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市场调查报告书
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1416753

模製电路元件 (MID) 市场报告：2030 年趋势、预测与竞争分析

Molded Interconnect Device (MID) Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

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简介目录

模製电路元件 (MID) 趋势与预测

预计到 2030 年，全球模製电路元件 (MID) 市场将达到 30 亿美元，2024 年至 2030 年复合年增长率为 10.8%。该市场的关键驱动因素是对轻质耐用电子元件的需求不断增长以及对小型化电子元件的需求不断增长。全球模製电路元件 (MID) 市场的未来前景广阔，通讯、消费性电器产品、汽车、医疗、工业、军事和航太市场充满机会。

模製电路元件 (MID) 市场洞察

Lucintel 预测，感测器将在预测期内实现最高成长，因为它们将用于各种应用，例如自适应刮痕控制系统和气候控制应用。

预计该市场将在预测期内见证汽车的最高成长。

由于该地区拥有技术纯熟劳工以及领先的原始设备製造商(OEM)，预计亚太地区将在预测期内实现最高成长。

常问问题

Q1.市场规模为：

A1. 到 2030 年，全球模製电路元件 (MID) 市场预计将达到 30 亿美元。

Q2.市场成长预测是多少：

A2. 2024 年至 2030 年，全球模製电路元件 (MID) 市场预计将以 10.8% 的复合年增长率成长。

Q3. 影响市场成长的关键驱动因素是：

A3. 该市场的关键驱动因素是对轻质耐用电子设备的需求不断增长以及对小型化电子设备的需求不断增长。

Q4.市场的主要细分市场是：

A4. 模製电路元件 (MID) 市场前景广阔，通讯、消费性电器产品、汽车、医疗、工业、军事和航太市场充满机会。

Q5.市场的主要企业是：

A5. 一些主要的模製电路元件 (MID) 公司是：

  • Molex
  • TE Connectivity
  • Amphenol
  • LPKF Laser &Electronics
  • Taoglas

Q6.未来最大的细分市场是什么？

A6.Lucintel 预计预测期内成长最高，因为感测器将用于各种应用，例如自适应刮痕控制系统和气候控制应用。

Q7. 未来五年预计哪些地区的市场成长最大？

A7. 由于该地区拥有技术纯熟劳工和领先的OEM製造商，预计亚太地区将在预测期内实现最高增长。

Q8. 可以客製化报告吗？

A8. 是的，Lucintel 列出了 10% 的客製化服务，无需额外费用。

目录

第一章执行摘要

第二章全球模製电路元件（MID）市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球模製电路元件（MID）市场趋势（2018-2023）与预测（2024-2030）
  • 按产品类型分類的全球模製电路元件 (MID) 市场
    • 天线及连接模组
    • 感应器
    • 连接器和开关
    • 照明系统
    • 其他的
  • 按製程分類的全球模製电路元件 (MID) 市场
    • 雷射直接成型
    • 二次注射成型
    • 电影技术
  • 按最终用途行业分類的全球模製电路元件 (MID) 市场
    • 电讯
    • 家用电器
    • 车
    • 医疗保健
    • 工业的
    • 军事和航太
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 按地区分類的全球模製电路元件 (MID) 市场
  • 北美模製电路元件 (MID) 市场
  • 欧洲模製电路元件（MID）市场
  • 亚太模製电路元件 (MID) 市场
  • 其他地区模製电路元件（MID）市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 按产品类型分類的全球模製电路元件 (MID) 市场成长机会
    • 全球模製电路元件 (MID) 市场成长机会（按製程）
    • 最终用途产业的全球模製电路元件 (MID) 市场成长机会
    • 全球模製电路元件 (MID) 市场成长机会（按地区）
  • 全球模製电路元件（MID）市场新趋势
  • 战略分析
    • 新产品开发
    • 扩大全球模製电路元件（MID）市场的产能
    • 全球模製电路元件 (MID) 市场的合併、收购和合资企业
    • 认证和许可

第七章主要企业概况

  • Molex
  • TE Connectivity
  • Amphenol
  • LPKF Laser & Electronics
  • Taoglas
简介目录

Molded Interconnect Device (MID) Trends and Forecast

The future of the global molded interconnect device (MID) market looks promising with opportunities in the telecommunication, consumer electronic, automotive, medical, industrial, and military & aerospace markets. The global molded interconnect device (MID) market is expected to reach an estimated $3 billion by 2030 with a CAGR of 10.8% from 2024 to 2030. The major drivers for this market are growing demand for lightweight and durable electronic devices and increasing demand for miniaturized electronic devices.

A more than 150-page report is developed to help in your business decisions.

Molded Interconnect Device (MID) by Segment

The study includes a forecast for the global molded interconnect device (MID) by product type, process, end use industry, and region.

Molded Interconnect Device (MID) Market by Product Type [Shipment Analysis by Value from 2018 to 2030]:

  • Antennae & Connectivity Modules
  • Sensors
  • Connectors & Switches
  • Lighting Systems
  • Others

Molded Interconnect Device (MID) Market by Process [Shipment Analysis by Value from 2018 to 2030]:

  • Laser Direct Structuring
  • Two-Shot Molding
  • Film Techniques

Molded Interconnect Device (MID) Market by End Use Industry [Shipment Analysis by Value from 2018 to 2030]:

  • Telecommunications
  • Consumer Electronics
  • Automotive
  • Medical
  • Industrial
  • Military & Aerospace
  • Others

Molded Interconnect Device (MID) Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Molded Interconnect Device (MID) Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies molded interconnect device (MID) companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the molded interconnect device (MID) companies profiled in this report include-

  • Molex
  • TE Connectivity
  • Amphenol
  • LPKF Laser & Electronics
  • Taoglas

Molded Interconnect Device (MID) Market Insights

Lucintel forecasts that sensor is expected to witness the highest growth over the forecast period due to its variety of application like adaptive scrase control systems and in climate control applications.

Within this market, automotive is expected to witness the highest growth over the forecast period.

APAC is expected to witness highest growth over the forecast period due to availability of skilled labor and presence of major original equipment manufacturers in the region.

Features of the Global Molded Interconnect Device (MID) Market

Market Size Estimates: Molded interconnect device (MID) market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Molded interconnect device (MID) market size by product type, process, end use industry, and region in terms of value ($B).

Regional Analysis: Molded interconnect device (MID) market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different product types, processes, end use industries, and regions for the molded interconnect device (MID) market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the molded interconnect device (MID) market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the molded interconnect device (MID) market size?

Answer: The global molded interconnect device (MID) market is expected to reach an estimated $3 billion by 2030.

Q2. What is the growth forecast for molded interconnect device (MID) market?

Answer: The global molded interconnect device (MID) market is expected to grow with a CAGR of 10.8% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the molded interconnect device (MID) market?

Answer: The major drivers for this market are growing demand for lightweight and durable electronic devices and increasing demand for miniaturized electronic devices.

Q4. What are the major segments for molded interconnect device (MID) market?

Answer: The future of the molded interconnect device (MID) market looks promising with opportunities in the telecommunication, consumer electronic, automotive, medical, industrial, and military & aerospace markets.

Q5. Who are the key molded interconnect device (MID) market companies?

Answer: Some of the key molded interconnect device (MID) companies are as follows:

  • Molex
  • TE Connectivity
  • Amphenol
  • LPKF Laser & Electronics
  • Taoglas

Q6. Which molded interconnect device (MID) market segment will be the largest in future?

Answer: Lucintel forecasts that sensor is expected to witness the highest growth over the forecast period due to its variety of application like adaptive scrase control systems and in climate control applications.

Q7. In molded interconnect device (MID) market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to availability of skilled labor and presence of major original equipment manufacturers in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the molded interconnect device (MID) market by product type (antennae & connectivity modules, sensors, connectors & switches, lighting systems, and others), process (laser direct structuring, two-shot molding, and film techniques), end use industry (telecommunications, consumer electronics, automotive, medical, industrial, military & aerospace, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Molded Interconnect Device (MID) Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Molded Interconnect Device (MID) Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Molded Interconnect Device (MID) Market by Product Type
    • 3.3.1: Antennae & Connectivity Modules
    • 3.3.2: Sensors
    • 3.3.3: Connectors & Switches
    • 3.3.4: Lighting Systems
    • 3.3.5: Others
  • 3.4: Global Molded Interconnect Device (MID) Market by Process
    • 3.4.1: Laser Direct Structuring
    • 3.4.2: Two-Shot Molding
    • 3.4.3: Film Techniques
  • 3.5: Global Molded Interconnect Device (MID) Market by End Use Industry
    • 3.5.1: Telecommunications
    • 3.5.2: Consumer Electronics
    • 3.5.3: Automotive
    • 3.5.4: Medical
    • 3.5.5: Industrial
    • 3.5.6: Military & Aerospace
    • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Molded Interconnect Device (MID) Market by Region
  • 4.2: North American Molded Interconnect Device (MID) Market
    • 4.2.2: North American Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
  • 4.3: European Molded Interconnect Device (MID) Market
    • 4.3.1: European Molded Interconnect Device (MID) Market by Product Type: Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems, and Others
    • 4.3.2: European Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
  • 4.4: APAC Molded Interconnect Device (MID) Market
    • 4.4.1: APAC Molded Interconnect Device (MID) Market by Product Type: Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems, and Others
    • 4.4.2: APAC Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
  • 4.5: ROW Molded Interconnect Device (MID) Market
    • 4.5.1: ROW Molded Interconnect Device (MID) Market by Product Type: Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems, and Others
    • 4.5.2: ROW Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by Product Type
    • 6.1.2: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by Process
    • 6.1.3: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by End Use Industry
    • 6.1.4: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by Region
  • 6.2: Emerging Trends in the Global Molded Interconnect Device (MID) Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Molded Interconnect Device (MID) Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Molded Interconnect Device (MID) Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Molex
  • 7.2: TE Connectivity
  • 7.3: Amphenol
  • 7.4: LPKF Laser & Electronics
  • 7.5: Taoglas