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市场调查报告书
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1289720

全球PCB市场IC载板：趋势、机遇与竞争分析[2023-2028]

IC Substrate in the Global PCB Market: Trends, Opportunities and Competitive Analysis [2023-2028]
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

PCB市场IC载板的市场趋势及预测

就 IC 基板利用率而言，全球 PCB 市场预计到 2028 年将达到约 153 亿美元，2023 年至 2028 年復合年增长率为 14.2%。 该市场的主要驱动力是晶圆级封装和倒装芯片封装等先进封装技术的日益普及、智能手錶和健身手环等智能可穿戴设备的日益普及以及小型化趋势的日益增强。 全球PCB市场IC载板前景广阔，在平板电脑、智能手机、笔记本电脑和可穿戴设备等领域都有应用机会。

PCB市场IC载板厂商列表

市场上的公司通过其提供的产品质量进行竞争。 该市场的主要参与者专注于扩大製造设施、投资研发、开发基础设施以及利用整个价值链的整合机会。 这些策略使PCB市场的IC载板公司能够满足日益增长的需求、确保竞争力、开发创新产品和技术、降低生产成本并扩大客户群。

PCB市场IC载板市场洞察

根据 Lucintel 的预测，FC BGA 预计在预测期内仍将是较大的类型细分市场，因为其布线密度更高，并且能够进行定制以最大限度地提高电气性能。

由于对高性能移动设备的需求不断增长以及先进技术的渗透，预计智能手机在预测期内仍将是市场上最大的细分市场。

由于电子行业的强劲增长、先进封装技术的不断增长趋势以及该地区成熟的半导体和电子製造商的存在，亚太地区将继续成为最大的地区。

本报告回答了 11 个关键问题：

  • Q.1.您的细分市场中最有前途和高增长的机会是什么？
  • Q.2.哪些细分市场未来将加速增长？为什么？
  • Q.3.您认为哪些地区未来会加速增长？为什么？
  • Q.4.影响市场动态的关键因素有哪些？ 主要的市场挑战和业务风险是什么？
  • Q.5.这个市场的业务风险和竞争威胁是什么？
  • Q.6.这个市场有哪些新趋势？为什么？
  • Q.7.市场上客户需求有何变化？
  • 问题 8.新兴市场的发展有哪些？ 引领这些发展的公司在哪里？
  • Q.9.谁是市场上的主要参与者？ 领先公司正在采取哪些战略举措来发展业务？
  • Q.10.这个市场上的竞争产品有哪些？因材料或产品替代而失去市场份额的威胁是什么？
  • Q.11.过去五年发生了哪些类型的併购？对行业产生了哪些影响？

内容

第 1 章执行摘要

第二章全球PCB市场IC载板：市场动态

  • 简介、背景、分类
  • 供应链
  • 行业驱动因素和挑战

第三章2017-2028年市场趋势及预测分析

  • 宏观经济趋势（2017-2022 年）和预测（2023-2028 年）
  • 全球PCB市场IC载板趋势（2017-2022年）及预测（2023-2028年）
  • 按 IC 载板类型划分的全球 PCB 市场
    • FC BGA
    • FC CSP
  • 全球 PCB 市场 IC 载板（按应用）
    • 平板电脑
    • 智能手机
    • 笔记本电脑
    • 可穿戴设备
    • 其他

第四章2017-2028年分地区市场趋势及预测分析

  • 全球PCB市场IC载板（按地区）
  • 北美PCB市场的IC载板
  • 欧洲PCB市场的IC载板
  • 亚太地区 PCB 市场的 IC 载板
  • ROW PCB 市场中的 IC 载板

第 5 章：竞争分析

  • 产品组合分析
  • 运营整合
  • 波特五力分析

第 6 章增长机会和战略分析

  • 增长机会分析
    • 全球 PCB 市场按 IC 基板类型划分的增长机会
    • 全球 PCB 市场中 IC 载板应用的增长机会
    • 按地区划分的全球 PCB 市场 IC 载板的增长机会
  • 全球PCB市场IC载板新趋势
  • 战略分析
    • 新产品开发
    • 全球PCB市场IC载板产能扩张
    • 全球PCB市场IC载板併购及合资企业
    • 身份验证和许可

第 7 章主要公司简介

  • ASE Group
  • TTM Technologies
  • Simmtech
  • Fujitsu Limited
  • Ibiden
  • JCET Group
  • Kinsus Interconnect Technology
  • Korea Circuit
  • KYOCERA Corporation
  • LG Innotek
简介目录

IC Substrate in PCB Market Trends and Forecast

The future of the global IC substrate in the global PCB market looks promising with opportunities in the tablet PC, smartphone, laptop, and wearable device applications. The global PCB market in terms of IC substrate usage is expected to reach an estimated $15.3 billion by 2028 with a CAGR of 14.2% from 2023 to 2028. The major drivers for this market are increasing acceptance of advanced packaging technologies, such as wafer-level packaging and flip-chip packaging, increasing popularity of smart wearable, like smart watches and fitness bands, and growing trend of miniaturization.

IC Substrate in PCB Market

A more than 150-page report is developed to help in your business decisions.

IC Substrate in PCB Market by Segments

The study includes trends and forecast for IC substrate in the global PCB market by type, application, and region, as follows:

IC Substrate in PCB Market by Type [Value ($B) Shipment Analysis from 2017 to 2028]:

  • FC BGA
  • FC CSP

IC Substrate in PCB Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Tablet PC
  • Smart Phones
  • Laptops
  • Wearable Devices
  • Others

IC Substrate in PCB Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of IC Substrate in PCB Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, IC substrate companies in the PCB market cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of IC substrate companies in the PCB market profiled in this report include.

  • ASE Group
  • TTM Technologies
  • Simmtech
  • Fujitsu Limited
  • Ibiden
  • JCET Group
  • Kinsus Interconnect Technology
  • Korea Circuit
  • KYOCERA Corporation
  • LG Innotek

IC Substrate in PCB Market Insights

Lucintel forecasts that FC BGA is expected to remain the larger type segment over the forecast period due to its capability of routing density and ability to be customized for maximum electrical performance.

Within this market, smartphones are expected to remain the largest segment over the forecast period due to rising demand for high-performance mobile devices and increasing penetration of advanced technologies.

APAC will remain the largest region due to significantly growing electronics industry, increasing trend of advanced packaging technologies, and presence of the well-established semiconductor and electronics players in the region.

Features of IC Substrate in PCB Market

  • Market Size Estimates: IC substrate in the global PCB market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: IC substrate in the global PCB market size by various segments, such as by raw material usage, end use industry, and region
  • Regional Analysis: IC substrate in the global PCB market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different raw material usages, end use industries, and regions for IC substrate in PCB market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for IC substrate in PCB market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

  • Q1. What is IC substrate in PCB market size?
  • Answer: The global PCB market in terms of IC substrate usage is expected to reach an estimated $15.3 billion by 2028.
  • Q2. What is the growth forecast for IC substrate in PCB market?
  • Answer: The global PCB market in terms of IC substrate usage is expected to grow with a CAGR of 14.2% from 2023 to 2028.
  • Q3. What are the major drivers influencing the growth of IC substrate in PCB market?
  • Answer: The major drivers for this market are increasing acceptance of advanced packaging technologies, such as wafer-level packaging and flip-chip packaging, increasing popularity of smart wearable's like smart watches and fitness bands, and growing trend of miniaturization.
  • Q4. What are the major segments for IC substrate in PCB market?
  • Answer: The future of IC substrate in the global PCB market looks promising with opportunities in the tablet PC, smartphone, laptop, and wearable device markets.
  • Q5. Who is the key IC substrate in PCB companies?
  • Answer: Some of the key IC substrate in PCB companies are as follows:
  • ASE Group
  • TTM Technologies
  • Simmtech
  • Fujitsu Limited
  • Ibiden
  • JCET Group
  • Kinsus Interconnect Technology
  • Korea Circuit
  • KYOCERA Corporation
  • LG Innotek
  • Q6. Which IC substrate in PCB segment will be the largest in future?
  • Answer: Lucintel forecasts that FC BGA is expected to remain the larger type segment over the forecast period due to its capability of routing density and ability to be customized for maximum electrical performance.
  • Q7. In IC substrate in PCB market, which region is expected to be the largest in next 5 years?
  • Answer: APAC will remain the largest region due to significantly growing electronics industry, increasing trend of advanced packaging technologies, and presence of the well-established semiconductor and electronics players in the region.
  • Q8. Do we receive customization in this report?
  • Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for IC substrate in the global PCB market by type (FC BGA and FC CSP), application (tablet PC, smartphones, laptops, wearable devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. IC Substrate in the Global PCB Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: IC Substrate in the Global PCB Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: IC Substrate in the Global PCB Market by Type
    • 3.3.1: FC BGA
    • 3.3.2: FC CSP
  • 3.4: IC Substrate in the Global PCB Market by Application
    • 3.4.1: Tablet PC
    • 3.4.2: Smart Phones
    • 3.4.3: Laptops
    • 3.4.4: Wearable Devices
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: IC Substrate in the Global PCB Market by Region
  • 4.2: IC Substrate in the North American PCB Market
    • 4.2.1: IC Substrate in the North American PCB Market by Type: FC BGA and FC CSP
    • 4.2.2: IC Substrate in the North American PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
  • 4.3: IC Substrate in the European PCB Market
    • 4.3.1: IC Substrate in the European PCB Market by Type: FC BGA and FC CSP
    • 4.3.2: IC Substrate in the European PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
  • 4.4: IC Substrate in the APAC PCB Market
    • 4.4.1: IC Substrate in the APAC PCB Market by Type: FC BGA and FC CSP
    • 4.4.2: IC Substrate in the APAC PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
  • 4.5: IC Substrate in the ROW PCB Market
    • 4.5.1: IC Substrate in the ROW PCB Market by Type: FC BGA and FC CSP
    • 4.5.2: IC Substrate in the ROW PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for IC Substrate in the Global PCB Market by Type
    • 6.1.2: Growth Opportunities for IC Substrate in the Global PCB Market by Application
    • 6.1.3: Growth Opportunities for IC Substrate in the Global PCB Market by Region
  • 6.2: Emerging Trends for IC Substrate in the Global PCB Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of IC Substrate in the Global PCB Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures of IC Substrate in the Global PCB Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: ASE Group
  • 7.2: TTM Technologies
  • 7.3: Simmtech
  • 7.4: Fujitsu Limited
  • 7.5: Ibiden
  • 7.6: JCET Group
  • 7.7: Kinsus Interconnect Technology
  • 7.8: Korea Circuit
  • 7.9: KYOCERA Corporation
  • 7.10: LG Innotek