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市场调查报告书
商品编码
1536792

电子封装：市场占有率分析、产业趋势/统计、成长预测（2024-2029）

Electronic Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

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简介目录

预计2024年全球电子封装市场规模将达207.5亿美元，2024-2029年预测期间复合年增长率为23.12%，2029年将达587.1亿美元。

电子封装市场

主要亮点

  • 对电视、机上盒、MP3播放器、数位相机等的需求不断增长，使得电子产品包装适合大规模生产。物联网、人工智慧的兴起以及复杂电子产品的激增正在推动消费性电子和汽车产业的高端应用。由于这些因素，正在采用更先进的电子封装技术来维持需求。
  • 电子公司正逐渐将永续实践纳入包装设计中。我们认识到这会对消费者的决策产生重大影响。例如，三星承诺在 2025 年之前在其产品系列中使用环境永续材料。这包括用生物分解性或回收材料替代塑胶包装材料。此类倡议不仅迎合了具有环保意识的购买群体，而且还使该品牌在环保意识日益增强的市场中成为负责任的领导者。
  • 此外，数位革命也对包装设计产生了一些影响。消费性电子产品包装包括二维码、AR（扩增实境）介面、NFC（近距离场通讯）标籤等。这些技术变得越来越流行，并正在改变消费者与包装互动的方式。
  • 这些技术透过将实体包装与数位体验相结合来增强用户参与度。例如，盒子上的二维码可以引导消费者存取包含详细产品规格、使用者评论或产品虚拟实境体验的网站。因此，这些技术正成为消费性电子产品封装套件中不可或缺的一部分。
  • 汽车产业在受调查的市场中占据很大一部分，这主要是由于电动车（EV）和混合动力汽车的日益普及。电动和混合动力汽车汽车使用大量储存装置、处理器、类比电路、分离功率元件和感测器，因此预计在预测期内需求将激增。
  • 据 IBEF 称，到 2025 年，印度电动车 (EV) 市场预计将达到 5,000 亿卢比（70.9 亿美元）。此外，根据 CEEW 能源金融中心的一项研究，到 2030 年，印度的电动车机会将达到 2,060 亿美元。这些新兴市场的开拓预计将进一步推动电子封装市场的成长。
  • 疫情严重影响了电子封装解决方案和消费性电子封装的销售。消费性电子产品包装的需求是由行动电话和电脑产业所推动的。即使在疫情期间，生产停顿、原材料短缺和供应链中断也没有对这些产业的产出产生重大影响。

电子封装市场趋势

电子封装在航太和国防领域的采用预计将增加

  • 美国、法国、英国等已开发国家以及俄罗斯、印度、中国等许多开发中国家的国防预算都在定期成长。其中许多国家也有出口武器的兴趣。因此，航太和国防市场的研发投资仍在继续。
  • 在当今不断变化的地缘政治情势下，必须重视集体自卫的重要性。从武器、导引和导航系统、对抗措施、武装车辆及其动力来源，军队和国防力量对于国家安全和抵御外部威胁至关重要。为了维持强大的军事体系，监视和武装部队必须有效且有效率地运作。
  • 印度国防生产部表示，该国国防产值将从2019财年的8,112亿印度卢比（115.2亿美元）增加至2023财年的1,086.4亿印度卢比（131.6亿美元）。此外，该国的国防电池需求预计将从2022年的4吉瓦时激增至2030年的10吉瓦时。该国国防生产的持续成长，加上国防电池的日益普及，预计将在预测期内推动市场成长。
  • 海军军舰、舰载卫星通讯通道、武器控制系统、海岸防卫队等使用许多先进的电子产品，并需要电子元件采用军用级封装。潮湿和恶劣的环境需要高品质的产品，并鼓励研发投资。

亚太地区市场将实现显着成长

  • 由于汽车基础设施的成长和电动车销量的增加，预计亚太地区在估计和预测期内将占据最大的市场占有率。中产阶级收入的增加和大量年轻人口可能会增加对汽车产业的需求。印度汽车工业商协会（SIAM）预计，2023年乘用车总产量为454万辆，较2022年的365万辆大幅成长，预计将带动未来研究市场的成长马苏。
  • 此外，中国被认为是世界电子中心，因为它生产大量符合最高品质、性能和交付标准的电气元件和电子产品。这为电子封装市场带来了巨大的成长潜力。
  • 内需大幅成长、技术进步、高品质产品生产是中国工业成长的主要动力。中国如此大规模的纸和纸板生产为电子产品包装的销售创造了健康的环境。
  • 据NIPFA（国家投资促进和便利机构）称，印度对电子产品的需求大幅增长。在强有力的政策支持、相关人员大规模投资以及电子产品需求快速成长的推动下，电子製造业预计到2025年将达到2,200亿美元。

电子封装产业概况

电子封装市场较为分散。微系统几乎应用于每个工业领域，其中包括消费性电子、医疗保健设备、航太和国防以及通讯等关键领域。主要市场参与者包括 UFP Technologies、Schott AG、Sealed Air Corporation、DuPont de Nemours, Inc. 和 Sonoco Products Company。

  • 2023 年 9 月，Schott AG 推出了适用于航太业的新型微电子封装。该封装旨在延长航空电子设备保护的使用寿命，同时与可伐铁镍合金製成的传统电子封装相比，重量减轻高达 75%。据说该产品还可以保护敏感电子设备，例如射频设计、直流/直流转换器（DC/DC）、储能设备和感测器组件。

其他好处：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场动态

  • 市场概况
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 消费者议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争公司之间敌对关係的强度
  • 产业价值链分析
  • 市场驱动因素
    • 加速全球电动车销售
    • 技术进步提升产品品质
  • 市场限制因素
    • 电子封装高成本且缺乏熟练的专业人员是市场成长的挑战
  • 技术简介

第五章市场区隔

  • 按材质
    • 塑胶
    • 金属
    • 玻璃
  • 按最终用户产业
    • 家电
    • 航太/国防
    • 车
    • 卫生保健
  • 按地区
    • 北美洲
      • 美国
      • 加拿大
    • 欧洲
      • 英国
      • 德国
      • 法国
      • 义大利
    • 亚洲
      • 中国
      • 印度
      • 日本
      • 澳洲
    • 拉丁美洲
      • 巴西
      • 阿根廷
    • 中东/非洲
      • 阿拉伯聯合大公国
      • 沙乌地阿拉伯

第六章 竞争状况

  • 公司简介
    • SCHOTT AG
    • DuPont de Nemours Inc.
    • Sealed Air Corporation
    • GY Packaging
    • UFP Technologies Inc.
    • Sonoco Products Company
    • Smurfit Kappa Group PLC
    • Dunapack Packaging Group
    • WestRock Company
    • Mondi Group
    • Dordan Manufacturing Company

第七章 投资分析

第八章市场的未来

简介目录
Product Code: 46566

The Electronic Packaging Market size is estimated at USD 20.75 billion in 2024, and is expected to reach USD 58.71 billion by 2029, growing at a CAGR of 23.12% during the forecast period (2024-2029).

Electronic Packaging - Market

Key Highlights

  • Electronic packaging is more suited for mass production due to the rising demand for TVs, set-top boxes, MP3 players, and digital cameras. The rise of IoT and AI and the proliferation of complex electronics drive the high-end application segment in the consumer electronics and automotive industries. Due to these factors, more advanced electronic packaging technologies are being adopted to sustain demand.
  • Electronics corporations are progressively incorporating sustainable practices into their packaging designs. They acknowledge that this can significantly influence consumer decisions. For instance, Samsung has pledged to use environmentally sustainable materials throughout its product range by 2025. This initiative includes substituting plastic packaging materials with biodegradable or recycled goods. Such endeavors not only cater to environmentally conscious buyers but also establish a brand as a responsible leader in an increasingly sensitive market to environmental concerns.
  • Moreover, the digital revolution has impacted packaging design in several ways. Consumer electronics packaging includes QR codes, augmented reality (AR) interfaces, and NFC (near-field communication) tags. These technologies are becoming increasingly popular and are transforming the way consumers interact with packaging.
  • These technologies enhance user engagement by merging physical packaging with digital experiences. For instance, a QR code on a box can direct consumers to a website with detailed product specifications, user reviews, or even virtual reality experiences of the product in action. As a result, these technologies are becoming an essential part of the consumer electronics packaging toolkit.
  • The automotive sector accounts for a significant portion of the market studied, mainly due to its increasing adoption of electric vehicles (EVs) and hybrid vehicles. As a large number of memory devices, processors, analog circuits, discrete power devices, and sensors are used in electric and hybrid cars, demand is set to rise rapidly over the forecast period.
  • According to IBEF, India's electric vehicle (EV) market is expected to reach INR 50,000 crores (USD 7.09 billion) by 2025. Furthermore, a CEEW Centre for Energy Finance study shows that India will have USD 206 billion in opportunities for electric vehicles by 2030. Such developments will further drive the market growth for electronic packaging.
  • The pandemic severely affected the sales of electronic packaging solutions and consumer electronics packaging. The demand for consumer electronics packaging is driven by the mobile phone and computer industries. Even during the pandemic, the halt in production, scarcity of raw materials, and supply chain disruptions did not significantly impact the outputs of these industries.

Electronic Packaging Market Trends

The Aerospace and Defense Segment is Expected to Increasingly Adopt Electronic Packaging

  • The defense budgets of developed nations, such as the United States, France, and the United Kingdom, and many developing nations, such as Russia, India, and China, have been increasing regularly. Many of these nations are also interested in the export of weapons. This has resulted in continued investment in R&D in the aerospace and defense market.
  • The importance of collective defense must be addressed in today's ever-changing geopolitical landscape. From weapons, guidance, navigation systems, countermeasures, and armed vehicles and their power sources, military and defense forces are essential for a nation's security and defense against external threats. Surveillance and armed forces must operate effectively and efficiently to maintain a strong military system.
  • According to the Department of Defence Production (India), the value of the country's defense production increased from INR 811.20 billion (USD 11.52 billion) in FY 2019 to INR 1086.84 billion (USD 13.16 billion) in FY 2023. Furthermore, the country's demand for defense batteries was expected to surge from 4 gigawatt hours in 2022 to 10 gigawatt hours in 2030. Such a constant rise in defense production in the country, coupled with the rise in the adoption of defense batteries, is expected to bolster the market growth during the forecast period.
  • Naval warships, satellite communication channels on board, weapon control systems, coastguards, etc., use many sophisticated electronic products and require military-grade packaging of the electronic components. Humidity and harsh environments require high-quality products and facilitate investment in R&D.

Asia-Pacific to Experience Significant Market Growth

  • Asia-Pacific is estimated to hold the largest market share during the forecast period owing to growing automotive infrastructure and increased sales of electric vehicles. Rising middle-class income and a large youth population may drive up demand in the automotive industry. According to the Society of Indian Automobile Manufacturers (SIAM), in 2023, the total production of passenger vehicles was 4.54 million units, significantly up from 3.65 million units in 2022, which would drive the growth of the market studied in the future.
  • Furthermore, China is considered the electronic hub worldwide because it mass-manufactures and produces electrical components and electronic products that meet the highest quality, performance, and delivery standards. This gives significant growth potential to the electronic packaging market.
  • Massive increases in domestic demand, technological advancements, and the production of high-quality products have been China's primary drivers of industry growth. Such large-scale production of paper and paperboard in China is creating a healthy environment for the sales of electronic packaging.
  • According to the National Investment Promotion & Facilitation Agency (NIPFA), India has seen a significant increase in demand for electronic products. The electronic manufacturing sector is anticipated to reach USD 220 billion by 2025 due to strong policy support, massive investments by multiple stakeholders, and a surge in demand for electronic products.

Electronic Packaging Industry Overview

The electronic packaging market is fragmented. Microsystems are used in almost every industry vertical, with some significant sections being consumer electronics, healthcare equipment, aerospace and defense, communications, etc. The major market players include UFP Technologies, Schott AG, Sealed Air Corporation, DuPont de Nemours, Inc., and Sonoco Products Company.

  • In September 2023, Schott AG unveiled new microelectronic packages for the aerospace industry. The packages aim to extend the life of avionics protection while reducing the weight by up to 75% compared to conventional electronic packaging made from Kovar iron-nickel alloy. The products are also said to protect sensitive electronics, such as radio frequency designs, direct current/direct current converters (DC/DC), electrical storage devices, and sensor components.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Market Drivers
    • 4.4.1 Accelerated Sales of Electrical Automotives Across the Globe
    • 4.4.2 Technological Advancements Drive the Product Quality
  • 4.5 Market Restraints
    • 4.5.1 High Costs for Electronic Packaging and Lack of Skilled Professionals to Challenge the Market Growth
  • 4.6 Technology Snapshot

5 MARKET SEGMENTATION

  • 5.1 By Material
    • 5.1.1 Plastic
    • 5.1.2 Metal
    • 5.1.3 Glass
  • 5.2 By End User Industry
    • 5.2.1 Consumer Electronics
    • 5.2.2 Aerospace and Defense
    • 5.2.3 Automotive
    • 5.2.4 Healthcare
  • 5.3 By Geography***
    • 5.3.1 North America
      • 5.3.1.1 United States
      • 5.3.1.2 Canada
    • 5.3.2 Europe
      • 5.3.2.1 United Kingdom
      • 5.3.2.2 Germany
      • 5.3.2.3 France
      • 5.3.2.4 Italy
    • 5.3.3 Asia
      • 5.3.3.1 China
      • 5.3.3.2 India
      • 5.3.3.3 Japan
      • 5.3.3.4 Australia
    • 5.3.4 Latin America
      • 5.3.4.1 Brazil
      • 5.3.4.2 Argentina
    • 5.3.5 Middle East & Africa
      • 5.3.5.1 United Arab Emirates
      • 5.3.5.2 Saudi Arabia

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles*
    • 6.1.1 SCHOTT AG
    • 6.1.2 DuPont de Nemours Inc.
    • 6.1.3 Sealed Air Corporation
    • 6.1.4 GY Packaging
    • 6.1.5 UFP Technologies Inc.
    • 6.1.6 Sonoco Products Company
    • 6.1.7 Smurfit Kappa Group PLC
    • 6.1.8 Dunapack Packaging Group
    • 6.1.9 WestRock Company
    • 6.1.10 Mondi Group
    • 6.1.11 Dordan Manufacturing Company

7 INVESTMENT ANALYSIS

8 FUTURE OF THE MARKET