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市场调查报告书
商品编码
1594326

模製布线设备市场：按产品类型、製程和产业划分 - 2025-2030 年全球预测

Molded Interconnect Device Market by Product Type (Antennae & Connectivity Modules, Connectors & Switches, Lighting Systems), Process (Film Techniques, Laser Direct Structuring, Two-Shot Molding), Vertical - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 199 Pages | 商品交期: 最快1-2个工作天内

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2023年模製布线装置市场规模为24.4亿美元，预计2024年将达27.8亿美元，复合年增长率为14.33%，到2030年将达到62.4亿美元。

模塑互连装置 (MID) 是一项创新技术，它使用 3D射出成型电路载体将电气和机械功能整合到单一封装中。对 MID 的需求是由家用电子电器、汽车、医疗设备和通讯等各种应用中对更小尺寸、更高功能和更高性能的需求不断增长所推动的。 MID 透过将电路和外壳组合到一个组件中来减少空间、重量和组装成本。 MID 最终用途跨越多个产业，应用范围从LED构装到天线再到感测器组件。主要市场成长要素包括小型化趋势的增强、对高效能电子设备的需求不断增加以及 3D 电路列印技术的进步。车载电子产品的日益普及极大地影响了 MID 市场的机会，其中 MID 整合可实现无缝连接并增强车辆功能。随着汽车技术向电动车和自动驾驶汽车发展，MID 将成为一个重要组成部分。然而，该市场面临初始製造成本高、缺乏标准化製造流程以及整合复杂电气元件的技术挑战等限制。为了克服这些障碍，公司需要专注于开发具有成本效益的 3D 电路列印方法和提高材料性能以实现更好的温度控管等领域。此外，与高分子材料创新研发机构的合作和伙伴关係可能会推动 MID 的新能力。考虑到 MID 市场的竞争格局，主要企业正在专注于策略扩张、合併和技术创新，以保持竞争力。为了利用这条成长路径，企业应加强对新兴市场的关注，并投资先进製造技术，以製造更复杂的 MID 结构，以满足多样化和不断变化的客户需求。

主要市场统计
基准年[2023] 24.4亿美元
预测年份 [2024] 27.8亿美元
预测年份 [2030] 62.4亿美元
复合年增长率（%） 14.33%

市场动态：快速发展的模製接线设备市场的关键市场洞察

供需的动态交互作用正在改变模製接线装置市场。了解这些不断变化的市场动态可以帮助企业做出明智的投资决策、策略决策并抓住新的商机。全面了解这些趋势可以帮助企业降低政治、地理、技术、社会和经济领域的风险，并了解消费行为及其对製造成本的影响，并更清楚地了解对采购趋势的影响。

  • 市场驱动因素
    • 医疗保健和消费性电子产业不断增长的需求
    • 在汽车产业的广泛应用
    • 雷射直接成型使用率高
  • 市场限制因素
    • 对原物料成本的担忧
  • 市场机会
    • 模製互连装置的技术进步
    • 投资扩大 IIoT 生态系统
  • 市场挑战
    • 模製互连设备的相容性问题

波特五力：驾驭模具接线设备市场的策略工具

波特的五力框架是理解市场竞争格局的重要工具。波特的五力框架为评估公司的竞争地位和探索策略机会提供了清晰的方法。该框架可帮助公司评估市场动态并确定新业务的盈利。这些见解使公司能够利用自己的优势，解决弱点并避免潜在的挑战，从而确保更强大的市场地位。

PESTLE分析：了解模具布线装置市场的外部影响

外部宏观环境因素在塑造模具接线装置市场的绩效动态方面发挥着至关重要的作用。对政治、经济、社会、技术、法律和环境因素的分析提供了应对这些影响所需的资讯。透过调查 PESTLE 因素，公司可以更了解潜在的风险和机会。这种分析可以帮助公司预测法规、消费者偏好和经济趋势的变化，并为他们做出积极主动的决策做好准备。

市场占有率分析 了解模製接线装置市场的竞争状况

模製布线设备市场的详细市场占有率分析可以对供应商绩效进行全面评估。公司可以透过比较收益、客户群和成长率等关键指标来揭示其竞争地位。该分析揭示了市场集中、分散和整合的趋势，为供应商提供了製定策略决策所需的洞察力，使他们能够在日益激烈的竞争中占有一席之地。

FPNV定位矩阵模具布线装置市场厂商绩效评估

FPNV 定位矩阵是评估模製布线设备市场供应商的重要工具。此矩阵允许业务组织根据供应商的商务策略和产品满意度评估供应商，从而做出符合其目标的明智决策。这四个象限使您能够清晰、准确地划分供应商，并确定最能满足您的策略目标的合作伙伴和解决方案。

策略分析和建议，以规划模具布线设备市场的成功之路

对于旨在加强其在全球市场的影响力的公司来说，对模製布线设备市场的策略分析至关重要。透过审查关键资源、能力和绩效指标，公司可以识别成长机会并努力改进。这种方法使您能够克服竞争环境中的挑战，利用新的商机，并取得长期成功。

本报告对市场进行了全面分析，涵盖关键重点领域：

1. 市场渗透率：对当前市场环境的详细审查、主要企业的广泛资料、对其在市场中的影响力和整体影响力的评估。

2. 市场开拓：辨识新兴市场的成长机会，评估现有领域的扩张潜力，并提供未来成长的策略蓝图。

3. 市场多元化：分析近期产品发布、开拓地区、关键产业进展、塑造市场的策略投资。

4. 竞争评估与情报：全面分析竞争格局，检验市场占有率、业务策略、产品系列、认证、核准核准、专利趋势、主要企业的技术进步等。

5. 产品开发与创新：重点在于有望推动未来市场成长的最尖端科技、研发活动和产品创新。

我们也回答重要问题，以帮助相关人员做出明智的决策：

1.目前的市场规模和未来的成长预测是多少？

2. 哪些产品、区隔市场和地区提供最佳投资机会？

3.塑造市场的主要技术趋势和监管影响是什么？

4.主要厂商的市场占有率和竞争地位如何？

5. 推动供应商市场进入和退出策略的收益来源和策略机会是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 医疗保健和消费性电子产业的需求不断增长
      • 在汽车产业的广泛应用
      • 雷射直接成型的广泛应用
    • 抑制因素
      • 对原物料成本的担忧
    • 机会
      • 模製互连装置的技术进步
      • 投资扩大 IIoT 生态系统
    • 任务
      • 模製互连装置不相容问题
  • 市场区隔分析
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 经济
    • 社群
    • 技术的
    • 合法地
    • 环境

第六章模製布线装置市场：依产品类型

  • 天线及连接模组
  • 连接器和开关
  • 照明系统
  • 感应器

第七章模製布线装置市场：依製程分类

  • 电影技术
  • 雷射直接成型
  • 2次注射成型

第八章模製接线装置市场：依行业分类

  • 车
  • 家电
  • 产业
  • 药品
  • 军事/航太
  • 通讯

第九章北美和南美模製布线装置市场

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第10章亚太模製布线装置市场

  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第十一章 欧洲、中东和非洲模製布线装置市场

  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十二章竞争格局

  • 2023 年市场占有率分析
  • FPNV 定位矩阵，2023
  • 竞争情境分析
  • 战略分析和建议

公司名单

  • Amphenol Corporation
  • Arlington Plating Company
  • GALTRONICS Corporation Limited
  • Harting Group
  • KYOCERA AVX Components Corporation
  • LPKF Laser & Electronics SE
  • MID Solutions GmbH
  • Molex LLC
  • RTP Company
  • SUZHOU CICOR TECHNOLOGY CO. LTD
  • Taoglas
  • TE Connectivity
  • Teprosa GmbH
  • Tongda Group
  • Yomura Technologies Inc.
Product Code: MRR-7162E4C41202

The Molded Interconnect Device Market was valued at USD 2.44 billion in 2023, expected to reach USD 2.78 billion in 2024, and is projected to grow at a CAGR of 14.33%, to USD 6.24 billion by 2030.

Molded Interconnect Devices (MIDs) represent an innovative technology that integrates electrical and mechanical functions in a single package, using 3D injection-molded circuit carriers. The necessity for MIDs arises from the growing demand for miniaturization, increased functionality, and enhanced performance in various applications such as consumer electronics, automotive, medical devices, and telecommunications. By combining circuitry and housing into a single component, MIDs reduce space, weight, and assembly costs. The end-use scope of MIDs spans multiple industries, where they serve in applications ranging from LED packages to antennas and sensor assemblies. Key market growth factors include the rising trend toward miniaturization, increasing demand for efficient electronic devices, and advancements in 3D circuit printing technologies. Opportunities in the MID market are significantly influenced by the increasing adoption in automotive electronics, where the integration of MIDs can aid in seamless connectivity and enhanced vehicle functionalities. As automotive technologies evolve towards electric and autonomous vehicles, MIDs stand to gain as essential components. However, the market faces limitations such as high initial manufacturing costs, lack of standardized manufacturing processes, and technical challenges in integrating complex electrical components. To overcome these hurdles, businesses should focus on areas like developing cost-effective 3D circuit printing methods and improving material performance for better thermal management. Moreover, collaborations and partnerships with R&D institutions for innovation in polymer materials could propel new MID capabilities. Insight into the MID market nature reveals a moderately competitive landscape, with key players focusing on strategic expansions, mergers, and technology innovations to maintain a competitive edge. To capitalize on growth avenues, firms should amplify their focus on emerging markets and invest in advanced manufacturing technologies, enabling the production of more complex MID structures that cater to diverse, evolving customer demands.

KEY MARKET STATISTICS
Base Year [2023] USD 2.44 billion
Estimated Year [2024] USD 2.78 billion
Forecast Year [2030] USD 6.24 billion
CAGR (%) 14.33%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Molded Interconnect Device Market

The Molded Interconnect Device Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Rising need in healthcare and consumer electronics industry
    • Wide applications in automotive industry
    • High use of laser direct structuring
  • Market Restraints
    • Concerns pertaining to raw materials cost
  • Market Opportunities
    • Technological advancements in molded interconnect devices
    • Investments in expanding IIoT ecosystem
  • Market Challenges
    • Incompatibility issues of molded interconnect devices

Porter's Five Forces: A Strategic Tool for Navigating the Molded Interconnect Device Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Molded Interconnect Device Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Molded Interconnect Device Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Molded Interconnect Device Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Molded Interconnect Device Market

A detailed market share analysis in the Molded Interconnect Device Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Molded Interconnect Device Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Molded Interconnect Device Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Molded Interconnect Device Market

A strategic analysis of the Molded Interconnect Device Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Molded Interconnect Device Market, highlighting leading vendors and their innovative profiles. These include Amphenol Corporation, Arlington Plating Company, GALTRONICS Corporation Limited, Harting Group, KYOCERA AVX Components Corporation, LPKF Laser & Electronics SE, MID Solutions GmbH, Molex LLC, RTP Company, SUZHOU CICOR TECHNOLOGY CO. LTD, Taoglas, TE Connectivity, Teprosa GmbH, Tongda Group, and Yomura Technologies Inc..

Market Segmentation & Coverage

This research report categorizes the Molded Interconnect Device Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Product Type, market is studied across Antennae & Connectivity Modules, Connectors & Switches, Lighting Systems, and Sensors.
  • Based on Process, market is studied across Film Techniques, Laser Direct Structuring, and Two-Shot Molding.
  • Based on Vertical, market is studied across Automotive, Consumer Electronics, Industrial, Medical, Military & Aerospace, and Telecommunications.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Rising need in healthcare and consumer electronics industry
      • 5.1.1.2. Wide applications in automotive industry
      • 5.1.1.3. High use of laser direct structuring
    • 5.1.2. Restraints
      • 5.1.2.1. Concerns pertaining to raw materials cost
    • 5.1.3. Opportunities
      • 5.1.3.1. Technological advancements in molded interconnect devices
      • 5.1.3.2. Investments in expanding IIoT ecosystem
    • 5.1.4. Challenges
      • 5.1.4.1. Incompatibility issues of molded interconnect devices
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Molded Interconnect Device Market, by Product Type

  • 6.1. Introduction
  • 6.2. Antennae & Connectivity Modules
  • 6.3. Connectors & Switches
  • 6.4. Lighting Systems
  • 6.5. Sensors

7. Molded Interconnect Device Market, by Process

  • 7.1. Introduction
  • 7.2. Film Techniques
  • 7.3. Laser Direct Structuring
  • 7.4. Two-Shot Molding

8. Molded Interconnect Device Market, by Vertical

  • 8.1. Introduction
  • 8.2. Automotive
  • 8.3. Consumer Electronics
  • 8.4. Industrial
  • 8.5. Medical
  • 8.6. Military & Aerospace
  • 8.7. Telecommunications

9. Americas Molded Interconnect Device Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Molded Interconnect Device Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Molded Interconnect Device Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
  • 12.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Amphenol Corporation
  • 2. Arlington Plating Company
  • 3. GALTRONICS Corporation Limited
  • 4. Harting Group
  • 5. KYOCERA AVX Components Corporation
  • 6. LPKF Laser & Electronics SE
  • 7. MID Solutions GmbH
  • 8. Molex LLC
  • 9. RTP Company
  • 10. SUZHOU CICOR TECHNOLOGY CO. LTD
  • 11. Taoglas
  • 12. TE Connectivity
  • 13. Teprosa GmbH
  • 14. Tongda Group
  • 15. Yomura Technologies Inc.

LIST OF FIGURES

  • FIGURE 1. MOLDED INTERCONNECT DEVICE MARKET RESEARCH PROCESS
  • FIGURE 2. MOLDED INTERCONNECT DEVICE MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2023 VS 2030 (%)
  • FIGURE 11. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 13. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 15. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 20. MOLDED INTERCONNECT DEVICE MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 21. MOLDED INTERCONNECT DEVICE MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. MOLDED INTERCONNECT DEVICE MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. MOLDED INTERCONNECT DEVICE MARKET DYNAMICS
  • TABLE 7. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY ANTENNAE & CONNECTIVITY MODULES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY CONNECTORS & SWITCHES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY LIGHTING SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY SENSORS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY FILM TECHNIQUES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY LASER DIRECT STRUCTURING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY TWO-SHOT MOLDING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY MEDICAL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY MILITARY & AEROSPACE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 22. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 23. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 24. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 25. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 26. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 27. ARGENTINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 28. ARGENTINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 29. ARGENTINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 30. BRAZIL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 31. BRAZIL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 32. BRAZIL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 33. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 34. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 35. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 36. MEXICO MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 37. MEXICO MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 38. MEXICO MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 39. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 40. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 41. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 42. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 43. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 44. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 45. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 46. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 47. AUSTRALIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 48. AUSTRALIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 49. AUSTRALIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 50. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 51. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 52. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 53. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 54. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 55. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 56. INDONESIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 57. INDONESIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 58. INDONESIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 59. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 60. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 61. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 62. MALAYSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 63. MALAYSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 64. MALAYSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 65. PHILIPPINES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 66. PHILIPPINES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 67. PHILIPPINES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 68. SINGAPORE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 69. SINGAPORE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 70. SINGAPORE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 71. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 72. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 73. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 74. TAIWAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 75. TAIWAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 76. TAIWAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 77. THAILAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 78. THAILAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 79. THAILAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 80. VIETNAM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 81. VIETNAM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 82. VIETNAM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 83. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 84. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 85. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 86. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 87. DENMARK MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 88. DENMARK MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 89. DENMARK MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 90. EGYPT MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 91. EGYPT MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 92. EGYPT MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 93. FINLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 94. FINLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 95. FINLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 96. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 97. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 98. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 99. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 100. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 101. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 102. ISRAEL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 103. ISRAEL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 104. ISRAEL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 105. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 106. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 107. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 108. NETHERLANDS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 109. NETHERLANDS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 110. NETHERLANDS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 111. NIGERIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 112. NIGERIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 113. NIGERIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 114. NORWAY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 115. NORWAY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 116. NORWAY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 117. POLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 118. POLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 119. POLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 120. QATAR MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 121. QATAR MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 122. QATAR MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 123. RUSSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 124. RUSSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 125. RUSSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 126. SAUDI ARABIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 127. SAUDI ARABIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 128. SAUDI ARABIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 129. SOUTH AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 130. SOUTH AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 131. SOUTH AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 132. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 133. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 134. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 135. SWEDEN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 136. SWEDEN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 137. SWEDEN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 138. SWITZERLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 139. SWITZERLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 140. SWITZERLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 141. TURKEY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 142. TURKEY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 143. TURKEY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 144. UNITED ARAB EMIRATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 145. UNITED ARAB EMIRATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 146. UNITED ARAB EMIRATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 147. UNITED KINGDOM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 148. UNITED KINGDOM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 149. UNITED KINGDOM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 150. MOLDED INTERCONNECT DEVICE MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 151. MOLDED INTERCONNECT DEVICE MARKET, FPNV POSITIONING MATRIX, 2023