半导体后端设备：市场占有率分析、产业趋势与统计、成长预测，2024-2029

上年度全球半导体后端设备市场价值为846亿美元，预计未来五年将达1,380.2亿美元，预测期内复合年增长率为8.5%。

主要受家用电子电器应用推动的半导体产业大幅扩张，是推动全球半导体后端设备市场成长的关键因素之一。

主要亮点

• 设计、前端和后端是半导体製造流程的三个主要组成部分。后端半导体製造是指在晶圆上创建所有功能/电路之后的步骤，包括用于封装、测试和组装积体电路的工具。极高的精度、精度和高吞吐量使这项令人兴奋的技术成为可能。
• 智慧型手机和先进家用电子电器和汽车开发等其他设备的成长正在推动全球半导体产业的发展。无线技术（5G）和人工智慧等技术进步正在推动这些产业的发展。因此，包括对高性能和经济实惠的半导体晶片的需求持续增长在内的多种因素，在短期、中期和长期范围内以不同的方式影响着市场。例如，根据爱立信的行动报告，到年终年底，全球5G用户数将达到46亿，约占所有行动用户数的一半。
• 这些趋势的影响也反映在半导体销售上。例如，2023年2月，半导体产业协会（SIA）宣布，2022年全球半导体产业销售额为5,741亿美元，比上年的5,559亿美元成长3.3%。半导体产业的显着成长也可能推动后端设备市场，在预测期内提供大量机会。
• 此外，增加对半导体设备价值链的投资也为所研究市场的成长提供了良好的前景。例如，根据SEMI的预测，全球半导体製造设备销售额将从2021年的1,026亿美元成长到2022年的1,076亿美元，成长5%。
• 不过，市场也看到了一些与成本相关的抑制因素。例如，混合连接最困难的挑战之一是成本。这种类型的处理被认为是晶片製造商、晶圆代工厂和 IDM 晶圆厂后端的延伸。与其他类型的包装相比，所需的设备更加昂贵且自动化，且製程清洁度标准也更加严格。
• 此外，持续不断的地缘政治衝突，例如美国贸易争端和俄罗斯-乌克兰衝突，对半导体产业的价值链产生了重大影响。例如，这些衝突已经影响产业一段时间，加剧了晶片短缺和半导体供应链问题。这种干扰可能导致镍、钯、铜、钛、铝和铁矿石等关键原料的价格波动，进而扰乱半导体製造。

半导体后端设备市场趋势

黏合设备预计将推动市场发展。

• 由于对具有更高效率、处理能力和更小占地面积的半导体晶片的需求不断增长，半导体键合设备将得到应用，从而推动预测期内的市场需求。此外，随着前端製程的显着发展，对半导体键合设备的需求不断增加。
• 支援黏合设备需求的主要因素之一是智慧型手机、穿戴式装置、个人电脑和智慧家居设备等家用电子电器和运算设备产品的成长。半导体晶片/IC 消耗的增加为所研究市场的成长创造了良好的前景，因为这些设备使用多个积体电路或半导体晶片。例如，根据 WSTS 的数据，2023 年半导体整合市场预计将达到 4,530.4 亿美元，而 2016 年为 2,767 亿美元。
• 此外，对尖端封装技术和其他应用的投资也推动了对黏合设备解决方案的需求。例如，2022 年 3 月，英特尔公司在欧盟半导体价值链上投资了 800 亿欧元，其中包括尖端封装技术。此外，製造商正致力于改进製造后端机械和半导体製造设备（SME）所需的半导体。例如，全球重要的连接和电源解决方案提供商 Qorvo 于 2023 年 2 月透露，它已获得 Adeia Inc. 的 Adeia混合键合技术许可。
• 对半导体设备製造设备的投资不断增加也为所研究市场的成长创造了良好的前景。例如，晶片设备製造商ASML于2022年11月宣布将在韩国开设新厂生产半导体设备。该公司宣布将投资 2,400 亿韩元（1.81 亿美元）建设占地 16,000平方公尺的设施。预计于 2024 年下半年开始营运。由于键结是半导体晶片製造过程中的重要步骤，这些新兴市场的开拓预计将带来未来的市场机会。
• 此外，不同行业各种应用对键合设备的需求预计将在未来几年推动市场。汽车製造商也在多种乘客安全应用中使用 MEMS 和光电子技术，这主要是由于人们对乘客和驾驶员安全的担忧日益增加。黏合设备可以提供这些汽车组件所需的精密封装。

亚太地区实现显着成长

• 亚太半导体后端设备市场预计在预测期内将迅速扩大。预计该市场将受到国内主要供应商的策略性投资和成熟半导体产业扩张的推动。随着未来四年晶片消费量的增加，亚太地区的半导体市场规模预计将是美洲的三倍以上。
• 此外，该地区还是一些世界上最大的半导体製造商的所在地。据SIA称，包括台湾、中国、韩国和日本在内的东亚地区占全球半导体产能的75%。随着全球晶片短缺的持续，亚太地区的其他几个国家正在建立新的代工设施，以满足对后端设备的需求。
• 根据半导体设备与材料国际公司的数据，2022年中国大陆在半导体设备上的支出为282.7亿美元，而台湾则为268.2亿美元。支出逐年增加，很可能成为受访市场的驱动力。此外，台湾正迅速成为半导体生产的市场参与者，对製造和后端机械产生了很高的需求。据SIA称，台湾（92%）和韩国（8%）拥有全球最先进（<10奈米厚）的半导体製造能力。
• 此外，由于国内晶片需求的增加，预计中国将取代美国成为全球领先的半导体产业强国。根据半导体产业协会预测，到2030年，半导体市场规模将翻一番，达到1兆美元以上，其中中国贡献了60%以上的成长。如此快速的成长预计将增加对半导体键合设备的需求。
• 此外，随着5G技术的引入，该地区用于半导体製造的设备市场正在扩大，预计这将为世界数位基础设施提供主要推动力，从而带动对半导体晶片的需求。例如，GSM协会的《2022年亚太移动经济》报告预测，到2025年，5G连线数将达到4亿，占所有行动连线数的14%以上。这些发展可能会在未来几年推动亚太市场的发展。

半导体后端设备产业概况

半导体后端设备市场竞争温和。各种服务供应商定期要求后端设备来满足其不断增长的半导体需求。由于设定和研发成本非常高，因此最好利用知名品牌的专业知识来管理这种需求和订单的涌入。然而，政府监管支持和企业合作以提高产量已成为该行业的常态。主要市场参与者包括 ASML Holding NV、Applied Materials, Inc.、Tokyo Electron Ltd. 和 Lam Research Corporation。

2023年8月，领先的半导体代工厂台积电开始向多家先进封装设备供应商新订单。本公司与固登精工、Apic Yamada、Disco、Scientech等供应商合作。与设备供应商的合作突显了该公司为加强其先进封装能力所做的持续努力。

2023年6月，美国晶圆製造设备製造商Lam Research宣布，将能够一步在晶圆边缘两侧形成专有的保护膜，以防止先进半导体製造过程中出现的缺陷和损坏。隆重推出Coronaus DX，它能够采用以前无法实现的先进逻辑、封装和晶片製造製程。预计此类发展也将影响先进后端设备的发展。

其他福利：

• Excel 格式的市场预测 (ME) 表
• 3 个月分析师支持

目录

第一章简介

• 研究假设和市场定义
• 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

• 市场概况
• 价值链/供应链分析
• 产业吸引力－波特五力分析
  • 买方议价能力
  • 供应商的议价能力
  • 新进入者的威胁
  • 替代品的威胁
  • 竞争公司之间敌对关係的强度
• 宏观经济走势对市场的影响

第五章市场动态

• 市场驱动因素
  • 电动和混合动力汽车对半导体的需求增加
  • 建立新代晶圆代工厂的需求（国际​​晶片短缺）
• 市场抑制因素
  • 设定成本高
  • 产品的不断发展影响着需求

第六章市场区隔

• 按类型
  • 晶圆测试
  • 切块
  • 黏合
  • 测量
  • 组装和包装
• 按地区
  • 北美洲
  • 欧洲
  • 亚太地区
    • 中国
    • 台湾
    • 韩国
    • 日本
    • 其他亚太地区

第七章 竞争形势

• 公司简介
  • ASML Holding
  • Applied Materials
  • Lam Research
  • Tokyo Electron Limited
  • KLA Corporation
  • Advantest Corporation
  • Onto Innovation Inc.
  • SCREEN Holdings Co. Ltd.
  • Teradyne Inc.
  • Toshiba Corporation

第八章投资分析

第9章市场的未来

The Global Semiconductor Back-End Equipment Market was valued at USD 84.6 billion in the previous year and is expected to register a CAGR of 8.5 percent during the forecast period to become USD 138.02 billion by the next five years. The significant expansion of the semiconductor industry, primarily fueled by consumer electronics applications, is one of the primary elements augmenting the growth of the Global Market for semiconductor back-end equipment.

Key Highlights

• The design, front-end, and back-end processes are the three main components of the semiconductor manufacturing process. Back-end semiconductor manufacturing refers to the processes after all features/circuits have been created on the wafer and includes tools for packaging, testing, and assembling integrated circuits. Extreme accuracy, precision, and high throughput make for this exciting technology.
• The growth of smartphones and other devices, such as advanced consumer electronics and automotive development, drives the global semiconductor industry. Technology advancements like wireless technologies (5G) and artificial intelligence drive these industries. As a result, several factors, including the consistent increase in demand for high-performance and affordable semiconductor chips, influence the Market in different ways over the short-, medium-, and long-term horizons. For instance, according to Ericsson Mobility Report, by the end of 2028, there will be 4.6 billion 5G subscriptions globally, accounting for about half of all mobile subscriptions.
• The impact of such trends is evident on the semiconductor sales. For instance, in February 2023, the Semiconductor Industry Association (SIA) announced global semiconductor industry sales totaled USD 574.1 billion in 2022, reporting an increase of 3.3% compared to the previous year's total of USD 555.9 billion. The semiconductor industry's significant growth will also drive the Market for back-end equipment, opening up numerous opportunities during the forecast period.
• Furthermore, the growing investment in the semiconductor equipment value chain also creates a favorable outlook for the growth of the studied Market. For instance, according to SEMI, the global sales of semiconductor manufacturing equipment increased 5% from USD 102.6 billion in 2021 to a record of USD 107.6 billion in 2022.
• However, the Market is also witnessing several restraints associated with cost. For instance, one of the most challenging issues with hybrid bonding is cost. This type of processing is seen by chip makers, foundries, and IDMs as an extension of the wafer fab back end of the line. The equipment required is more expensive and automated than other types of packaging, and the standards for process cleanliness are much stricter.
• Further, the ongoing geo-political conflicts such as the US-China trade dispute and the conflict between Russia and Ukraine significantly impact the value chain of the semiconductor industry as these conflicts have resulted in the implementation of various types of sanctions of several countries which in turn impacts the growth of the studied Market. For example, these conflicts have already exacerbated the chip shortages and semiconductor supply chain issues that have affected the industry for some time. The disruption may also result in volatile pricing for critical raw materials such as nickel, palladium, copper, titanium, aluminum, and iron ore, which may obstruct the manufacturing of Semiconductors.

Semiconductor Back-End Equipment Market Trends

Bonding Equipment is Expected to Drive the Market.

• Semiconductor Bonding Equipment finds application due to rising demand for semiconductor chips with higher efficiency, processing power, and smaller footprint, driving demand for the market during the forecast period. The need for semiconductor bonding equipment has also increased due to significant developments in front-end processes.
• One of the main factors assisting the demand for bonding equipment is the growth of consumer electronic and computing device products such as smartphones, wearables, PCs, smart home devices, etc. As these devices use multiple integrated circuits and semiconductor chips, the growing consumption of semiconductor chips/ICs creates a favorable outlook for the studied market's growth. For instance, according to WSTS, the semiconductor-integrated market is anticipated to reach a value of USD 453.04 billion in 2023, compared to USD 276.7 billion in 2016.
• Furthermore, investments in cutting-edge packaging technologies and other applications also drive the demand for bonding equipment solutions. For instance, in March 2022, Intel Corp. invested EUR 80 billion across the entire semiconductor value chain in the European Union, including cutting-edge packaging technologies. Moreover, the manufacturers are also concentrating on improving the semiconductors needed to make the back-end machinery and semiconductor manufacturing equipment (SME). For instance, Qorvo, a significant global provider of connectivity and power solutions, was revealed to have licensed Adeia's hybrid bonding technology in February 2023 by Adeia Inc.
• The growing investments in semiconductor equipment manufacturing facilities also create a favorable outlook for the growth of the studied market. For instance, the chip equipment manufacturer ASML announced in November 2022 that it was to open a new facility in South Korea to produce semiconductor equipment. The company announced that it would spend WON 240 billion (USD 181 million) to build a facility that would be 16,000 square meters. The expected start of operations is in the second half of 2024. These futuristic industry developments are expected to lead to future market opportunities, as bonding is a crucial process in the semiconductor chip manufacturing process.
• Moreover, in the upcoming years, the market is expected to be driven by the demand for bonding equipment for various applications across industries. Primarily due to the rising concerns about the safety of passengers and drivers, automobile manufacturers are also using MEMS and optoelectronics in several passenger safety applications. Bonding equipment can provide the high-precision packaging that these automobile assemblies require.

Asia-Pacific to Witness a Significant Growth

• The Asia-Pacific Semiconductor Back-End Equipment Market is expected to expand rapidly during the forecast period. The Market is anticipated to be driven by strategic investments made by important domestic suppliers and the expansion of the well-established semiconductor industry. As chip consumption increases in the next four years, the Asia-Pacific semiconductor market is expected to more than triple in size from that of the Americas.
• Furthermore, the region is home to one of the biggest semiconductor manufacturers in the world. According to SIA, East Asia, which includes Taiwan, China, South Korea, and Japan, has 75 percent of the world's capacity for producing semiconductors. Several other countries in the Asia Pacific intend to establish new foundry facilities and draw demand for back-end equipment because of the ongoing global chip shortage.
• According to Semiconductor Equipment and Materials International, in 2022, spending on semiconductor equipment in China amounted to USD 28.27 billion, while in Taiwan, it stood at USD 26.82 billion. The expenditure has increased yearly, which will drive the studied Market. Further, Taiwan is quickly becoming a market player in the production of semiconductors, creating a high demand for manufacturing and back-end machinery. Taiwan (92%) and South Korea (8%), according to SIA, are responsible for all of the world's most sophisticated (below 10nm thickness) semiconductor manufacturing capacities.
• In addition, it is anticipated that China will surpass the United States as the world's significant semiconductor industry powerhouse due to its growing domestic chip demand. According to the Semiconductor Industry Association, the semiconductor market will double in size to reach more than USD 1 trillion by 2030, with China accounting for more than 60% of that growth. Such exponential growth is anticipated to increase demand for semiconductor bonding equipment.
• Furthermore, the Market for equipment used in semiconductor manufacturing in the region is expanding due to the introduction of 5G technology, which is anticipated to provide a significant boost to the digital infrastructure globally, driving the demand for semiconductor chips. For instance, the Mobile Economy Asia-Pacific 2022 report from the GSM Association projects that by 2025, there will be 400 million 5G connections, equivalent to over 14% of all mobile links. In the upcoming years, such developments will fuel the Market in the Asia Pacific region.

Semiconductor Back-End Equipment Industry Overview

The semiconductor back-end equipment market is moderately competitive. Various service providers regularly demand back-end equipment to cope with the ever-increasing semiconductor need. This influx of demand and orders is best managed with the expertise of well-established brands due to extensively high setup and R&D costs. However, government regulation support and company partnerships to boost production are standard in the industry. Some key market players include ASML Holding N.V., Applied Materials, Inc., Tokyo Electron Limited, and Lam Research Corporation, among others.

In August 2023, TSMC, a leading semiconductor foundry, began placing new orders with several advanced packaging equipment suppliers. The company has been working with suppliers such as Gudeng Precision Industrial, Apic Yamada, Disco, and Scientech. The decision to engage with equipment suppliers highlights the company's ongoing efforts to enhance its advanced packaging capabilities.

In June 2023, Lam Research, an American wafer fabrication equipment manufacturer, unveiled Coronus DX, which can, in a single step, deposit a proprietary layer of protective film on both sides of the wafer edge to help prevent damage and defects and damage that occur during advanced semiconductor manufacturing, paving the way for adoption of advanced logic, packaging and chip production processes that weren't feasible before. Such developments are also anticipated to influence the development of advanced back-end equipment.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

• 4.1 Market Overview
• 4.2 Value Chain / Supply Chain Analysis
• 4.3 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.3.1 Bargaining Power of Buyers
  • 4.3.2 Bargaining Power of Suppliers
  • 4.3.3 Threat of New Entrants
  • 4.3.4 Threat of Substitute Products
  • 4.3.5 Intensity of Competitive Rivalry
• 4.4 Impact of Macroeconomic Trends on The Market

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Increasing Demand for Semiconductors in Electric and Hybrid Vehicles
  • 5.1.2 Demand for Setting Up New Foundries (International Chip Shortage)
• 5.2 Market Restraints
  • 5.2.1 High Setup Costs
  • 5.2.2 Constant Evolution of Products Influencing Demand

6 MARKET SEGMENTATION

• 6.1 By Type
  • 6.1.1 Wafer Testing
  • 6.1.2 Dicing
  • 6.1.3 Bonding
  • 6.1.4 Metrology
  • 6.1.5 Assembly and Packaging
• 6.2 By Geography
  • 6.2.1 North America
  • 6.2.2 Europe
  • 6.2.3 Asia-Pacific
    • 6.2.3.1 China
    • 6.2.3.2 Taiwan
    • 6.2.3.3 South Korea
    • 6.2.3.4 Japan
    • 6.2.3.5 Rest of the Asia-Pacific

7 COMPETITIVE LANDSCAPE

• 7.1 Company Profiles
  • 7.1.1 ASML Holding
  • 7.1.2 Applied Materials
  • 7.1.3 Lam Research
  • 7.1.4 Tokyo Electron Limited
  • 7.1.5 KLA Corporation
  • 7.1.6 Advantest Corporation
  • 7.1.7 Onto Innovation Inc.
  • 7.1.8 SCREEN Holdings Co. Ltd.
  • 7.1.9 Teradyne Inc.
  • 7.1.10 Toshiba Corporation

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET