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市场调查报告书
商品编码
1878355

无线连接晶片组市场－2025-2030年预测

Wireless Connectivity Chipset Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 140 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

无线连接晶片组市场预计将从 2025 年的 106.56 亿美元成长到 2030 年的 165.26 亿美元，复合年增长率为 9.17%。

无线连接晶片组市场由现代通讯系统内部硬体的基本建构模组所构成。这些晶片组旨在透过无线通讯协定（包括 Wi-Fi、蓝牙或二者结合）实现设备连接。该市场的扩张主要得益于消费领域智慧家庭自动化技术的日益普及以及汽车行业对先进连接技术的需求不断增长。高速网路存取的日益普及，尤其是在欧洲、北美和亚太地区，正在加速连网设备和智慧家庭应用的普及。这个生态系统涵盖了不断扩展且种类繁多的产品，包括语音助理、智慧家电、智慧照明、恆温器和保全摄影机。然而，这种扩张也带来了网路复杂性的增加和安全隐患，因为每个连网设备都代表着网路攻击的新途径。

物联网 (IoT) 在住宅、商业和工业环境中的快速整合是推动高级自动化发展以及无线晶片组需求成长的根本因素。自动化带来的优势众多，包括提高生产力、增强营运柔软性和可靠性、提升安全性、加快处理速度、提升生活便利性以及提高整体成本效益。预计未来几年，物联网连接在各个领域的持续成长将成为无线晶片组市场持续成长的驱动力。

主要市场成长驱动因素

市场的主要驱动力是网路在家庭和企业中日益普及和变革性的应用。现代数位经济的特征是对网路连线的高度依赖，这为Wi-Fi晶片组创造了持续的需求，也为製造商带来了机会。 Wi-Fi网路技术的进步为用户提供了更快的速度和更低的延迟，从而促进了资料密集型服务和应用的蓬勃发展。这一趋势主要受消费者对高清影片内容的需求以及企业和消费者领域向云端基础服务的广泛转变所驱动。这些因素显着增加了透过Wi-Fi网路传输的资料量。这种数据爆炸性增长催生了对强大无线连接的需求，以支援高速、高容量的网路。 5G的持续部署，以及未来扩增实境（AR）和虚拟实境（VR）等身临其境型技术的普及，预计将进一步加速资料流量和效能需求的成长。

第二个相互关联的驱动因素是自动化在多个领域的日益普及。物联网 (IoT) 在住宅、商业和工业环境中的快速应用，催生了对先进自动化解决方案的强劲需求。这种需求直接转换为无线晶片组消耗量的成长，而无线晶片组正是互联繫统通讯的基础。自动化整合带来了许多显着优势，包括提高生产力、增强适应性和可靠性、强化安全通讯协定、提升产量、加快资料处理速度、提高便利性以及显着降低成本。因此，覆盖各行各业的物联网连接网路预计将在不久的将来成为推动无线晶片组市场成长的核心支柱。

区域市场展望

亚太地区预计将占据全球无线连接晶片组市场的主要份额，并有望保持这一地位。这一主导地位得益于多项区域趋势。消费者偏好转向萤幕大小更大、更实用的设备，例如平板电脑和智慧型手机，正在推动对支援这些设备的无线连接晶片组的需求。此外，教育科技公司致力于将数位设备融入学习课程，这也促进了连网设备的普及，并刺激了对这些关键组件的需求。

亚太地区网路服务需求的快速成长也推动了无线连接晶片组的普及。包括5G在内的先进网路服务的持续推广和消费者接受度预计将带来显着的社会和经济效益。这项技术升级週期为需要先进连接技术的设备的激增创造了理想环境，巩固了亚太地区作为全球无线晶片组市场关键成长引擎的地位。设备拥有量的成长、教育领域的数位化以及下一代网路的部署，共同使亚太地区处于市场扩张的前沿。

本报告的主要优势：

  • 深入分析：提供对主要和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、垂直行业和其他细分市场。
  • 竞争格局：了解全球主要企业的策略倡议，并了解透过正确的策略进入市场的可能性。
  • 市场驱动因素与未来趋势：探讨影响市场的动态因素和关键趋势及其对未来市场发展的影响。
  • 可操作的建议：利用洞察力，做出策略决策，在动态环境中发展新的业务流和收入来源。
  • 受众广泛：适用于Start-Ups、研究机构、顾问公司、中小企业和大型企业，且经济实惠。

以下是一些公司如何使用这份报告的范例

产业与市场分析、机会评估、产品需求预测、打入市场策略、地理扩张、资本投资决策、法规结构及影响、新产品开发、竞争情报

报告范围：

  • 2022-2024年实际数据及2025-2030年预测数据
  • 成长机会、挑战、供应链前景、法规结构与趋势分析
  • 竞争定位、策略和市场占有率分析
  • 按业务板块和地区分類的收入成长和预测评估，包括国家/地区
  • 公司概况（策略、产品、财务资讯、关键发展等）

目录

第一章执行摘要

第二章 市场概览

  • 市场概览
  • 市场定义
  • 调查范围

第二章 市场区隔

第三章 商业情境

  • 市场驱动因素
  • 市场限制
  • 市场机会
  • 波特五力分析
  • 产业价值链分析
  • 政策与法规
  • 策略建议

第四章 技术展望

5. 无线连接晶片组市场（依技术划分）

  • 介绍
  • Wi-Fi
  • Bluetooth
  • NFC（近距离场通讯）
  • 细胞
  • 其他的

6. 依架构分類的无线连接晶片组市场

  • 介绍
  • 独立版
  • 託管

7. 无线连接晶片组市场（依应用领域划分）

  • 介绍
  • 家用电子电器
  • 车
  • 医疗保健
  • 工业的
  • 其他的

8. 无线连接晶片组市场（依地区划分）

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他的
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 西班牙
    • 义大利
    • 其他的
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他的
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 台湾
    • 其他的

第九章：竞争格局与分析

  • 主要企业和策略分析
  • 市占率分析
  • 合併、收购、协议和合作
  • 竞争对手仪錶板

第十章：公司简介

  • Broadcom Inc
  • Qualcomm Technologies, Inc.
  • MediaTek Inc
  • Intel Corporation
  • Texas Instruments Incorporated
  • STMicroelectronics
  • NXP Semiconductors NV
  • ONSEMI
  • Infineon Technologies AG
  • Qorvo Inc

第十一章附录

  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要收益
  • 调查方法
  • 简称
简介目录
Product Code: KSI061614992

Wireless Connectivity Chipset Market is expected to grow at a 9.17% CAGR, achieving USD 16.526 billion by 2030 from USD 10.656 billion in 2025.

The wireless connectivity chipset market is defined by components integral to the internal hardware of modern communication systems. These chipsets are engineered to enable devices to connect via wireless protocols, including Wi-Fi, Bluetooth, or a combination of both. The expansion of this market is primarily driven by the proliferating adoption of smart home automation in the consumer sector and the rising demand for enhanced connectivity within the automotive industry. As high-speed internet access becomes more widespread, particularly in regions such as Europe, North America, and Asia Pacific, the deployment of connected devices and smart home applications is accelerating. This ecosystem encompasses a growing array of products, including voice assistants, smart appliances, intelligent lighting, thermostats, and security cameras. However, this expansion also introduces increased network complexity and security considerations, as each connected device can potentially represent a new vector for cyber attacks.

The rapid integration of the Internet of Things (IoT) across residential, commercial, and industrial environments is a fundamental force fueling the need for advanced automation and, consequently, for wireless chipsets. The benefits of automation are multifaceted, leading to increased production, greater operational flexibility and reliability, enhanced security, faster processing speeds, more convenient living, and overall cost-effectiveness. The continued growth in IoT connections across various sectors is anticipated to be a persistent driver for the wireless chipset market in the coming years.

Primary Market Growth Drivers

A principal driver for the market is the escalating and transformative use of the internet in both households and businesses. The modern digital economy is characterized by a heavy reliance on internet connectivity, which in turn creates sustained demand for Wi-Fi chipsets and opportunities for manufacturers. Advancements in Wi-Fi network technology are delivering faster speeds and lower latency to users, enabling the widespread adoption of data-intensive services and applications. This trend is largely fueled by consumer appetite for high-definition video content and a broad movement-across both corporate and consumer segments-toward cloud-based services. These factors are generating a massive increase in the volume of data carried over Wi-Fi networks. This data deluge is creating a requirement for robust wireless connections that can support fast, high-capacity networks. The ongoing deployment of 5G, coupled with the future adoption of immersive technologies like augmented reality (AR) and virtual reality (VR), is expected to further accelerate data traffic and performance demands.

A second, interrelated driver is the broadening adoption of automation across multiple domains. The rapid proliferation of the Internet of Things in residential, commercial, and industrial settings has created a powerful demand for sophisticated automation solutions. This demand directly translates into increased consumption of wireless chipsets, which serve as the communication backbone for these interconnected systems. The integration of automation offers compelling advantages, including improved productivity, enhanced adaptability and dependability, stronger security protocols, increased output, faster data processing, greater convenience, and significant cost-effectiveness. The expanding web of IoT connections across diverse industries is therefore expected to be a central pillar propelling the growth of the wireless chipset market in the foreseeable future.

Geographical Market Outlook

The Asia Pacific region is projected to be the prominent shareholder in the global wireless connectivity chipset market and is anticipated to maintain this position. This dominance is supported by several regional dynamics. A shift in consumer preference towards devices with larger, more practical screen sizes, such as tablets and smartphones, is boosting demand for the wireless connectivity chipsets that enable them. Furthermore, initiatives by educational technology companies that integrate digital devices into learning curricula are contributing to the installed base of connected gadgets, thereby stimulating demand for these essential components.

The adoption of wireless connectivity chipsets is also being propelled by the rapidly growing demand for internet services across the Asia-Pacific region. The ongoing rollout and consumer adoption of advanced internet services, including 5G, are anticipated to unlock significant societal and economic benefits. This technological upgrade cycle creates a fertile environment for the proliferation of devices requiring advanced connectivity, thereby cementing the region's role as a critical growth engine for the global wireless chipset market. The confluence of rising device ownership, digitalization in education, and next-generation network deployment positions Asia Pacific at the forefront of market expansion.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Wireless Connectivity Chipset Market Segmentation:

  • WIRELESS CONNECTIVITY CHIPSET MARKET BY TECHNOLOGY
  • Wi-Fi
  • Bluetooth
  • NFC (Near Field Communication)
  • Cellular
  • Others
  • WIRELESS CONNECTIVITY CHIPSET MARKET BY ARCHITECTURE
  • Standalone
  • Hosted
  • WIRELESS CONNECTIVITY CHIPSET MARKET BY APPLICATION
  • Consumer Electronics
  • Automotive
  • Medical & Healthcare
  • Industrial
  • Others
  • WIRELESS CONNECTIVITY CHIPSET MARKET BY GEOGRAPHY
  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Italy
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Taiwan
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. WIRELESS CONNECTIVITY CHIPSET MARKET BY TECHNOLOGY

  • 5.1. Introduction
  • 5.2. Wi-Fi
  • 5.3. Bluetooth
  • 5.4. NFC (Near Field Communication)
  • 5.5. Cellular
  • 5.6. Others

6. WIRELESS CONNECTIVITY CHIPSET MARKET BY ARCHITECTURE

  • 6.1. Introduction
  • 6.2. Standalone
  • 6.3. Hosted

7. WIRELESS CONNECTIVITY CHIPSET MARKET BY APPLICATION

  • 7.1. Introduction
  • 7.2. Consumer Electronics
  • 7.3. Automotive
  • 7.4. Medical & Healthcare
  • 7.5. Industrial
  • 7.6. Others

8. WIRELESS CONNECTIVITY CHIPSET MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. USA
    • 8.2.2. Canada
    • 8.2.3. Mexico
  • 8.3. South America
    • 8.3.1. Brazil
    • 8.3.2. Argentina
    • 8.3.3. Others
  • 8.4. Europe
    • 8.4.1. Germany
    • 8.4.2. France
    • 8.4.3. United Kingdom
    • 8.4.4. Spain
    • 8.4.5. Italy
    • 8.4.6. Others
  • 8.5. Middle East and Africa
    • 8.5.1. Saudi Arabia
    • 8.5.2. UAE
    • 8.5.3. Others
  • 8.6. Asia Pacific
    • 8.6.1. China
    • 8.6.2. India
    • 8.6.3. Japan
    • 8.6.4. South Korea
    • 8.6.5. Taiwan
    • 8.6.6. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. Broadcom Inc
  • 10.2. Qualcomm Technologies, Inc.
  • 10.3. MediaTek Inc
  • 10.4. Intel Corporation
  • 10.5. Texas Instruments Incorporated
  • 10.6. STMicroelectronics
  • 10.7. NXP Semiconductors NV
  • 10.8. ONSEMI
  • 10.9. Infineon Technologies AG
  • 10.10. Qorvo Inc

11. APPENDIX

  • 11.1. Currency
  • 11.2. Assumptions
  • 11.3. Base and Forecast Years Timeline
  • 11.4. Key Benefits for the Stakeholders
  • 11.5. Research Methodology
  • 11.6. Abbreviations