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市场调查报告书
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1802306

2025年全球模塑互连设备（MID）市场报告

Molded Interconnect Device (MID) Global Market Report 2025
出版日期: | 出版商: The Business Research Company | 英文 250 Pages | 商品交期: 2-10个工作天内

价格
简介目录

预计未来几年，模塑互连设备 (MID) 市场将快速成长，到 2029 年将达到 35.5 亿美元，复合年增长率为 15.4%。预测期内的成长归因于消费性电子产品的持续发展、医疗设备整合度的提高、汽车电子产品的成长以及快速原型製作和製造技术的创新。预测期内的主要趋势包括法规合规性和品质标准、客製化和设计灵活性、快速原型製作和製造技术、永续性和材料创新，以及工业 4.0 和智慧製造。

未来五年15.4%的预测成长率，较我们先前对该市场的预测略有下降0.7%。这一下降主要源自于美国与其他国家之间关税的影响。这可能会直接影响美国，限制其从德国和日本大量进口的3D电路元件的供应，并扰乱其先进汽车感测器和医疗设备的生产。由于互惠关税以及不断升级的贸易紧张局势和限制措施对全球经济和贸易的负面影响，影响也将更加广泛。

物联网设备需求的不断增长有望推动模塑互连设备市场的成长。物联网设备包括大量连接到互联网并在设备和系统之间交换资料的实体实体。这一成长主要源自于半导体和电子产业对更高运算速度、效率、低功耗设备和智慧晶片组的需求。根据 Techjury 于 2022 年 8 月基于 IoT Analytics 数据的报告，企业的物联网倡议特别专注于智慧城市（23%）、连网产业（17%）和连网建筑（12%）。然而，从物联网相关数据中提取价值对于 97% 的公司来说仍然是一项挑战，这凸显了市场的成长潜力。

目录

第一章执行摘要

第二章 市场特征

第三章 市场趋势与策略

第四章 市场：宏观经济情景，包括利率、通膨、地缘政治、贸易战和关税，以及新冠疫情和復苏对市场的影响

第五章 全球成长分析与策略分析框架

  • 全球模製互连设备 (MID) 市场：PESTEL 分析（政治、社会、技术、环境、法律因素、驱动因素和限制因素）
  • 最终用途产业分析
  • 全球模製互连设备（MID）市场：成长率分析
  • 全球模塑互连设备 (MID) 市场表现：规模与成长，2019-2024 年
  • 全球模塑互连设备 (MID) 市场预测：规模与成长，2024-2029 年，2034 年预测
  • 全球模塑互连设备 (MID)：总目标市场 (TAM)

第六章市场区隔

  • 全球模塑互连设备 (MID) 市场：按产品、性能和预测，2019-2024 年、2024-2029 年、2034 年
  • 天线和连接模组
  • 连接器和开关
  • 感应器
  • 灯光
  • 全球模塑互连设备 (MID) 市场：按製程、实际状况及预测，2019-2024 年、2024-2029 年、2034 年
  • 雷射直接成型 (LDS)
  • 双色注塑成型
  • 其他流程
  • 全球模塑互连设备 (MID) 市场：按应用、效能及预测，2019-2024 年、2024-2029 年、2034 年
  • 车
  • 消费品
  • 卫生保健
  • 产业
  • 军事和航太
  • 通讯和计算
  • 全球模塑互连设备 (MID) 市场、天线和连接模组、按类型细分：实际结果和预测，2019-2024 年、2024-2029 年、2034 年
  • 整合天线
  • 射频模组
  • 全球模塑互连设备 (MID) 市场、连接器和开关（按类型细分）：实际结果和预测（2019-2024 年、2024-2029 年、2034 年）
  • 电连接器
  • 机械开关
  • 全球模塑互连设备 (MID) 市场、感测器、按类型细分：实际结果和预测，2019-2024 年、2024-2029 年、2034 年
  • 温度感测器
  • 压力感测器
  • 接近感测器
  • 全球模塑互连设备 (MID) 市场、照明（按类型细分）：实际结果和预测（2019-2024 年、2024-2029 年预测、2034 年预测）
  • LED照明模组
  • 装饰照明解决方案

第七章 区域和国家分析

  • 全球模塑互连设备 (MID) 市场：区域表现及预测（2019-2024 年、2024-2029 年及 2034 年）
  • 全球模塑互连设备 (MID) 市场：国家/地区、绩效及预测（2019-2024 年、2024-2029 年及 2034 年）

第八章 亚太市场

第九章：中国市场

第十章 印度市场

第十一章 日本市场

第十二章：澳洲市场

第十三章 印尼市场

第十四章 韩国市场

第十五章 西欧市场

第十六章英国市场

第十七章：德国市场

第十八章：法国市场

第十九章：义大利市场

第20章：西班牙市场

第21章 东欧市场

第22章 俄罗斯市场

第23章 北美市场

第24章美国市场

第25章：加拿大市场

第26章 南美洲市场

第27章：巴西市场

第28章 中东市场

第29章：非洲市场

第30章：竞争格局与公司概况

  • 模製互连设备 (MID) 市场：竞争格局
  • 模製互连设备 (MID) 市场：公司简介
    • Molex LLC Overview, Products and Services, Strategy and Financial Analysis
    • TE Connectivity Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • Amphenol Corporation Overview, Products and Services, Strategy and Financial Analysis
    • LPKF Laser & Electronics AG Overview, Products and Services, Strategy and Financial Analysis
    • 2E mechatronic GmbH & Co. KG Overview, Products and Services, Strategy and Financial Analysis

第31章：其他领先和创新企业

  • Harting Technologiegruppe
  • Arlington Plating Company
  • MID Solutions LLC
  • MacDermid Inc.
  • JOHNAN Corporation
  • TactoTek Oy
  • Axon'Cable SAS
  • S2P Solutions
  • Suzhou Cicor Technology Co. Ltd
  • Chogori Technology Co. Ltd.
  • Mitsubishi Engineering-Plastics Corporation
  • Galtronics Corporation Ltd.
  • RTP Company
  • BASF SE
  • EMS-Chemie Holding AG

第 32 章全球市场竞争基准化分析与仪表板

第33章 重大併购

第34章近期市场趋势

第 35 章：高潜力市场国家、细分市场与策略

  • 2029 年模製互连设备 (MID) 市场：提供新机会的国家
  • 2029 年模塑互连设备 (MID) 市场：细分市场带来新机会
  • 2029 年模製互连设备 (MID) 市场：成长策略
    • 基于市场趋势的策略
    • 竞争对手的策略

第36章 附录

简介目录
Product Code: r22792u

Molded Interconnect Devices (MIDs) represent sophisticated electromechanical components integrating mechanical and electrical engineering principles in three dimensions. They amalgamate traditional product interfaces-circuit boards, housing, connectors, and wiring-into a singular, compact, and fully functional unit. MIDs typify a production method utilizing selectively plated plastic pieces.

The primary processes employed in Molded Interconnect Devices encompass Laser Direct Structuring (LDS), Two-Shot Molding, and other relevant techniques. Laser Direct Structuring stands out as an environmentally friendly, precise, and pioneering manufacturing method for three-dimensional molded connector devices. These products include antenna and connectivity modules, connectors and switches, sensors, lighting, and other relevant items. Applications span across automotive, consumer products, healthcare, industrial, military and aerospace, as well as telecommunication and computing sectors.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

The sharp escalation of U.S. tariffs and resulting trade tensions in spring 2025 are significantly affecting the electrical and electronics sector. Key components such as semiconductors, display panels, and rare-earth metals crucial for batteries and motors are now facing heavy duties. Consumer electronics companies are seeing profit margins shrink, as fierce competition makes it difficult to pass on rising costs to consumers. At the same time, industrial electronics firms are experiencing project delays due to shortages of tariff-impacted parts like printed circuit boards. In response, businesses are shifting assembly operations to tariff-exempt nations, building up inventory reserves, and redesigning products to reduce reliance on restricted materials.

The molded interconnected device market research report is one of a series of new reports from The Business Research Company that provides molded interconnected device market statistics, including molded interconnected device industry global market size, regional shares, competitors with a molded interconnected device market share, detailed molded interconnected device market segments, market trends and opportunities, and any further data you may need to thrive in the molded interconnected device industry. This molded interconnected device market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The molded interconnect device (mid) market size has grown rapidly in recent years. It will grow from $1.75 billion in 2024 to $2 billion in 2025 at a compound annual growth rate (CAGR) of 14.4%. The growth in the historic period can be attributed to miniaturization trends, consumer electronics evolution, automotive electronics development, medical device innovations, shift towards smart manufacturing.

The molded interconnect device (mid) market size is expected to see rapid growth in the next few years. It will grow to $3.55 billion in 2029 at a compound annual growth rate (CAGR) of 15.4%. The growth in the forecast period can be attributed to ongoing evolution of consumer electronics, rise in medical device integration, automotive electronics growth, rapid prototyping and manufacturing innovations. Major trends in the forecast period include regulatory compliance and quality standards, customization and design flexibility, rapid prototyping and manufacturing technologies, sustainability and material innovations, industry 4.0 and smart manufacturing.

The forecast of 15.4% growth over the next five years reflects a modest reduction of 0.7% from the previous estimate for this market. This reduction is primarily due to the impact of tariffs between the US and other countries. This is likely to directly affect the US through constrained availability of 3D circuitry components, heavily imported from Germany and Japan, disrupting production of advanced automotive sensors and medical devices. The effect will also be felt more widely due to reciprocal tariffs and the negative effect on the global economy and trade due to increased trade tensions and restrictions.

The rising demand for IoT devices is poised to drive the growth of the molded interconnect devices market. IoT devices encompass a multitude of physical items connected to the internet, exchanging data across devices and systems. This surge is fueled by the demand for higher computational speed, efficiency, low-power devices, and intelligent chipsets, primarily within the semiconductor & electronics industry. As reported in August 2022 by Techjury sourced from IoT Analytics, corporate IoT initiatives focused notably on Smart City (23%), Connected Industry (17%), and Connected Building (12%). However, the extraction of value from IoT-related data remains a challenge for 97% of firms, underscoring the market's potential growth.

The burgeoning demand within the aerospace industry is expected to propel the growth of the molded interconnect devices market. Molded interconnect devices offer significant advantages such as space savings, weight reduction, reliability, thermal management, manufacturing efficiency, and design flexibility, aligning well with diverse aerospace applications. For instance, as reported in August 2023 by Cadrex, the aerospace industry recorded revenue of $741 billion in 2022, marking a 3% increase from the previous year. This industry's expanding requirements are a key driver stimulating growth within the molded interconnect devices market.

Technological advancement is a prominent trend gaining traction in the molded interconnect device market. Leading companies in this sector are focusing on developing innovative technological solutions that can adapt to various applications, which has spurred the evolution of technologies like laser plastic welding. For example, in April 2022, SABIC, a Saudi Arabia-based chemical company known for producing chemicals, plastics, agri-nutrients, and metals, introduced the LNP THERMOCOMP OFC08V compound. This high-performance solution is tailored for 5G base station dipole antennas and other electrical and electronic applications. The compound is a glass fiber-reinforced material derived from polyphenylene sulfide (PPS) resin, specifically designed to facilitate lightweight and cost-effective all-plastic antenna designs. It exhibits excellent performance in laser direct structuring (LDS) plating, ensuring strong adhesion between layers, effective warpage control, and reliable dielectric and radio frequency (RF) characteristics.

Major companies operating in the molded interconnect device market are focusing on pioneering products such as light antennas to bolster market revenues. Light antennas represent a breakthrough in wireless communications, being smaller than a US dime and pivotal in enabling widespread LiFi (Light Fidelity) usage in smartphones and connected devices. As unveiled in February 2023 by pureLiFi Limited, the LiFi Light Antenna is engineered for seamless integration, optimizing performance, size, cost, and production needs. Leveraging the light spectrum, LiFi surpasses conventional technologies like WiFi and 5G in speed, reliability, and security, offering scalability for widespread adoption in smartphones and connected devices.

In September 2022, Tide Rock Holdings completed the acquisition of Plastic Molding Technology (PMT), a strategic move that expands their service capabilities across multiple sites. This acquisition brings onboard a highly skilled team and 95 molding machines ranging from 20 to 500 tons, positioning Tide Rock Holdings to cater to a broader client base in plastic injection and inserts molding. Plastic Molding Technology is renowned in the industry for its expertise and strategic site locations.

Major companies operating in the molded interconnect device (MID) market are Molex LLC, TE Connectivity Ltd., Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions LLC, MacDermid Inc., JOHNAN Corporation, TactoTek Oy, Axon' Cable S.A.S, S2P Solutions, Suzhou Cicor Technology Co. Ltd, Chogori Technology Co. Ltd., Mitsubishi Engineering-Plastics Corporation, Galtronics Corporation Ltd., RTP Company, BASF SE, EMS-Chemie Holding AG, Ensinger GmbH, Zeon Corporation, SelectConnect Technologies, Multiple Dimensions AG, Cicor Group, Tesa SE, Yomura Technologies Inc., T-Ink Inc., ODU GmbH & Co. KG

Asia-Pacific was the largest region in the molded interconnect device (MID) market share in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the molded interconnect device (mid) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the molded interconnect device (mid) market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The molded interconnect device market consists of sales of metal spraying and film techniques. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Molded Interconnect Device (MID) Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on molded interconnect device (mid) market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

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  • Create regional and country strategies on the basis of local data and analysis.
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  • Report will be updated with the latest data and delivered to you within 2-3 working days of order along with an Excel data sheet for easy data extraction and analysis.
  • All data from the report will also be delivered in an excel dashboard format.

Where is the largest and fastest growing market for molded interconnect device (mid) ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The molded interconnect device (mid) market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

  • Markets Covered:1) By Product: Antenna And Connectivity Modules; Connectors And Switches; Sensors; Lighting
  • 2) By Process: Laser Direct Structuring (LDS); Two-Shot Molding; Other Processes
  • 3) By Application: Automotive; Consumer Products; Healthcare; Industrial; Military And Aerospace; Telecommunication And Computing
  • Subsegments:
  • 1) By Antenna And Connectivity Modules: Integrated Antennas; RF Modules
  • 2) By Connectors And Switches: Electrical Connectors; Mechanical Switches
  • 3) By Sensors: Temperature Sensors; Pressure Sensors; Proximity Sensors
  • 4) By Lighting: LED Lighting Modules; Decorative Lighting Solutions
  • Companies Mentioned:Molex LLC; TE Connectivity Ltd.; Amphenol Corporation; LPKF Laser & Electronics AG; 2E mechatronic GmbH & Co. KG; Harting Technologiegruppe; Arlington Plating Company; MID Solutions LLC; MacDermid Inc.; JOHNAN Corporation; TactoTek Oy; Axon' Cable S.A.S; S2P Solutions; Suzhou Cicor Technology Co. Ltd; Chogori Technology Co. Ltd.; Mitsubishi Engineering-Plastics Corporation; Galtronics Corporation Ltd.; RTP Company; BASF SE; EMS-Chemie Holding AG; Ensinger GmbH; Zeon Corporation; SelectConnect Technologies; Multiple Dimensions AG; Cicor Group; Tesa SE; Yomura Technologies Inc.; T-Ink Inc.; ODU GmbH & Co. KG
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time Series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data Segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery Format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Molded Interconnect Device (MID) Market Characteristics

3. Molded Interconnect Device (MID) Market Trends And Strategies

4. Molded Interconnect Device (MID) Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Trade Wars and Tariffs, And Covid And Recovery On The Market

  • 4.1. Supply Chain Impact from Tariff War & Trade Protectionism

5. Global Molded Interconnect Device (MID) Growth Analysis And Strategic Analysis Framework

  • 5.1. Global Molded Interconnect Device (MID) PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
  • 5.2. Analysis Of End Use Industries
  • 5.3. Global Molded Interconnect Device (MID) Market Growth Rate Analysis
  • 5.4. Global Molded Interconnect Device (MID) Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
  • 5.5. Global Molded Interconnect Device (MID) Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
  • 5.6. Global Molded Interconnect Device (MID) Total Addressable Market (TAM)

6. Molded Interconnect Device (MID) Market Segmentation

  • 6.1. Global Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Antenna And Connectivity Modules
  • Connectors And Switches
  • Sensors
  • Lighting
  • 6.2. Global Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Laser Direct Structuring (LDS)
  • Two-Shot Molding
  • Other Processes
  • 6.3. Global Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Automotive
  • Consumer Products
  • Healthcare
  • Industrial
  • Military And Aerospace
  • Telecommunication And Computing
  • 6.4. Global Molded Interconnect Device (MID) Market, Sub-Segmentation Of Antenna And Connectivity Modules, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Integrated Antennas
  • RF Modules
  • 6.5. Global Molded Interconnect Device (MID) Market, Sub-Segmentation Of Connectors And Switches, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Electrical Connectors
  • Mechanical Switches
  • 6.6. Global Molded Interconnect Device (MID) Market, Sub-Segmentation Of Sensors, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Temperature Sensors
  • Pressure Sensors
  • Proximity Sensors
  • 6.7. Global Molded Interconnect Device (MID) Market, Sub-Segmentation Of Lighting, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • LED Lighting Modules
  • Decorative Lighting Solutions

7. Molded Interconnect Device (MID) Market Regional And Country Analysis

  • 7.1. Global Molded Interconnect Device (MID) Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 7.2. Global Molded Interconnect Device (MID) Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Molded Interconnect Device (MID) Market

  • 8.1. Asia-Pacific Molded Interconnect Device (MID) Market Overview
  • Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.3. Asia-Pacific Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.4. Asia-Pacific Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Molded Interconnect Device (MID) Market

  • 9.1. China Molded Interconnect Device (MID) Market Overview
  • 9.2. China Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.3. China Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.4. China Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Molded Interconnect Device (MID) Market

  • 10.1. India Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.2. India Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.3. India Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Molded Interconnect Device (MID) Market

  • 11.1. Japan Molded Interconnect Device (MID) Market Overview
  • 11.2. Japan Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.3. Japan Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.4. Japan Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Molded Interconnect Device (MID) Market

  • 12.1. Australia Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.2. Australia Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.3. Australia Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Molded Interconnect Device (MID) Market

  • 13.1. Indonesia Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.2. Indonesia Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.3. Indonesia Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Molded Interconnect Device (MID) Market

  • 14.1. South Korea Molded Interconnect Device (MID) Market Overview
  • 14.2. South Korea Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.3. South Korea Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.4. South Korea Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Molded Interconnect Device (MID) Market

  • 15.1. Western Europe Molded Interconnect Device (MID) Market Overview
  • 15.2. Western Europe Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.3. Western Europe Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.4. Western Europe Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Molded Interconnect Device (MID) Market

  • 16.1. UK Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.2. UK Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.3. UK Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Molded Interconnect Device (MID) Market

  • 17.1. Germany Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.2. Germany Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.3. Germany Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Molded Interconnect Device (MID) Market

  • 18.1. France Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.2. France Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.3. France Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Molded Interconnect Device (MID) Market

  • 19.1. Italy Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.2. Italy Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.3. Italy Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Molded Interconnect Device (MID) Market

  • 20.1. Spain Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.2. Spain Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.3. Spain Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Molded Interconnect Device (MID) Market

  • 21.1. Eastern Europe Molded Interconnect Device (MID) Market Overview
  • 21.2. Eastern Europe Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.3. Eastern Europe Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.4. Eastern Europe Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Molded Interconnect Device (MID) Market

  • 22.1. Russia Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.2. Russia Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.3. Russia Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Molded Interconnect Device (MID) Market

  • 23.1. North America Molded Interconnect Device (MID) Market Overview
  • 23.2. North America Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.3. North America Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.4. North America Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Molded Interconnect Device (MID) Market

  • 24.1. USA Molded Interconnect Device (MID) Market Overview
  • 24.2. USA Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.3. USA Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.4. USA Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Molded Interconnect Device (MID) Market

  • 25.1. Canada Molded Interconnect Device (MID) Market Overview
  • 25.2. Canada Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.3. Canada Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.4. Canada Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Molded Interconnect Device (MID) Market

  • 26.1. South America Molded Interconnect Device (MID) Market Overview
  • 26.2. South America Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.3. South America Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.4. South America Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Molded Interconnect Device (MID) Market

  • 27.1. Brazil Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.2. Brazil Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.3. Brazil Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Molded Interconnect Device (MID) Market

  • 28.1. Middle East Molded Interconnect Device (MID) Market Overview
  • 28.2. Middle East Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.3. Middle East Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.4. Middle East Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Molded Interconnect Device (MID) Market

  • 29.1. Africa Molded Interconnect Device (MID) Market Overview
  • 29.2. Africa Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.3. Africa Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.4. Africa Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Molded Interconnect Device (MID) Market Competitive Landscape And Company Profiles

  • 30.1. Molded Interconnect Device (MID) Market Competitive Landscape
  • 30.2. Molded Interconnect Device (MID) Market Company Profiles
    • 30.2.1. Molex LLC Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.2. TE Connectivity Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.3. Amphenol Corporation Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.4. LPKF Laser & Electronics AG Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.5. 2E mechatronic GmbH & Co. KG Overview, Products and Services, Strategy and Financial Analysis

31. Molded Interconnect Device (MID) Market Other Major And Innovative Companies

  • 31.1. Harting Technologiegruppe
  • 31.2. Arlington Plating Company
  • 31.3. MID Solutions LLC
  • 31.4. MacDermid Inc.
  • 31.5. JOHNAN Corporation
  • 31.6. TactoTek Oy
  • 31.7. Axon' Cable S.A.S
  • 31.8. S2P Solutions
  • 31.9. Suzhou Cicor Technology Co. Ltd
  • 31.10. Chogori Technology Co. Ltd.
  • 31.11. Mitsubishi Engineering-Plastics Corporation
  • 31.12. Galtronics Corporation Ltd.
  • 31.13. RTP Company
  • 31.14. BASF SE
  • 31.15. EMS-Chemie Holding AG

32. Global Molded Interconnect Device (MID) Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Molded Interconnect Device (MID) Market

34. Recent Developments In The Molded Interconnect Device (MID) Market

35. Molded Interconnect Device (MID) Market High Potential Countries, Segments and Strategies

  • 35.1 Molded Interconnect Device (MID) Market In 2029 - Countries Offering Most New Opportunities
  • 35.2 Molded Interconnect Device (MID) Market In 2029 - Segments Offering Most New Opportunities
  • 35.3 Molded Interconnect Device (MID) Market In 2029 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer