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工业电子封装市场 - 按材料类型(塑胶、金属、陶瓷、复合材料)、按包装类型(托盘、管、袋子和小袋、盒子和箱子、机架和橱柜)、按保护等级、按应用和预测, 2023 年 - 2032Industrial Electronics Packaging Market - By Material Type (Plastics, Metals, Ceramics, Composites), By Packaging Type (Trays, Tubes, Bags and pouches, Boxes and Cases, Racks and Cabinets), By Protection Level, By Application & Forecast, 2023 - 2032 |
工业电子封装市场预计2023 年至2032 年复合年增长率将超过4%。製造、汽车和航空航太等各行业越来越多地采用先进的自动化和控制系统,推动了对专业封装解决方案的需求。敏感电子元件。这些系统需要安全的包装,以防止环境因素(例如灰尘、湿气和静电放电)对其功能产生不利影响。
此外,电子设备小型化的不断发展趋势也促进了市场的扩张。例如,2023年6月,东芝推出了100V N通道功率MOSFET,预计将支援电源电路的小型化。这导致了包装材料和设计的创新,可以容纳这些较小的组件,同时提供强大的保护。
全球工业电子封装产业根据材料类型、封装类型、防护等级、应用和地区进行分类。
由于陶瓷材料具有高导热性、优异的电绝缘性以及耐极端温度和腐蚀性环境等卓越特性,陶瓷材料正在获得巨大的吸引力,并将在 2032 年之前继续保持显着的复合年增长率。随着电子设备变得更加紧凑和功率密集,陶瓷提供了有效散热的理想解决方案,确保这些组件的使用寿命和可靠性。此外,它们的稳定性和耐化学降解性使其非常适合在恶劣的工业环境中的应用。
工业电子封装市场的密封封装领域预计在 2023 年至 2032 年期间将大幅成长,因为它具有为敏感电子元件提供不可渗透和安全环境的无与伦比的能力。密封封装可保持组件的完整性,确保其长期功能和可靠性,特别是在关键应用中,即使是最轻微的湿气或杂质进入也可能导致灾难性故障。这种等级的保护对于航空航太、国防和医疗设备等产业至关重要,这些产业的精确度和耐用性至关重要,从而促进了该领域的成长。
由于全球通讯网路的快速扩张和 5G 等先进技术的部署,电信设备封装应用的工业电子封装产业规模预计到 2032 年将大幅成长。坚固的封装对于保护敏感电信设备免受环境因素、振动和机械应力的影响至关重要,这些因素会影响讯号品质和营运效率。电信设备对专业和客製化包装解决方案的需求将有利于市场扩张。
亚太地区工业电子封装市场正在经历强劲成长,并且由于其作为全球製造中心的地位以及各行业对电子元件的需求不断增加,到2032年将实现强劲的复合年增长率。先进技术的快速采用、对永续发展的共同关注,再加上熟练且具有成本效益的劳动力的可用性,将使亚太地区在不久的将来成为工业电子封装行业参与者的利润丰厚的途径。
The Industrial Electronics Packaging Market is estimated to register a CAGR of over 4% during 2023 and 2032. The increasing adoption of advanced automation and control systems across various industries, including manufacturing, automotive, and aerospace, is fueling the demand for specialized packaging solutions for sensitive electronic components. These systems require secure packaging to safeguard against environmental factors, such as dust, moisture, and electrostatic discharge, which can adversely affect their functionality.
Moreover, the growing trend of miniaturization in electronic devices is contributing to the market expansion. For instance, in June 2023, Toshiba introduced 100V N-channel power MOSFET that is anticipated to support power supply circuit miniaturization. This has led to innovations in packaging materials and designs that can accommodate these smaller components while providing robust protection.
The global industrial electronics packaging industry is classified based on material type, packaging type, protection level, application, and region.
The ceramic material is gaining significant traction and will continue to record notable CAGR through 2032 due to its exceptional attributes, such as high thermal conductivity, excellent electrical insulation, and resistance to extreme temperatures and corrosive environments. As electronic devices become more compact and power-dense, ceramics offer an ideal solution to dissipate heat efficiently, ensuring the longevity and reliability of these components. Moreover, their stability and resistance to chemical degradation make them well-suited for applications in harsh industrial settings.
Hermetic packaging segment of industrial electronics packaging market is slated to grow decently over 2023-2032, due to its unmatched ability to provide an impermeable and secure environment for sensitive electronic components. Hermetic packages maintain the integrity of components, ensuring their long-term functionality and reliability, especially in critical applications where even the slightest ingress of moisture or impurities can lead to catastrophic failures. This level of protection is crucial in industries like aerospace, defense, and medical devices, where precision and durability are paramount, boosting the segment growth.
The industrial electronics packaging industry size from telecommunications equipment packaging application is touted to grow tremendously through 2032, owing to the rapid expansion of global communication networks and the deployment of advanced technologies like 5G. Robust packaging is essential to shield sensitive telecom equipment from environmental factors, vibration, and mechanical stress, which can impact signal quality and operational efficiency. The need for specialized and tailored packaging solutions for telecom equipment will favor the market expansion.
Asia Pacific industrial electronics packaging market is experiencing robust growth and will register strong CAGR through 2032, due to its position as a global manufacturing hub, with increased demand for electronic components across various industries. The rapid adoption of advanced technologies, collective focus on sustainability, in consort with availability of a skilled, cost-effective labor force will position the APAC region as a lucrative avenue for industrial electronics packaging industry players in the near future.