市场调查报告书
商品编码
1525916
全球先进封装市场:按类型、最终用户和地区进行预测(截至 2030 年)Global Advanced Packaging Market Research Report Information by Type, by End-user, and by Region -Forecast Till 2030 |
预计先进封装市场规模在预测期内将以 5.6% 的复合年增长率成长,到 2023 年将达到 353.367 亿美元。
推动先进封装市场的主要因素是电子产业的爆炸性扩张以及对各种消费性电子产品(如穿戴式装置、笔记型电脑、桌上型电脑、智慧型手机和小型电子产品)日益增长的需求。
区域展望
预计2022年亚太地区将占最大占有率,2030年将成长至365.2858亿美元。该地区的市场占有率很大,因为该地区有如此多的半导体製造工厂。该地区的製造商正在扩大产能,以满足无晶圆厂供应商不断增长的需求,而中国正在整合其电路板製造业务。
由于多种原因,北美先进封装市场也大幅扩张。首先,该市场直接受到消费性电子产品需求成长的影响。人们越来越多地使用电子产品进行通讯、休閒和工作相关任务,需要适合这些设备复杂而小型设计的先进封装解决方案。由于对优质晶片的需求不断增加,市场也不断扩大。
欧洲先进封装市场的成长是由快速扩张所推动的,特别是在智慧型手机、电子产品和物联网需求不断增长的推动下的晶圆级封装。为了满足这种不断增长的需求,先进封装供应商正在积极开发程序和计划,以降低先进封装的总成本并确保最大的营运效率。
该报告调查了全球先进封装市场,并提供了市场的定义和概述,分析了影响市场成长和市场机会的因素、市场规模的趋势和预测,以及按各个细分市场、地区和主要国家进行的细分。
Global Advanced Packaging Market Research Report Information by Type (Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-level Packaging and Others), by End-user (Consumer Electronics, Healthcare, Industrial, Aerospace and Defense, Automotive and Other), and by Region (North America, Europe, Asia Pacific, South America, and Middle East & Africa) -Forecast Till 2030
In 2023, the advanced packaging market was estimated to be worth USD 35,336.7 million. Over the course of the projection period, the Advanced Packaging industry is expected to increase at a compound annual growth rate (CAGR) of 5.6%. The collection and linking of Types prior to conventional integrated circuit packaging is known as advanced packaging. Multiple devices can be combined and packed as a single electrical device thanks to advanced packaging. The industrial segment that deals with creating, designing, and producing sophisticated and novel packaging solutions for a range of products is known as the advanced packaging market. Modern packaging methods are used to improve the performance, usefulness, and dependability of packaged items while guaranteeing its preservation, protection, and appearance. The increased need for embedded die packaging can also be attributed to the increasing downsizing of devices and the increasing use of micro-electromechanical systems (MEMS) in manufacturing. Although the technology has been available for some time, its low yields and high costs have restricted its applicability to specialized fields.
As technology develops, producers are moving toward producing small electronic devices for a variety of markets, including consumer electronics, healthcare, automotive, and semiconductor IC manufacture.
The main factors driving the Advanced Packaging Market are the electronics industry's explosive expansion and the rising demand for a range of consumer electronics, including wearables, laptops, desktops, smartphones, and tiny gadgets.
The Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-level Packaging, and Others are the segments of the Advanced Packaging Market based on type.
The Advanced Packaging Market has been divided into Consumer Electronics, Healthcare, Industrial, Aerospace and Defense, Automotive, and Other segments based on the end-user.
Regional Perspectives
The Asia-Pacific region is predicted to account for the largest share in 2022 and grow to USD 36,528.58 million by 2030. Because there are so many semiconductor production facilities in the Asia-Pacific region, the market share is substantial in that area. In order to fulfill the increased demand from fabless suppliers, manufacturers in this region are expanding their production capacity, and China is attempting to consolidate its substrate manufacturing business.
For several reasons, the advanced packaging market in North America is expanding significantly. First, the market is directly impacted by the growing demand for consumer electronics. People are using electronic gadgets more and more for communication, leisure, and work-related tasks, which means that sophisticated packaging solutions are required to fit the intricate and small designs of these devices. The market is also expanding due to the rising demand for premium chips.
The rapid expansion of the advanced packaging market, especially in wafer level packaging, driven by the rising demand for smartphones, electronics, and the Internet of Things (IoT), is responsible for the growth of the Europe Advanced Packaging Market. Providers of advanced packaging are actively creating procedures and plans to lower the total cost of advanced packaging and guarantee maximum operational effectiveness to satisfy this expanding demand.
South America's market for innovative packaging materials is expanding gradually due to a number of factors. The need for improved packaging solutions is being driven by the rising demand for sophisticated electronic gadgets like wearables, tablets, and smartphones. Advanced packaging technologies enable the production of semiconductor chips that are more compact, powerful, and energy-efficient-all necessary for these devices.
The market for advanced packaging semiconductor materials is expanding significantly in the Middle East and Africa (MEA) region. In order to enable more performance and usefulness in electronic devices, advanced packaging refers to the compact and efficient integration and encapsulation of semiconductor chips.
Principal Players
Amkor Technology Inc., ASE Technology Holding Co. Ltd., China Wafer Level CSP Co. Ltd., ChipMOS Technologies Inc., FlipChip International LLC, HANA Micron Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., King Yuan Electronics Corp., Nepes Corporation, Powertech Technology Inc., and numerous other notable businesses are among those that lead the advanced packaging market.