全球功率元件新型封装和材料市场（截至 2032 年）：按产品类型、应用和地区划分

预计到 2032 年，全球功率元件新型封装和材料市场规模将达到 59.287 亿美元，复合年增长率为 9.44%。该市场涵盖采用尖端封装解决方案和先进材料，旨在支援下一代功率元件。这些创新技术能够改善散热性能、加快开关速度并增强耐用性，从而重塑从电动车到智慧电网等各种应用。

全球功率元件新型封装和材料市场的主要驱动力是电力电子领域对效率和速度的日益关注。氮化镓 (GaN) 和碳化硅 (SiC) 基元件的应用日益广泛，正在改变汽车、家用电器和再生能源，使其能够实现更快的充电速度、更低的能量损耗和卓越的热性能。此外，3D 封装、先进热介面材料的使用以及紧凑的整合是推动整个产业转型的关键因素。这种转变在电动车 (EV) 领域尤其明显，因为高效率和快速充电至关重要。

报告属性详情

• 市场规模 (2023 年)：25 亿美元
• 市场规模 (2032 年)：59.287 亿美元
• 复合年增长率 (2024-2032)：9.44%
• 基准年：2023 年
• 市场预测期：2024-2032 年

区域分析

受汽车、消费性电子和工业领域需求以及研发和先进封装技术投资的推动，北美市场正在逐步扩张。预计到2023年，北美市场规模将达到4.6917亿美元（美国），3,208万美元（加拿大），主要得益于汽车和电子产业的创新。

欧洲市场主要受永续发展和能源效率目标的驱动，尤其是在汽车和工业自动化领域。意法半导体、英飞凌科技和恩智浦半导体等该领域的行业领导者，提供根据不断变化的需求量身定制的解决方案。欧洲市场以德国（1.2573亿美元）、法国（8,840万美元）和英国（9,294万美元）为主，体现了其强大的工业基础和对永续发展的重视。

亚太地区拥有强大的半导体生态系统，在电动车製造和应用方面处于全球领先地位。该地区还在通讯和再生能源领域进行了大量投资。中国（7.3829亿美元）、日本（1.0437亿美元）和印度（2,920万美元）是市场的主要推动力，其中亚太地区是成长最快的地区。

本报告研究了功率元件新型封装和材料的全球市场，提供了市场定义和概述、影响市场成长的各种因素分析、市场规模趋势和预测、按不同细分市场、地区和主要国家/地区进行的细分、竞争格局以及主要公司的概况。

目录

第1章 摘要整理

第2章 市场概要

第3章 调查手法

第4章 市场动态

• 促进因素
  • 对更高效率和速度的需求
  • 公司间合作与伙伴关係
• 限制因素
  • 将新材料和封装整合到功率元件中
• 机遇
  • 对永续和可扩展功率产品的需求不断增长

第5章 市场要素分析

• 供应链分析
• 波特的五力分析
• COVID-19流行对全球电力设备新包装及新素材市场带来的影响
• 价格分析

第6章 电力设备新包装及新素材市场:各产品类型

• 板上晶片 (COB)
• 引线键结封装
• 砷化镓 (GAAS)
• 氮化镓 (GAN)
• 碳化硅 (SIC)
• 其他

第7章 电力设备新包装及新素材市场:各用途

• 汽车
• CE产品
• 工业
• IT·通讯
• 军事·航太
• 其他

第8章 电力设备新包装及新素材市场:各地区

• 概要
• 北美
  • 美国
  • 加拿大
• 欧洲
  • 德国
  • 英国
  • 法国
  • 俄罗斯
  • 西班牙
  • 荷兰
  • 其他
• 亚太地区
  • 中国
  • 日本
  • 印度
  • 韩国
  • 新加坡
  • 澳洲和纽西兰
  • 其他
• 中东·非洲
  • 南非
  • GCC各国
  • 土耳其
  • 以色列
  • 其他
• 南美
  • 巴西
  • 墨西哥
  • 阿根廷
  • 其他

第9章 竞争情形

• 市场占有率分析
• 比较分析:主要企业的财务
• 竞争仪表板
• 主要的展开

第10章 企业简介

• INFINEON TECHNOLOGIES
• STMICROELECTRONICS
• TEXAS INSTRUMENTS
• MITSUBISHI ELECTRIC CORPORATION
• ROHM SEMICONDUCTOR
• NXP SEMICONDUCTORS N.V.
• ANALOG DEVICES
• ON SEMICONDUCTORS
• MICROCHIP TECHNOLOGY
• WOLFSPEED, INC.
• 资料引用

Global New Packages and Materials for Power Devices Market Research Report by Product Type [Chip-On-Board (COB), Wire Bonding Packaging, Silicon Carbide (SIC), Gallium Nitride (GaN), Gallium Arsenide (GaAs), Others], by Application (Automotive, Consumer Electronics, IT & Telecommunications, Military & Aerospace, Industrial, Others), and by Region (North America, Europe, Asia Pacific, Latin America, Middle East & Africa) Forecast till 2032

Industry Overview

The global new packages and materials for power devices market is expected to achieve a value of USD 5,928.7 million, expanding at a 9.44% by the end of 2032. The term highlights the adoption of modern packaging solutions and advanced materials designed to support next-generation power devices. By enabling better heat dissipation, higher switching speeds, and improved durability, these innovations are reshaping applications from electric vehicles to smart grids.

The global New Packages and Materials for Power Devices Market is primarily driven by the rising emphasis on efficiency and speed in power electronics. The increasing use of GaN and SiC-based devices is changing the automotive, consumer electronics, and renewable energy sectors by allowing faster charging, lower energy losses, and better thermal performance. Besides that, 3D packaging, the use of advanced thermal interface materials, and compact integration are the main factors that are driving the industry-wide transitions. These transitions are more visible in electric vehicles (EVs), where higher efficiency and rapid charging are the most important.

Major Company Development

Between 2023 and 2024, Microchip Technology accelerated its expansion strategy with the help of an extension and two partnership agreements. To meet the demand for semiconductors in the United States, it invested $800 million to triple production in Oregon. In December 2023, it was decided to open a design center in Cambridge to facilitate innovation and gain access to engineering talent. By April 2024, Microchip was able to improve its supply chain through a strategic alliance with TSMC in Japan, allowing for additional capacity, geographical diversity, and semiconductor manufacturing that is more resilient.

Key Players

Major players in the global new packages and materials for power devices market are Infineon Technologies AG, STMicroelectronics, ROHM Semiconductor, Texas Instruments, Mitsubishi Electric Corporation, NXP Semiconductors, Analog Devices, ON Semiconductor, Microchip Technology Inc., and Wolfspeed.

Report Attribute Details

• Market Size 2023: USD 2,500 Million
• Market Size 2032: USD 5,928.7 Million
• CAGR (2024-2032): 9.44%
• Base Year: 2023
• Market Forecast Period: 2024-2032

Industry Segmentations

• By Product Type: Chip-On-Board (COB) - 9.66%, Wire Bonding Packaging - 8.56%.
• By Application: Automotive - 8.49%, Consumer Electronics - 10.18%.

Regional Analysis

The North American market is growing gradually, and this movement is led by the demand of the automotive, consumer electronics, and industrial sectors, along with the investments in R&D and advanced packaging technologies. The North American market was valued at USD 469.17 million in the U.S. and USD 32.08 million in Canada in 2023, driven by innovation in automotive and electronics.

The European region is seeing a market mainly based on sustainability and energy efficiency targets, which are the focus of demand, particularly in the areas of automotive and industrial automation. The industry leaders in this sector, namely STMicroelectronics, Infineon Technologies, and NXP Semiconductors, are providing custom-made solutions to match the changing requirements in this area. Germany (USD 125.73 million), France (USD 88.40 million), and the UK (USD 92.94 million) anchored Europe's market, reflecting its strong industrial and sustainability focus.

The Asia-Pacific region has a robust semiconductor ecosystem that has allowed the region to become a global leader in the manufacture and use of EVs (Electric Vehicles), and the region has also invested very heavily in telecom and the renewable energy sector. With China at USD 738.29 million, Japan at USD 104.37 million, and India at USD 29.20 million, Asia-Pacific stood out as the fastest-expanding hub for new materials and packaging.

The Middle East & Africa is the fastest-growing regional market, expanding from USD 126.00 million in 2023 to USD 314.81 million by 2032, at a CAGR of 10.08%. Infineon Technologies and ON Semiconductor are among the leading companies strengthening their presence, addressing requirements across the oil & gas, telecom, and defense sectors. This positions the region as a high-potential frontier for advanced power solutions.

South America's market is focusing on infrastructure development, renewable energy adoption, and telecom expansion, which are creating consistent demand for efficient power devices. ON Semiconductor and STMicroelectronics are leading efforts to expand through strategic partnerships and localized solutions. With steady investments, the region is expected to play a greater role in the global market.

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

2 MARKET INTRODUCTION

• 2.1 DEFINITION
• 2.2 SCOPE OF THE STUDY
• 2.3 RESEARCH OBJECTIVE
• 2.4 MARKET STRUCTURE

3 RESEARCH METHODOLOGY

• 3.1 OVERVIEW
• 3.2 DATA FLOW
  • 3.2.1 DATA MINING PROCESS
• 3.3 PURCHASED DATABASE:
• 3.4 SECONDARY SOURCES:
  • 3.4.1 SECONDARY RESEARCH DATA FLOW:
• 3.5 PRIMARY RESEARCH:
  • 3.5.1 PRIMARY RESEARCH DATA FLOW:
  • 3.5.2 PRIMARY RESEARCH: NUMBER OF INTERVIEWS CONDUCTED
  • 3.5.3 PRIMARY RESEARCH: REGIONAL COVERAGE
• 3.6 APPROACHES FOR MARKET SIZE ESTIMATION:
  • 3.6.1 REVENUE ANALYSIS APPROACH
• 3.7 DATA FORECASTING
  • 3.7.1 DATA FORECASTING TECHNIQUE
• 3.8 DATA MODELING
  • 3.8.1 MICROECONOMIC FACTOR ANALYSIS:
  • 3.8.2 DATA MODELING:
• 3.9 TEAMS AND ANALYST CONTRIBUTION

4 MARKET DYNAMICS

• 4.1 INTRODUCTION
• 4.2 DRIVERS
  • 4.2.1 DEMAND OF BETTER EFFICIENCY AND SPEED
  • 4.2.2 COLLABORATION AND PARTNERSHIPS AMONG PLAYERS
• 4.3 RESTRAINTS
  • 4.3.1 INTEGRATION OF NEW MATERIAL AND PACKAGES INTO POWER DEVICES
• 4.4 OPPORTUNITIES
  • 4.4.1 RISING DEMAND OF SUSTAINABLE AND SCALABLE POWER PRODUCTS

5 MARKET FACTOR ANALYSIS

• 5.1 SUPPLY CHAIN ANALYSIS
  • 5.1.1 RAW MATERIAL SOURCING
  • 5.1.2 MANUFACTURING
  • 5.1.3 ASSEMBLY AND TESTING
  • 5.1.4 PACKAGING AND DISTRIBUTION
• 5.2 PORTER FIVE FORCES
  • 5.2.1 BARGAINING POWER OF SUPPLIERS
  • 5.2.2 BARGAINING POWER OF BUYERS
  • 5.2.3 THREAT OF NEW ENTRANTS
  • 5.2.4 THREAT OF SUBSTITUTES
  • 5.2.5 INTENSITY OF RIVALRY
• 5.3 IMPACT OF CORONAVIRUS OUTBREAK ON THE GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET
• 5.4 PRICING ANALYSIS OF THE GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET

6 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY PRODUCT TYPE

• 6.1 INTRODUCTION
• 6.2 CHIP-ON-BOARD (COB)
• 6.3 WIRE BONDING PACKAGING
• 6.4 GALLIUM ARSENIDE (GAAS)
• 6.5 GALLIUM NITRIDE (GAN)
• 6.6 SILICON CARBIDE (SIC)
• 6.7 OTHER PACKAGES/ MATERIALS

7 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY APPLICATION

• 7.1 INTRODUCTION
• 7.2 AUTOMOTIVE
• 7.3 CONSUMER ELECTRONICS
• 7.4 INDUSTRIAL
• 7.5 IT AND TELECOMMUNICATIONS
• 7.6 MILITARY & AEROSPACE
• 7.7 OTHER APPLICATIONS

8 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY REGION

• 8.1 OVERVIEW
• 8.2 NORTH AMERICA
  • 8.2.1 U.S
  • 8.2.2 CANADA
• 8.3 EUROPE
  • 8.3.1 GERMANY
  • 8.3.2 U.K.
  • 8.3.3 FRANCE
  • 8.3.4 RUSSIA
  • 8.3.5 SPAIN
  • 8.3.6 NETHERLANDS
  • 8.3.7 REST OF EUROPE
• 8.4 ASIA-PACIFIC
  • 8.4.1 CHINA
  • 8.4.2 JAPAN
  • 8.4.3 INDIA
  • 8.4.4 SOUTH KOREA
  • 8.4.5 SINGAPORE
  • 8.4.6 AUSTRALIA AND NEW ZEALAND
  • 8.4.7 REST OF ASIA-PACIFIC
• 8.5 MIDDLE EAST AND AFRICA
  • 8.5.1 SOUTH AFRICA
  • 8.5.2 GCC COUNTRIES
  • 8.5.3 TURKEY
  • 8.5.4 ISRAEL
  • 8.5.5 REST OF MIDDLE EAST & AFRICA
• 8.6 LATIN AMERICA
  • 8.6.1 BRAZIL
  • 8.6.2 MEXICO
  • 8.6.3 ARGENTINA
  • 8.6.4 REST OF LATIN AMERICA

9 COMPETITIVE LANDSCAPE

• 9.1 MARKET SHARE ANALYSIS
• 9.2 COMPARATIVE ANALYSIS: KEY PLAYERS FINANCIAL
• 9.3 COMPETITOR DASHBOARD
• 9.4 KEY DEVELOPMENTS

10 COMPANY PROFILES

• 10.1 INFINEON TECHNOLOGIES
  • 10.1.1 COMPANY OVERVIEW
  • 10.1.2 FINANCIAL OVERVIEW
  • 10.1.3 PRODUCTS OFFERED
  • 10.1.4 KEY DEVELOPMENTS
  • 10.1.5 SWOT ANALYSIS
  • 10.1.6 KEY STRATEGY
• 10.2 STMICROELECTRONICS
  • 10.2.1 COMPANY OVERVIEW
  • 10.2.2 FINANCIAL OVERVIEW
  • 10.2.3 PRODUCTS OFFERED
  • 10.2.4 KEY DEVELOPMENTS
  • 10.2.5 SWOT ANALYSIS
  • 10.2.6 KEY STRATEGY
• 10.3 TEXAS INSTRUMENTS
  • 10.3.1 COMPANY OVERVIEW
  • 10.3.2 FINANCIAL OVERVIEW
  • 10.3.3 PRODUCTS OFFERED
  • 10.3.4 KEY DEVELOPMENTS
  • 10.3.5 SWOT ANALYSIS
  • 10.3.6 KEY STRATEGY
• 10.4 MITSUBISHI ELECTRIC CORPORATION
  • 10.4.1 COMPANY OVERVIEW
  • 10.4.2 FINANCIAL OVERVIEW
  • 10.4.3 PRODUCTS OFFERED
  • 10.4.4 KEY DEVELOPMENTS
  • 10.4.5 SWOT ANALYSIS
  • 10.4.6 KEY STRATEGY
• 10.5 ROHM SEMICONDUCTOR
  • 10.5.1 COMPANY OVERVIEW
  • 10.5.2 FINANCIAL OVERVIEW
  • 10.5.3 PRODUCTS OFFERED
  • 10.5.4 KEY DEVELOPMENTS
  • 10.5.5 SWOT ANALYSIS
  • 10.5.6 KEY STRATEGY
• 10.6 NXP SEMICONDUCTORS N.V.
  • 10.6.1 COMPANY OVERVIEW
  • 10.6.2 FINANCIAL OVERVIEW
  • 10.6.3 PRODUCTS OFFERED
  • 10.6.4 KEY DEVELOPMENTS
  • 10.6.5 SWOT ANALYSIS
  • 10.6.6 KEY STRATEGY
• 10.7 ANALOG DEVICES
  • 10.7.1 COMPANY OVERVIEW
  • 10.7.2 FINANCIAL OVERVIEW
  • 10.7.3 PRODUCTS OFFERED
  • 10.7.4 KEY DEVELOPMENTS
  • 10.7.5 SWOT ANALYSIS
  • 10.7.6 KEY STRATEGY
• 10.8 ON SEMICONDUCTORS
  • 10.8.1 COMPANY OVERVIEW
  • 10.8.2 FINANCIAL OVERVIEW
  • 10.8.3 PRODUCTS OFFERED
  • 10.8.4 KEY DEVELOPMENTS
  • 10.8.5 SWOT ANALYSIS
  • 10.8.6 KEY STRATEGY
• 10.9 MICROCHIP TECHNOLOGY
  • 10.9.1 COMPANY OVERVIEW
  • 10.9.2 FINANCIAL OVERVIEW
  • 10.9.3 PRODUCTS OFFERED
  • 10.9.4 KEY DEVELOPMENTS
  • 10.9.5 SWOT ANALYSIS
  • 10.9.6 KEY STRATEGY
• 10.10 WOLFSPEED, INC.
  • 10.10.1 COMPANY OVERVIEW
  • 10.10.2 FINANCIAL OVERVIEW
  • 10.10.3 PRODUCTS OFFERED
  • 10.10.4 KEY DEVELOPMENTS
  • 10.10.5 SWOT ANALYSIS
  • 10.10.6 KEY STRATEGY
• 10.11 DATA CITATIONS

LIST OF TABLES

• TABLE 1 QFD MODELING FOR MARKET SHARE ASSESSMENT
• TABLE 2 PRICING ANALYSIS
• TABLE 3 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 4 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR CHIP-ON-BOARD (COB), BY REGION, 2018-2032 (USD MILLION)
• TABLE 5 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR WIRE BONDING PACKAGING, BY REGION, 2018-2032 (USD MILLION)
• TABLE 6 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR GALLIUM ARSENIDE (GAAS), BY REGION, 2018-2032 (USD MILLION)
• TABLE 7 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR GALLIUM NITRIDE (GAN), BY REGION, 2018-2032 (USD MILLION)
• TABLE 8 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR SILICON CARBIDE (SIC), BY REGION, 2018-2032 (USD MILLION)
• TABLE 9 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR OTHER PACKAGES/ MATERIALS, BY REGION, 2018-2032 (USD MILLION)
• TABLE 10 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 11 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR AUTOMOTIVE, BY REGION, 2018-2032 (USD MILLION)
• TABLE 12 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR CONSUMER ELECTRONICS, BY REGION, 2018-2032 (USD MILLION)
• TABLE 13 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR INDUSTRIAL, BY REGION, 2018-2032 (USD MILLION)
• TABLE 14 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR IT AND TELECOMMUNICATIONS, BY REGION, 2018-2032 (USD MILLION)
• TABLE 15 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR MILITARY & AEROSPACE, BY REGION, 2018-2032 (USD MILLION)
• TABLE 16 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR OTHER APPLICATIONS, BY REGION, 2018-2032 (USD MILLION)
• TABLE 17 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY REGION, 2018-2032 (USD MILLION)
• TABLE 18 NORTH AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION)
• TABLE 19 NORTH AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 20 NORTH AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 21 U.S.: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 22 U.S.: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 23 CANADA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 24 CANADA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 25 EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION)
• TABLE 26 EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 27 EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 28 GERMANY: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 29 GERMANY: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 30 U.K.: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 31 U.K.: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 32 FRANCE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 33 FRANCE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 34 RUSSIA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 35 RUSSIA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 36 SPAIN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 37 SPAIN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 38 NETHERLANDS: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 39 NETHERLANDS: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 40 REST OF EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 41 REST OF EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 42 ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION)
• TABLE 43 ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 44 ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 45 CHINA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 46 CHINA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 47 JAPAN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 48 JAPAN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 49 INDIA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 50 INDIA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 51 SOUTH KOREA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 52 SOUTH KOREA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 53 SINGAPORE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 54 SINGAPORE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 55 AUSTRALIA AND NEW ZEALAND: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 56 AUSTRALIA AND NEW ZEALAND: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 57 REST OF ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 58 REST OF ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 59 MEA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION)
• TABLE 60 MIDDLE EAST & AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 61 MIDDLE EAST & AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 62 SOUTH AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 63 SOUTH AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 64 GCC COUNTRIES: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 65 GCC COUNTRIES: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 66 TURKEY: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 67 TURKEY: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 68 ISRAEL: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 69 ISRAEL: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 70 REST OF MIDDLE EAST & AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 71 REST OF MIDDLE EAST & AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 72 SOUTH AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION)
• TABLE 73 LATIN AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 74 LATIN AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 75 BRAZIL: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 76 BRAZIL: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 77 MEXICO: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 78 MEXICO: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 79 ARGENTINA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 80 ARGENTINA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 81 REST OF LATIN AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 82 REST OF LATIN AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 83 COMPARATIVE ANALYSIS: KEY PLAYERS FINANCIAL
• TABLE 84 KEY DEVELOPMENTS
• TABLE 85 INFINEON TECHNOLOGIES: PRODUCTS OFFERED
• TABLE 86 INFINEON TECHNOLOGIES: KEY DEVELOPMENTS
• TABLE 87 STMICROELECTRONICS: PRODUCTS OFFERED
• TABLE 88 STMICROELECTRONICS: KEY DEVELOPMENTS
• TABLE 89 TEXAS INSTRUMENTS: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 90 TEXAS INSTRUMENTS: KEY DEVELOPMENTS
• TABLE 91 MITSUBISHI ELECTRIC CORPORATION: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 92 MITSUBISHI ELECTRIC CORPORATION: KEY DEVELOPMENTS
• TABLE 93 ROHM SEMICONDUCTOR: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 94 ROHM SEMICONDUCTOR: KEY DEVELOPMENTS
• TABLE 95 NXP SEMICONDUCTORS N.V.: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 96 NXP SEMICONDUCTORS N.V.: KEY DEVELOPMENTS
• TABLE 97 ANALOG DEVICES: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 98 ON SEMICONDUCTORS: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 99 ON SEMICONDUCTORS: KEY DEVELOPMENTS
• TABLE 100 MICROCHIP TECHNOLOGY: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 101 MICROCHIP TECHNOLOGY: KEY DEVELOPMENTS
• TABLE 102 WOLFSPEED, INC.: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 103 WOLFSPEED, INC.: KEY DEVELOPMENTS

LIST OF FIGURES

• FIGURE 1 GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET: STRUCTURE
• FIGURE 2 GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET: MARKET GROWTH FACTOR ANALYSIS (2023-2032)
• FIGURE 3 OPPORTUNITY IMPACT FORECAST
• FIGURE 4 SUPPLY CHAIN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET
• FIGURE 5 PORTER'S FIVE FORCES MODEL: GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET
• FIGURE 6 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY PRODUCT TYPE, SEGMENT ATTRACTIVENESS ANALYSIS
• FIGURE 7 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY PRODUCT TYPE, 2023 (VALUE % SHARE)
• FIGURE 8 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY APPLICATION, SEGMENT ATTRACTIVENESS ANALYSIS
• FIGURE 9 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY APPLICATION, 2023 (VALUE % SHARE)
• FIGURE 10 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY REGION, 2023 (VALUE % SHARE)
• FIGURE 11 NORTH AMERICA: SWOT ANALYSIS
• FIGURE 12 EUROPE: SWOT ANALYSIS
• FIGURE 13 ASIA-PACIFIC: SWOT ANALYSIS
• FIGURE 14 MEA: SWOT ANALYSIS
• FIGURE 15 LATIN AMERICA: SWOT ANALYSIS
• FIGURE 16 MARKET SHARE ANALYSIS,
• FIGURE 17 COMPETITOR DASHBOARD: GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET
• FIGURE 18 INFINEON TECHNOLOGIES: SWOT ANALYSIS
• FIGURE 19 STMICROELECTRONICS: SWOT ANALYSIS
• FIGURE 20 TEXAS INSTRUMENTS: SWOT ANALYSIS
• FIGURE 21 MITSUBISHI ELECTRIC CORPORATION: SWOT ANALYSIS
• FIGURE 22 ROHM SEMICONDUCTOR: SWOT ANALYSIS
• FIGURE 23 NXP SEMICONDUCTORS N.V.: SWOT ANALYSIS
• FIGURE 24 ANALOG DEVICES: SWOT ANALYSIS
• FIGURE 25 ON SEMICONDUCTORS: SWOT ANALYSIS
• FIGURE 26 MICROCHIP TECHNOLOGY: SWOT ANALYSIS
• FIGURE 27 WOLFSPEED, INC.: SWOT ANALYSIS