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市场调查报告书
商品编码
1417364

无线连接晶片组市场报告：2030 年趋势、预测与竞争分析

Wireless Connectivity Chipset Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

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简介目录

无线连接晶片组趋势和预测

到 2030 年，全球无线连接晶片组市场预计将达到 128 亿美元，2024 年至 2030 年复合年增长率为 7.8%。该市场的主要驱动因素是高速互联网的普及、汽车行业不断增长的连接需求以及由于无线网路技术的进步而导致的智慧家庭自动化的日益普及。全球无线连接晶片组市场的未来前景广阔，为消费者、企业、行动电话、汽车和工业市场带来机会。

无线连接晶片组市场洞察

Lucintel 预测，在预测期内，独立 Wi-Fi 仍将是最大的市场区隔。各个行业都在走向数位化，越来越多地采用数位技术来保持竞争力、提高生产力并提供卓越的客户体验。

由于网路服务需求不断增长、5G智慧型手机的可用性和成本不断上升，以及智慧型手机在该地区都市区和农村地区的快速普及，预计亚太地区在预测期内将经历最高的增长。

常问问题

Q.1 无线连接晶片组的市场规模有多大？

A1. 到 2030 年，全球无线连接晶片组市场预计将达到 128 亿美元。

Q.2 无线连接晶片组市场的成长预测是什么？

A2. 2024年至2030年，全球无线连接晶片组市场预计将以7.8%的复合年增长率成长。

Q.3 影响无线连接晶片组市场成长的关键因素有哪些？

A3. 该市场的主要驱动因素是高速互联网的日益普及、汽车行业对连接的需求不断增加以及由于无线网路技术的进步而导致的智慧家庭自动化的日益普及。

Q4.市场的主要细分市场是什么？

A4. 全球无线连接晶片组市场前景广阔，为消费者、企业、行动电话、汽车和工业市场带来机会。

Q5.市场上主要企业有哪些？

A5. 一些主要的无线连接晶片公司是：

  • Broadcom
  • Qualcomm Incorporated
  • Mediatek
  • Intel Corporation
  • Texas Instruments Incorporated
  • STMicroelectronics
  • NXP Semiconductors
  • On Semiconductor Corporation
  • Infineon Technologies
  • Microchip Technology

Q6.未来最大的细分市场是什么？

A6.Lucintel 预计 Wi-Fi 独立设备在预测期间内仍将是最大的细分市场。各个行业都在走向数位化，越来越多地采用数位技术来保持竞争力、提高生产力并提供卓越的客户体验。

Q7. 预计未来五年哪个地区将成为最大的市场？

A7. 由于网路服务需求不断增长、5G 智慧型手机的可用性和成本不断上升，以及智慧型手机在该地区都市区和农村地区的快速普及，预计亚太地区将经历最高的成长。

Q8. 可以客製化报告吗？

A8. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章全球无线连接晶片组市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球无线连接晶片组市场趋势（2018-2023）与预测（2024-2030）
  • 按类型分類的全球无线连接晶片组市场
    • 独立 Wi-Fi
    • 蓝牙独立
    • Wi-Fi 与蓝牙组合
    • 低功耗无线IC
  • 全球无线连接晶片组市场（依最终用途）
    • 消费者
    • 公司
    • 行动电话
    • 车
    • 工业的
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 全球无线连接晶片组市场（按地区）
  • 北美无线连接晶片组市场
  • 欧洲无线连接晶片组市场
  • 亚太无线连接晶片组市场
  • 其他地区的无线连接晶片组市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 按类型分類的全球无线连接晶片组市场成长机会
    • 全球无线连接晶片组市场成长机会（依最终用途）
    • 全球无线连接晶片组市场成长机会（按地区）
  • 全球无线连接晶片组市场的新兴趋势
  • 战略分析
    • 新产品开发
    • 全球无线连接晶片组市场产能扩张
    • 全球无线连接晶片组市场的合併、收购和合资企业
    • 认证和许可

第七章主要企业概况

  • Broadcom
  • Qualcomm Incorporated
  • Mediatek
  • Intel Corporation
  • Texas Instruments Incorporated
  • STMicroelectronics
  • NXP Semiconductors
  • On Semiconductor Corporation
  • Infineon Technologies
  • Microchip Technology
简介目录

Wireless Connectivity Chipset Trends and Forecast

The future of the global wireless connectivity chipset market looks promising with opportunities in the consumer, enterprise, mobile handsets, automotive, and industrial markets. The global wireless connectivity chipset market is expected to reach an estimated $12.8 billion by 2030 with a CAGR of 7.8% from 2024 to 2030. The major drivers for this market are growing penetration of high-speed internet, increasing demands for connectivity in the automobile industry and the growing popularity of smart home automation, along with the advancement of wireless network technologies.

A more than 150-page report is developed to help in your business decisions.

Wireless Connectivity Chipset by Segment

The study includes a forecast for the global wireless connectivity chipset by type, end use, and region.

Wireless Connectivity Chipset Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Wi-Fi Standalone
  • Bluetooth Standalone
  • Wi-Fi and Bluetooth Combo
  • Low-Power Wireless Ic

Wireless Connectivity Chipset Market by End Use [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer
  • Enterprise
  • Mobile Handsets
  • Automotive
  • Industrial
  • Others

Wireless Connectivity Chipset Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Wireless Connectivity Chipset Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies wireless connectivity chipset companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the wireless connectivity chipset companies profiled in this report include-

  • Broadcom
  • Qualcomm Incorporated
  • Mediatek
  • Intel Corporation
  • Texas Instruments Incorporated
  • STMicroelectronics
  • NXP Semiconductors
  • On Semiconductor Corporation
  • Infineon Technologies
  • Microchip Technology

Wireless Connectivity Chipset Market Insights

Lucintel forecasts that Wi-Fi standalone will remain the largest segment over the forecast period growing digitalization across various industries, as well as, growing adoption of digital technology in order to maintain competitiveness, boost productivity, and provide superior customer experiences.

APAC is expected to witness highest growth over the forecast period because of growing demand for internet services, rising 5G smartphone availability and cost, as well as the quick uptake of smartphones in both urban and rural locations in the region.

Features of the Global Wireless Connectivity Chipset Market

Market Size Estimates: Wireless connectivity chipset market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Wireless connectivity chipset market size by type, end use, and region in terms of value ($B).

Regional Analysis: Wireless connectivity chipset market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, end use, and regions for the wireless connectivity chipset market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the wireless connectivity chipset market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the wireless connectivity chipset market size?

Answer: The global wireless connectivity chipset market is expected to reach an estimated $12.8 billion by 2030.

Q.2 What is the growth forecast for wireless connectivity chipset market?

Answer: The global wireless connectivity chipset market is expected to grow with a CAGR of 7.8% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the wireless connectivity chipset market?

Answer: The major drivers for this market are growing penetration of high-speed internet, increasing demands for connectivity in the automobile industry and the growing popularity of smart home automation, along with the advancement of wireless network technologies.

Q4. What are the major segments for wireless connectivity chipset market?

Answer: The future of the global wireless connectivity chipset market looks promising with opportunities in the consumer, enterprise, mobile handsets, automotive, and industrial markets.

Q5. Who are the key wireless connectivity chipset market companies?

Answer: Some of the key wireless connectivity chipset companies are as follows.

  • Broadcom
  • Qualcomm Incorporated
  • Mediatek
  • Intel Corporation
  • Texas Instruments Incorporated
  • STMicroelectronics
  • NXP Semiconductors
  • On Semiconductor Corporation
  • Infineon Technologies
  • Microchip Technology

Q6. Which wireless connectivity chipset market segment will be the largest in future?

Answer: Lucintel forecasts that Wi-Fi standalone will remain the largest segment over the forecast period growing digitalization across various industries, as well as, growing adoption of digital technology in order to maintain competitiveness, boost productivity, and provide superior customer experiences.

Q7. In wireless connectivity chipset market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period because of growing demand for internet services, rising 5G smartphone availability and cost, as well as the quick uptake of smartphones in both urban and rural locations in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the wireless connectivity chipset market by type (Wi-Fi standalone, bluetooth standalone, Wi-Fi and bluetooth combo, low-power wireless IC), end use (consumer, enterprise, mobile handsets, automotive, industrial, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Wireless Connectivity Chipset Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Wireless Connectivity Chipset Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Wireless Connectivity Chipset Market by Type
    • 3.3.1: Wi-Fi Standalone
    • 3.3.2: Bluetooth Standalone
    • 3.3.3: Wi-Fi and Bluetooth Combo
    • 3.3.4: Low-power Wireless IC
  • 3.4: Global Wireless Connectivity Chipset Market by End Use
    • 3.4.1: Consumer
    • 3.4.2: Enterprise
    • 3.4.3: Mobile Handsets
    • 3.4.4: Automotive
    • 3.4.5: Industrial
    • 3.4.6: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Wireless Connectivity Chipset Market by Region
  • 4.2: North American Wireless Connectivity Chipset Market
    • 4.2.2: North American Wireless Connectivity Chipset Market by End Use: Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, and Others
  • 4.3: European Wireless Connectivity Chipset Market
    • 4.3.1: European Wireless Connectivity Chipset Market by Type: Wi-Fi Standalone, Bluetooth Standalone, Wi-Fi and Bluetooth Combo, and Low-power Wireless IC
    • 4.3.2: European Wireless Connectivity Chipset Market by End Use: Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, and Others
  • 4.4: APAC Wireless Connectivity Chipset Market
    • 4.4.1: APAC Wireless Connectivity Chipset Market by Type: Wi-Fi Standalone, Bluetooth Standalone, Wi-Fi and Bluetooth Combo, and Low-power Wireless IC
    • 4.4.2: APAC Wireless Connectivity Chipset Market by End Use: Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, and Others
  • 4.5: ROW Wireless Connectivity Chipset Market
    • 4.5.1: ROW Wireless Connectivity Chipset Market by Type: Wi-Fi Standalone, Bluetooth Standalone, Wi-Fi and Bluetooth Combo, and Low-power Wireless IC
    • 4.5.2: ROW Wireless Connectivity Chipset Market by End Use: Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Wireless Connectivity Chipset Market by Type
    • 6.1.2: Growth Opportunities for the Global Wireless Connectivity Chipset Market by End Use
    • 6.1.3: Growth Opportunities for the Global Wireless Connectivity Chipset Market by Region
  • 6.2: Emerging Trends in the Global Wireless Connectivity Chipset Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Wireless Connectivity Chipset Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Wireless Connectivity Chipset Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Broadcom
  • 7.2: Qualcomm Incorporated
  • 7.3: Mediatek
  • 7.4: Intel Corporation
  • 7.5: Texas Instruments Incorporated
  • 7.6: STMicroelectronics
  • 7.7: NXP Semiconductors
  • 7.8: On Semiconductor Corporation
  • 7.9: Infineon Technologies
  • 7.10: Microchip Technology