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市场调查报告书
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1856905

模塑互连市场预测至2032年：按产品、材料、技术、组件、应用、最终用户和地区分類的全球分析

Molded Interconnect Device Market Forecasts to 2032 - Global Analysis By Product (Two-Dimensional (2D) MID, Three-Dimensional (3D) MID, and Other Products), Material, Technology, Component, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，预计到 2025 年，全球模塑互连市场规模将达到 20.6 亿美元，到 2032 年将达到 45.7 亿美元，预测期内复合年增长率为 12.0%。

模塑互连装置 (MID) 是一种先进的电子解决方案，它将结构和电子功能整合于3D塑胶基体中。导电路径可以直接成型于模塑塑胶元件内，从而减少对传统电路基板的依赖。 MID 广泛应用于汽车、医疗、消费性电子和电讯等领域，具有尺寸较小、重量更轻、耐用性更强等优势。 MID 支援复杂紧凑的设计，同时提升装置的整体效能。

对物联网设备和5G技术的需求不断增长

智慧型设备和下一代连接技术的普及加速了对小型多功能组件（例如模塑电路组件）的需求。模塑积体电路 (MID) 可将电子电路直接整合到 3D 塑胶结构中，使其成为空间受限的物联网应用的理想选择。随着 5G 网路的全球部署，通讯和消费性电子产业在天线、感测器和开关等领域对 MID 的应用正在加速成长。电子设备小型化和轻量化的趋势进一步推动了市场发展。雷射直接成型 (LDS) 和多色注塑成型等技术进步正在提高设计精度和电气性能。这些创新使 MID 成为穿戴式装置、智慧家庭系统和边缘运算设备的关键建构模组。

高昂的初始製造和模具成本

安装LDS系统和精密成型设备需要大量资金投入，这对中小型製造商尤其具有挑战性。将机械和电子功能整合到单块基板需要先进的工程技术和严格的品管。广泛的应用客製化进一步增加了原型製作和检验成本。虽然自动化和模组化模具的出现有助于降低这些成本，但扩充性仍然是一个问题。这些经济限制因素可能会减缓市场扩张，尤其是在对成本敏感的地区。

在医疗保健和医疗设备推广应用

助听器、诊断感测器和穿戴式监测器等设备受益于微型医疗器材（MID）带来的小型化和耐用性。无线通讯和物联网在病患监护系统中的整合正在拓展微型医疗器材的应用范围。生物相容性材料和精密成型技术的进步使得更安全、更符合人体工学的医疗设计成为可能。监管机构对数位医疗和远距离诊断的支持进一步推动了市场需求。随着个人化医疗和智慧治疗的发展，微型医疗器材在下一代医疗解决方案中发挥关键作用。

替代互连技术

替代技术具有成本优势，并且与传统製造流程相容。增材电子和印刷导电油墨的创新也在某些应用领域挑战了MID（模组化积体电路）的主导地位。一些製造商倾向于采用更易于升级和维护的模组化设计，从而减少对整合结构的依赖。奈米材料和导电聚合物的快速发展正在丰富互连领域的格局。如果缺乏持续创新，MID将面临被更具适应性或成本效益的技术所取代的风险。

新冠疫情的影响：

新冠疫情扰乱了全球供应链，导致製造资讯技术（MID）生产放缓，并影响了各行业的零件供应。停工和劳动力短缺尤其影响了精密工具和半导体整合产业的生产计划。然而，这场危机也加速了数位转型，增加了对物联网医疗保健和远距离诊断的需求。医疗穿戴式装置和非接触式装置等领域的MID应用显着成长。后疫情时代的策略重点在于灵活生产、数位化库存系统和在地采购，以降低未来可能出现的干扰。

预计在预测期内，液晶聚合物（LCP）细分市场将成为最大的细分市场。

由于其优异的热稳定性、低吸湿性和卓越的介电性能，液晶聚合物 (LCP) 预计将在预测期内占据最大的市场份额。 LCP 适用于天线、射频模组和 5G 组件等高频应用。它与 LDS 技术的兼容性使其即使在复杂形状中也能实现精确的电路配置。随着对小型化、高速电子产品的需求不断增长，LCP 在严苛环境下也能提供无与伦比的效能。近期发展趋势包括基于 LCP 的传感器外壳以及用于汽车和通讯行业的超薄连接器。

预计在预测期内，医疗设备领域将实现最高的复合年增长率。

预计在预测期内，医疗设备领域将保持最高的成长率，这主要得益于市场对小型化、多功能和生物相容性组件的需求。微型诊断设备（MID）有助于将感测器、天线和电路整合到符合人体工学的医疗工具和穿戴式装置中。远端患者监护和智慧诊断的兴起正在拓展MID在医疗保健领域的应用。新兴趋势包括一次性诊断试剂套件和具有无线遥测功能的植入式设备。监管机构正透过加快核准和推行数位化医疗计画来支持技术创新。

最大份额区域：

亚太地区预计将在预测期内占据最大的市场份额，这主要得益于其强劲的电子製造业和不断扩展的通讯基础设施。中国、日本和韩国等国正大力投资5G部署和消费性电子产品生产。政府为促进半导体和元件本地化生产而采取的倡议，正在推动对微型积体电路（MID）的需求。该地区在汽车电子和工业自动化领域的领先地位，进一步巩固了其市场地位。全球原始设备製造商（OEM）与区域供应商之间的策略联盟，正在加速技术转移和创新。

复合年增长率最高的地区：

预计在预测期内，北美地区将呈现最高的复合年增长率，这主要得益于其技术领先地位和强劲的研发投入。美国正在航太、国防和先进医疗设备领域开发行动资讯技术（MID）应用。智慧製造和人工智慧驱动的设计工具的普及，正在提升MID的客製化程度和效能。对数位健康和​​互联基础设施的监管支持，正在拓展市场机会。关键发展方向包括支援MID的穿戴式装置、汽车感测器和工业IoT模组。

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    • 基于产品系列、地域覆盖和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究材料
    • 原始研究资料
    • 次级研究资讯来源
    • 先决条件

第三章 市场趋势分析

  • 司机
  • 抑制因素
  • 机会
  • 威胁
  • 产品分析
  • 技术分析
  • 应用分析
  • 终端用户分析
  • 新兴市场
  • 新冠疫情的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

5. 全球模塑互连组件市场（按产品划分）

  • 二维（2D）MID
  • 3D（3D）MID
  • 其他产品

6. 全球模塑互连组件市场（依材料划分）

  • 热塑性塑料
    • 聚碳酸酯（PC）
    • 液晶聚合物（LCP）
    • 聚丁烯对苯二甲酸酯（PBT）
    • 聚邻苯二甲酰胺（PPA）
  • 其他热塑性塑料

7. 全球模塑互连组件市场（依技术划分）

  • 雷射直接成形（LDS）
  • 薄膜嵌入成型（FIM）
  • 双色注塑成型
  • 其他技术

8. 全球模塑互连组件市场（按组件划分）

  • 天线
  • 连接器
  • 感应器
  • 转变
  • 照明部件

9. 全球模塑互连组件市场（按应用划分）

  • 车
    • 方向盘控制
    • 感应器和开关
    • 照明系统
  • 家用电器
    • 智慧型手机和穿戴式装置
    • 家用电器
  • 医疗设备
    • 诊断设备
    • 手术器械
  • 通讯
    • 天线模组
    • 路由器和数据机
  • 产业
    • 自动化设备
    • 控制系统
  • 其他用途

第十章 全球模塑互连组件市场（依最终用户划分）

  • 原始设备製造商 (OEM)
  • 电子製造服务

第十一章 全球模塑互连组件市场（按地区划分）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 亚太其他地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲国家
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十二章 重大进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与併购
  • 新产品上市
  • 业务拓展
  • 其他关键策略

第十三章：企业概况

  • TE Connectivity
  • Element Solutions
  • Molex LLC
  • Cicor Group
  • Amphenol Corporation
  • Sumitomo Electric Industries, Ltd.
  • LPKF Laser & Electronics AG
  • RTP Company
  • Taoglas Limited
  • Multiple Dimensions AG
  • KYOCERA AVX Components Corporation
  • Teprosa GmbH
  • HARTING Technology Group
  • 2E mechatronic GmbH & Co. KG
  • MID Solutions GmbH
Product Code: SMRC31777

According to Stratistics MRC, the Global Molded Interconnect Device Market is accounted for $2.06 billion in 2025 and is expected to reach $4.57 billion by 2032 growing at a CAGR of 12.0% during the forecast period. A Molded Interconnect Device (MID) is a sophisticated electronic solution that combines structural and electronic functions within a three-dimensional plastic base. It allows conductive pathways to be formed directly on molded plastic components, reducing reliance on conventional circuit boards. MIDs find applications across automotive, medical, consumer electronics, and telecom sectors, offering benefits like miniaturization, weight savings, and greater durability. They support intricate, compact designs while enhancing overall device performance.

Market Dynamics:

Driver:

Rising demand for iot devices and 5g technology

The proliferation of smart devices and next-generation connectivity is accelerating the need for compact, multifunctional components like molded interconnect devices. MIDs enable the integration of electronic circuits directly onto 3D plastic structures, making them ideal for space-constrained IoT applications. As 5G networks expand globally, telecom and consumer electronics sectors are increasingly deploying MIDs in antennas, sensors, and switches. The trend toward miniaturization and lightweight electronics is further boosting market momentum. Technological advancements such as laser direct structuring (LDS) and multi-shot molding are enhancing design precision and electrical performance. These innovations are positioning MIDs as essential building blocks in wearables, smart home systems, and edge computing devices.

Restraint:

High initial manufacturing and tooling costs

Setting up LDS systems and precision molding equipment requires significant capital investment, particularly challenging for small and mid-sized manufacturers. The integration of mechanical and electronic functions into a single substrate demands advanced engineering and rigorous quality control. Customization across diverse applications further increases prototyping and validation expenses. Although automation and modular tooling are emerging to reduce these costs, scalability remains a concern. These financial constraints can slow market expansion, especially in cost-sensitive regions.

Opportunity:

Increased adoption in healthcare and medical devices

Devices such as hearing aids, diagnostic sensors, and wearable monitors benefit from MID-enabled miniaturization and durability. The integration of wireless communication and IoT in patient monitoring systems is expanding MID applications. Advances in biocompatible materials and precision molding are enabling safer and more ergonomic medical designs. Regulatory support for digital health and remote diagnostics is further propelling market demand. As personalized medicine and smart therapeutics evolve, MIDs are playing a pivotal role in next-generation healthcare solutions.

Threat:

Alternative interconnect technologies

The alternatives offer cost benefits and compatibility with conventional manufacturing workflows. Innovations in additive electronics and printed conductive inks are also challenging MID dominance in select applications. Some manufacturers prefer modular designs that allow easier upgrades and maintenance, reducing reliance on integrated structures. Rapid advancements in nanomaterials and conductive polymers are diversifying the interconnect landscape. Without continuous innovation, MIDs risk being displaced by more adaptable or cost-effective technologies.

Covid-19 Impact:

The COVID-19 pandemic disrupted global supply chains, delaying MID production and affecting component availability across industries. Lockdowns and workforce shortages impacted manufacturing timelines, particularly for precision tooling and semiconductor integration. However, the crisis accelerated digital transformation, increasing demand for IoT-enabled healthcare and remote diagnostics. MID applications in medical wearables and contactless devices saw a notable rise. Post-pandemic strategies now emphasize flexible production, digital inventory systems, and localized sourcing to mitigate future disruptions.

The liquid crystal polymer (LCP) segment is expected to be the largest during the forecast period

The liquid crystal polymer (LCP) segment is expected to account for the largest market share during the forecast period, due to its exceptional thermal stability, low moisture absorption, and superior dielectric properties. LCPs are well-suited for high-frequency applications such as antennas, RF modules, and 5G components. Their compatibility with LDS technology allows precise circuit structuring on complex geometries. As demand grows for miniaturized and high-speed electronics, LCPs offer unmatched performance in demanding environments. Recent developments include LCP-based sensor housings and ultra-thin connectors for automotive and telecom sectors.

The medical devices segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the medical devices segment is predicted to witness the highest growth rate, driven by the need for compact, multifunctional, and biocompatible components. MIDs facilitate the integration of sensors, antennas, and circuitry into ergonomic medical tools and wearables. The rise of remote patient monitoring and smart diagnostics is expanding MID applications in healthcare. Emerging trends include disposable diagnostic kits and implantable devices with wireless telemetry. Regulatory bodies are supporting innovation through fast-track approvals and digital health initiatives.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, supported by robust electronics manufacturing and expanding telecom infrastructure. Countries like China, Japan, and South Korea are investing heavily in 5G deployment and consumer electronics production. Government initiatives promoting local semiconductor and component fabrication are boosting MID demand. The region's leadership in automotive electronics and industrial automation further strengthens its market position. Strategic collaborations between global OEMs and regional suppliers are accelerating technology transfer and innovation.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by technological leadership and strong R&D investments. The U.S. is pioneering MID applications in aerospace, defense, and advanced medical devices. Adoption of smart manufacturing and AI-driven design tools is enhancing MID customization and performance. Regulatory support for digital health and connected infrastructure is expanding market opportunities. Key developments include MID-enabled wearables, automotive sensors, and industrial IoT modules.

Key players in the market

Some of the key players in Molded Interconnect Device Market include TE Connectivity, Element Solutions, Molex LLC, Cicor Group, Amphenol Corporation, Sumitomo Electric Industries, Ltd., LPKF Laser & Electronics AG, RTP Company, Taoglas Limited, Multiple Dimensions AG, KYOCERA AVX Components Corporation, Teprosa GmbH, HARTING Technology Group, 2E mechatronic GmbH & Co. KG, and MID Solutions GmbH.

Key Developments:

In October 2025, Molex announced that it has signed an agreement to acquire Smiths Interconnect. Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, is a leading provider of high-reliability connectivity products and solutions serving the aerospace and defense, medical, semiconductor test and industrial markets.

In March 2024, Element Solutions Inc announced an agreement to sell its flexographic printing plate business, MacDermid Graphics Solutions, to XSYS, a global specialist provider in the flexographic printing industry, for an enterprise value of approximately $325 million. The MacDermid Graphics Solutions business transferring to XSYS constitutes substantially all of Element Solutions' Graphics Solutions reporting vertical.

Products Covered:

  • Two-Dimensional (2D) MID
  • Three-Dimensional (3D) MID
  • Other Products

Materials Covered:

  • Thermoplastics
  • Other Thermoplasticsd

Technologies Covered:

  • Laser Direct Structuring (LDS)
  • Film Insert Molding (FIM)
  • Two-Shot Molding
  • Other Technologies

Components Covered:

  • Antennas
  • Connectors
  • Sensors
  • Switches
  • Lighting Components

Applications Covered:

  • Automotive
  • Consumer Electronics
  • Medical Devices
  • Telecommunications
  • Industrial
  • Other Applications

End Users Covered:

  • Original Equipment Manufacturers (OEMs)
  • Electronics Manufacturing Services

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Technology Analysis
  • 3.8 Application Analysis
  • 3.9 End User Analysis
  • 3.10 Emerging Markets
  • 3.11 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Molded Interconnect Device Market, By Product

  • 5.1 Introduction
  • 5.2 Two-Dimensional (2D) MID
  • 5.3 Three-Dimensional (3D) MID
  • 5.4 Other Products

6 Global Molded Interconnect Device Market, By Material

  • 6.1 Introduction
  • 6.2 Thermoplastics
    • 6.2.1 Polycarbonate (PC)
    • 6.2.2 Liquid Crystal Polymer (LCP)
    • 6.2.3 Polybutylene Terephthalate (PBT)
    • 6.2.4 Polyphthalamide (PPA)
  • 6.3 Other Thermoplastics

7 Global Molded Interconnect Device Market, By Technology

  • 7.1 Introduction
  • 7.2 Laser Direct Structuring (LDS)
  • 7.3 Film Insert Molding (FIM)
  • 7.4 Two-Shot Molding
  • 7.5 Other Technologies

8 Global Molded Interconnect Device Market, By Component

  • 8.1 Introduction
  • 8.2 Antennas
  • 8.3 Connectors
  • 8.4 Sensors
  • 8.5 Switches
  • 8.6 Lighting Components

9 Global Molded Interconnect Device Market, By Application

  • 9.1 Introduction
  • 9.2 Automotive
    • 9.2.1 Steering Wheel Controls
    • 9.2.2 Sensors & Switches
    • 9.2.3 Lighting Systems
  • 9.3 Consumer Electronics
    • 9.3.1 Smartphones & Wearables
    • 9.3.2 Home Appliances
  • 9.4 Medical Devices
    • 9.4.1 Diagnostic Equipment
    • 9.4.2 Surgical Instruments
  • 9.5 Telecommunications
    • 9.5.1 Antenna Modules
    • 9.5.2 Routers & Modems
  • 9.6 Industrial
    • 9.6.1 Automation Equipment
    • 9.6.2 Control Systems
  • 9.7 Other Applications

10 Global Molded Interconnect Device Market, By End User

  • 10.1 Introduction
  • 10.2 Original Equipment Manufacturers (OEMs)
  • 10.3 Electronics Manufacturing Services

11 Global Molded Interconnect Device Market, By Geography

  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 Germany
    • 11.3.2 UK
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia Pacific
    • 11.4.1 Japan
    • 11.4.2 China
    • 11.4.3 India
    • 11.4.4 Australia
    • 11.4.5 New Zealand
    • 11.4.6 South Korea
    • 11.4.7 Rest of Asia Pacific
  • 11.5 South America
    • 11.5.1 Argentina
    • 11.5.2 Brazil
    • 11.5.3 Chile
    • 11.5.4 Rest of South America
  • 11.6 Middle East & Africa
    • 11.6.1 Saudi Arabia
    • 11.6.2 UAE
    • 11.6.3 Qatar
    • 11.6.4 South Africa
    • 11.6.5 Rest of Middle East & Africa

12 Key Developments

  • 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 12.2 Acquisitions & Mergers
  • 12.3 New Product Launch
  • 12.4 Expansions
  • 12.5 Other Key Strategies

13 Company Profiling

  • 13.1 TE Connectivity
  • 13.2 Element Solutions
  • 13.3 Molex LLC
  • 13.4 Cicor Group
  • 13.5 Amphenol Corporation
  • 13.6 Sumitomo Electric Industries, Ltd.
  • 13.7 LPKF Laser & Electronics AG
  • 13.8 RTP Company
  • 13.9 Taoglas Limited
  • 13.10 Multiple Dimensions AG
  • 13.11 KYOCERA AVX Components Corporation
  • 13.12 Teprosa GmbH
  • 13.13 HARTING Technology Group
  • 13.14 2E mechatronic GmbH & Co. KG
  • 13.15 MID Solutions GmbH

List of Tables

  • Table 1 Global Molded Interconnect Device Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Molded Interconnect Device Market Outlook, By Product (2024-2032) ($MN)
  • Table 3 Global Molded Interconnect Device Market Outlook, By Two-Dimensional (2D) MID (2024-2032) ($MN)
  • Table 4 Global Molded Interconnect Device Market Outlook, By Three-Dimensional (3D) MID (2024-2032) ($MN)
  • Table 5 Global Molded Interconnect Device Market Outlook, By Other Products (2024-2032) ($MN)
  • Table 6 Global Molded Interconnect Device Market Outlook, By Material (2024-2032) ($MN)
  • Table 7 Global Molded Interconnect Device Market Outlook, By Thermoplastics (2024-2032) ($MN)
  • Table 8 Global Molded Interconnect Device Market Outlook, By Polycarbonate (PC) (2024-2032) ($MN)
  • Table 9 Global Molded Interconnect Device Market Outlook, By Liquid Crystal Polymer (LCP) (2024-2032) ($MN)
  • Table 10 Global Molded Interconnect Device Market Outlook, By Polybutylene Terephthalate (PBT) (2024-2032) ($MN)
  • Table 11 Global Molded Interconnect Device Market Outlook, By Polyphthalamide (PPA) (2024-2032) ($MN)
  • Table 12 Global Molded Interconnect Device Market Outlook, By Other Thermoplastics (2024-2032) ($MN)
  • Table 13 Global Molded Interconnect Device Market Outlook, By Technology (2024-2032) ($MN)
  • Table 14 Global Molded Interconnect Device Market Outlook, By Laser Direct Structuring (LDS) (2024-2032) ($MN)
  • Table 15 Global Molded Interconnect Device Market Outlook, By Film Insert Molding (FIM) (2024-2032) ($MN)
  • Table 16 Global Molded Interconnect Device Market Outlook, By Two-Shot Molding (2024-2032) ($MN)
  • Table 17 Global Molded Interconnect Device Market Outlook, By Other Technologies (2024-2032) ($MN)
  • Table 18 Global Molded Interconnect Device Market Outlook, By Component (2024-2032) ($MN)
  • Table 19 Global Molded Interconnect Device Market Outlook, By Antennas (2024-2032) ($MN)
  • Table 20 Global Molded Interconnect Device Market Outlook, By Connectors (2024-2032) ($MN)
  • Table 21 Global Molded Interconnect Device Market Outlook, By Sensors (2024-2032) ($MN)
  • Table 22 Global Molded Interconnect Device Market Outlook, By Switches (2024-2032) ($MN)
  • Table 23 Global Molded Interconnect Device Market Outlook, By Lighting Components (2024-2032) ($MN)
  • Table 24 Global Molded Interconnect Device Market Outlook, By Application (2024-2032) ($MN)
  • Table 25 Global Molded Interconnect Device Market Outlook, By Automotive (2024-2032) ($MN)
  • Table 26 Global Molded Interconnect Device Market Outlook, By Steering Wheel Controls (2024-2032) ($MN)
  • Table 27 Global Molded Interconnect Device Market Outlook, By Sensors & Switches (2024-2032) ($MN)
  • Table 28 Global Molded Interconnect Device Market Outlook, By Lighting Systems (2024-2032) ($MN)
  • Table 29 Global Molded Interconnect Device Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 30 Global Molded Interconnect Device Market Outlook, By Smartphones & Wearables (2024-2032) ($MN)
  • Table 31 Global Molded Interconnect Device Market Outlook, By Home Appliances (2024-2032) ($MN)
  • Table 32 Global Molded Interconnect Device Market Outlook, By Medical Devices (2024-2032) ($MN)
  • Table 33 Global Molded Interconnect Device Market Outlook, By Diagnostic Equipment (2024-2032) ($MN)
  • Table 34 Global Molded Interconnect Device Market Outlook, By Surgical Instruments (2024-2032) ($MN)
  • Table 35 Global Molded Interconnect Device Market Outlook, By Telecommunications (2024-2032) ($MN)
  • Table 36 Global Molded Interconnect Device Market Outlook, By Antenna Modules (2024-2032) ($MN)
  • Table 37 Global Molded Interconnect Device Market Outlook, By Routers & Modems (2024-2032) ($MN)
  • Table 38 Global Molded Interconnect Device Market Outlook, By Industrial (2024-2032) ($MN)
  • Table 39 Global Molded Interconnect Device Market Outlook, By Automation Equipment (2024-2032) ($MN)
  • Table 40 Global Molded Interconnect Device Market Outlook, By Control Systems (2024-2032) ($MN)
  • Table 41 Global Molded Interconnect Device Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 42 Global Molded Interconnect Device Market Outlook, By End User (2024-2032) ($MN)
  • Table 43 Global Molded Interconnect Device Market Outlook, By Original Equipment Manufacturers (OEMs) (2024-2032) ($MN)
  • Table 44 Global Molded Interconnect Device Market Outlook, By Electronics Manufacturing Services (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.