of global MID market dynamics. Key players profiled include TE Connectivity, LPKF Laser and Electronics, Lanxess, and Multiple Dimensions AG, among others.

This report equips industry experts with critical insights into market trends, regulatory landscapes, and competitive dynamics. It highlights growth opportunities driven by miniaturization trends, automotive advancements, and medical device innovations, while addressing challenges related to skilled labor shortages. The rigorous methodology, blending primary and secondary data, ensures reliable findings, enabling stakeholders to navigate regulatory complexities, competitive pressures, and investment priorities in a market poised for growth through technological innovation and expanding applications.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Segmentation

By Process

  • Laser Direct Structuring
  • 2-shot molding
  • Film Techniques

By Product Type

  • Antennae and Connectivity Modules
  • Sensors
  • Connectors and Switches
  • Lighting
  • Others

By Application

  • Telecommunication
  • Consumer Electronics
  • Automotive
  • Medical Devices
  • Others

By Geography

  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Italy
  • Others
  • Middle East & Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • Japan
  • China
  • India
  • South Korea
  • Taiwan
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study
  • 2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. MOLDED INTERCONNECT DEVICES MARKET BY PROCESS

  • 5.1. Introduction
  • 5.2. Laser Direct Structuring
  • 5.3. 2-shot molding
  • 5.4. Film Techniques

6. MOLDED INTERCONNECT DEVICES MARKET BY PRODUCT TYPE

  • 6.1. Introduction
  • 6.2. Antennae and Connectivity Modules
  • 6.3. Sensors
  • 6.4. Connectors and Switches
  • 6.5. Lighting
  • 6.6. Others

7. MOLDED INTERCONNECT DEVICES MARKET BY APPLICATION

  • 7.1. Introduction
  • 7.2. Telecommunication
  • 7.3. Consumer Electronics
  • 7.4. Automotive
  • 7.5. Medical Devices
  • 7.6. Others
  • 7.7. Manufacturers
  • 7.8. Others

8. MOLDED INTERCONNECT DEVICES MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. By Process
    • 8.2.2. By Product Type
    • 8.2.3. By Application
    • 8.2.4. By Country
      • 8.2.4.1. United States
      • 8.2.4.2. Canada
      • 8.2.4.3. Mexico
  • 8.3. South America
    • 8.3.1. By Process
    • 8.3.2. By Product Type
    • 8.3.3. By Application
    • 8.3.4. By Country
      • 8.3.4.1. Brazil
      • 8.3.4.2. Argentina
      • 8.3.4.3. Others
  • 8.4. Europe
    • 8.4.1. By Process
    • 8.4.2. By Product Type
    • 8.4.3. By Application
    • 8.4.4. By Country
      • 8.4.4.1. United Kingdom
      • 8.4.4.2. Germany
      • 8.4.4.3. France
      • 8.4.4.4. Italy
      • 8.4.4.5. Others
  • 8.5. Middle East & Africa
    • 8.5.1. By Process
    • 8.5.2. By Product Type
    • 8.5.3. By Application
    • 8.5.4. By Country
      • 8.5.4.1. Saudi Arabia
      • 8.5.4.2. UAE
      • 8.5.4.3. Others
  • 8.6. Asia Pacific
    • 8.6.1. By Process
    • 8.6.2. By Product Type
    • 8.6.3. By Application
    • 8.6.4. By Country
      • 8.6.4.1. Japan
      • 8.6.4.2. China
      • 8.6.4.3. India
      • 8.6.4.4. South Korea
      • 8.6.4.5. Taiwan
      • 8.6.4.6. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. TE Connectivity Ltd.
  • 10.2. LPFK Laser and Electronics AG
  • 10.3. Molex, LLC
  • 10.4. MID Solutions GmbH
  • 10.5. Lanxess AG
  • 10.6. MacDermid, Inc.
  • 10.7. RTP Company
  • 10.8. Smart Plastic Products (S2P)
  • 10.9. Harting Technology Group
  • 10.10. Cicor Management AG
  • 10.11. Amphenol Corporation

11. RESEARCH METHODOLOGY