查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1432346

混合储存立方体：市场占有率分析、产业趋势、成长预测（2024-2029）

Hybrid Memory Cube - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

简介目录

混合储存立方体（HMC）市场规模预计到2024年为14.5亿美元，到2029年达到29.2亿美元，在预测期内（2024-2029年）复合年增长率为15.11%。

混合储存立方体市场

混合记忆体立方体是一项突破性技术，代表着目前记忆体架构的模式转移。

主要亮点

  • 推动混合储存立方体（HMC）市场扩张的关键因素是伺服器群和员工数量的增加、商业设备出货的增加、创投库存以及消费硬体领域组装活动的增加。由于对高频宽的需求不断增加、人工智慧的使用增加以及电子设备小型化的趋势等因素，HMC和HBM市场正在扩大。
  • HMC 正在透过实现可取代传统 DRAM 系统的进步来重新定义记忆体。 HMC 正在记忆体市场制定新标准，与现有系统（例如 CPU）所达到的计算速度相符。
  • HMC 打破了记忆体障碍并显着提高了频宽和效能。 HMC 的架构比目前记忆体架构的效率显着提高，每位元能耗比目前 DRAM 技术低 70%。
  • 对行动性的不断增长的需求以及云端服务日益增长的影响力预计将进一步增加对 HMC 解决方案的需求。这是因为 HMC 的高频宽提高了网路系统的效能以匹配线路速度。
  • COVID-19大流行影响了全球工业部门，2020年全球经济受到负面影响。半导体、消费性电子、旅游、汽车等众多产业受到疫情的严重影响，对混合储存立方体市场产生了负面影响。

混合储存立方体市场趋势

网路和通讯产业预计将录得显着成长

  • 全球通讯产业正在经历基础设施向宽频和行动技术发展的持续转型。
  • 混合记忆体立方体越来越多地用于高效能运算 (HPC)。 HPC 可以指一组分散式和平行化技术，用于连接计算单元以更快地执行更复杂的任务。
  • 边缘运算网路和通讯技术支援透过连接的分散式通讯设备进行长距离资讯传输。
  • 资讯传输、交换、处理、分析和搜寻方面的快速技术创新对于各种新兴通讯技术的成功至关重要，这可能会间接影响预测期内 HMC 市场的成长。 5G的出现预计将提振HMC市场。

亚太地区预估复合年增长率最快

  • 由于消费群和资料流量不断增长，该地区的零售、医疗保健和 IT/通讯行业需要先进、高速的资料处理系统。此外，中国希望在通讯、物联网、巨量资料和云端运算等应用领域建立世界一流的IC设计单位，这有望进一步提振HMC市场。
  • 连网型设备产生的大量资料以及巨量资料应用的出现给资料中心的储存系统和容量带来了巨大的压力，企业正在寻找解决方案。 HMC 具有巨大的潜力，不仅可以减少工作负载，还可以提高资料中心效能并降低功耗。
  • 亚太地区互联网基础设施的发展导致该地区采用模组化资料中心。这就是亚太地区各种规模和产业的企业都在拥抱数位革命的原因。这也推动资料中心供应商和使用者继续增加对模组化资料中心建置和服务的投资。由于这些重要措施，预计亚太地区在预测期内的成长率最高，达 58.57%。

混合立方内存产业概况

混合储存立方体市场的主要公司众多，因此公司之间的竞争非常激烈。主要参与者包括美光科技、三星、英特尔和富士通。这些参与者为其产品带来的创新以及预测消费者需求并将新产品推向市场的能力使他们比其他参与者俱有竞争优势。透过在 HMC 领域对研发、策略合作伙伴关係和併购的大量投资，公司获得了可观的市场占有率。

  • 2023 年 1 月 - Aerospike 让资料能够处理具有全球弹性的应用程式、即时操作或实现近乎即时的决策。

其他福利：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场动态

  • 市场概况
  • 市场促进因素与市场约束因素介绍
  • 市场驱动因素
    • 企业储存应用需求增加
  • 市场限制因素
    • 现有 DRAM 的存在
  • 产业吸引力－波特五力分析
    • 买家/消费者的议价能力
    • 供应商的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争公司之间敌对关係的强度

第五章市场区隔

  • 按最终用户产业
    • 企业储存
    • 通讯和网路
    • 其他最终用户产业
  • 按地区
    • 北美洲
      • 美国
      • 加拿大
    • 欧洲
      • 英国
      • 德国
      • 法国
      • 其他欧洲国家
    • 亚太地区
      • 中国
      • 日本
      • 韩国
      • 台湾
      • 其他亚太地区
    • 世界其他地区
      • 拉丁美洲
      • 中东/非洲

第六章 竞争形势

  • 公司简介
    • Micron Technologies Inc.
    • Intel Corporation
    • Xilinx Inc.
    • Fujitsu Ltd.
    • Semtech Corporation
    • Open Silicon Inc.
    • ARM Holdings PLC
    • Samsung Electronics Co. Ltd.
    • IBM Corporation
    • Altera Corporation

第七章 投资分析

第八章 市场机会及未来趋势

简介目录
Product Code: 46357

The Hybrid Memory Cube Market size is estimated at USD 1.45 billion in 2024, and is expected to reach USD 2.92 billion by 2029, growing at a CAGR of 15.11% during the forecast period (2024-2029).

Hybrid Memory Cube - Market

A hybrid memory cube (henceforth called HMC) is a revolutionary technology that signifies a paradigm shift from current memory architectures.

Key Highlights

  • The significant factors driving the Hybrid Memory Cube (HMC) market expansion are the rising number of server farms and employees, the rising shipments of business equipment, and the rising number of assembling activities in the venture stockpiling and consumer hardware sectors. The market for HMC and HBM is expanding due to factors like the rising need for high bandwidth, rising AI use, and developing trends in electronic device downsizing.
  • HMC is redefining memory by enabling advancements that can replace conventional DRAM-based systems. It is setting a new standard in the memory market that matches the computing speeds realized by existing systems (such as CPU).
  • HMC dramatically improves bandwidth and performance by breaking through the memory wall. The architecture of HMC is exponentially more efficient than current memory architectures, utilizing 70% less energy per bit than current DRAM technologies. For instance, Synopsys Inc. announced the availability of its next-generation Verification IP (VIP) for Micron's Hybrid Memory Cube (HMC) architecture. This can enable Micron's HMC with ease of use, fast integration, and optimum performance, resulting in accelerated verification closure.
  • The ever increasing demand for mobility and the rising impact of cloud services is expected to further create demand for HMC solutions, owing to their higher bandwidth, which boosts the capability of networking systems to match line speed performance.
  • The COVID-19 pandemic impacted worldwide sectors, and the global economy was negatively impacted in 2020. Many industries, such as semiconductors, consumer electronics, travel, and automobile, were severely impacted due to the pandemic, which negatively impacted the hybrid memory cube market.

Hybrid Memory Cube Market Trends

Networking and Telecommunication Segment is Expected to Register a Significant Growth

  • The global telecommunication sector is continuously transitioning as infrastructure improvements to broadband and mobile technologies continue.
  • Hybrid memory cubes are increasingly used for high-performance computing (HPC), which can be termed as the set of distributed and parallelization techniques used to connect computing units to perform more complex tasks faster.
  • Edge computing networks and telecommunication technologies support information transmission over distances via., connected and distributed communication devices.
  • Rapid innovations in transmitting, switching, processing, analyzing, and retrieving information are essential for the success of various emerging telecommunication technologies, and this is likely to indirectly influence the growth of the HMC market over the forecast period. The advent of 5G is expected to boost the HMC market.

Asia-Pacific is Expected to Witness Fastest CAGR

  • The region's industries, such as retail, healthcare, IT, and telecommunication, need advanced and fast data processing systems due to the increasing consumer base and data traffic. Moreover, China wishes to establish a world-class IC design unit in applications, such as telecommunications, IoT, big data, and cloud computing industries, which is expected to further boost the HMC market.
  • The enormous amount of data generated through the connected devices and the emergence of Big Data applications have put intense pressure on the data center memory systems and capacity, making the companies look for solutions to the problem. HMCs have a huge potential that could reduce not only the workload but also increase the performance and reduce power consumption by the data centers.
  • The development of internet infrastructure in Asia-Pacific leads to the employment of modular data centers in this region. Therefore, Asia-Pacific companies of all sizes and industries are embracing the digital revolution. It is also driving data center providers and users to continuously increase their investment in the construction and services of modular data centers. Due to these significant measures, Asia-Pacific is expected to account for the highest growth rate of 58.57% over the forecast period.

Hybrid Memory Cube Industry Overview

The competitive rivalry among the players in the hybrid memory cube market is high due to the presence of many major players. Some major players include Micron Technologies, Samsung, Intel, Fujitsu, and many more. The innovations brought about by these players in their products and their ability to introduce a new product in the market by forecasting the needs of their consumers has enabled them to gain a competitive advantage over other players. Hefty investments in research and development, strategic partnerships, and mergers and acquisitions in the field of HMC have enabled the companies to capture a significant market share.

  • January 2023 - Aerospike enabled businesses to make real-time or nearly real-time decisions with the help of its modern data platform, which can handle globally resilient applications, function at an infinite scale, and provide predictable performance and cost-effectiveness.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope Of The Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Introduction to Market Drivers and Restraints
  • 4.3 Market Drivers
    • 4.3.1 Increasing Demand for Enterprise Storage Application
  • 4.4 Market Restraints
    • 4.4.1 Strong Presence of Existing DRAMs
  • 4.5 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.5.1 Bargaining Power of Buyers/Consumers
    • 4.5.2 Bargaining Power of Suppliers
    • 4.5.3 Threat of New Entrants
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry

5 MARKET SEGMENTATION

  • 5.1 By End-user Industry
    • 5.1.1 Enterprise Storage
    • 5.1.2 Telecommunications and Networking
    • 5.1.3 Other End-user Industries
  • 5.2 Geography
    • 5.2.1 North America
      • 5.2.1.1 United States
      • 5.2.1.2 Canada
    • 5.2.2 Europe
      • 5.2.2.1 United Kingdom
      • 5.2.2.2 Germany
      • 5.2.2.3 France
      • 5.2.2.4 Rest of Europe
    • 5.2.3 Asia-Pacific
      • 5.2.3.1 China
      • 5.2.3.2 Japan
      • 5.2.3.3 South Korea
      • 5.2.3.4 Taiwan
      • 5.2.3.5 Rest of Asia-Pacific
    • 5.2.4 Rest of the World
      • 5.2.4.1 Latin America
      • 5.2.4.2 Middle-East & Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Micron Technologies Inc.
    • 6.1.2 Intel Corporation
    • 6.1.3 Xilinx Inc.
    • 6.1.4 Fujitsu Ltd.
    • 6.1.5 Semtech Corporation
    • 6.1.6 Open Silicon Inc.
    • 6.1.7 ARM Holdings PLC
    • 6.1.8 Samsung Electronics Co. Ltd.
    • 6.1.9 IBM Corporation
    • 6.1.10 Altera Corporation

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS