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市场调查报告书
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1438161

2030 年 MID（模製电路元件）市场预测：按产品类型、製程、最终用户和地区进行的全球分析

Molded Interconnect Devices Market Forecasts to 2030 - Global Analysis By Product Type, By Process (Laser Direct Structuring, Film Techniques and Two-Shot Molding), End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据Stratistics MRC预测，2023年全球MID（模製电路元件）市场规模将达13亿美元，预计2030年将达到35亿美元，预测期内复合年增长率为14.4%。

MID 是透过将电子元件直接整合到射出成型塑胶元件中而形成的3D结构。这项技术可实现紧凑、轻量化的设计，将机械和电气功能整合到一个组件中。 MID 用于各种行业，包括汽车和消费性电子产品，以创建高效、节省空间的电子设备。

对连网型设备的需求不断增长

在物联网 (IoT) 等趋势的推动下，对连网型设备的需求不断增长，这是 MID 市场的关键驱动力。 MID 技术允许电子元件无缝整合到3D结构中，从而形成紧凑的多功能设备。随着汽车、医疗保健和消费电子等行业对智慧互联产品的需求不断增加，MID 有效结合机械和电气功能的能力满足了这些不断变化的市场需求，它被定位为重要的解决方案。

初期投资成本高

建立 MID 生产的基础设施，包括专用机械和技术，需要大量的财政资源。公司在为研发和生产设置分配资金方面面临挑战，这阻碍了普及。财务障碍可能会限制潜在竞争对手的市场进入，并减缓整体 MID 市场的成长。

製造技术的进步

製造技术的进步透过提高生产效率和扩大设计可能性为 MID 市场带来了重大机会。积层製造、雷射直接成型 (LDS) 和 3D 列印等创新正在实现更复杂和客製化的 MID 设计。这简化了製造过程并实现了复杂电子功能的整合。因此，MID 市场可以利用这些进步来提供更复杂、更紧凑且更具成本效益的解决方案，从而推动产业成长。

原物料价格波动

原物料价格的波动对MID市场构成重大威胁。由于 MID 使用专门的材料来製造电子和结构部件，因此这些原材料的价格波动可能会影响製造成本和整体盈利。製造商可能面临维持具有竞争力的价格的挑战，材料成本的不确定性可能会扰乱供应链并影响 MID 市场的稳定性和成长。

COVID-19 的影响：

COVID-19 大流行扰乱了全球供应链、导致生产延误并影响了消费者需求，从而影响了 MID 市场。封锁、社会疏离措施和经济不确定性给製造和分销带来了挑战。此外，优先事项的转变和消费者支出的下降正在影响 MID 在各行业的采用。远距工作的适应和消费行为的变化也影响市场动态，需要产业相关人员进行策略调整。

雷射直接成型（LDS）领域预计将在预测期内成为最大的领域

由于 MID 製造的先进能力，预计雷射直接成型 (LDS) 领域在预测期内将实现最高成长。 LDS 技术透过使用雷射光束选择性地激活模具基板内的添加剂，实现精确而复杂的电路图案。这种方法具有很高的弹性和设计复杂性，使其在各种应用中越来越受欢迎。对先进电子设备不断增长的需求以及日益增长的小型化趋势正在推动 LDS 领域在市场中占据主导地位。

感测器细分市场预计在预测期内复合年增长率最高

在 MID 市场中，感测器领域预计将在预测期内呈现最高成长率。这种快速成长是由各行业对紧凑型整合感测器解决方案不断增长的需求所推动的。 MID 技术能够将感测器无缝嵌入3D结构中，从而提高设计效率和功能，推动 MID 在感测器应用中得到更多采用，并为该产业的强劲成长做出贡献。

比最大的地区

北美地区预计将引领 MID 市场，在预测期内占据最大份额。这一优势得益于强大的电子产业、技术创新以及在汽车、医疗保健和通讯等领域的广泛采用。有利的经济状况、完善的製造基础设施以及对先进技术的坚定承诺造就了该地区的优势。对紧凑型多功能电子解决方案的持续需求进一步推动了北美 MID 市场的成长。

复合年增长率最高的地区：

由于电子製造业的快速成长、先进技术的不断采用以及消费性电子市场的扩大，预计亚太地区的 MID 市场将快速成长。该地区受益于强大的供应链、具有成本效益的製造能力以及对紧凑型整合式电子解决方案不断增长的需求。在政府支持措施和蓬勃发展的创新生态系统的推动下，亚太地区正在成为MID应用的中心，市场预计将迅速扩大。

免费客製化服务：

订阅此报告的客户将收到以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 调查来源
    • 主要调查来源
    • 二次调查来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 产品分析
  • 最终用户分析
  • 新型冠状病毒感染疾病（COVID-19）的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球 MID 市场：依产品类型

  • 天线/连接模组
  • 连接器开关
  • 照明系统
  • 感应器
  • 其他的

第六章 全球 MID 市场：依流程

  • 雷射直接成型（LDS）
  • 薄膜技术
  • 二次射出成型

第七章 全球 MID 市场：依最终用户分类

  • 通讯
  • 车
  • 消费性电子产品
  • 产业
  • 医疗保健
  • 军事/航太
  • 其他的

第八章全球 MID 市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第九章 主要进展

  • 合约、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第十章 公司简介

  • Amphenol Corporation
  • Cicor Group
  • Galtronics USA Inc.（Baylin Technologies）
  • Harting Technology Group
  • Kubler Group
  • LP Technologies, Inc.
  • LPKF Laser & Electronics AG
  • MacDermid Alpha Electronics Solutions
  • MID Solutions, Inc.
  • Molex LLC
  • Multiple Dimensions AG
  • RTP Company
  • Taoglas
  • TE Connectivity Ltd.
  • T-Ink Inc.
  • Yomura Technologies Inc.
Product Code: SMRC25130

According to Stratistics MRC, the Global Molded Interconnect Devices (MID) Market is accounted for $1.3 billion in 2023 and is expected to reach $3.5 billion by 2030 growing at a CAGR of 14.4% during the forecast period. Molded Interconnect Devices (MID) are three-dimensional circuit structures formed by integrating electronics directly into injection-molded plastic components. This technology enables compact and lightweight designs, combining mechanical and electrical functions in a single part. MID is utilized in various industries, such as automotive and consumer electronics, to create efficient and space-saving electronic devices.

Market Dynamics:

Driver:

Growing demand for connected devices

The increasing demand for connected devices, driven by trends like the Internet of Things (IoT), is a key driver in the molded interconnect devices (MID) market. MID technology allows the seamless integration of electronic components into three-dimensional structures, enabling compact and multifunctional devices. As the demand for smart and interconnected products rises across industries such as automotive, healthcare and consumer electronics, MID's ability to efficiently combine mechanical and electrical functions positions it as a crucial solution for meeting these evolving market needs.

Restraint:

High initial investment costs

Establishing the infrastructure for MID production, including specialized machinery and technology, requires substantial financial resources. Companies face challenges in allocating funds for research, development and production setup, hindering widespread adoption. The financial barriers limit market entry for potential competitors and may slow down the overall growth of the MID market.

Opportunity:

Advancements in manufacturing technologies

Advancements in manufacturing technologies present a significant opportunity in the molded interconnect device (MID) market by enhancing production efficiency and expanding design possibilities. Innovations like additive manufacturing, laser direct structuring, and 3D printing enable more intricate and customized MID designs. This streamlines the manufacturing process and allows for the integration of complex electronic functionalities. As a result, the MID market can capitalize on these advancements to offer more sophisticated, compact and cost-effective solutions, fostering industry growth.

Threat:

Fluctuations in raw material prices

Fluctuations in raw material prices pose a significant threat to the molded interconnect device (MID) market. As MID relies on specialized materials for both electronic and structural components, any volatility in the prices of these raw materials can impact production costs and overall profitability. Manufacturers may face challenges in maintaining competitive pricing and the uncertainty in material costs can disrupt supply chains, affecting the stability and growth of the MID market.

Covid-19 Impact:

The COVID-19 pandemic has impacted the molded interconnect devices (MID) market by disrupting global supply chains, causing production delays and affecting consumer demand. Lockdowns, social distancing measures and economic uncertainties have led to challenges in manufacturing and distribution. Additionally, shifts in priorities and reduced consumer spending have influenced the adoption of MID in various industries. Adaptation to remote work and changes in consumer behavior have also influenced market dynamics, requiring strategic adjustments from industry players.

The laser direct structuring (LDS) segment is expected to be the largest during the forecast period

The laser direct structuring (LDS) segment is projected to be the largest in the forecast period due to its advanced capabilities in molded interconnect device (MID) manufacturing. LDS technology enables precise and intricate circuit patterns by selectively activating additives in the molded substrate using laser beams. This method offers high flexibility and design complexity, making it increasingly favored in diverse applications. The demand for sophisticated electronic devices and the growing trend towards miniaturization contribute to the dominance of the LDS segment in the market.

The sensors segment is expected to have the highest CAGR during the forecast period

The sensors segment is anticipated to exhibit the highest growth rate during the forecast period in the molded interconnect devices (MID) market. This surge is attributed to the escalating demand for compact and integrated sensor solutions across industries. MID technology's ability to seamlessly embed sensors within three-dimensional structures enhances design efficiency and functionality, driving the growing adoption of MID in sensor applications and contributing to the segment's robust growth.

Region with largest share:

North America is poised to lead the molded interconnect devices (MID) market, boasting the largest share during the forecast period. This dominance is attributed to a robust electronics industry, technological innovation and widespread adoption across sectors like automotive, healthcare and telecommunications. Favorable economic conditions, a well-established manufacturing infrastructure and a proactive approach towards advanced technologies contribute to the region's prominence. The continuous demand for compact and multifunctional electronic solutions further propels the growth of the MID market in North America.

Region with highest CAGR:

The Asia-Pacific region is poised for rapid growth in the molded interconnect devices (MID) market due to its burgeoning electronics manufacturing sector, increasing adoption of advanced technologies and expanding consumer electronics markets. The region benefits from a robust supply chain, cost-effective manufacturing capabilities and a rising demand for compact and integrated electronic solutions. With supportive government initiatives and a flourishing innovation ecosystem, Asia-Pacific is becoming a focal point for MID applications, contributing to the anticipated swift expansion of the market.

Key players in the market

Some of the key players in Molded Interconnect Devices (MID) market include Amphenol Corporation, Cicor Group, Galtronics USA Inc. (Baylin Technologies), Harting Technology Group, Kubler Group, LP Technologies, Inc., LPKF Laser & Electronics AG, MacDermid Alpha Electronics Solutions, MID Solutions, Inc., Molex LLC, Multiple Dimensions AG, RTP Company, Taoglas, TE Connectivity Ltd., T-Ink Inc. and Yomura Technologies Inc.

Key Developments:

In November 2023, Molex has built a new medical device campus in Poland in a $110m project that adds high power busbar and battery interconnect for its electrification business. The new Molex facility Katowice, Poland, has an initial 23,000 square-meter manufacturing space for advanced medical devices for Phillips-Medisize as well as electric vehicle and electrification interconnect for Molex customers. The site will have advanced medical device assembly, packaging and injection molding and also manufacture interconnect battery solutions for electric vehicles and high-power busbar solutions for Molex's electrification business.

In May 2022, Taoglas has signed a partnership agreement with Dejerao. The company will help Dejerao's customers by providing best-in-class RF antennas for cellular bonding devices used in mobile applications.

In March 2022, Amphenol Corporation has expanded its SURLOK Plus Series to include 8 mm and 10.3 mm right-angle connectors, with a voltage range of 1500 VDC to meet energy storage and high-power connection and transfer requirements.

Product Types Covered:

  • Antenna & Connectivity Modules
  • Connectors & Switches
  • Lighting Systems
  • Sensors
  • Other Product Types

Processes Covered:

  • Laser Direct Structuring (LDS)
  • Film Techniques
  • Two-Shot Molding

End Users Covered:

  • Telecommunications
  • Automotive
  • Consumer Electronics
  • Industrial
  • Medical
  • Military & Aerospace
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 End User Analysis
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Molded Interconnect Devices (MID) Market, By Product Type

  • 5.1 Introduction
  • 5.2 Antenna & Connectivity Modules
  • 5.3 Connectors & Switches
  • 5.4 Lighting Systems
  • 5.5 Sensors
  • 5.6 Other Product Types

6 Global Molded Interconnect Devices (MID) Market, By Process

  • 6.1 Introduction
  • 6.2 Laser Direct Structuring (LDS)
  • 6.3 Film Techniques
  • 6.4 Two-Shot Molding

7 Global Molded Interconnect Devices (MID) Market, By End User

  • 7.1 Introduction
  • 7.2 Telecommunications
  • 7.3 Automotive
  • 7.4 Consumer Electronics
  • 7.5 Industrial
  • 7.6 Medical
  • 7.7 Military & Aerospace
  • 7.8 Other End Users

8 Global Molded Interconnect Devices (MID) Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 Amphenol Corporation
  • 10.2 Cicor Group
  • 10.3 Galtronics USA Inc. (Baylin Technologies)
  • 10.4 Harting Technology Group
  • 10.5 Kubler Group
  • 10.6 LP Technologies, Inc.
  • 10.7 LPKF Laser & Electronics AG
  • 10.8 MacDermid Alpha Electronics Solutions
  • 10.9 MID Solutions, Inc.
  • 10.10 Molex LLC
  • 10.11 Multiple Dimensions AG
  • 10.12 RTP Company
  • 10.13 Taoglas
  • 10.14 TE Connectivity Ltd.
  • 10.15 T-Ink Inc.
  • 10.16 Yomura Technologies Inc.

List of Tables

  • Table 1 Global Molded Interconnect Devices (MID) Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
  • Table 3 Global Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
  • Table 4 Global Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
  • Table 5 Global Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
  • Table 6 Global Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
  • Table 7 Global Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
  • Table 8 Global Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
  • Table 9 Global Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
  • Table 10 Global Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
  • Table 11 Global Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
  • Table 12 Global Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
  • Table 13 Global Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 14 Global Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 15 Global Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 16 Global Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 17 Global Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
  • Table 18 Global Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
  • Table 19 Global Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 20 North America Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
  • Table 21 North America Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
  • Table 22 North America Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
  • Table 23 North America Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
  • Table 24 North America Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
  • Table 25 North America Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
  • Table 26 North America Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
  • Table 27 North America Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
  • Table 28 North America Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
  • Table 29 North America Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
  • Table 30 North America Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
  • Table 31 North America Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
  • Table 32 North America Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 33 North America Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 34 North America Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 35 North America Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 36 North America Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
  • Table 37 North America Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
  • Table 38 North America Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 39 Europe Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
  • Table 40 Europe Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
  • Table 41 Europe Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
  • Table 42 Europe Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
  • Table 43 Europe Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
  • Table 44 Europe Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
  • Table 45 Europe Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
  • Table 46 Europe Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
  • Table 47 Europe Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
  • Table 48 Europe Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
  • Table 49 Europe Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
  • Table 50 Europe Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
  • Table 51 Europe Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 52 Europe Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 53 Europe Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 54 Europe Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 55 Europe Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
  • Table 56 Europe Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
  • Table 57 Europe Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 58 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
  • Table 59 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
  • Table 60 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
  • Table 61 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
  • Table 62 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
  • Table 63 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
  • Table 64 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
  • Table 65 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
  • Table 66 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
  • Table 67 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
  • Table 68 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
  • Table 69 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
  • Table 70 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 71 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 72 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 73 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 74 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
  • Table 75 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
  • Table 76 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 77 South America Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
  • Table 78 South America Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
  • Table 79 South America Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
  • Table 80 South America Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
  • Table 81 South America Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
  • Table 82 South America Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
  • Table 83 South America Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
  • Table 84 South America Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
  • Table 85 South America Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
  • Table 86 South America Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
  • Table 87 South America Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
  • Table 88 South America Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
  • Table 89 South America Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 90 South America Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 91 South America Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 92 South America Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 93 South America Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
  • Table 94 South America Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
  • Table 95 South America Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 96 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
  • Table 97 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
  • Table 98 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
  • Table 99 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
  • Table 100 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
  • Table 101 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
  • Table 102 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
  • Table 103 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
  • Table 104 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
  • Table 105 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
  • Table 106 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
  • Table 107 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
  • Table 108 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 109 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 110 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 111 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 112 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
  • Table 113 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
  • Table 114 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)