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市场调查报告书
商品编码
1859945

模塑电路基板（MIS）：全球市场份额和排名、总销售额和需求预测（2025-2031 年）

Molded Interconnect Substrate (MIS) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
出版日期: | 出版商: QYResearch | 英文 90 Pages | 商品交期: 2-3个工作天内

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全球模塑电路基板(MIS) 市场规模预计在 2024 年达到 9,800 万美元，预计到 2031 年将达到 2.97 亿美元，在 2025 年至 2031 年的预测期内，复合年增长率将达到 15.8%。

本报告全面评估了近期关税调整和国际战略反制措施对模塑电路基板(MIS)跨境产业布局、资本配置模式、区域经济相互依存关係和供应链重组的影响。

模塑电路基板技术 (MIS) 是一种创新的基板解决方案，非常适合行动产业。它涵盖了广泛的解决方案，可满足行动应用积体电路封装的复杂需求。其嵌入式铜互连技术能够实现精细的线宽和间距，从而在小外形规格中实现高 I/O 数量。此外，它还提供了一种可靠的覆晶安装製程。 MIS 的另一个关键特性是其铜填充通孔和填充垫片技术，这对于满足高频要求至关重要，并能有效提升散热性能。

目前，世界上只有三家公司生产 MIS：台湾的 PPt、中国的 MiSpak Technology 和马来西亚的 QDOS。

PPt目前提供1层、2层、3层、4层和6层MIS。 MiSpak Technology提供1层和2层MIS。 QDOS提供1层、2层和3层MIS。

MIS产品在基板应用市场的成长潜力主要来自伺服器和资料中心的网路通讯产品、电动车和智慧汽车驱动的汽车电子控制装置以及5G和AIoT等应用领域。随着这些相关产品的出现，半导体封装用基板的要求也将显着提高，需要更大的设计灵活性、更高的性能和更强的可靠性。

在先进导线架产品方面，MIS製造商（PPt、MiSpak、QDOS）主要供应的产品并不限于单层基板。 PPt还可以提供多晶片封装的多层基板可捲绕导线架产品，而传统导线架供应商则难以提供此类产品。

目前，MIS主要应用于功率/PMIC/模拟、汽车电子、射频/5G、光学影像防手震（OIS）、指纹认证、第三代半导体、LED等领域。其中，MIS主要应用于功率领域，在第三代半导体领域则主要用于GaN元件。

随着技术发展，5G应用对讯号速度、延迟和稳定性提出了更高的要求。随着电脑化和智慧化需求的不断增长，家用电子电器和工业市场涌现大量新的应用。这导致半导体晶片的性能要求持续提高，包括高速运算、高性能和低损耗。

这一发展趋势也增加了对具备小型化、窄间距和高散热等特性的积体电路构装基板的需求。微整合系统（MIS）製造商经过多年研发，已掌握了窄间距、曲面加工和多层基板的生产技术，这些技术有望在5G和电动车等领域中广泛应用。

此外，在智慧型手机这一家用电子电器领域，全球知名品牌行动电话製造商占据相当大的市场。随着新机型的发布，相机模组的规格也不断提升，高规格相机模组的普及率也持续成长。随着摄影机模组在新机型的应用日益普及，受中美贸易摩擦的影响，中国主要厂商也正在加快研发步伐。透过在地采购建立原物料供应体系，MIS厂商在智慧型手机相机模组领域实施了多种策略。随着新机型的不断推出，MIS厂商产品的市场渗透率预计将进一步提升。

本报告旨在对全球模塑电路基板(MIS) 市场按地区/国家、类型和应用进行全面分析，重点关注总销售量、收入、价格、市场份额和主要企业的排名。

本报告以2024年为基准年，按销量（百万台）和收入（百万美元）对模塑电路基板（MIS）市场规模、估算和预测进行了呈现，并包含了2020年至2031年的历史数据和预测数据。报告提供定量和定性分析，以帮助读者制定业务和成长策略、评估市场竞争、分析自身在当前市场中的地位，并就模塑电路基板（MIS）做出明智的商业决策。

市场区隔

公司

  • PPt
  • MiSpak Technology
  • QDOS

按类型分類的细分市场

  • 1层MIS
  • 双层MIS
  • 3层MIS
  • 4层MIS
  • 6层MIS
  • 其他的

应用领域

  • 类比晶片
  • 功率积体电路
  • RF/5G
  • 指纹感应器
  • OIS（光学影像防手震）
  • 其他的

按地区

  • 北美洲
    • 美国
    • 加拿大
  • 亚太地区
    • 中国
    • 日本
    • 韩国
    • 东南亚
    • 印度
    • 澳洲
    • 亚太其他地区
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 义大利
    • 荷兰
    • 北欧国家
    • 其他欧洲
  • 拉丁美洲
    • 墨西哥
    • 巴西
    • 其他拉丁美洲
  • 中东和非洲
    • 土耳其
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他中东和非洲地区

The global market for Molded Interconnect Substrate (MIS) was estimated to be worth US$ 98 million in 2024 and is forecast to a readjusted size of US$ 297 million by 2031 with a CAGR of 15.8% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Molded Interconnect Substrate (MIS) cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

Molded Interconnect Substrate Technology (MIS) is a novel substrate solution that is ideal for mobile industry. It encompasses a wide range of solutions for the complex needs of IC package for mobile applications. With its embedded copper trace technology, it enable a finer line and space that is needed for high I/O count with smaller form factor. It also provides a robust Flip Chip assembly process. Another important feature of MIS substrate is copper filled-via and filled-pad technologies, which is significantly important for high frequency requirements, and improve thermal dissipation.

Currently, there are currently only three companies in the world that manufacture MIS substrates, China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.

PPt now can supply 1 layer, 2 layer, 3 layer, 4 layer and 6 layer MIS substrates. MiSpak Technology supplies 1 layer and 2 layer MIS substrates. QDOS supplies 1 layer, 2 layer and 3 layer MIS substrates

The growth potential of MIS products in the substrate application market will come from network communication products such as servers and data centers, automotive electronic control equipment driven by electric vehicles and automotive intelligence, as well as 5G, AIoT and other applications. With the launch of these related products, the requirements for substrates used in semiconductor packaging will also increase significantly, requiring a high degree of design flexibility, improved performance and high reliability.

In terms of advanced lead frame products, MIS manufacturers (PPt, MiSpak and QDOS) mainly supply products that are not limited to single-layer boards. PPt can also provide multi-layer board windable lead frame products for multi-chip packaging, which are products that are difficult for traditional lead frame suppliers to provide.

Currently the MIS substrates are mainly used in power/PMIC/analog, automotive electronics, RF/5G, Optical Image Stabilization (OIS), fingerprint recognition, third generation semiconductor, and LED, etc. Most of MIS substrates are used in power segment. For third generation semiconductor, MIS substrates are mainly used in GaN devices.

As technology continues to update, 5G applications require high speed, low latency technology and stable signals. With the demand for electronicization and intelligence, new applications continue to emerge in the consumer electronics and Industrial markets. This drives the performance requirements of Semiconductor chips to continue, towards high-speed computing, high performance, low loss, etc.

The development direction has also increased the demand for IC packaging substrates to have fine, narrow spacing, high heat dissipation and other characteeristics. The MIS substrates manufacturers have be cultivating its product production Technology capabilities for a long time and has currently developed Narrow pitch, winding, multi-layer board production technologies will be used in 5G, a lot, electric vehicles, etc.

In addition, in terms of consumer electronic smartphone applications, global well-known brand mobile phone manufacturers have a large presence in the market. When launching new mobile phones, the specifications of camera modules are continuously improved, and high-specification camera modules are constantly being. The penetration into new mobile phones has also accelerated the development of major Chinese mobile phone manufacturers due to theimpact of the Sino-US trade war. By introducing local raw Material supply, The MIS substrates manufacturers have laid out multiple plans in the field of mobile phone camera module applications. As new mobile phones are launched in the market one after another, it is expected that the market penetration rate of MIS substrates manufacturers products will increase.

This report aims to provide a comprehensive presentation of the global market for Molded Interconnect Substrate (MIS), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Molded Interconnect Substrate (MIS) by region & country, by Type, and by Application.

The Molded Interconnect Substrate (MIS) market size, estimations, and forecasts are provided in terms of sales volume (Million Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Molded Interconnect Substrate (MIS).

Market Segmentation

By Company

  • PPt
  • MiSpak Technology
  • QDOS

Segment by Type

  • 1 Layer MIS Substrate
  • 2 Layer MIS Substrate
  • 3 Layer MIS Substrate
  • 4 Layer MIS Substrate
  • 6 Layer MIS Substrate
  • Others

Segment by Application

  • Analog Chip
  • Power IC
  • RF/5G
  • Fingerprint Sensor
  • OIS (Optical Image Stablization)
  • Others

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Molded Interconnect Substrate (MIS) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Molded Interconnect Substrate (MIS) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Molded Interconnect Substrate (MIS) in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 Molded Interconnect Substrate (MIS) Product Introduction
  • 1.2 Global Molded Interconnect Substrate (MIS) Market Size Forecast
    • 1.2.1 Global Molded Interconnect Substrate (MIS) Sales Value (2020-2031)
    • 1.2.2 Global Molded Interconnect Substrate (MIS) Sales Volume (2020-2031)
    • 1.2.3 Global Molded Interconnect Substrate (MIS) Sales Price (2020-2031)
  • 1.3 Molded Interconnect Substrate (MIS) Market Trends & Drivers
    • 1.3.1 Molded Interconnect Substrate (MIS) Industry Trends
    • 1.3.2 Molded Interconnect Substrate (MIS) Market Drivers & Opportunity
    • 1.3.3 Molded Interconnect Substrate (MIS) Market Challenges
    • 1.3.4 Molded Interconnect Substrate (MIS) Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global Molded Interconnect Substrate (MIS) Players Revenue Ranking (2024)
  • 2.2 Global Molded Interconnect Substrate (MIS) Revenue by Company (2020-2025)
  • 2.3 Global Molded Interconnect Substrate (MIS) Players Sales Volume Ranking (2024)
  • 2.4 Global Molded Interconnect Substrate (MIS) Sales Volume by Company Players (2020-2025)
  • 2.5 Global Molded Interconnect Substrate (MIS) Average Price by Company (2020-2025)
  • 2.6 Key Manufacturers Molded Interconnect Substrate (MIS) Manufacturing Base and Headquarters
  • 2.7 Key Manufacturers Molded Interconnect Substrate (MIS) Product Offered
  • 2.8 Key Manufacturers Time to Begin Mass Production of Molded Interconnect Substrate (MIS)
  • 2.9 Molded Interconnect Substrate (MIS) Market Competitive Analysis
    • 2.9.1 Molded Interconnect Substrate (MIS) Market Concentration Rate (2020-2025)
    • 2.9.2 Global 5 and 10 Largest Manufacturers by Molded Interconnect Substrate (MIS) Revenue in 2024
    • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Molded Interconnect Substrate (MIS) as of 2024)
  • 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 1 Layer MIS Substrate
    • 3.1.2 2 Layer MIS Substrate
    • 3.1.3 3 Layer MIS Substrate
    • 3.1.4 4 Layer MIS Substrate
    • 3.1.5 6 Layer MIS Substrate
    • 3.1.6 Others
  • 3.2 Global Molded Interconnect Substrate (MIS) Sales Value by Type
    • 3.2.1 Global Molded Interconnect Substrate (MIS) Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global Molded Interconnect Substrate (MIS) Sales Value, by Type (2020-2031)
    • 3.2.3 Global Molded Interconnect Substrate (MIS) Sales Value, by Type (%) (2020-2031)
  • 3.3 Global Molded Interconnect Substrate (MIS) Sales Volume by Type
    • 3.3.1 Global Molded Interconnect Substrate (MIS) Sales Volume by Type (2020 VS 2024 VS 2031)
    • 3.3.2 Global Molded Interconnect Substrate (MIS) Sales Volume, by Type (2020-2031)
    • 3.3.3 Global Molded Interconnect Substrate (MIS) Sales Volume, by Type (%) (2020-2031)
  • 3.4 Global Molded Interconnect Substrate (MIS) Average Price by Type (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 Analog Chip
    • 4.1.2 Power IC
    • 4.1.3 RF/5G
    • 4.1.4 Fingerprint Sensor
    • 4.1.5 OIS (Optical Image Stablization)
    • 4.1.6 Others
  • 4.2 Global Molded Interconnect Substrate (MIS) Sales Value by Application
    • 4.2.1 Global Molded Interconnect Substrate (MIS) Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global Molded Interconnect Substrate (MIS) Sales Value, by Application (2020-2031)
    • 4.2.3 Global Molded Interconnect Substrate (MIS) Sales Value, by Application (%) (2020-2031)
  • 4.3 Global Molded Interconnect Substrate (MIS) Sales Volume by Application
    • 4.3.1 Global Molded Interconnect Substrate (MIS) Sales Volume by Application (2020 VS 2024 VS 2031)
    • 4.3.2 Global Molded Interconnect Substrate (MIS) Sales Volume, by Application (2020-2031)
    • 4.3.3 Global Molded Interconnect Substrate (MIS) Sales Volume, by Application (%) (2020-2031)
  • 4.4 Global Molded Interconnect Substrate (MIS) Average Price by Application (2020-2031)

5 Segmentation by Region

  • 5.1 Global Molded Interconnect Substrate (MIS) Sales Value by Region
    • 5.1.1 Global Molded Interconnect Substrate (MIS) Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global Molded Interconnect Substrate (MIS) Sales Value by Region (2020-2025)
    • 5.1.3 Global Molded Interconnect Substrate (MIS) Sales Value by Region (2026-2031)
    • 5.1.4 Global Molded Interconnect Substrate (MIS) Sales Value by Region (%), (2020-2031)
  • 5.2 Global Molded Interconnect Substrate (MIS) Sales Volume by Region
    • 5.2.1 Global Molded Interconnect Substrate (MIS) Sales Volume by Region: 2020 VS 2024 VS 2031
    • 5.2.2 Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2020-2025)
    • 5.2.3 Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2026-2031)
    • 5.2.4 Global Molded Interconnect Substrate (MIS) Sales Volume by Region (%), (2020-2031)
  • 5.3 Global Molded Interconnect Substrate (MIS) Average Price by Region (2020-2031)
  • 5.4 North America
    • 5.4.1 North America Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 5.4.2 North America Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • 5.5 Europe
    • 5.5.1 Europe Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 5.5.2 Europe Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • 5.6 Asia Pacific
    • 5.6.1 Asia Pacific Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 5.6.2 Asia Pacific Molded Interconnect Substrate (MIS) Sales Value by Region (%), 2024 VS 2031
  • 5.7 South America
    • 5.7.1 South America Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 5.7.2 South America Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • 5.8 Middle East & Africa
    • 5.8.1 Middle East & Africa Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 5.8.2 Middle East & Africa Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value and Sales Volume
    • 6.2.1 Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.2.2 Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Volume, 2020-2031
  • 6.3 United States
    • 6.3.1 United States Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.3.2 United States Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.4.2 Europe Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.5.2 China Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.6.2 Japan Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.7.2 South Korea Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.8.2 Southeast Asia Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.9.2 India Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 PPt
    • 7.1.1 PPt Company Information
    • 7.1.2 PPt Introduction and Business Overview
    • 7.1.3 PPt Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.1.4 PPt Molded Interconnect Substrate (MIS) Product Offerings
    • 7.1.5 PPt Recent Development
  • 7.2 MiSpak Technology
    • 7.2.1 MiSpak Technology Company Information
    • 7.2.2 MiSpak Technology Introduction and Business Overview
    • 7.2.3 MiSpak Technology Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.2.4 MiSpak Technology Molded Interconnect Substrate (MIS) Product Offerings
    • 7.2.5 MiSpak Technology Recent Development
  • 7.3 QDOS
    • 7.3.1 QDOS Company Information
    • 7.3.2 QDOS Introduction and Business Overview
    • 7.3.3 QDOS Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.3.4 QDOS Molded Interconnect Substrate (MIS) Product Offerings
    • 7.3.5 QDOS Recent Development

8 Industry Chain Analysis

  • 8.1 Molded Interconnect Substrate (MIS) Industrial Chain
  • 8.2 Molded Interconnect Substrate (MIS) Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 Molded Interconnect Substrate (MIS) Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 Molded Interconnect Substrate (MIS) Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer

List of Tables

  • Table 1. Molded Interconnect Substrate (MIS) Market Trends
  • Table 2. Molded Interconnect Substrate (MIS) Market Drivers & Opportunity
  • Table 3. Molded Interconnect Substrate (MIS) Market Challenges
  • Table 4. Molded Interconnect Substrate (MIS) Market Restraints
  • Table 5. Global Molded Interconnect Substrate (MIS) Revenue by Company (2020-2025) & (US$ Million)
  • Table 6. Global Molded Interconnect Substrate (MIS) Revenue Market Share by Company (2020-2025)
  • Table 7. Global Molded Interconnect Substrate (MIS) Sales Volume by Company (2020-2025) & (Million Units)
  • Table 8. Global Molded Interconnect Substrate (MIS) Sales Volume Market Share by Company (2020-2025)
  • Table 9. Global Market Molded Interconnect Substrate (MIS) Price by Company (2020-2025) & (US$/Pcs)
  • Table 10. Key Manufacturers Molded Interconnect Substrate (MIS) Manufacturing Base and Headquarters
  • Table 11. Key Manufacturers Molded Interconnect Substrate (MIS) Product Type
  • Table 12. Key Manufacturers Time to Begin Mass Production of Molded Interconnect Substrate (MIS)
  • Table 13. Global Molded Interconnect Substrate (MIS) Manufacturers Market Concentration Ratio (CR5 and HHI)
  • Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Molded Interconnect Substrate (MIS) as of 2024)
  • Table 15. Mergers & Acquisitions, Expansion Plans
  • Table 16. Global Molded Interconnect Substrate (MIS) Sales Value by Type: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 17. Global Molded Interconnect Substrate (MIS) Sales Value by Type (2020-2025) & (US$ Million)
  • Table 18. Global Molded Interconnect Substrate (MIS) Sales Value by Type (2026-2031) & (US$ Million)
  • Table 19. Global Molded Interconnect Substrate (MIS) Sales Market Share in Value by Type (2020-2025)
  • Table 20. Global Molded Interconnect Substrate (MIS) Sales Market Share in Value by Type (2026-2031)
  • Table 21. Global Molded Interconnect Substrate (MIS) Sales Volume by Type: 2020 VS 2024 VS 2031 (Million Units)
  • Table 22. Global Molded Interconnect Substrate (MIS) Sales Volume by Type (2020-2025) & (Million Units)
  • Table 23. Global Molded Interconnect Substrate (MIS) Sales Volume by Type (2026-2031) & (Million Units)
  • Table 24. Global Molded Interconnect Substrate (MIS) Sales Market Share in Volume by Type (2020-2025)
  • Table 25. Global Molded Interconnect Substrate (MIS) Sales Market Share in Volume by Type (2026-2031)
  • Table 26. Global Molded Interconnect Substrate (MIS) Price by Type (2020-2025) & (US$/Pcs)
  • Table 27. Global Molded Interconnect Substrate (MIS) Price by Type (2026-2031) & (US$/Pcs)
  • Table 28. Global Molded Interconnect Substrate (MIS) Sales Value by Application: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 29. Global Molded Interconnect Substrate (MIS) Sales Value by Application (2020-2025) & (US$ Million)
  • Table 30. Global Molded Interconnect Substrate (MIS) Sales Value by Application (2026-2031) & (US$ Million)
  • Table 31. Global Molded Interconnect Substrate (MIS) Sales Market Share in Value by Application (2020-2025)
  • Table 32. Global Molded Interconnect Substrate (MIS) Sales Market Share in Value by Application (2026-2031)
  • Table 33. Global Molded Interconnect Substrate (MIS) Sales Volume by Application: 2020 VS 2024 VS 2031 (Million Units)
  • Table 34. Global Molded Interconnect Substrate (MIS) Sales Volume by Application (2020-2025) & (Million Units)
  • Table 35. Global Molded Interconnect Substrate (MIS) Sales Volume by Application (2026-2031) & (Million Units)
  • Table 36. Global Molded Interconnect Substrate (MIS) Sales Market Share in Volume by Application (2020-2025)
  • Table 37. Global Molded Interconnect Substrate (MIS) Sales Market Share in Volume by Application (2026-2031)
  • Table 38. Global Molded Interconnect Substrate (MIS) Price by Application (2020-2025) & (US$/Pcs)
  • Table 39. Global Molded Interconnect Substrate (MIS) Price by Application (2026-2031) & (US$/Pcs)
  • Table 40. Global Molded Interconnect Substrate (MIS) Sales Value by Region, (2020 VS 2024 VS 2031) & (US$ Million)
  • Table 41. Global Molded Interconnect Substrate (MIS) Sales Value by Region (2020-2025) & (US$ Million)
  • Table 42. Global Molded Interconnect Substrate (MIS) Sales Value by Region (2026-2031) & (US$ Million)
  • Table 43. Global Molded Interconnect Substrate (MIS) Sales Value by Region (2020-2025) & (%)
  • Table 44. Global Molded Interconnect Substrate (MIS) Sales Value by Region (2026-2031) & (%)
  • Table 45. Global Molded Interconnect Substrate (MIS) Sales Volume by Region (Million Units): 2020 VS 2024 VS 2031
  • Table 46. Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2020-2025) & (Million Units)
  • Table 47. Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2026-2031) & (Million Units)
  • Table 48. Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2020-2025) & (%)
  • Table 49. Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2026-2031) & (%)
  • Table 50. Global Molded Interconnect Substrate (MIS) Average Price by Region (2020-2025) & (US$/Pcs)
  • Table 51. Global Molded Interconnect Substrate (MIS) Average Price by Region (2026-2031) & (US$/Pcs)
  • Table 52. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value Growth Trends, (US$ Million): 2020 VS 2024 VS 2031
  • Table 53. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value, (2020-2025) & (US$ Million)
  • Table 54. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value, (2026-2031) & (US$ Million)
  • Table 55. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Volume, (2020-2025) & (Million Units)
  • Table 56. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Volume, (2026-2031) & (Million Units)
  • Table 57. PPt Company Information
  • Table 58. PPt Introduction and Business Overview
  • Table 59. PPt Molded Interconnect Substrate (MIS) Sales (Million Units), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 60. PPt Molded Interconnect Substrate (MIS) Product Offerings
  • Table 61. PPt Recent Development
  • Table 62. MiSpak Technology Company Information
  • Table 63. MiSpak Technology Introduction and Business Overview
  • Table 64. MiSpak Technology Molded Interconnect Substrate (MIS) Sales (Million Units), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 65. MiSpak Technology Molded Interconnect Substrate (MIS) Product Offerings
  • Table 66. MiSpak Technology Recent Development
  • Table 67. QDOS Company Information
  • Table 68. QDOS Introduction and Business Overview
  • Table 69. QDOS Molded Interconnect Substrate (MIS) Sales (Million Units), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 70. QDOS Molded Interconnect Substrate (MIS) Product Offerings
  • Table 71. QDOS Recent Development
  • Table 72. Key Raw Materials Lists
  • Table 73. Raw Materials Key Suppliers Lists
  • Table 74. Molded Interconnect Substrate (MIS) Downstream Customers
  • Table 75. Molded Interconnect Substrate (MIS) Distributors List
  • Table 76. Research Programs/Design for This Report
  • Table 77. Key Data Information from Secondary Sources
  • Table 78. Key Data Information from Primary Sources

List of Figures

  • Figure 1. Molded Interconnect Substrate (MIS) Product Picture
  • Figure 2. Global Molded Interconnect Substrate (MIS) Sales Value, 2020 VS 2024 VS 2031 (US$ Million)
  • Figure 3. Global Molded Interconnect Substrate (MIS) Sales Value (2020-2031) & (US$ Million)
  • Figure 4. Global Molded Interconnect Substrate (MIS) Sales Volume (2020-2031) & (Million Units)
  • Figure 5. Global Molded Interconnect Substrate (MIS) Sales Price (2020-2031) & (US$/Pcs)
  • Figure 6. Molded Interconnect Substrate (MIS) Report Years Considered
  • Figure 7. Global Molded Interconnect Substrate (MIS) Players Revenue Ranking (2024) & (US$ Million)
  • Figure 8. Global Molded Interconnect Substrate (MIS) Players Sales Volume Ranking (2024) & (Million Units)
  • Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by Molded Interconnect Substrate (MIS) Revenue in 2024
  • Figure 10. Molded Interconnect Substrate (MIS) Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
  • Figure 11. 1 Layer MIS Substrate Picture
  • Figure 12. 2 Layer MIS Substrate Picture
  • Figure 13. 3 Layer MIS Substrate Picture
  • Figure 14. 4 Layer MIS Substrate Picture
  • Figure 15. 6 Layer MIS Substrate Picture
  • Figure 16. Others Picture
  • Figure 17. Global Molded Interconnect Substrate (MIS) Sales Value by Type (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 18. Global Molded Interconnect Substrate (MIS) Sales Value Market Share by Type, 2024 & 2031
  • Figure 19. Global Molded Interconnect Substrate (MIS) Sales Volume by Type (2020 VS 2024 VS 2031) & (Million Units)
  • Figure 20. Global Molded Interconnect Substrate (MIS) Sales Volume Market Share by Type, 2024 & 2031
  • Figure 21. Global Molded Interconnect Substrate (MIS) Price by Type (2020-2031) & (US$/Pcs)
  • Figure 22. Product Picture of Analog Chip
  • Figure 23. Product Picture of Power IC
  • Figure 24. Product Picture of RF/5G
  • Figure 25. Product Picture of Fingerprint Sensor
  • Figure 26. Product Picture of OIS (Optical Image Stablization)
  • Figure 27. Product Picture of Others
  • Figure 28. Global Molded Interconnect Substrate (MIS) Sales Value by Application (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 29. Global Molded Interconnect Substrate (MIS) Sales Value Market Share by Application, 2024 & 2031
  • Figure 30. Global Molded Interconnect Substrate (MIS) Sales Volume by Application (2020 VS 2024 VS 2031) & (Million Units)
  • Figure 31. Global Molded Interconnect Substrate (MIS) Sales Volume Market Share by Application, 2024 & 2031
  • Figure 32. Global Molded Interconnect Substrate (MIS) Price by Application (2020-2031) & (US$/Pcs)
  • Figure 33. North America Molded Interconnect Substrate (MIS) Sales Value (2020-2031) & (US$ Million)
  • Figure 34. North America Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • Figure 35. Europe Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 36. Europe Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • Figure 37. Asia Pacific Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 38. Asia Pacific Molded Interconnect Substrate (MIS) Sales Value by Region (%), 2024 VS 2031
  • Figure 39. South America Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 40. South America Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • Figure 41. Middle East & Africa Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 42. Middle East & Africa Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • Figure 43. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value (%), (2020-2031)
  • Figure 44. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Volume (%), (2020-2031)
  • Figure 45. United States Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 46. United States Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 47. United States Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 48. Europe Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 49. Europe Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 50. Europe Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 51. China Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 52. China Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 53. China Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 54. Japan Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 55. Japan Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 56. Japan Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 57. South Korea Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 58. South Korea Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 59. South Korea Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 60. Southeast Asia Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 61. Southeast Asia Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 62. Southeast Asia Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 63. India Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 64. India Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 65. India Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 66. Molded Interconnect Substrate (MIS) Industrial Chain
  • Figure 67. Molded Interconnect Substrate (MIS) Manufacturing Cost Structure
  • Figure 68. Channels of Distribution (Direct Sales, and Distribution)
  • Figure 69. Bottom-up and Top-down Approaches for This Report
  • Figure 70. Data Triangulation
  • Figure 71. Key Executives Interviewed