电子封装市场 - COVID-19 的增长、趋势、影响和预测 (2023-2028)

预测期内，电子封装市场预计将以 18.51% 的复合年增长率增长。

对电视、机顶盒、MP3 播放器和数码相机等产品的需求不断增长，通常会为大规模生产提供电子封装。

主要亮点

• 医疗保健领域使用的许多设备都依赖于半导体製造技术，预计这将对电子封装市场产生影响。 例如，2022 年 1 月，LG 电子推出了其最新的医疗保健产品 MediPain，这是一种止痛家用设备。
• 物联网、人工智能的兴起以及復杂电子产品的激增正在推动消费电子和汽车行业的高端应用领域。 这些因素正在推动采用更先进的电子封装技术来维持需求。 此外，Amkor Technology 和三星电子合作开发了尖端的 H-Cube 解决方案。 三星电子开发了 Hybrid-Substrate，这是最现代的 2.5D 封装解决方案，专门为需要高性能、大面积封装技术的 HPC、AI、数据中心和网络设备的半导体创建。宣布开发 Cube 技术。
• 此外，全球 Wi-Fi 芯片组市场正在向 802.11ac 过渡，MIMO 是第五代 Wi-Fi。 高达 1.3GHz 的长距离通信速度增加了客户对这项技术的采用，从而推动了需求。
• 市场的最新进展包括具有极简美学的创新包装解决方案、新颖、独特、生动且令人难忘的设计，推动了市场增长。我来了。 2022年1月，Smurfit Kappa集团宣布投资3300万美元扩大其在巴西的工厂产能。 这将使该公司能够扩大其针对消费电子产品、易腐食品和药品的上架包装能力。
• 汽车行业在所研究的市场中也占很大比重，这主要是由于越来越多地采用电动汽车 (EV) 和混合动力汽车。 由于电动和混合动力汽车大量使用存储器件、处理器、模拟电路、分立功率器件、传感器等，预计预测期内需求将快速增长。
• 根据 IBEF 的数据，到 2025 年，印度的电动汽车 (EV) 市场预计将达到 50,000 克朗（70.9 亿美元）。 此外，根据 CEEW 能源金融中心的一项研究，到 2030 年，印度将有 2060 亿美元的电动汽车机会。 这些新兴市场的发展将进一步推动电子封装市场的增长。
• 全球流行病的蔓延对电子封装解决方案和消费电子产品封装的销售产生了负面影响。 手机和电脑行业推动了消费电子产品包装需求。 在大流行期间，这些行业的生产并未受到停产、原材料短缺和供应链中断的显着影响。

主要市场趋势

航空航天和国防工业对电子封装的采用不断增长

• 美国、法国和英国等发达国家以及俄罗斯、印度和中国等发展中国家的国防预算都在定期增加。 其中许多国家也将重点放在武器出口上。 因此，航空航天和国防市场的研发持续投资。
• 此外，俄罗斯最近将其军费开支增加了 2.9%，达到 659 亿美元，以支持英国和英国边境沿线的军队。 这是俄罗斯连续第三年增长，最近军费开支达到 GDP 的 4.1%。
• 此外，多种类型的军事和航空航天设备（例如数据处理设备、数据显示系统、计算机以及飞机制导和控制组件）都包含半导体器件。 例如，根据半导体行业协会的数据，2022 年 8 月全球半导体行业收入为 474 亿美元，较 2021 年 8 月微增 0.1%。
• 海军军舰、舰载卫星通信频道、武器控制系统、海岸警卫队等是许多精密电子产品的用户，需要军用级电子和半导体组件封装。 潮湿和恶劣的环境需要高质量的产品并推动研发投资。
• 由于这些因素，预计电子封装在预测期内将出现显着增长。

亚太地区见证了显着的市场增长

• 由于汽车基础设施的发展和电动汽车销量的增加，预计亚太地区在预测期内将占据最大的市场份额。 此外，由于中等收入阶层的增加和年轻人数量的增加，汽车行业的需求有可能会增加。 据IBEF称，2022年6月乘用车、三轮车、两轮车和四轮车的总产量为2,081,148辆，有望推动未来研究市场的增长。
• 此外，中国被认为是世界电子中心，因为它大量生产和製造符合最高质量、性能和交付标准的电气元件和电子产品。 这赋予了电子封装市场巨大的增长潜力。
• 区域企业也在投资安装可实现高效电子和半导体封装的机器。 此外，2022 年 8 月，总部位于印度泰米尔纳德邦的半导体製造商 Polymatech 将在该邦投资 10 亿美元，以扩建其芯片组製造和封装设施。
• 根据国家投资促进和促进局 (NIPFA) 的数据，印度对电子产品的需求显着增加。 由于强有力的政策支持、多方利益相关者的大规模投资以及对电子产品的需求激增，电子製造业预计到 2025 年将达到 2200 亿美元。
• 内需的显着增长、技术进步和高质量产品的生产是中国工业增长的主要驱动力。 中国纸和纸板的大规模生产为电子包装销售创造了健康的环境。

竞争格局

电子封装市场是分散的。 微系统几乎用于每个行业，其中重要的部分包括消费电子产品、医疗保健设备、航空航天和国防以及通信。 随着电子产品集成到其中，IC 等半导体器件已成为机器不可或缺的一部分，这极大地推动了电子封装的发展。 未来，我们可以期待大公司和初创公司之间以创新为重点的收购和合作。

2022 年 2 月，Siemens Digital Industries Software 宣布与半导体封装巨头 Advanced Semiconductor Engineering (ASE) 和两家新公司合作，从事多个复杂集成电路 (IC) 封装的组装和互连。我们宣布将在该平台上展开合作. 2021 年 5 月，英特尔宣布投资 35 亿美元升级其新墨西哥工厂，以製造先进的半导体封装技术，例如英特尔革命性的 3D 封装技术 Foveros。 凭藉其革命性的 3D 封装技术 Foveros，英特尔能够使 CPU 的计算单元垂直堆迭而不是水平堆迭，从而在更小的封装中提供更好的性能。

其他福利。

• Excel 格式的市场预测 (ME) 表
• 三个月的分析师支持

内容

第1章介绍

• 研究假设和市场定义
• 调查范围

第2章研究方法论

第 3 章执行摘要

第4章市场动态

• 市场概览
• 市场驱动因素
  • 对产品和消费者安全的兴趣日益浓厚
  • 通过技术进步提高产品质量
• 市场製约因素
  • 电子封装的高成本和熟练工人短缺阻碍了市场增长
• 行业吸引力 - 波特五力分析
  • 供应商的议价能力
  • 消费者的议价能力
  • 新进入者的威胁
  • 替代品的威胁
  • 竞争公司之间的敌对关係
• 技术快照

第 5 章市场细分

• 按材料
  • 塑料
  • 金属
  • 玻璃
  • 其他材料
• 按最终用户行业
  • 消费类电子产品
  • 航空航天与国防
  • 汽车
  • 医疗保健
  • 其他最终用户行业
• 区域信息
  • 北美
    • 美国
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 其他欧洲
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 其他亚太地区
  • 拉丁美洲
  • 中东和非洲

第6章竞争格局

• 公司简介
  • AMETEK Inc.
  • Dordan Manufacturing Company
  • E. I. du Pont de Nemours and Company
  • GY Packaging, Plastiform Inc.
  • Kiva Container Corporation
  • Primex Design & Fabrication
  • Quality Foam Packaging Inc.
  • Sealed Air Corporation
  • The Box Co-Op
  • UFP Technologies, Inc.

第7章 投资分析

第8章 市场将来性

The Electronic Packaging Market is expected to register a CAGR of 18.51% over the forecast period. Electronic packaging is generally more suited for mass production due to the rising demand for products such as TVs, set-top boxes, MP3 players, and digital cameras.

Key Highlights

• Many devices used in the healthcare sector depend on semiconductor manufacturing technology, which, in turn, is expected to impact the electronic packaging market. For instance, in January 2022, LG Electronics launched its latest healthcare product, "MediPain," a pain relief home device.
• The rise of IoT and AI and the proliferation of complex electronics are driving the high-end application segment in the consumer electronics and automotive industries. Due to these factors, more advanced electronic packaging technologies are being adopted to sustain demand. Furthermore, Amkor Technology and Samsung Electronics collaborated to develop the cutting-edge H-Cube solution. Samsung Electronics has announced the development of Hybrid-Substrate Cube technology, its most contemporary 2.5D packaging solution explicitly created for semiconductors for HPC, AI, data center, and network instruments that demand high-performance and spacious area packaging technology.
• Further, the global wi-fi chipset market is experiencing the transition to the 5th wi-fi generation, the 802.11ac with MIMO. An increasing number of customers are likely to adopt the technology due to an improvement in speed up to 1.3 GHz over long distance, driving the demand.
• Some recent advances in the market contain innovative packaging solutions with a new, unique, vibrant, and memorable design with minimal aesthetics driving the market's growth. In January 2022, Smurfit Kappa Group announced the expansion of its plant capacity in Brazil by investing USD 33 million. This will help the company extend its capabilities for shelf-ready packaging for home appliances, fresh produce, and pharmaceutical products.
• Also, the automotive sector accounts for a significant portion of the market studied, mainly due to its increasing adoption of electric vehicles (EVs) and hybrid vehicles. As a large number of memory devices, processors, analog circuits, discrete power devices, and sensors are used in electric and hybrid cars, the demand is set to rise at a rapid rate over the forecast period.
• According to IBEF, India's electric vehicle (EV) market is expected to reach INR 50,000 crores (USD 7.09 billion) by 2025. Further, a CEEW Centre for Energy Finance study shows India's USD 206 billion in opportunities for electric vehicles by 2030. Such developments will further drive the market growth for electronic packaging.
• The global spread of the pandemic has harmed sales of electronic packaging solutions and consumer electronics packaging. The demand for consumer electronics packaging is driven by the mobile phone and computer industries. Even during the pandemic, the output of these industries was not significantly impacted by a halt in production, a scarcity of raw materials, and supply chain disruptions.

Key Market Trends

Aerospace and Defense Industry to Increasingly Adopt Electronic Packaging

• The defense budgets of developed nations, such as United States, France, United Kingdom, and many developing nations, such as Russia, India, China, etc., have been increasing regularly. Many of these nations are also into the export of weapons. It results in continued investment in R&D in the aerospace and defense market.
• Further, Russia recently increased its military spending by 2.9%, to USD 65.9 billion, as it supported its forces along the United Kingdomrainian border. This was Russia's third consecutive year of growth, with military spending was reached 4.1% of GDP recently.
• Moreover, several types of military and aerospace equipment, such as data processing units, data display systems, computers, and aircraft guidance-control assemblies, are loaded with semiconductor devices. For instance, according to the Semiconductor Industry Association, global semiconductor industry sales were USD 47.4 billion during August 2022, a slight increase of 0.1% over August 2021.
• Naval warships, satellite communication channels on board, weapon control systems, coastguards, etc., are the users of many sophisticated electronic products and require military-grade packaging of the electronic and semiconductor components. Humidity and harsh environment make it necessary for the requirement of high-quality products and facilitate the investment in R&D.
• Owing to these factors, electronic packaging is anticipated to witness significant growth over the forecast period.

Asia-Pacific to Experience Significant Market Growth

• The Asia-Pacific region is estimated to hold the largest market share during the forecast period owing to growing automotive infrastructure and increased sales of electric vehicles. Rising middle-class income and a large youth population may drive up demand in the automotive industry. According to IBEF, in June 2022, the total production of passenger vehicles, three-wheelers, two-wheelers, and quadricycles was 2,081,148 units, which will drive the studied market growth in the future.
• Further, China is considered the electronic hub worldwide because of the mass manufacturing and production of electrical components and electronic products to meet the highest quality, performance, and delivery standards. This gives significant growth potential to the electronic packaging market.
• Regional companies are also investing in installing machinery that enables productive electronic and semiconductor packaging. Further, in August 2022, Polymatech, a semiconductor manufacturing company based in Tamil Nadu, India, invested USD 1 billion in the state to expand its chipset manufacturing and packaging facility.
• According to National Investment Promotion & Facilitation Agency (NIPFA), India has seen a significant increase in demand for electronic products. The electronic manufacturing sector is anticipated to reach USS 220 billion by 2025 due to strong policy support, massive investments by multiple stakeholders, and a surge in demand for electronic products.
• Massive increases in domestic demand, technological advancements, and the production of high-quality products have been China's primary drivers of industry growth. Such large-scale production of paper and paperboard in China is creating a healthy environment for the sales of electronic packaging.

Competitive Landscape

The electronic packaging market is fragmented. Microsystems are used almost in every industry vertical, with some significant sections being consumer electronics, healthcare equipment, aerospace and defense, communications, etc. Semiconductor devices, such as ICs, have become an integral part of a machine as electronics are getting integrated into machines, which is, in turn, driving the growth of electronic packaging significantly. Moving forward, acquisitions and collaboration of large companies with startups are expected, focusing on innovation.

In February 2022 , Siemens Digital Industries Software announced that it is working with Advanced Semiconductor Engineering (ASE), a leading semiconductor packaging supplier, on two platforms for multiple complex integrated circuits (IC) package assemblies and interconnects. Back in May 2021 , the Intel Corporation announced an investment of USD 3.5 billion to upgrade its facilities in New Mexico to manufacture advanced semiconductor packaging technologies, such as Foveros, Intel's innovative 3D packaging technology. Intel can create CPUs with computation tiles stacked vertically instead of side-by-side, owing to Foveros' innovative 3D packaging technique, which offers better performance in a smaller package.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising Concern over Product and Consumer Safety
  • 4.2.2 Technological Advancements Drive the Product Quality
• 4.3 Market Restraints
  • 4.3.1 High Costs for Electronic Packaging and Lack of Skilled Professionals to Challenge the Market Growth
• 4.4 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.4.1 Bargaining Power of Suppliers
  • 4.4.2 Bargaining Power of Consumers
  • 4.4.3 Threat of New Entrants
  • 4.4.4 Threat of Substitute Products
  • 4.4.5 Intensity of Competitive Rivalry
• 4.5 Technology Snapshot

5 MARKET SEGMENTATION

• 5.1 By Material
  • 5.1.1 Plastic
  • 5.1.2 Metal
  • 5.1.3 Glass
  • 5.1.4 Other Materials
• 5.2 By End User Industry
  • 5.2.1 Consumer Electronics
  • 5.2.2 Aerospace and Defense
  • 5.2.3 Automotive
  • 5.2.4 Healthcare
  • 5.2.5 Other End User Industries
• 5.3 By Geography
  • 5.3.1 North America
    • 5.3.1.1 United States
    • 5.3.1.2 Canada
  • 5.3.2 Europe
    • 5.3.2.1 United Kingdom
    • 5.3.2.2 Germany
    • 5.3.2.3 France
    • 5.3.2.4 Rest of the Europe
  • 5.3.3 Asia Pacific
    • 5.3.3.1 China
    • 5.3.3.2 India
    • 5.3.3.3 Japan
    • 5.3.3.4 Rest of the Asia Pacific
  • 5.3.4 Latin America
  • 5.3.5 Middle East & Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Company Profiles
  • 6.1.1 AMETEK Inc.
  • 6.1.2 Dordan Manufacturing Company
  • 6.1.3 E. I. du Pont de Nemours and Company
  • 6.1.4 GY Packaging, Plastiform Inc.
  • 6.1.5 Kiva Container Corporation
  • 6.1.6 Primex Design & Fabrication
  • 6.1.7 Quality Foam Packaging Inc.
  • 6.1.8 Sealed Air Corporation
  • 6.1.9 The Box Co-Op
  • 6.1.10 UFP Technologies, Inc.

7 INVESTMENT ANALYSIS

8 FUTURE OF THE MARKET