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市场调查报告书
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1964043

模塑电路元件市场－全球产业规模、份额、趋势、机会、预测：按製程、应用、区域和竞争格局划分，2021-2031年

Molded Interconnect Device Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Process, By Application, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3个工作天内

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简介目录

全球模塑电路元件市场预计将从 2025 年的 99.4 亿美元成长到 2031 年的 216.2 亿美元，复合年增长率为 13.83%。

模塑电路元件 (MID) 透过使用射出成型的热塑性塑胶将电子电路图案嵌入单一单元中，从而将机械和电气功能无缝整合。这项市场成长的主要驱动力是电子产业对小型化日益增长的需求，以及为简化组装流程、降低製造成本和提高可靠性而做出的努力。汽车和医疗技术等行业正在越来越多地采用这些器件，以实现空间优化和功能整合。为了证明该领域拥有强大的生态系统支持，3D MID eV 研究协会在 2024 年报告称，其由致力于推进 MID 技术的众多製造商和研究机构组成的专业行业网络拥有 87 个成员。

市场概览
预测期 2027-2031
市场规模：2025年 99.4亿美元
市场规模：2031年 216.2亿美元
复合年增长率：2026-2031年 13.83%
成长最快的细分市场 双色注塑成型
最大的市场 亚太地区

然而，市场扩张的主要障碍在于专用射出成型模具和雷射成型设备所需的大量初始投资。与传统的印刷基板组装相比，这一巨大的资金门槛往往使得该技术在小批量生产中经济效益不佳。因此，MID技术的应用通常仅限于大规模生产环境，因为在这些环境中，规模经济效应可以有效地抵消初始投资成本。

市场驱动因素

汽车电子和电动车架构的快速发展是模塑电路元件市场的主要驱动力。製造商正越来越多地采用这项技术，将电路直接整合到结构件中，从而显着减轻车辆重量，并消除狭小车厢内繁琐的布线。这种整合对于容纳现代电动车所必需的复杂感测器阵列和控制系统至关重要，同时又不牺牲空间利用率。根据国际能源总署 (IEA) 于 2024 年 4 月发布的《2024 年全球电动车展望》，2023 年电动车销量将达到约 1,400 万辆，从而对这些整合组件产生了巨大的需求。 LPKF Laser & Electronics SE 公司 2024 财年的连合收益为 1.243 亿欧元，这反映了该公司在必要的雷射结构化系统方面的大量资本投资，也印证了该行业的规模之大。

此外，5G通讯基础设施的快速部署正在推动市场成长，因为其对天线设计提出了更高的要求，而标准印刷电路基板无法满足这些要求。模塑互连技术能够将三维天线结构直接整合到智慧型手机和基地台的内部机壳中，从而在不增加设备尺寸的情况下，提升不同频宽的讯号品质。这项技术对于维持消费者期望的紧凑设计，同时支援下一代网路所需的MIMO（多重输入多输出）配置至关重要。正如爱立信2024年6月发布的《行动报告》所述，光是2024年第一季，全球5G用户就增加了1.6亿，总数达到17亿人。这给为这些先进连接解决方案提供组件的製造商带来了越来越大的压力。

市场挑战

模塑电路元件市场成长的主要障碍在于专用製造基础设施所需的大量前期投资。在开始生产之前，需要对精密射出成型机和雷射直接成型系统等设备进行大量资本投入。这种沉重的财务负担提高了损益平衡点，使得该技术对于中小批量生产而言经济效益低。因此，该技术的应用主要局限于汽车和医疗电子等大规模生产行业，而中小企业和小批量生产应用则被排除在外，因为规模经济无法抵消其初始成本。

这项技术的资本密集特征在其研发所需的巨额资金投入上体现得淋漓尽致。根据研究协会3-D MID eV统计，截至2024年，该协会管理的研究计划累积资助金额已达约1.76亿欧元。如此庞大的投资规模凸显了该领域的高进入门槛和复杂的财务状况，直接限制了其在成本敏感型领域的市场渗透。在这些领域，传统的印刷电路基板仍然是更具经济效益的选择。

市场趋势

生物相容性互连技术的兴起，源自于患者照护设备小型化需求的迫切性，正在改变智慧医疗植入市场。製造商正扩大模塑互连装置 (MID) 的应用，以在保持生物相容性的同时，将复杂的电路直接整合到助听器、神经调节系统和智慧药物传输装置的机壳中。这种策略最大限度地减少了有限空间内所需的组件数量，最大限度地利用了内部空间，并提高了设备的可靠性。 Cicor 集团在 2025 年 7 月发布的「2025 财年半年度报告」中指出，得益于其核心医疗技术和工业领域的持续需求，该行业在医疗领域的强劲发展势头得以体现，并实现了 2.807 亿瑞士法郎的净销售额。

同时，积层製造电子技术（AME）的出现正在革新快速原型製作，它消除了传统射出成型模具高昂的初始成本。这项製造技术的突破使工程师能够同时列印介电结构和导电走线，从而在数小时内而非数週内创建复杂的3D电路。 AME消除了小批量生产中昂贵模具的经济障碍，加快了设计迭代周期，并支援客製化电子元件的快速开发。为了展示这项数位製造技术的快速商业性化扩张，Nano Dimension公司于2025年9月宣布，第二季营收达2,580万美元，年增72.4%。

目录

第一章概述

第二章：调查方法

第三章执行摘要

第四章：客户心声

第五章：模塑电路元件的全球市场展望

  • 市场规模及预测
    • 按金额
  • 市占率及预测
    • 特定製程方法（雷射直接成型、双色射出成型）
    • 按应用领域（汽车、消费品、医疗、工业、军事/航太、电信、其他）
    • 按地区
    • 按公司（2025 年）
  • 市场地图

第六章：北美模塑电路元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 北美洲：国别分析
    • 我们
    • 加拿大
    • 墨西哥

第七章：欧洲模塑电路元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 欧洲：国别分析
    • 德国
    • 法国
    • 英国
    • 义大利
    • 西班牙

第八章：亚太地区模塑电路元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 亚太地区：国别分析
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲

第九章：中东和非洲模塑电路元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 中东与非洲：国别分析
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 南非

第十章：南美洲模塑电路元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 南美洲：国别分析
    • 巴西
    • 哥伦比亚
    • 阿根廷

第十一章 市场动态

  • 促进因素
  • 任务

第十二章 市场趋势与发展

  • 併购
  • 产品发布
  • 近期趋势

第十三章 全球模塑电路元件市场：SWOT分析

第十四章：波特五力分析

  • 产业竞争
  • 新进入者的潜力
  • 供应商的议价能力
  • 顾客权力
  • 替代品的威胁

第十五章 竞争格局

  • Molex LLC
  • TE Connectivity Ltd.
  • Amphenol Corporation
  • HARTING Technology Group
  • KYOCERA AVX Components Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • TEPROSA
  • Taoglas
  • RTP Company

第十六章 策略建议

第十七章：关于研究公司及免责声明

简介目录
Product Code: 21787

The Global Molded Interconnect Device Market is projected to expand from USD 9.94 Billion in 2025 to USD 21.62 Billion by 2031, registering a CAGR of 13.83%. Molded Interconnect Devices (MIDs) utilize injection-molded thermoplastics to embed electronic circuit traces, seamlessly merging mechanical and electrical functionalities into a single unit. This market is primarily fueled by the growing necessity for miniaturization within the electronics sector and the drive to minimize assembly stages, which concurrently reduces production costs and bolsters reliability. Industries such as automotive and medical technology are increasingly adopting these devices to achieve space optimization and functional integration. As evidence of the robust ecosystem supporting this field, the Research Association 3-D MID e.V. reported in 2024 that its specialized industrial network included 87 members, comprising various manufacturers and research institutes committed to furthering MID technology.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 9.94 Billion
Market Size 2031USD 21.62 Billion
CAGR 2026-203113.83%
Fastest Growing SegmentTwo-Shot Molding
Largest MarketAsia Pacific

However, a major obstacle hindering broader market growth is the substantial upfront capital required for specialized injection molding tools and laser structuring machinery. This significant financial threshold often renders the technology economically impractical for low-volume production compared to conventional printed circuit board assemblies. Consequently, the adoption of MIDs is generally constrained to high-volume manufacturing environments where economies of scale can be effectively leveraged to offset the initial investment costs.

Market Driver

The surging growth of automotive electronics and electric vehicle architectures acts as a primary catalyst for the molded interconnect device market. Manufacturers are increasingly adopting this technology to embed circuits directly into structural parts, significantly lowering vehicle weight and removing the need for cumbersome cabling in tight interiors. This integration is vital for housing the intricate sensor arrays and control systems essential to modern electric mobility without sacrificing spatial efficiency. According to the International Energy Agency's 'Global EV Outlook 2024' released in April 2024, electric car sales hit nearly 14 million in 2023, generating immense demand for these integrated assemblies. The industrial magnitude of this sector is further highlighted by LPKF Laser & Electronics SE, which reported a consolidated revenue of EUR 124.3 million for the 2024 fiscal year, reflecting the heavy capital investment in the necessary laser structuring systems.

Furthermore, the rapid rollout of 5G telecommunications infrastructure stimulates market growth by demanding antenna designs that standard printed circuit boards cannot support. Molded interconnects facilitate the creation of three-dimensional antenna structures directly on the internal shells of smartphones and base stations, enhancing signal quality across various frequencies without enlarging the device. This capability is crucial for handling the multiple-input multiple-output configurations required by next-generation networks while preserving the compact designs consumers expect. As noted in the 'Ericsson Mobility Report' from June 2024, global 5G subscriptions surged by 160 million in the first quarter of 2024 alone, totaling 1.7 billion, which places increasing pressure on component makers to supply these advanced connectivity solutions.

Market Challenge

A major impediment to the growth of the Molded Interconnect Device market is the substantial upfront investment needed for specialized manufacturing infrastructure. Companies are required to allocate significant capital for precision injection molding machinery and laser direct structuring tools before production can even begin. This heavy financial burden creates a high break-even point, making the technology economically inefficient for low-to-medium volume production runs. As a result, adoption is largely confined to mass-market industries such as automotive and medical electronics, thereby excluding smaller businesses and lower-volume applications that cannot justify the initial costs through economies of scale.

The capital-intensive nature of this technology is further demonstrated by the immense financial resources necessary for its development. According to the Research Association 3-D MID e.V., the cumulative funding for research projects managed by the association reached approximately 176 million euros in 2024. This level of investment highlights the high entry barriers and financial complexity associated with the sector, directly restricting the market's capacity to penetrate cost-sensitive areas where traditional printed circuit boards continue to be the more financially viable alternative.

Market Trends

The rise of bio-compatible interconnects is transforming the market for smart medical implants, propelled by the urgent requirement for miniaturization in patient-care devices. Manufacturers are increasingly utilizing molded interconnect devices to embed intricate circuitry directly into the casings of hearing aids, neuromodulation systems, and smart drug delivery units while maintaining biocompatibility. This strategy maximizes internal space and boosts device reliability by minimizing the number of distinct components needed within tightly constrained form factors. Underscoring the strong industrial momentum in this healthcare segment, Cicor Group reported in its 'Half Year Report 2025' from July 2025 that it achieved net sales of CHF 280.7 million, fueled by persistent demand in its core medical technology and industrial sectors.

Simultaneously, the advent of Additively Manufactured Electronics (AME) is revolutionizing rapid prototyping by eliminating the steep initial costs tied to conventional injection molding tooling. This manufacturing breakthrough permits engineers to print dielectric structures and conductive traces concurrently, allowing for the creation of complex 3D circuits in a matter of hours instead of weeks. By removing the financial hurdle of costly tooling for low-volume production, AME speeds up design iteration cycles and supports the agile development of tailored electronic components. Highlighting the swift commercial expansion of this digital production technology, Nano Dimension announced in September 2025 that its second-quarter revenue climbed to USD 25.8 million, marking a 72.4% increase compared to the same period the prior year.

Key Market Players

  • Molex LLC
  • TE Connectivity Ltd.
  • Amphenol Corporation
  • HARTING Technology Group
  • KYOCERA AVX Components Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • TEPROSA
  • Taoglas
  • RTP Company

Report Scope

In this report, the Global Molded Interconnect Device Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Molded Interconnect Device Market, By Process

  • Laser Direct Structuring
  • Two-Shot Molding

Molded Interconnect Device Market, By Application

  • Automotive
  • Consumer Products
  • Healthcare
  • Industrial
  • Military & Aerospace
  • Telecommunication
  • Others

Molded Interconnect Device Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Molded Interconnect Device Market.

Available Customizations:

Global Molded Interconnect Device Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Molded Interconnect Device Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Process (Laser Direct Structuring, Two-Shot Molding)
    • 5.2.2. By Application (Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication, Others)
    • 5.2.3. By Region
    • 5.2.4. By Company (2025)
  • 5.3. Market Map

6. North America Molded Interconnect Device Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Process
    • 6.2.2. By Application
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Molded Interconnect Device Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Process
        • 6.3.1.2.2. By Application
    • 6.3.2. Canada Molded Interconnect Device Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Process
        • 6.3.2.2.2. By Application
    • 6.3.3. Mexico Molded Interconnect Device Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Process
        • 6.3.3.2.2. By Application

7. Europe Molded Interconnect Device Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Process
    • 7.2.2. By Application
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Molded Interconnect Device Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Process
        • 7.3.1.2.2. By Application
    • 7.3.2. France Molded Interconnect Device Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Process
        • 7.3.2.2.2. By Application
    • 7.3.3. United Kingdom Molded Interconnect Device Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Process
        • 7.3.3.2.2. By Application
    • 7.3.4. Italy Molded Interconnect Device Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Process
        • 7.3.4.2.2. By Application
    • 7.3.5. Spain Molded Interconnect Device Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Process
        • 7.3.5.2.2. By Application

8. Asia Pacific Molded Interconnect Device Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Process
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Molded Interconnect Device Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Process
        • 8.3.1.2.2. By Application
    • 8.3.2. India Molded Interconnect Device Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Process
        • 8.3.2.2.2. By Application
    • 8.3.3. Japan Molded Interconnect Device Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Process
        • 8.3.3.2.2. By Application
    • 8.3.4. South Korea Molded Interconnect Device Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Process
        • 8.3.4.2.2. By Application
    • 8.3.5. Australia Molded Interconnect Device Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Process
        • 8.3.5.2.2. By Application

9. Middle East & Africa Molded Interconnect Device Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Process
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Molded Interconnect Device Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Process
        • 9.3.1.2.2. By Application
    • 9.3.2. UAE Molded Interconnect Device Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Process
        • 9.3.2.2.2. By Application
    • 9.3.3. South Africa Molded Interconnect Device Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Process
        • 9.3.3.2.2. By Application

10. South America Molded Interconnect Device Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Process
    • 10.2.2. By Application
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Molded Interconnect Device Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Process
        • 10.3.1.2.2. By Application
    • 10.3.2. Colombia Molded Interconnect Device Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Process
        • 10.3.2.2.2. By Application
    • 10.3.3. Argentina Molded Interconnect Device Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Process
        • 10.3.3.2.2. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Molded Interconnect Device Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Molex LLC
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. TE Connectivity Ltd.
  • 15.3. Amphenol Corporation
  • 15.4. HARTING Technology Group
  • 15.5. KYOCERA AVX Components Corporation
  • 15.6. LPKF Laser & Electronics AG
  • 15.7. MID Solutions GmbH
  • 15.8. TEPROSA
  • 15.9. Taoglas
  • 15.10. RTP Company

16. Strategic Recommendations

17. About Us & Disclaimer