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全球半导体製造设备市场：按前端设备、按后端设备、按产品类型、按尺寸、按供应链参与者、按地区 - 预测至 2029 年
市场调查报告书
商品编码
1573609

全球半导体製造设备市场：按前端设备、按后端设备、按产品类型、按尺寸、按供应链参与者、按地区 - 预测至 2029 年

Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP, Deposition, Wafer Cleaning, Assembly & Packaging, Dicing, Bonding, Metrology, Wafer/IC Testing, Logic, Memory, MPU, Discrete - Global Forecast to 2029
出版日期: | 出版商: MarketsandMarkets | 英文 304 Pages | 订单完成后即时交付

价格

半导体製造设备市场规模预计将从 2024 年的 1,092.4 亿美元增至 2029 年的 1,550.9 亿美元，预测期内复合年增长率为 7.3%。

推动市场成长的主要因素是半导体製造设备的扩张、汽车半导体市场的快速成长以及对先进高效晶片的需求不断增加。此外，先进封装技术的进步和政府对国内半导体产业的支持力度加大，为市场参与企业提供了新的成长途径。晶圆厂中心的大规模扩张、对云端运算兴起的依赖以及电动和联网汽车的重新配置正在塑造半导体製造设备市场。所有这一切都得到了节能製造的进步、先进的半导体製造设备以及来自更小晶片的更大压力的支持。这刺激了技术创新和生产规模的扩大，导致其他行业更多地使用半导体製造设备。

调查范围
调查年份 2020-2029
基准年 2023年
预测期 2024-2029
考虑单位 金额（十亿美元）
按细分市场 按前端设备、按后端设备、按产品类型、按尺寸、按供应链参与者、按地区
目标区域 北美、欧洲、亚太等地区

EUV技术的进步以及应对挑战而加大对高精度设备的投资是微影术领域在半导体製造设备前端设备市场中占据重要份额的主要驱动力。微影术是一种主要的半导体製造工艺，涉及以高分辨率在硅晶圆上图形化微小电路图案。此製程使用光或电子束来模拟极小的特征，以将 IC 布局放置在晶圆表面上。这项技术的进步，特别是 EUV微影术，为製造更小、更高性能的晶片提供了一条途径。 ASML（荷兰）等公司使用 EUV微影术。这是一种使用较短波长光的工艺，可以产生小至 5 奈米的特征。

由于对精密半导体元件的需求不断增加以及对高产量比率和生产效率的製程的需求不断增加，预计半导体製造设备市场的键结部分将成长最快。需要键合设备来在半导体晶粒与其封装或基板之间形成电互连，以便半导体元件能够发挥作用。常用的技术包括引线接合法、球键合和焊料凸块键结。正确的键合技术可以对半导体製造流程的性能或成本效率产生巨大的影响。先进半导体封装技术的进步以及对经济高效且可靠的汽车和消费性电子元件的需求正在推动对键合设备的需求。

本报告调查了全球半导体製造设备市场，包括前端设备、后端设备、产品类型、尺寸、供应链参与者、区域趋势以及进入市场的公司概况等趋势。

目录

第一章简介

第二章调查方法

第三章执行摘要

第 4 章重要考察

第五章市场概况

  • 介绍
  • 市场动态
  • 价值链分析
  • 生态系分析
  • 投资金筹措场景
  • 影响客户业务的趋势和颠覆
  • 技术分析
  • 价格分析
  • 主要相关人员和采购标准
  • 波特五力分析
  • 案例研究分析
  • 贸易分析
  • 专利分析
  • 监管状况
  • 2024-2025年重大会议和活动
  • 人工智慧/生成人工智慧对半导体製造设备市场的影响
  • 参与企业的製造设备中使用的连接器

第六章 半导体製造设备市场（依前端设备分）

  • 介绍
  • 微影术
  • 晶圆表面处理
  • 晶圆清洗
  • 沉积
  • 其他的

第七章 半导体製造设备市场（依后端设备）

  • 介绍
  • 组装/包装
  • 切丁
  • 测量
  • 黏合
  • 晶圆测试/IC测试

第8章 半导体製造设备中使用的Fab设备

  • 介绍
  • 自动化
  • 化学品
  • 气体控制
  • 其他的

第九章半导体製造设备市场（依产品类型）

  • 介绍
  • 记忆
  • 逻辑
  • MPU
  • 离散的
  • 模拟
  • 其他的

第十章 半导体製造设备市场（分维度）

  • 介绍
  • 二维ICS
  • 2.5D ICS
  • 3D ICS

第十一章 半导体製造设备市场（依供应链参与企业划分）

  • 介绍
  • 铸造厂
  • IDM公司
  • 封测公司

第十二章 半导体製造设备市场（分地区）

  • 介绍
  • 美洲
  • 欧洲、中东和非洲 (EMEA)
  • 亚太地区

第十三章竞争格局

  • 概述
  • 主要参与企业的策略/秘密，2020-2024
  • 2023 年市场占有率分析
  • 2019-2023年收益分析
  • 企业价值评估及财务指标
  • 企业评估矩阵：主要参与企业，2023
  • 企业评估矩阵：Start-Ups/小型企业，2023 年
  • 品牌/产品比较
  • 竞争格局及趋势
  • 前 5 名付款人的设施概览

第十四章 公司简介

  • 介绍
  • 主要参与企业
    • APPLIED MATERIALS, INC.
    • ASML
    • TOKYO ELECTRON LIMITED
    • LAM RESEARCH CORPORATION
    • KLA CORPORATION
    • SCREEN HOLDINGS CO., LTD.
    • TERADYNE, INC.
    • ADVANTEST CORPORATION
    • HITACHI HIGH-TECH CORPORATION
    • PLASMA-THERM
  • 其他公司
    • ASM INTERNATIONAL NV
    • EV GROUP（EVG）
    • ONTO INNOVATION
    • NORDSON CORPORATION
    • ADT
    • BENEQ
    • CVD EQUIPMENT CORPORATION
    • EUGENE TECHNOLOGY CO. LTD.
    • NIKON CORPORATION
    • SEMICONDUCTOR EQUIPMENT CORP.
    • SENTECH INSTRUMENTS GMBH
    • CANON INC.
    • KOKUSAI ELECTRIC CORPORATION
    • SEMES
    • FORMFACTOR

第十五章附录

Product Code: SE 5344

The semiconductor manufacturing equipment market is projected to reach USD 155.09 billion by 2029 from USD 109.24 billion in 2024 at a CAGR of 7.3% during the forecast period. The major factors driving the growth of the market are expansion of semiconductor fabrication facilities, surge in automotive semiconductor market, and increasing demand for advanced and efficient chips. Further, advancements in advanced packaging technologies and increasing government support for domestic semiconductor industry are some new growth avenues for market participants. Large-scale expansions within fab centers, the dependence of rising cloud computing and change to electric, connected vehicle configurations make up the semiconductor manufacturing equipment market. All this is backed by much energy-efficient manufacture, advance regarding advanced semiconductor manufacturing facilities, and more pressure from smaller chips. It inspires innovation and scaling of production, resulting in increased usage of semiconductor manufacturing equipment in other industries as well.

Scope of the Report
Years Considered for the Study2020-2029
Base Year2023
Forecast Period2024-2029
Units ConsideredValue (USD Billion)
SegmentsBy Front-end Equipment, Back-end Equipment, Product Type, Dimension, Supply Chain Participants, and Region
Regions coveredNorth America, Europe, APAC, RoW

"Lithography to register the largest market share in semiconductor manufacturing front-end equipment segment during the forecast period."

Advances in EUV technology and increasing investment in high-precision equipment for handling the challenges will be key drivers of the lithography segment in the front-end equipment market of semiconductor manufacturing equipment, accounting for a significant share. Lithography is one of the principal semiconductor fabrication processes of patterning intricate circuit patterns at microscopic resolution on silicon wafers. This step places the IC layout onto the surface of the wafer with light or electron beams imitating extremely minute features. Advances in the technology, most specifically in EUV lithography, provide a pathway to fabricate chips that are smaller and more powerful. Companies such as ASML (Netherlands) use EUV lithography, a process employing shorter wavelengths of light to fabricate features down to 5nm.

"Bonding to account for the highest CAGR in back-end equipment segment during the forecast period."

The bonding segment of the semiconductor manufacturing equipment market is expected to grow the most due to the increasing requirement for the precise semiconductor devices and for the processes of high yield and efficiency of production. Bonding equipment is needed in the formation of electrical interconnections between semiconductor dies and their packages or substrates so that semiconductor devices can function. Some generally used techniques include wire bonding, ball bonding, and solder bump bonding. The right bonding technology will make all the difference in either performance or cost-effectiveness in the semiconductor manufacturing process. Growth in the development of advanced semiconductor packaging technology and demand for cost-effective, high-reliability automotive and consumer-electronics components are driving demand for bonding equipment.

"Asia Pacific to register the fastest growth during the forecast period."

The highest CAGR is expected to be registered in the Asia Pacific region, which has the highest presence of leading semiconductor manufacturing equipment providers in key countries such as China, Japan, Taiwan, and South Korea, that ascertain dominance in semiconductor production and innovation in this region. The region has advanced production capabilities and a substantial consumer electronics sector. In addition, the growing government initiatives, the relentless advances in technology, and the substantial investments of local and international players. The increasing semiconductor need across consumer electronics, automotive, and telecommunications contribute to increasing growth. The concentration on innovative culture and infrastructure development is also a driving factor in the region's competitive position in the global market. The high growth is attributed to technological advancements in artificial intelligence (Al), Internet of Things (IoT), and 5G. The region is characterized with the robust manufacturing of consumer electronics and high demand for electronic appliances and electric vehicles, which basically calls for a huge need for a reliable as well as performance semiconductor manufacturing equipment.

The break-up of the profile of primary participants in the semiconductor manufacturing equipment market-

  • By Company Type: Tier 1 - 25%, Tier 2 - 35%, Tier 3 - 40%
  • By Designation Type: C Level - 40%, Director Level - 30%, Others - 30%
  • By Region Type: Asia Pacific - 45%, Americas - 35%, Europe, Middle East & Africa - 20%

The major players in the semiconductor manufacturing equipment market with a significant global presence include Applied Materials, Inc. (US), ASML (Netherlands), Tokyo Electron Limited (Japan), Lam Research Corporation (US), KLA Corporation (US), and others.

Research Coverage

The report segments the semiconductor manufacturing equipment market and forecasts its size by front-end equipment, back-end equipment, product type, dimension, supply chain participant, and region. It also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing market growth. The report covers qualitative aspects in addition to quantitative aspects of the market.

Reasons to buy the report:

The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall semiconductor manufacturing equipment market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, opportunities, and challenges.

The report provides insights on the following pointers:

  • Analysis of key drivers (expansion of semiconductor fabrication facilities, surge in automotive semiconductor market, and increased demand for advanced and efficient chips), restraints (high capital investment requirements and complexity of manufacturing processes), opportunities (expansion of advanced packaging technologies and government support for domestic semiconductor industry), and challenges (rapid pace of technological advancements and environmental and regulatory compliance in manufacturing)
  • Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new solution and service launches in the semiconductor manufacturing equipment market.
  • Market Development: Comprehensive information about lucrative markets - the report analyses the semiconductor manufacturing equipment market across varied regions.
  • Market Diversification: Exhaustive information about new solutions and services, untapped geographies, recent developments, and investments in the semiconductor manufacturing equipment market.
  • Competitive Assessment: In-depth assessment of market shares, growth strategies, and solution and service offerings of leading players, including Applied Materials, Inc. (US), ASML (Netherlands), Tokyo Electron Limited (Japan), Lam Research Corporation (US), and KLA Corporation (US).

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 STUDY OBJECTIVES
  • 1.2 MARKET DEFINITION
    • 1.2.1 INCLUSIONS AND EXCLUSIONS
  • 1.3 STUDY SCOPE
    • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
    • 1.3.2 YEARS CONSIDERED
  • 1.4 CURRENCY CONSIDERED
  • 1.5 UNIT CONSIDERED
  • 1.6 STAKEHOLDERS

2 RESEARCH METHODOLOGY

  • 2.1 RESEARCH DATA
    • 2.1.1 SECONDARY DATA
      • 2.1.1.1 Secondary sources
      • 2.1.1.2 Key data from secondary sources
    • 2.1.2 PRIMARY DATA
      • 2.1.2.1 List of primary participants
      • 2.1.2.2 Breakdown of primary interviews
      • 2.1.2.3 Key data from primary sources
    • 2.1.3 SECONDARY AND PRIMARY RESEARCH
      • 2.1.3.1 Key industry insights
  • 2.2 MARKET SIZE ESTIMATION
    • 2.2.1 BOTTOM-UP APPROACH
    • 2.2.2 TOP-DOWN APPROACH
  • 2.3 FACTOR ANALYSIS
    • 2.3.1 DEMAND-SIDE ANALYSIS
    • 2.3.2 SUPPLY-SIDE ANALYSIS
  • 2.4 DATA TRIANGULATION
  • 2.5 RESEARCH ASSUMPTIONS
  • 2.6 RESEARCH LIMITATIONS
  • 2.7 RISK ASSESSMENT

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

  • 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • 4.2 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT
  • 4.3 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT
  • 4.4 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE
  • 4.5 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION
  • 4.6 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT
  • 4.7 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION
  • 4.8 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY

5 MARKET OVERVIEW

  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    • 5.2.1 DRIVERS
      • 5.2.1.1 Expansion of semiconductor fabrication facilities
      • 5.2.1.2 Surge in automotive semiconductor market
      • 5.2.1.3 Increasing demand for advanced and efficient chips
    • 5.2.2 RESTRAINTS
      • 5.2.2.1 High capital investment requirements
      • 5.2.2.2 Complexity of manufacturing processes
    • 5.2.3 OPPORTUNITIES
      • 5.2.3.1 Expansion of advanced packaging technologies
      • 5.2.3.2 Government support for domestic semiconductor industry
    • 5.2.4 CHALLENGES
      • 5.2.4.1 Rapid pace of technological advancements
      • 5.2.4.2 Environmental and regulatory compliance in manufacturing
  • 5.3 VALUE CHAIN ANALYSIS
  • 5.4 ECOSYSTEM ANALYSIS
  • 5.5 INVESTMENT AND FUNDING SCENARIO
  • 5.6 TRENDS AND DISRUPTIONS IMPACTING CUSTOMER BUSINESS
  • 5.7 TECHNOLOGY ANALYSIS
    • 5.7.1 KEY TECHNOLOGIES
      • 5.7.1.1 Wafer Bonding
    • 5.7.2 COMPLEMENTARY TECHNOLOGIES
      • 5.7.2.1 Flip Chip
    • 5.7.3 ADJACENT TECHNOLOGIES
      • 5.7.3.1 3D Stacking
  • 5.8 PRICING ANALYSIS
    • 5.8.1 AVERAGE SELLING PRICE OF PRODUCTS OFFERED BY KEY PLAYERS
    • 5.8.2 AVERAGE SELLING PRICE, BY REGION
  • 5.9 KEY STAKEHOLDERS AND BUYING CRITERIA
    • 5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
    • 5.9.2 BUYING CRITERIA
  • 5.10 PORTER'S FIVE FORCES ANALYSIS
    • 5.10.1 THREAT OF NEW ENTRANTS
    • 5.10.2 THREAT OF SUBSTITUTES
    • 5.10.3 BARGAINING POWER OF SUPPLIERS
    • 5.10.4 BARGAINING POWER OF BUYERS
    • 5.10.5 INTENSITY OF COMPETITIVE RIVALRY
  • 5.11 CASE STUDY ANALYSIS
    • 5.11.1 ENHANCING LED MANUFACTURING THROUGH ELMO'S ADVANCED MOTION CONTROL SOLUTIONS
    • 5.11.2 SYNOVA SA ADDRESSES CHALLENGES AND SOLUTIONS IN ADVANCED DIE SINGULATION AND WAFER DICING WITH LMJ TECHNOLOGY
    • 5.11.3 OPTIMIZING PHOTORESISTS FOR ADVANCED LITHOGRAPHY TECHNIQUES
  • 5.12 TRADE ANALYSIS
    • 5.12.1 IMPORT SCENARIO (HS CODE 848620)
    • 5.12.2 EXPORT SCENARIO (HS CODE 848620)
  • 5.13 PATENT ANALYSIS
  • 5.14 REGULATORY LANDSCAPE
    • 5.14.1 STANDARDS
      • 5.14.1.1 47 CFR 15
      • 5.14.1.2 NAICS code 334413
      • 5.14.1.3 29 CFR 1910
      • 5.14.1.4 SEMI E6, E76, F5, F14, S6, S1, S10, S12, S13, S14, S18, and S22
      • 5.14.1.5 IEC 60204-33:2009
  • 5.15 KEY CONFERENCES AND EVENTS, 2024-2025
  • 5.16 IMPACT OF AI/GEN AI ON SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • 5.17 CONNECTORS USED IN MANUFACTURING FACILITIES OF SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET PLAYERS
    • 5.17.1 METRIC CIRCULAR
    • 5.17.2 CPC, RECTANGULAR
    • 5.17.3 D-SUB
    • 5.17.4 OVERMOLDED ASSEMBLIES
    • 5.17.5 CABLE HARNESS
    • 5.17.6 OTHER DEVICES

6 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT

  • 6.1 INTRODUCTION
  • 6.2 LITHOGRAPHY
    • 6.2.1 PHOTOLITHOGRAPHY
      • 6.2.1.1 Deep ultraviolet (DUV) lithography
      • 6.2.1.2 Extreme ultraviolet (EUV) lithography
    • 6.2.2 ELECTRON BEAM LITHOGRAPHY
    • 6.2.3 ION BEAM LITHOGRAPHY
    • 6.2.4 NANOIMPRINT LITHOGRAPHY
    • 6.2.5 OTHERS
  • 6.3 WAFER SURFACE CONDITIONING
    • 6.3.1 ETCHING
      • 6.3.1.1 Advancements in dry etching technologies to drive market growth
    • 6.3.2 CHEMICAL MECHANICAL PLANARIZATION (CMP)
      • 6.3.2.1 Demand for high-performance devices driving market growth
  • 6.4 WAFER CLEANING
    • 6.4.1 DEMAND FOR HIGH-PERFORMANCE AND RELIABLE SEMICONDUCTOR DEVICES TO FUEL MARKET GROWTH
  • 6.5 DEPOSITION
    • 6.5.1 ADVANCEMENTS IN DEPOSITION PROCESSES TO DRIVE MARKET GROWTH
  • 6.6 OTHER FRONT-END EQUIPMENT

7 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT

  • 7.1 INTRODUCTION
  • 7.2 ASSEMBLY & PACKAGING
    • 7.2.1 ADVANCEMENTS IN PACKAGING TECHNOLOGIES TO DRIVE MARKET GROWTH
  • 7.3 DICING
    • 7.3.1 INCREASING NEED FOR HIGH-PRECESSION SEMICONDUCTOR DEVICES TO SPUR MARKET DEMAND
  • 7.4 METROLOGY
    • 7.4.1 NEED FOR PRECISION MEASUREMENT AND ADVANCED DETECTION TO FUEL MARKET GROWTH
  • 7.5 BONDING
    • 7.5.1 RISING DEMAND FOR ADVANCED SEMICONDUCTOR PACKAGING TECHNOLOGY TO DRIVE MARKET GROWTH
  • 7.6 WAFER TESTING/IC TESTING
    • 7.6.1 ADVANCEMENTS IN TESTING TECHNOLOGIES BOOSTING SEMICONDUCTOR RELIABILITY AND MARKET GROWTH

8 FAB FACILITY EQUIPMENT USED IN SEMICONDUCTOR MANUFACTURING EQUIPMENT

  • 8.1 INTRODUCTION
  • 8.2 AUTOMATION
  • 8.3 CHEMICAL
  • 8.4 GAS CONTROL
  • 8.5 OTHER FAB FACILITY EQUIPMENT

9 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE

  • 9.1 INTRODUCTION
  • 9.2 MEMORY
    • 9.2.1 RISING DEMAND FOR HIGH-CAPACITY STORAGE AND ADVANCED PACKAGING TO ACCELERATE MARKET GROWTH
  • 9.3 LOGIC
    • 9.3.1 DEMAND FOR HIGH-PERFORMANCE COMPUTING TO DRIVE MARKET GROWTH
  • 9.4 MPU
    • 9.4.1 ADVANCEMENTS IN CLOUD COMPUTING AND EDGE COMPUTING TECHNOLOGIES TO DRIVE MARKET GROWTH
  • 9.5 DISCRETE
    • 9.5.1 RISING DEMAND FOR DISCRETE DEVICES IN AUTOMOTIVE AND ENERGY SECTORS TO DRIVE MARKET GROWTH
  • 9.6 ANALOG
    • 9.6.1 RISING ADOPTION OF IOT DEVICES TO FUEL MARKET GROWTH
  • 9.7 OTHERS
    • 9.7.1 SENSORS
      • 9.7.1.1 Increased adoption of interconnected devices to drive market growth
    • 9.7.2 OPTOELECTRONIC COMPONENTS
      • 9.7.2.1 Adoption of advanced display technologies to fuel market growth

10 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION

  • 10.1 INTRODUCTION
  • 10.2 2D ICS
    • 10.2.1 HIGH-DENSITY INTEGRATION IN CONSUMER ELECTRONICS TO FOSTER MARKET GROWTH
  • 10.3 2.5D ICS
    • 10.3.1 NEED FOR COST-EFFECTIVE, HIGH-PERFORMANCE SOLUTIONS TO SPUR MARKET DEMAND
  • 10.4 3D ICS
    • 10.4.1 NEED FOR INTEGRATING DIVERSE FUNCTIONALITIES IN COMPACT FORM FACTOR TO FUEL MARKET GROWTH

11 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT

  • 11.1 INTRODUCTION
  • 11.2 FOUNDRIES
    • 11.2.1 RISING DEMAND FOR ADVANCED SEMICONDUCTORS AND COST-EFFECTIVE MANUFACTURING TO DRIVE FOUNDRY GROWTH
  • 11.3 IDM FIRMS
    • 11.3.1 VERTICAL INTEGRATION AND ADVANCED MANUFACTURING CAPABILITIES TO DRIVE MARKET GROWTH
  • 11.4 OSAT COMPANIES
    • 11.4.1 ADVANCEMENTS IN PACKAGING TECHNOLOGIES AND OUTSOURCING TO FUEL MARKET GROWTH

12 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION

  • 12.1 INTRODUCTION
  • 12.2 AMERICAS
    • 12.2.1 MACROECONOMIC OUTLOOK FOR NORTH AMERICA
    • 12.2.2 US
      • 12.2.2.1 Government initiatives and adoption of advanced technologies to accelerate market growth
    • 12.2.3 CANADA
      • 12.2.3.1 Strategic innovation and collaboration to create growth opportunities
    • 12.2.4 REST OF AMERICAS
      • 12.2.4.1 Technological advancements in emerging economies to boost market growth
  • 12.3 EUROPE, MIDDLE EAST & AFRICA (EMEA)
    • 12.3.1 MACROECONOMIC OUTLOOK FOR EMEA
    • 12.3.2 GERMANY
      • 12.3.2.1 Advanced technological infrastructure and Industry 4.0 to support market growth
    • 12.3.3 UK
      • 12.3.3.1 Strategic innovation and investment to propel market growth
    • 12.3.4 IRELAND
      • 12.3.4.1 Presence of fabrication facilities to contribute to market growth
    • 12.3.5 FRANCE
      • 12.3.5.1 Strong R&D focus and government initiatives to contribute to market growth
    • 12.3.6 ITALY
      • 12.3.6.1 Rising demand in automotive, consumer electronics, and industrial sectors to drive market
    • 12.3.7 NETHERLANDS
      • 12.3.7.1 Strategic R&D investments to propel market growth
    • 12.3.8 REST OF EMEA
  • 12.4 ASIA PACIFIC
    • 12.4.1 MACROECONOMIC OUTLOOK FOR ASIA PACIFIC
    • 12.4.2 CHINA
      • 12.4.2.1 Advanced manufacturing capabilities and supportive environment for innovation to accelerate market growth
    • 12.4.3 JAPAN
      • 12.4.3.1 Demand for advanced semiconductor manufacturing technologies in automotive sector to augment market growth
    • 12.4.4 SOUTH KOREA
      • 12.4.4.1 Strong manufacturing capabilities of major companies to create opportunities
    • 12.4.5 TAIWAN
      • 12.4.5.1 Investments in advanced manufacturing technologies to fuel market growth
    • 12.4.6 REST OF ASIA PACIFIC

13 COMPETITIVE LANDSCAPE

  • 13.1 OVERVIEW
  • 13.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2020-2024
  • 13.3 MARKET SHARE ANALYSIS, 2023
  • 13.4 REVENUE ANALYSIS, 2019-2023
  • 13.5 COMPANY VALUATION AND FINANCIAL METRICS
  • 13.6 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023
    • 13.6.1 STARS
    • 13.6.2 EMERGING LEADERS
    • 13.6.3 PERVASIVE PLAYERS
    • 13.6.4 PARTICIPANTS
    • 13.6.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023
      • 13.6.5.1 Company footprint
      • 13.6.5.2 Front-end equipment footprint
      • 13.6.5.3 Back-end equipment footprint
      • 13.6.5.4 Product type footprint
      • 13.6.5.5 Dimension footprint
      • 13.6.5.6 Supply chain participant footprint
      • 13.6.5.7 Region footprint
  • 13.7 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023
    • 13.7.1 PROGRESSIVE COMPANIES
    • 13.7.2 RESPONSIVE COMPANIES
    • 13.7.3 DYNAMIC COMPANIES
    • 13.7.4 STARTING BLOCKS
    • 13.7.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2023
      • 13.7.5.1 List of startups/SMEs
      • 13.7.5.2 Competitive benchmarking of startups/SMEs
  • 13.8 BRAND/PRODUCT COMPARISON
  • 13.9 COMPETITIVE SCENARIO AND TRENDS
    • 13.9.1 PRODUCT LAUNCHES
    • 13.9.2 DEALS
    • 13.9.3 EXPANSIONS
  • 13.10 FACILITY OVERVIEW OF TOP 5 PAYERS

14 COMPANY PROFILES

  • 14.1 INTRODUCTION
  • 14.2 KEY PLAYERS
    • 14.2.1 APPLIED MATERIALS, INC.
      • 14.2.1.1 Business overview
      • 14.2.1.2 Products/Solutions/Services offered
      • 14.2.1.3 Recent developments
        • 14.2.1.3.1 Product/Service launches
        • 14.2.1.3.2 Deals
        • 14.2.1.3.3 Expansions
      • 14.2.1.4 MnM view
        • 14.2.1.4.1 Key strengths/Right to win
        • 14.2.1.4.2 Strategic choices
        • 14.2.1.4.3 Weaknesses and competitive threats
    • 14.2.2 ASML
      • 14.2.2.1 Business overview
      • 14.2.2.2 Products/Solutions/Services offered
      • 14.2.2.3 Recent developments
        • 14.2.2.3.1 Product/Solution/Service launches
        • 14.2.2.3.2 Deals
        • 14.2.2.3.3 Expansions
      • 14.2.2.4 MnM view
        • 14.2.2.4.1 Key strengths/Right to win
        • 14.2.2.4.2 Strategic choices
        • 14.2.2.4.3 Weaknesses and competitive threats
    • 14.2.3 TOKYO ELECTRON LIMITED
      • 14.2.3.1 Business overview
      • 14.2.3.2 Products/Solutions/Services offered
      • 14.2.3.3 Recent developments
        • 14.2.3.3.1 Product/Solution/Service launches
        • 14.2.3.3.2 Deals
        • 14.2.3.3.3 Expansions
      • 14.2.3.4 MnM view
        • 14.2.3.4.1 Key strengths/Right to win
        • 14.2.3.4.2 Strategic Choices
        • 14.2.3.4.3 Weaknesses and competitive threats
    • 14.2.4 LAM RESEARCH CORPORATION
      • 14.2.4.1 Business overview
      • 14.2.4.2 Products/Solutions/Services offered
      • 14.2.4.3 Recent developments
        • 14.2.4.3.1 Product/Solution/Service launches
        • 14.2.4.3.2 Deals
        • 14.2.4.3.3 Expansions
      • 14.2.4.4 MnM view
        • 14.2.4.4.1 Key strengths/Right to win
        • 14.2.4.4.2 Strategic choices
        • 14.2.4.4.3 Weaknesses and competitive threats
    • 14.2.5 KLA CORPORATION
      • 14.2.5.1 Business overview
      • 14.2.5.2 Products/Solutions/Services offered
      • 14.2.5.3 Recent developments
        • 14.2.5.3.1 Product/Service launches
        • 14.2.5.3.2 Expansions
      • 14.2.5.4 MnM view
        • 14.2.5.4.1 Key strengths/Right to win
        • 14.2.5.4.2 Strategic choices
        • 14.2.5.4.3 Weaknesses and competitive threats
    • 14.2.6 SCREEN HOLDINGS CO., LTD.
      • 14.2.6.1 Business overview
      • 14.2.6.2 Products/Solutions/Services offered
      • 14.2.6.3 Recent developments
        • 14.2.6.3.1 Product/Service launches
        • 14.2.6.3.2 Deals
        • 14.2.6.3.3 Expansions
    • 14.2.7 TERADYNE, INC.
      • 14.2.7.1 Business overview
      • 14.2.7.2 Products/Solutions/Services offered
      • 14.2.7.3 Recent developments
        • 14.2.7.3.1 Product/Service launches
        • 14.2.7.3.2 Deals
    • 14.2.8 ADVANTEST CORPORATION
      • 14.2.8.1 Business overview
      • 14.2.8.2 Products/Solutions/Services offered
      • 14.2.8.3 Recent developments
        • 14.2.8.3.1 Product/Service launches
        • 14.2.8.3.2 Deals
    • 14.2.9 HITACHI HIGH-TECH CORPORATION
      • 14.2.9.1 Business overview
      • 14.2.9.2 Products/Solutions/Services offered
      • 14.2.9.3 Recent developments
        • 14.2.9.3.1 Product/Service launches
        • 14.2.9.3.2 Deals
        • 14.2.9.3.3 Expansions
    • 14.2.10 PLASMA-THERM
      • 14.2.10.1 Business overview
      • 14.2.10.2 Products/Solutions/Services offered
      • 14.2.10.3 Recent developments
        • 14.2.10.3.1 Product/Service launches
        • 14.2.10.3.2 Deals
        • 14.2.10.3.3 Expansions
  • 14.3 OTHER PLAYERS
    • 14.3.1 ASM INTERNATIONAL N.V.
    • 14.3.2 EV GROUP (EVG)
    • 14.3.3 ONTO INNOVATION
    • 14.3.4 NORDSON CORPORATION
    • 14.3.5 ADT
    • 14.3.6 BENEQ
    • 14.3.7 CVD EQUIPMENT CORPORATION
    • 14.3.8 EUGENE TECHNOLOGY CO. LTD.
    • 14.3.9 NIKON CORPORATION
    • 14.3.10 SEMICONDUCTOR EQUIPMENT CORP.
    • 14.3.11 SENTECH INSTRUMENTS GMBH
    • 14.3.12 CANON INC.
    • 14.3.13 KOKUSAI ELECTRIC CORPORATION
    • 14.3.14 SEMES
    • 14.3.15 FORMFACTOR

15 APPENDIX

  • 15.1 INSIGHTS FROM INDUSTRY EXPERTS
  • 15.2 DISCUSSION GUIDE
  • 15.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 15.4 CUSTOMIZATION OPTIONS
  • 15.5 RELATED REPORTS
  • 15.6 AUTHOR DETAILS

List of Tables

  • TABLE 1 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: RESEARCH ASSUMPTIONS
  • TABLE 2 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: RISK ASSESSMENT
  • TABLE 3 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: ROLE OF COMPANIES IN ECOSYSTEM
  • TABLE 4 AVERAGE SELLING PRICE OF LITHOGRAPHY EQUIPMENT OFFERED BY KEY PLAYERS, 2020-2023 (USD MILLION)
  • TABLE 5 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY SUPPLY CHAIN PARTICIPANT (%)
  • TABLE 6 KEY BUYING CRITERIA, BY SUPPLY CHAIN PARTICIPANT
  • TABLE 7 IMPACT OF PORTER'S FIVE FORCES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • TABLE 8 IMPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS, BY COUNTRY, 2019-2023 (USD MILLION)
  • TABLE 9 EXPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS, BY COUNTRY, 2019-2023 (USD MILLION)
  • TABLE 10 LIST OF MAJOR PATENT, 2021-2023
  • TABLE 11 AMERICAS: LIST OF REGULATIONS BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 12 EMEA: LIST OF REGULATIONS BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 13 ASIA PACIFIC: LIST OF REGULATIONS BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 14 KEY CONFERENCES AND EVENTS, 2024-2025
  • TABLE 15 FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, 2020-2023 (USD MILLION)
  • TABLE 16 FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, 2024-2029 (USD MILLION)
  • TABLE 17 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT, 2020-2023 (USD MILLION)
  • TABLE 18 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT, 2024-2029 (USD MILLION)
  • TABLE 19 FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 20 FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • TABLE 21 FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 22 FRONT-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 23 LITHOGRAPHY: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, 2020-2023 (UNITS)
  • TABLE 24 LITHOGRAPHY: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, 2024-2029 (UNITS)
  • TABLE 25 LITHOGRAPHY: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2020-2023 (UNITS)
  • TABLE 26 LITHOGRAPHY: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2024-2029 (UNITS)
  • TABLE 27 LITHOGRAPHY: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (UNITS)
  • TABLE 28 LITHOGRAPHY: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (UNITS)
  • TABLE 29 WAFER SURFACE CONDITIONING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, 2020-2023 (USD MILLION)
  • TABLE 30 WAFER SURFACE CONDITIONING: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, 2024-2029 (USD MILLION)
  • TABLE 31 BACK-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, 2020-2023 (USD MILLION)
  • TABLE 32 BACK-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, 2024-2029 (USD MILLION)
  • TABLE 33 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT, 2020-2023 (USD MILLION)
  • TABLE 34 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT, 2024-2029 (USD MILLION)
  • TABLE 35 BACK-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 36 BACK-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • TABLE 37 BACK-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 38 BACK-END EQUIPMENT: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 39 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 40 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • TABLE 41 MEMORY: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 42 MEMORY: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 43 MEMORY: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 44 MEMORY: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 45 LOGIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 46 LOGIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 47 LOGIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 48 LOGIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 49 MPU: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 50 MPU: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 51 MPU: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 52 MPU: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 53 DISCRETE: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 54 DISCRETE: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 55 DISCRETE: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 56 DISCRETE: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 57 ANALOG: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 58 ANALOG: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 59 ANALOG: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 60 ANALOG: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 61 OTHERS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 62 OTHERS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 63 OTHERS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 64 OTHERS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 65 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION, 2020-2023 (USD MILLION)
  • TABLE 66 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION, 2024-2029 (USD MILLION)
  • TABLE 67 2D ICS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 68 2D ICS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 69 2.5D ICS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 70 2.5D ICS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 71 3D ICS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 72 3D ICS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 73 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2020-2023 (USD MILLION)
  • TABLE 74 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2024-2029 (USD MILLION)
  • TABLE 75 FOUNDRIES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 76 FOUNDRIES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 77 IDM FIRMS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 78 IDM FIRMS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 79 OSAT COMPANIES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 80 OSAT COMPANIES: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 81 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 82 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 83 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
  • TABLE 84 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
  • TABLE 85 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT, 2020-2023 (USD MILLION)
  • TABLE 86 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT, 2024-2029 (USD MILLION)
  • TABLE 87 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 88 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • TABLE 89 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION, 2020-2023 (USD MILLION)
  • TABLE 90 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION, 2024-2029 (USD MILLION)
  • TABLE 91 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2020-2023 (USD MILLION)
  • TABLE 92 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2024-2029 (USD MILLION)
  • TABLE 93 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT, 2020-2023 (USD MILLION)
  • TABLE 94 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT, 2024-2029 (USD MILLION)
  • TABLE 95 AMERICAS: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
  • TABLE 96 AMERICAS: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
  • TABLE 97 AMERICAS: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 98 AMERICAS: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • TABLE 99 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT, 2020-2023 (USD MILLION)
  • TABLE 100 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT, 2024-2029 (USD MILLION)
  • TABLE 101 AMERICAS: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
  • TABLE 102 AMERICAS: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
  • TABLE 103 AMERICAS: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 104 AMERICAS: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • TABLE 105 US: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 106 US: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 107 CANADA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 108 CANADA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 109 REST OF AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 110 REST OF AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 111 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
  • TABLE 112 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
  • TABLE 113 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 114 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION, 2024-2029 (USD MILLION)
  • TABLE 115 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 116 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 117 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 118 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • TABLE 119 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION, 2020-2023 (USD MILLION)
  • TABLE 120 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION, 2024-2029 (USD MILLION)
  • TABLE 121 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2020-2023 (USD MILLION)
  • TABLE 122 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2024-2029 (USD MILLION)
  • TABLE 123 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT, 2020-2023 (USD MILLION)
  • TABLE 124 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT, 2024-2029 (USD MILLION)
  • TABLE 125 EMEA: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 126 EMEA: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • TABLE 127 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT, 2020-2023 (USD MILLION)
  • TABLE 128 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT, 2024-2029 (USD MILLION)
  • TABLE 129 EMEA: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 130 EMEA: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • TABLE 131 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
  • TABLE 132 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
  • TABLE 133 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 134 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 135 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 136 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • TABLE 137 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION, 2020-2023 (USD MILLION)
  • TABLE 138 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION, 2024-2029 (USD MILLION)
  • TABLE 139 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2020-2023 (USD MILLION)
  • TABLE 140 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2024-2029 (USD MILLION)
  • TABLE 141 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT, 2020-2023 (USD MILLION)
  • TABLE 142 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT, 2024-2029 (USD MILLION)
  • TABLE 143 ASIA PACIFIC: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
  • TABLE 144 ASIA PACIFIC: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
  • TABLE 145 ASIA PACIFIC: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 146 ASIA PACIFIC: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • TABLE 147 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT, 2020-2023 (USD MILLION)
  • TABLE 148 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT, 2024-2029 (USD MILLION)
  • TABLE 149 ASIA PACIFIC: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
  • TABLE 150 ASIA PACIFIC: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
  • TABLE 151 ASIA PACIFIC: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 152 ASIA PACIFIC: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • TABLE 153 CHINA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 154 CHINA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 155 JAPAN: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 156 JAPAN: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 157 SOUTH KOREA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 158 SOUTH KOREA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 159 TAIWAN: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 160 TAIWAN: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 161 REST OF ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2020-2023 (USD MILLION)
  • TABLE 162 REST OF ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2024-2029 (USD MILLION)
  • TABLE 163 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: KEY PLAYER STRATEGIES/RIGHT TO WIN, 2020-2024
  • TABLE 164 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: MARKET SHARE ANALYSIS OF TOP FIVE PLAYERS, 2023
  • TABLE 165 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: FRONT-END EQUIPMENT FOOTPRINT
  • TABLE 166 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: BACK-END EQUIPMENT FOOTPRINT
  • TABLE 167 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: PRODUCT TYPE FOOTPRINT
  • TABLE 168 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: DIMENSION FOOTPRINT
  • TABLE 169 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: SUPPLY CHAIN PARTICIPANT FOOTPRINT
  • TABLE 170 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: REGION FOOTPRINT
  • TABLE 171 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: LIST OF STARTUPS/SMES
  • TABLE 172 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: COMPETITIVE BENCHMARKING OF STARTUPS/SMES
  • TABLE 173 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: PRODUCT LAUNCHES, FEBRUARY 2020-JULY 2024
  • TABLE 174 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: DEALS, JANUARY 2020- SEPTEMBER 2023
  • TABLE 175 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: EXPANSIONS, FEBRUARY 2020-APRIL 2023
  • TABLE 176 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: FACITLITY OVERVIEW OF TOP 5 PLAYERS
  • TABLE 177 APPLIED MATERIALS, INC.: COMPANY OVERVIEW
  • TABLE 178 APPLIED MATERIALS, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 179 APPLIED MATERIALS, INC.: PRODUCT/SERVICE LAUNCHES
  • TABLE 180 APPLIED MATERIALS, INC.: DEALS
  • TABLE 181 APPLIED MATERIALS, INC.: EXPANSIONS
  • TABLE 182 ASML: COMPANY OVERVIEW
  • TABLE 183 ASML: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 184 ASML: PRODUCT/SOLUTION/SERVICE LAUNCHES
  • TABLE 185 ASML: DEALS
  • TABLE 186 ASML: EXPANSIONS
  • TABLE 187 TOKYO ELECTRON LIMITED: COMPANY OVERVIEW
  • TABLE 188 TOKYO ELECTRON LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 189 TOKYO ELECTRON LIMITED: PRODUCT/SOLUTION/SERVICE LAUNCHES
  • TABLE 190 TOKYO ELECTRON LIMITED: DEALS
  • TABLE 191 TOKYO ELECTRON LIMITED: EXPANSIONS
  • TABLE 192 LAM RESEARCH CORPORATION: COMPANY OVERVIEW
  • TABLE 193 LAM RESEARCH CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 194 LAM RESEARCH CORPORATION: PRODUCT/SOLUTION/SERVICE LAUNCHES
  • TABLE 195 LAM RESEARCH CORPORATION: DEALS
  • TABLE 196 LAM RESEARCH CORPORATION: EXPANSIONS
  • TABLE 197 KLA CORPORATION: COMPANY OVERVIEW
  • TABLE 198 KLA CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 199 KLA CORPORATION: PRODUCT/SERVICE LAUNCHES
  • TABLE 200 KLA CORPORATION: EXPANSIONS
  • TABLE 201 SCREEN HOLDINGS CO., LTD.: COMPANY OVERVIEW
  • TABLE 202 SCREEN HOLDINGS CO., LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 203 SCREEN HOLDINGS CO., LTD.: PRODUCT/SERVICE LAUNCHES
  • TABLE 204 SCREEN HOLDINGS CO., LTD.: DEALS
  • TABLE 205 SCREEN HOLDINGS CO., LTD.: EXPANSIONS
  • TABLE 206 TERADYNE, INC.: COMPANY OVERVIEW
  • TABLE 207 TERADYNE, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 208 TERADYNE, INC.: PRODUCT/SERVICE LAUNCHES
  • TABLE 209 TERADYNE, INC.: DEALS
  • TABLE 210 ADVANTEST CORPORATION: COMPANY OVERVIEW
  • TABLE 211 ADVANTEST CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 212 ADVANTEST CORPORATION: PRODUCT/SERVICE LAUNCHES
  • TABLE 213 ADVANTEST CORPORATION: DEALS
  • TABLE 214 HITACHI HIGH-TECH CORPORATION: COMPANY OVERVIEW
  • TABLE 215 HITACHI HIGH-TECH CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 216 HITACHI HIGH-TECH CORPORATION: PRODUCT/SERVICE LAUNCHES
  • TABLE 217 HITACHI HIGH-TECH CORPORATION: DEALS
  • TABLE 218 HITACHI HIGH-TECH CORPORATION: EXPANSIONS
  • TABLE 219 PLASMA-THERM: COMPANY OVERVIEW
  • TABLE 220 PLASMA-THERM: PRODUCTS/SOLUTIONS/SERVICES OFFERED
  • TABLE 221 PLASMA-THERM: PRODUCT/SERVICE LAUNCHES
  • TABLE 222 PLASMA-THERM: DEALS
  • TABLE 223 PLASMA-THERM: EXPANSIONS
  • TABLE 224 ASM INTERNATIONAL N.V.: COMPANY OVERVIEW
  • TABLE 225 EV GROUP (EVG): COMPANY OVERVIEW
  • TABLE 226 ONTO INNOVATION: COMPANY OVERVIEW
  • TABLE 227 NORDSON CORPORATIONS: COMPANY OVERVIEW
  • TABLE 228 ADT: COMPANY OVERVIEW
  • TABLE 229 BENEQ: COMPANY OVERVIEW
  • TABLE 230 CVD EQUIPMENT CORPORATION: COMPANY OVERVIEW
  • TABLE 231 EUGENE TECHNOLOGY CO. LTD.: COMPANY OVERVIEW
  • TABLE 232 NIKON CORPORATION: COMPANY OVERVIEW
  • TABLE 233 SEMICONDUCTOR EQUIPMENT CORP.: COMPANY OVERVIEW
  • TABLE 234 SENTECH INSTRUMENTS GMBH: COMPANY OVERVIEW
  • TABLE 235 CANON INC.: COMPANY OVERVIEW
  • TABLE 236 KOKUSAI ELECTRIC CORPORATION: COMPANY OVERVIEW
  • TABLE 237 SEMES: COMPANY OVERVIEW
  • TABLE 238 FORMFACTOR: COMPANY OVERVIEW

List of Figures

  • FIGURE 1 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SEGMENTATION
  • FIGURE 2 RESEARCH DESIGN
  • FIGURE 3 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: BOTTOM-UP APPROACH
  • FIGURE 4 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: TOP-DOWN APPROACH
  • FIGURE 5 MARKET SIZE ESTIMATION: DEMAND-SIDE ANALYSIS
  • FIGURE 6 MARKET SIZE ESTIMATION: SUPPLY-SIDE ANALYSIS
  • FIGURE 7 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: DATA TRIANGULATION
  • FIGURE 8 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SNAPSHOT
  • FIGURE 9 LITHOGRAPHY SEGMENT TO SECURE LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 10 METROLOGY SEGMENT TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 11 MEMORY SEGMENT TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 12 3D ICS SEGMENT TO WITNESS HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 13 IDM FIRMS TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 14 ASIA PACIFIC TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD
  • FIGURE 15 EXPANSION OF SEMICONDUCTOR MANUFACTURING FACILITIES TO DRIVE MARKET
  • FIGURE 16 DEPOSITION TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD
  • FIGURE 17 BONDING SEGMENT TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 18 LOGIC SEGMENT TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 19 2D ICS TO BE DOMINANT SEGMENT DURING FORECAST PERIOD
  • FIGURE 20 IDM FIRMS PROJECTED TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 21 ASIA PACIFIC TO ACCOUNT FOR LARGEST SHARE OF SEMICONDUCTOR MANUFACTURING EQUIPMENT
  • FIGURE 22 CHINA TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 23 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
  • FIGURE 24 IMPACT ANALYSIS OF DRIVERS ON SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • FIGURE 25 IMPACT ANALYSIS OF RESTRAINTS ON SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • FIGURE 26 IMPACT ANALYSIS OF OPPORTUNITIES ON SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • FIGURE 27 IMPACT ANALYSIS OF CHALLENGES ON SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • FIGURE 28 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: VALUE CHAIN ANALYSIS
  • FIGURE 29 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: ECOSYSTEM ANALYSIS
  • FIGURE 30 INVESTMENT AND FUNDING SCENARIO, 2019-2024
  • FIGURE 31 TRENDS AND DISRUPTIONS IMPACTING CUSTOMER BUSINESS
  • FIGURE 32 AVERAGE SELLING PRICE OF PRODUCTS OFFERED BY KEY PLAYERS, 2023
  • FIGURE 33 AVERAGE SELLING PRICE OF LITHOGRAPHY EQUIPMENT, BY REGION, 2020-2023
  • FIGURE 34 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY SUPPLY CHAIN PARTICIPANT
  • FIGURE 35 KEY BUYING CRITERIA, BY SUPPLY CHAIN PARTICIPANT
  • FIGURE 36 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: PORTER'S FIVE FORCES ANALYSIS
  • FIGURE 37 IMPACT OF PORTER'S FIVE FORCES
  • FIGURE 38 IMPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS, BY COUNTRY, 2019-2023
  • FIGURE 39 EXPORT DATA FOR HS CODE 848620-COMPLIANT PRODUCTS, BY COUNTRY, 2019-2023
  • FIGURE 40 PATENTS APPLIED AND GRANTED ANALYSIS, 2013-2023
  • FIGURE 41 IMPACT OF AI/GEN AI ON SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • FIGURE 42 CONNECTORS USED IN SEMICONDUCTOR MANUFACTURING FACILITIES
  • FIGURE 43 LITHOGRAPHY TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 44 METROLOGY SEGMENT TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 45 MEMORY SEGMENT TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 46 2D ICS SEGMENT TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 47 ASIA PACIFIC TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 48 ASIA PACIFIC TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 49 AMERICAS TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 50 IDM FIRMS TO ACCOUNT FOR LARGEST MARKET SHARE DURING FORECAST PERIOD
  • FIGURE 51 ASIA PACIFIC TO REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 52 AMERICAS: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SNAPSHOT
  • FIGURE 53 EMEA: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SNAPSHOT
  • FIGURE 54 ASIA PACIFIC: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET SNAPSHOT
  • FIGURE 55 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: MARKET SHARE ANALYSIS, 2023
  • FIGURE 56 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: REVENUE ANALYSIS OF KEY PLAYERS, 2019-2023
  • FIGURE 57 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: COMPANY VALUATION, 2024 (USD BILLION)
  • FIGURE 58 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: FINANCIAL METRICS
  • FIGURE 59 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: COMPANY EVALUATION MATRIX (KEY PLAYERS), 2023
  • FIGURE 60 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: COMPANY FOOTPRINT
  • FIGURE 61 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: COMPANY EVALUATION MATRIX (STARTUPS/SMES), 2023
  • FIGURE 62 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET: BRAND/PRODUCT COMPARISON
  • FIGURE 63 APPLIED MATERIALS, INC.: COMPANY SNAPSHOT
  • FIGURE 64 ASML: COMPANY SNAPSHOT
  • FIGURE 65 TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT
  • FIGURE 66 LAM RESEARCH CORPORATION: COMPANY SNAPSHOT
  • FIGURE 67 KLA CORPORATION: COMPANY SNAPSHOT
  • FIGURE 68 SCREEN HOLDINGS CO., LTD.: COMPANY SNAPSHOT
  • FIGURE 69 TERADYNE, INC.: COMPANY SNAPSHOT
  • FIGURE 70 ADVANTEST CORPORATION: COMPANY SNAPSHOT
  • FIGURE 71 HITACHI HIGH-TECH CORPORATION: COMPANY SNAPSHOT