SiC 晶圆市场 - COVID-19 的增长、趋势、影响和预测 (2023-2028)

2021 年 SiC 晶圆市场价值为 7.2674 亿美元，预计到 2027 年将达到 202.546 万美元，在 2022-2027 年的预测期内復合年增长率为 19.04%。

碳化硅 (SiC) 因其宽带隙而被用于高功率应用。 SiC 衬底通常用于高性能功率 IC。 SiC 可以承受比硅或氮化镓 (GaN) 更高的温度，并且可以提高电气设备的性能。

主要亮点

• 在汽车行业，新型电动汽车以更短的充电时间、更佳的续航里程和性能满足了客户的期望。 因此，汽车公司需要能够在高温下高效运行的电力电子设备，以便为他们的客户提供上述优势。 因此，使用SiC的功率模块由于具有高导热性、降低开关损耗、提高功率密度和增加带宽等优点，采用宽带隙SiC技术开发。
• 随着各个国家/地区宣布限制销售新的内燃机汽车，人们对 SiC 功率半导体的兴趣正在增加。 作为其中的一部分，在所研究的市场中运营的公司正在增加投资以建立新的製造设施。
• 2021 年 4 月，宽带隙化合物半导体领导者 II-VI Incorporated 将在中国建立 SiC 晶圆抛光製造基地，以服务于全球最大的电动汽车和清洁能源应用市场之一。宣布扩大规模 为满足亚洲日益增长的市场需求，该公司在其位于中国福州的亚洲地区总部的一个超过 50,000 平方英尺的新洁净室中安装了一条导电 SiC 衬底的后端处理线。
• 但是，考虑到 SiC 晶圆市场，市场参与者生产了 100 毫米和 150 毫米晶圆。 此外，一些公司正着力开发200mm晶圆，可能在未来几年内全面商业化。 因此，SiC 晶圆的商业尺寸小于 Si 晶圆。 为此，与硅基半导体相比，SiC基半导体在生产效率和生产速度方面受到限制。
• COVID-19 大流行从供需两方面影响了整个半导体製造市场。 此外，全球半导体工厂的停产和关闭加剧了供应短缺。 这种影响也体现在SiC晶圆市场上。 然而，其中许多影响可能是短期的。 世界各国政府对汽车和半导体行业的支持措施可能会重振行业增长。

SiC 晶圆的市场趋势

汽车和电动汽车终端用户行业的强劲增长

• 传统硅的功率处理限制有望为替代功率技术铺平道路，例如用于电动汽车应用的碳化硅。 在许多应用中，碳化硅 (SiC) 是硅 (Si) 的最先进替代品。 此外，正在努力提高电动汽车 (EV) 的效率、增加续航里程、降低整车重量并降低成本。 因此，随着控制电子设备密度的增加，在电动汽车中采用碳化硅的想法诞生了。
• SiC 作为一种替代硅的创新技术被用于许多应用中。 在电动汽车中采用 SiC 晶圆提高了汽车的整体效率、续航里程、重量和成本，并在控制电子设备中实现了更高的功率密度。
• 此外，政府对减少 CO2 排放和各主要汽车製造商的乘用车电气化要求的变化导致市场对 SiC 晶圆的需求不断增长。
• 汽车製造商正在开发全混合动力电动汽车 (HEV)、轻度混合动力电动汽车 (MHEV)、插电式混合动力电动汽车 (PHEV)、零排放纯电动汽车 (BEV)、燃料电池电动汽车 (FCEV)、等，向市场推出了不同电气化水平的车型。
• 例如，2021 年 2 月，福特向其位于德国科隆的电动汽车生产工厂投资 10 亿美元。 这项投资符合该公司将其欧洲汽车工厂转变为电动汽车製造的目标。

亚太地区占据最大市场份额

• 亚太地区在全球半导体市场占据主导地位，并受到政府政策的支持，使其成为全球碳化硅晶圆市场的重要区域。 此外，该地区的半导体产业由台湾、中国、日本和韩国主导，它们在全球半导体市场中占有很大份额。 另一方面，泰国、越南、新加坡和马来西亚等国家也对该地区的市场主导地位做出了重大贡献。
• 中国是亚洲乃至全球最大的半导体市场。 根据半导体行业协会的数据，2021年中国将以1925亿美元的芯片总销售额引领半导体市场，同比增长27.1%。 许多主要芯片製造商也呼吁进行巨额投资，以建立新设施并扩大芯片生产。
• 2021 年 6 月，中国三安集成电路 (SananIC) 在湖南三安半导体的工厂开设了全国第一条垂直集成 SiC 生产线。 该公司耗资 25 亿美元的最新製造工厂位于湖南长沙高新技术产业园区，处理从晶体生长到功率器件、封装和测试的整个晶圆和器件製造过程。
• 此外，在电动汽车行业的需求推动下，日本公司正在大量投资以增加 SiC 功率半导体的产量。 例如，2022年1月，日本富士电机宣布，决定对旗下功率半导体生产基地之一的富士电机津轻半导体进行资本投资，以增加SiC功率半导体的产量。 量产计划于 2024 年开始。
• 此外，总部位于东京的昭和电工株式会社将开始量产直径为 6 英寸（150 毫米）的碳化硅单晶晶圆（SiC 晶圆），用作材料2022 年 SiC 外延片加工并安装到 SiC 功率半导体上。3 月开始。

SiC晶圆市场竞争者分析

SiC 晶圆市场竞争激烈，由具有影响力的参与者组成。 由于占据了很大的市场份额，这些参与者正专注于扩大其海外客户群。 此外，通过战略合作，我们正在努力增加市场份额并增强盈利能力。

其他好处

• Excel 格式的市场预测 (ME) 表
• 三个月的分析师支持

内容

第一章介绍

• 研究假设和市场定义
• 调查范围

第二章研究方法论

第 3 章执行摘要

第 4 章市场洞察

• 市场概览
• 产业吸引力 - 波特五力分析
  • 供应商的议价能力
  • 买家的议价能力
  • 新进入者的威胁
  • 替代品的威胁
  • 竞争公司之间的敌对关係
• 技术洞察力
• 评估 COVID-19 对市场的影响

第 5 章市场动态

• 市场驱动力
  • 电动汽车 (EV) 普及率的上升和 800V 高压 EV 架构的趋势推动了对 SiC 晶圆的需求
  • 电力电子开关和 LED 照明设备对 SiC 晶圆的高导热性需求不断增加
• 市场挑战
  • 小型化、散热和封装等限制因素给芯片和基板供应带来压力

第 6 章市场细分

• 按晶圆尺寸
  • 2 英寸、3 英寸、4 英寸
  • 6 英寸
  • 8 英寸、12 英寸
• 通过申请
  • 电力
  • 射频 (RF)
  • 其他应用
• 按最终用户行业
  • 电信/通讯
  • 汽车/电动汽车 (EV)
  • 光伏/电源/储能
  • 工业（UPS、电机驱动器等）
  • 其他最终用户行业
• 区域信息
  • 北美
  • 欧洲
  • 亚太地区
  • 世界其他地方

第七章竞争格局

• 公司简介
  • Wolfspeed Inc.
  • II-VI Incorporated
  • Xiamen Powerway Advanced Material Co. Ltd
  • STMicroelectronics（Norstel AB）
  • Showa Denko KK
  • Atecom Technology Co. Ltd
  • SK Siltron Co. Ltd
  • SiCrystal GmbH
  • TankeBlue Co. Ltd
  • Semiconductor Wafer Inc.

第八章市场份额分析

第九章投资分析

第 10 章投资分析市场的未来

The SiC Wafer Market was valued at USD 726.74 million in 2021, and it is expected to reach USD 2,025.46 million by 2027, registering a CAGR of 19.04% during the forecast period 2022-2027. Silicon carbide (SiC) is used for high-power applications owing to its wide bandgap. High-performance power ICs are often based on SiC substrates. SiC can tolerate high temperatures than silicon or gallium nitride (GaN) and improve electrical device performance.

Key Highlights

• In the automotive industry, new EVs have reduced charge time and increased range and performance to meet customer expectations. Hence, automotive companies require power electronic devices capable of effective and efficient operation at elevated temperatures to offer the advantages mentioned above to customers. Thus, power modules are being developed using wide-bandgap SiC technologies, owing to SiC-based technology's advantages, such as high thermal conductivity, reduced switching losses, higher power density, and increased bandwidth capability.
• There has been a growing interest in SiC power semiconductors, with many countries announcing limiting the sales of new internal combustion engine vehicles. As part of these efforts, companies operating in the market studied have been increasing their investments to set up new manufacturing facilities.
• In April 2021, II-VI Incorporated, a leading company operating in wide-bandgap compound semiconductors, announced that it expanded the SiC wafer finishing manufacturing footprint in China to serve one of the largest worldwide markets for EVs and clean energy applications. To meet the increasing market demand in Asia, the company established a backend processing line for conductive SiC substrates in more than 50,000 sq. ft of new cleanroom space at the company's Asia Regional Headquarters in Fuzhou, China.
• However, considering the SiC wafer market, market players have been producing 100 mm and 150 mm wafers. Some companies are focusing on creating 200 mm wafers that may be fully commercialized in the next few years. Hence, commercial sizes of SiC wafers are smaller than Si wafers. This, in turn, limits the efficiency and rate of production of SiC-based semiconductors compared to silicon-based semiconductors.
• The COVID -19 pandemic affected the overall semiconductor manufacturing market from the demand and supply sides. In addition, the global lockdowns and closure of semiconductor plants further fueled the supply shortage. The effects were also reflected in the SiC wafer market. However, many of these effects are likely to be short-term. Precautions by governments across the globe to support automotive and semiconductor sectors could help revive industry growth.

SiC Wafer Market Trends

Automotive and Electric Vehicles End-User Industry Segment to Grow Significantly

• The power-handling limitations of traditional silicon are expected to pave the way for alternative power technologies such as silicon carbide in applications for electric vehicles. Silicon carbide (SiC) is a cutting-edge technology that replaces silicon (Si) in various applications. Moreover, efforts were made to raise the efficiency and range of electric cars (EVs) while reducing the weight and cost of the complete vehicle. Thus, with the increasing power density of control electronics, the notion of employing SiC for EVs was formed.
• SiC is an innovative technology used to replace silicon in many applications. The adoption of SiC wafers in electric vehicles has increased the efficiency, range, weight, and cost of the entire vehicle, thereby increasing the power density of control electronics.
• Moreover, changing government requirements regarding the reduction of CO2 emissions coupled with the electrification of passenger vehicles by various major automakers are contributing to the growth of demand for SiC wafers in the market.
• Vehicle models with different electrification levels have been introduced to the market by automakers, including full hybrid electric vehicles (HEVs), mild-hybrid electric vehicles (MHEVs), plug-in hybrid electric vehicles (PHEVs), zero-emission battery electric vehicles (BEVs), and fuel-cell electric vehicle (FCEVs), among others.
• For instance, in February 2021, Ford invested USD 1 billion in an electric vehicle production facility in Cologne, Germany. The investment aligns with the company's aims to convert its European arm of automotive plants to manufacture electric vehicles.

Asia-Pacific Hold the Largest Market Share

• The Asia-Pacific is a prominent region in the global SiC wafer market, as the region dominates the global semiconductor market, which is also supported by government policies. Furthermore, the region's semiconductor industry is driven by Taiwan, China, Japan, and South Korea, which account for a significant share of the global semiconductor market. In contrast, others, like Thailand, Vietnam, Singapore, and Malaysia, contribute significantly to the region's dominance in the market.
• China is the largest semiconductor market in Asia and globally. As per the semiconductor industry association, China led the semiconductor market with a total chip sales of USD 192.5 billion in 2021, marking an increase of 27.1% year on year. The country is also attracting huge investments from many major chipmakers to expand chip production by launching new facilities.
• In June 2021, China-based Sanan Integrated Circuit (Sanan IC) opened the nation's first vertically integrated SiC line at its Hunan Sanan Semiconductor plant. Located in the Changsha high-tech industrial park in the Hunan province, the company's latest manufacturing fab, with a USD 2.5 billion investment, handles all wafer and device fabrication steps from crystal growth to power devices, packaging, and testing.
• Furthermore, Japanese companies are making heavy investments to increase the production of SiC power semiconductors driven by the demand from the EV industry. For instance, in January 2022, Japan-based Fuji Electric Co. Ltd announced the decision to invest capital in Fuji Electric Tsugaru Semiconductor Co. Ltd, one of its power semiconductor production bases, for an increase in the production of SiC power semiconductors. Mass production is planned to begin in fiscal 2024.
• Furthermore, in March 2022, Tokyo-headquartered Showa Denko KK launched the mass production of silicon carbide single crystal wafers (SiC wafers) with a diameter of 6 inches (150 mm), which are used as materials for SiC epitaxial wafers to be processed and installed into SiC power semiconductors.

SiC Wafer Market Competitor Analysis

The SiC wafer market is highly competitive and consists of some influential players. These players, with a noticeable share in the market, are concentrating on expanding their customer base across foreign countries. They leverage strategic collaborative actions to improve their market percentage and enhance their profitability.

• March 2022 - Showa Denko KK started the mass manufacturing of silicon carbide single crystal wafers (SiC wafers) with a diameter of 6 inches (150 mm), which would be processed and integrated into SiC-based power semiconductors.
• February 2022 - II-VI Incorporated announced that it had qualified its 1200 V silicon carbide MOSFET platform, on its high-quality SiC substrates, to stringent automotive standard requirements. Additionally, the company expanded its relationship with GE by signing a three-year technology access agreement (TAA) with GE Research to access the Lab's global-class SiC module technology and the team of experts to accelerate customer design-in engagement activities.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHT

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power of Suppliers
  • 4.2.2 Bargaining Power of Buyers
  • 4.2.3 Threat of New Entrants
  • 4.2.4 Threat of Substitute Products
  • 4.2.5 Intensity of Competitive Rivalry
• 4.3 Technology Insights
• 4.4 Assessment of the Impact of COVID-19 on the Market

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Rising Penetration Rate of Electric Vehicles (EVs) and the Inclination Toward High-voltage 800V EV Architectures Propelling the Demand for SiC Wafers
  • 5.1.2 Increasing Demand for SiC Wafers in Power Electronics Switches and LED Lighting Devices due to its High Thermal Conductivity
• 5.2 Market Challenges
  • 5.2.1 Limiting Constraints such as Scalability, Heat Dissipation, and Packaging-related Pressure on the Die and Substrate Supply

6 MARKET SEGMENTATION

• 6.1 By Wafer Size
  • 6.1.1 2-, 3-, and 4-inch
  • 6.1.2 6-inch
  • 6.1.3 8- and 12-inch
• 6.2 By Application
  • 6.2.1 Power
  • 6.2.2 Radio Frequency (RF)
  • 6.2.3 Other Applications
• 6.3 By End-user Industry
  • 6.3.1 Telecom & Communications
  • 6.3.2 Automotive & Electric Vehicles (EVs)
  • 6.3.3 Photovoltaic/Power Supply/Energy Storage
  • 6.3.4 Industrial (UPS and Motor Drives, etc.)
  • 6.3.5 Other End-user Industries
• 6.4 By Geography
  • 6.4.1 North America
  • 6.4.2 Europe
  • 6.4.3 Asia-Pacific
  • 6.4.4 Rest of the World

7 COMPETITIVE LANDSCAPE

• 7.1 Company Profiles
  • 7.1.1 Wolfspeed Inc.
  • 7.1.2 II-VI Incorporated
  • 7.1.3 Xiamen Powerway Advanced Material Co. Ltd
  • 7.1.4 STMicroelectronics (Norstel AB)
  • 7.1.5 Showa Denko KK
  • 7.1.6 Atecom Technology Co. Ltd
  • 7.1.7 SK Siltron Co. Ltd
  • 7.1.8 SiCrystal GmbH
  • 7.1.9 TankeBlue Co. Ltd
  • 7.1.10 Semiconductor Wafer Inc.

8 MARKET SHARE ANALYSIS

9 INVESTMENT ANALYSIS

10 FUTURE OF THE MARKET