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市场调查报告书
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1445435

先进 IC 载板 - 市场占有率分析、产业趋势与统计、成长预测（2024 - 2029 年）

Advanced IC Substrates - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 125 Pages | 商品交期: 2-3个工作天内

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简介目录

先进IC载板市场规模预计到2024年为181.1亿美元，预计到2029年将达到315.4亿美元，在预测期内（2024-2029年）CAGR为11.73%。

先进 IC 载板 - 市场

厂商不断改进其封装技术，以满足更小占地面积、更高效能和更低功耗的严格要求。对消费性电子产品和行动通讯设备的需求促使电子製造商提供更紧凑、更便携的产品。

小型化的日益发展趋势正在推动对先进封装的需求。 5G 的出现影响了过去几年的需求，随着采用通讯技术的国家越来越多地在 5G 基地台和 HPC 中使用 FCBGA，预计 5G 的出现将继续下去。

FCBGA 预计将在市场需求中占据很大份额，因为它具有布线密度可用性，并且可以进行调整以实现最大电气性能。该市场的主要参与者包括 Unimicron、ASE Group、IBIDEN 和 SCC。例如，欣兴科技和景硕正在扩大其基板产能。欣兴微电子宣布，截至2022年，将投资总计200亿新台币用于先进倒装晶片基板的研发和产能扩张。

除此之外，全球消费和工业领域对物联网的需求预计将增加对 IC 基板的需求不断增长。根据网路和电视协会预测，2020年，全球物联网设备数量预计将达到501亿台，工业物联网需求预计在未来几年将超过消费者需求。预计此类发展将对市场产生正面影响。

先进基板产业遵循小型化、更高整合度和更高性能的趋势。因此，正在进行的 ED 和 SLP 封装领域的多家参与者正在进行巨额投资，并对此类技术表现出越来越大的兴趣。

更高的功率密度和电路板整合度带来了散热优势，从而进一步提高了系统可靠性。由于汽车应用的广泛采用，此类技术为市场带来了巨大的价值。

它们还推动电信和基础设施领域的发展，其中 ED 是提高硬体效率的合适基板解决方案。因此，参与者正在对新工厂进行巨额投资，预计 ED 将成为主要产品成分。

儘管 IC 基板具有潜力，但偏好的变化可能会减缓市场成长。例如，一些公司利用具有多个 RDL 的硅中介层来实现逻辑和 HBM 之间的更好连接。其他人使用带有 RDL 的基板上扇出。 FCBGA 需要基板供应商、晶圆凸块以及用于 RDL 以及组装和测试的晶圆製造能力。但 FO WLP 仅需要组装和晶圆厂来进行 RDL 以及晶圆凸点和测试。因此，业界正见证向 FOWLP 的转变。

COVID-19 大流行期间商业/企业工作方式和消费者行为的变化刺激了对某些类型产品的需求，预计将打开新市场和市场途径。例如，随着越来越多的企业升级其安全性并增加云端活动，对有线通讯中使用的半导体的需求仍在增长。许多网路上的视讯串流也增加了固定宽频的使用。

先进IC载板市场趋势

行动装置和消费性电子产品将占据主要市场份额

  • 对行动通讯设备和消费性电子产品的需求正在推动行动和消费性电子产品製造商创造更小、更便携的产品。日益增长的小型化趋势正在推动对先进封装的需求。
  • 行动装置和消费性电子产品功能的不断增加，以及智慧型装置和智慧型穿戴装置的日益普及，是预计在预测期内推动先进 IC 基板采用的一些主要因素。人工智慧和高效能运算等尖端技术以及高效能行动装置（包括 5G）的日益采用推动了对先进 IC 基板的需求。
  • 此外，智慧型手机占据了相当大的市场份额，随着5G智慧型手机的出现，需求预计将进一步增加。三星等跨国公司越来越多地投资半导体业务，以成为 5G 智慧型手机领域的杰出智慧型手机供应商。中国资讯通讯研究院 (CAICT) 的报告显示，2022 年 1 月，由于价格下降提振需求，中国相容 5G 网路的智慧型手机出货量成长 63.5%，达到 2.66 亿部。报告也称，5G智慧型手机出货量占中国出货量的75.9%，高于40.7%的全球平均。
  • 智慧手錶和健身手环等智慧穿戴装置的日益普及及其功能的不断增加也推动了行动和消费领域的成长。例如，2021 年 4 月，Fitbit 宣布推出新款 Luxe 健身追踪器，一款无按钮追踪器。 Android 和 iOS 装置都支援它。它还支援 Google 快速配对，以便更快速地与 Android 装置配对，并在与手机配对时支援连接 GPS。这些进步预计将进​​一步满足 FC CSP 的需求。
  • 除此之外，由于智慧家庭的渗透率不断提高，预计智慧家电在预测期内将出现大量应用并出现销售成长。许多消费性电子公司也加大了对市场研究的投资，以开发更节能的积体电路。

中国将见证显着成长

  • 预计未来几年中国积体电路产业将快速成长，同时要求加强研发投入，加强自主创新，以建立相对完整的半导体产业链体系。
  • 根据中国半导体产业协会的数据，2021年1月至9月，中国积体电路产业收入达6,858.6亿元人民币（1,084亿美元），较去年同期成长16.1%。该国还扩大了积体电路产业的产能。国家统计局数据显示，2021年我国积体电路产量3,594亿片，年增33.3%，成长速度较2020年翻倍。
  • 此外，根据 CNBC 2022 年 12 月的报道，中国正在为其半导体行业製定超过 1 万亿元人民币（1,430 亿美元）的一揽子支持计划，这是实现芯片自给自足并对抗美国的重要一步”此举旨在减缓其技术进步。北京计划推出预计将是其最重要的财政刺激方案之一，在五年内分配，主要以补贴和税收抵免的形式，以加强国内的半导体生产和研究活动。
  • 此外，2023年3月，中国IC载板製造商Thinktrans寻求透过A轮融资筹集5亿元人民币至10亿元人民币（7,245万美元至1.449亿美元）。 Thinktrans 在内部设计和製造 IC 载板，并将其直接销售给三类客户：IDM、OSAT 和设计公司。虽然该公司的大部分客户都位于大中华区，但执行长也将美国、日本和韩国视为持续扩张的潜在市场。
  • 中国政府对半导体产业的日益重视导致对先进IC基板的需求增加。该国制定了积极的成长策略，计划到 2025 年透过国内生产满足中国 70% 的半导体需求。此外，政府的技术独立第 14 个五年计画（2021-2025 年）也支持这一目标。

先进IC载板产业概况

先进IC载板市场竞争适中，由几个主要参与者组成。主导市场的参与者包括 ASE Group、TTM Technologies Inc.、Kyocera Corporation、Siliconware Precision Industries 和 Ibiden。市场上的现有参与者正在努力透过迎合 5G 电信、高效能资料等新技术来保持竞争优势。中心、紧凑型电子设备等

2023年2月，韩国LG Innotek宣布全面加速业务活动，瞄准倒装晶片球栅阵列（FC-BGA）基板市场。该公司最近在「CES 2023」上首次推出了最新的 FC-BGA。在FC-BGA的开发上，公司积极利用超精细电路、高整合阵列、高多层基板匹配、无芯技术等技术。

2023 年 1 月，LG Innotek 在全新的龟尾工厂举行庆祝活动，该工厂将生产 FC-BGA。 LG Innotek正在龟尾四号工厂建造最新的FC-BGA生产线，该工厂于2022年6月购买，总建筑面积约22万平方公尺。 LG Innotek打算加速FC-BGA的开发。预计今年上半年，新厂将拥有完善的生产体系，2023年下半年将开始全面投产。

额外的好处：

  • Excel 格式的市场估算 (ME) 表
  • 3 个月的分析师支持

目录

第 1 章：简介

  • 研究假设和市场定义
  • 研究范围

第 2 章：研究方法

第 3 章：执行摘要

第 4 章：市场洞察

  • 市场概况
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 消费者的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争激烈程度
  • 产业价值链分析
  • COVID-19 对产业影响的评估

第 5 章：市场动态

  • 市场驱动因素
    • 先进基板在物联网设备製造上的应用不断增加
    • 半导体元件小型化趋势日益明显
  • 市场限制
    • 製造过程的复杂性

第 6 章：市场细分

  • 按类型
    • FC球栅阵列
    • 光纤通讯光热发电
  • 按应用
    • 行动和消费者
    • 汽车和交通
    • 资讯科技和电信
    • 其他应用
  • 按地理
    • 美国
    • 中国
    • 日本
    • 韩国
    • 台湾
    • 世界其他地区

第 7 章：竞争格局

  • 公司简介
    • ASE Kaohsiung (ASE Inc.)
    • AT&S Austria Technologies & Systemtechnik AG
    • Siliconware Precision Industries Co. Ltd
    • TTM Technologies Inc.
    • Ibiden Co. Ltd
    • Kyocera Corporation
    • Fujitsu Ltd
    • JCET Group
    • Panasonic Holding Corporation
    • Kinsus Interconnect Technology Corp.
    • Unimicron Corporation

第 8 章：投资分析

第 9 章：市场机会与未来趋势

简介目录
Product Code: 66839

The Advanced IC Substrates Market size is estimated at USD 18.11 billion in 2024, and is expected to reach USD 31.54 billion by 2029, growing at a CAGR of 11.73% during the forecast period (2024-2029).

Advanced IC Substrates - Market

Players are continuously advancing their packaging technologies to cater to stringent requirements with a smaller footprint, higher performances, and lower power consumption. The demand for consumer electronics and mobile communication devices drives electronics manufacturers to deliver more compact and portable products.

The increasing trend of miniaturization is driving the demand for advanced packaging. The advent of 5G, which influenced the demand over the past few years, is expected to continue as the use of FCBGA in 5G base stations and HPCs is increasing in countries adopting communication technology.

FCBGA is expected to hold a significant share of the market demand, owing to its routing density availability, as it can be tuned for maximum electrical performance. The key players in the market are Unimicron, ASE Group, IBIDEN, and SCC. For instance, Unimicron and Kinsus are expanding their substrate capacities. Unimicron has announced that it would be investing a total of TWD 20 billion in R&D and expansion of its production capacity for advanced flip-chip substrates through 2022.

Apart from this, the global demand for IoT, in both the consumer and industrial spaces, is expected to add to the increasing demand for the IC substrate. According to the Internet and Television Association, the global number of IoT devices by 2020 is expected to reach 50.1 billion, and industrial IoT demand is expected to exceed consumer demand over the coming years. Such developments are expected to influence the market positively.

The advanced substrate industry follows miniaturization trends, greater integration, and higher performance. Owing to this, several players across the ongoing ED and SLP packaging are making huge investments and showing an increased interest in such technologies.

The higher power density and board integration result in thermal benefits, thereby enabling further improvements in system reliability. Such technologies bring massive value to the market due to extended adoption across automotive applications.

They also drive the telecom and infrastructure segment, where ED is a suitable substrate solution for increased hardware efficiency. Due to this, players are investing huge amounts in new plants where ED is expected to be the main product constituent.

Despite the potential of IC substrates, changing preferences are likely to slow down market growth. For instance, some companies utilize a silicon interposer with multiple RDLs for a better connection between logic and HBM. Others use fan-out-on-substrate with RDLs. FCBGA needs a substrate supplier, wafer bumps, and wafer fab capacity for RDLs and assembly and testing. But FO WLP only requires assembly and wafer fabs for RDLs and wafer bumps and testing. Hence, the industry is witnessing a shift toward FOWLP.

Changes in business/enterprise working style and consumer behavior during the COVID-19 pandemic have fuelled demand for some types of products, and it is expected to open both new markets and routes to market. For instance, demand for semiconductors used in wired communication is still growing as more enterprises are upgrading their security and increasing cloud activities. Video streaming across many networks has also increased fixed broadband usage.

Advanced IC Substrate Market Trends

Mobile Devices and Consumer Electronics to Hold Major Market Share

  • The demand for mobile communication devices and consumer electronics is pushing manufacturers of mobile and consumer electronics to create products that are smaller and more portable. The growing trend of miniaturization is driving demand for advanced packaging.
  • The increasing functionality of mobile devices and consumer electronics products, as well as the growing popularity of smart devices and smart wearables, are some of the major factors anticipated to drive the adoption of advanced IC substrates during the forecast period. The increasing adoption of cutting-edge technologies like AI and HPC and high-performance mobile devices (including 5G) drives demand for advanced IC substrates.
  • Furthermore, smartphones command a significant share of the market, and with the advent of 5G smartphones, the demand is expected to increase even further. Global companies, like Samsung, are increasingly investing in the semiconductor business to become prominent smartphone vendors in the 5G smartphone space. In January 2022, China's shipments of smartphones compatible with 5G networks increased by 63.5% to 266 million in 2021 as falling prices boosted demand, according to the report by the China Academy of Information and Communications (CAICT). The report also stated that 5G smartphone shipments accounted for 75.9% of Chinese shipments, higher than the global average of 40.7%.
  • The increasing adoption of smart wearables, like smartwatches and fitness bands, and their increasing functionality are also expanding the growth of the mobile and consumer segments. For instance, in April 2021, Fitbit announced its new Luxe fitness tracker, a buttonless tracker. It is supported on Android and iOS devices. It also supports Google Fast Pair for pairing more quickly with Android devices and supports connected GPS while paired to the phone. These advancements are expected to further develop the need for FC CSP.
  • Besides this, smart appliances are expected to see significant applications and observe growth in their sales during the forecast period, owing to the increasing penetration of smart homes. Many consumer electronic companies are also increasing their investments in the market studied to develop more energy-efficient ICs.

China to Witness Significant Growth

  • China's IC industry is expected to witness rapid growth in the coming few years while calling for increasing R&D input and strengthening independent innovation as part of the broader objective to establish a relatively complete semiconductor industry chain system.
  • As per the China Semiconductor Industry Association, the revenue of China's integrated circuit industry reached CNY 685.86 billion (USD 108.4 billion) during the January-September 2021 period, up 16.1% on a yearly basis. The country also scaled up its production capacities in the IC industry. According to the National Bureau of Statistics, China produced 359.4 billion units of ICs in 2021, up 33.3% year-on-year, doubling the growth rate in 2020.
  • Moreover, as per a report by CNBC in December 2022, China was working on a more than CNY 1 trillion (USD 143 billion) support package for its semiconductor industry, in a major step towards self-sufficiency in chips and to counter the United States' moves aimed at slowing its technological advances. Beijing has planned to roll out what is expected to be one of its most significant fiscal incentive packages, allocated over five years, mainly as subsidies and tax credits, to strengthen semiconductor production and research activities at home.
  • Moreover, in March 2023, Thinktrans, a China-based manufacturer of IC substrates, was seeking to raise CNY 500 million to CNY 1 billion (USD 72.45 million to USD 144.9 million) in Series A funds. Thinktrans designs and manufactures IC substrates in-house and sells them directly to three groups of clients: IDMs, OSATs, and design houses. While most of the company's clients are based in Greater China, the CEO has also identified the US, Japan, and South Korea as potential markets for continued expansion.
  • The growing emphasis on the semiconductor industry by the government of China is leading to an increase in demand for advanced IC substrates. The country has an aggressive growth strategy to meet 70% of China's semiconductor demand with domestic production by 2025. Additionally, the government's 14th Five-Year Plan (2021-2025) for technology independence also supports the objective.

Advanced IC Substrate Industry Overview

The advanced IC substrates market is moderately competitive and consists of a few major players. The players dominating the market are ASE Group, TTM Technologies Inc., Kyocera Corporation, Siliconware Precision Industries Co. Ltd., and Ibiden Co. Ltd. The existing players in the market are striving to maintain a competitive edge by catering to newer technologies such as 5G telecommunication, high-performance data centers, compact electronic devices, etc.

In February 2023, South Korea-based LG Innotek announced that it acclerated its business activities on a full scale to target the Flip-Chip Ball Grid Array (FC-BGA) substrate market. The company recently unveiled the latest FC-BGA for the first time at 'CES 2023'. For the development of FC-BGA, the company is actively utilizing technologies such as the ultra-fine circuit, high-integration array, high-multi-layer substrate matching, and coreless technologies.

In January 2023, LG Innotek celebrated at the brand-new Gumi plant, which will manufacture FC-BGA. LG Innotek is building the newest FC-BGA production lines in the Gumi No. 4 factory, which was purchased in June 2022 and had a total gross area of about 220,000 square meters. Innotek LG intends to accelerate the development of FC-BGA. By the first half of this year, the new plant is expected to have a sophisticated production system in place, and in the second half of 2023, full-scale production will begin.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitutes
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Assessment of the COVID-19 Impact on the Industry

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Rising Application of Advanced Substrate in Manufacturing of IoT Equipment
    • 5.1.2 Increasing Trend of Miniaturization in Semiconductor Devices
  • 5.2 Market Restraints
    • 5.2.1 Complexity in the Manufacturing Process

6 MARKET SEGMENTATION

  • 6.1 By Type
    • 6.1.1 FC BGA
    • 6.1.2 FC CSP
  • 6.2 By Application
    • 6.2.1 Mobile and Consumer
    • 6.2.2 Automotive and Transportation
    • 6.2.3 IT and Telecom
    • 6.2.4 Other Applications
  • 6.3 By Geography
    • 6.3.1 United States
    • 6.3.2 China
    • 6.3.3 Japan
    • 6.3.4 South Korea
    • 6.3.5 Taiwan
    • 6.3.6 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 ASE Kaohsiung (ASE Inc.)
    • 7.1.2 AT&S Austria Technologies & Systemtechnik AG
    • 7.1.3 Siliconware Precision Industries Co. Ltd
    • 7.1.4 TTM Technologies Inc.
    • 7.1.5 Ibiden Co. Ltd
    • 7.1.6 Kyocera Corporation
    • 7.1.7 Fujitsu Ltd
    • 7.1.8 JCET Group
    • 7.1.9 Panasonic Holding Corporation
    • 7.1.10 Kinsus Interconnect Technology Corp.
    • 7.1.11 Unimicron Corporation

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS