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市场调查报告书
商品编码
1425024

混合储存立方体市场 - 2024 年至 2029 年预测

Hybrid Memory Cube Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 144 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

2022年混合储存立方体市场规模为1,233,443,000美元。

混合记忆体立方 (HMC) 是一种简报的 PC 不规则存取记忆体 (Slam) 接口，适用于穿透硅通孔主记忆体。它由三星电子和美光科技于2011年共同开发，承诺速度比DDR3快15倍。 HMC 与不相容的竞争对手介面 HBM（高频宽记忆体）竞争。 HMC 是一种高效能储存技术，将 DRAM 和逻辑整合到单晶片中。这是透过使用硅通孔 (TSV) 技术在逻辑晶粒顶部堆迭多个 DRAM晶粒来实现的。 TSV 是一种微小的电气连接，可穿透硅基基板并实现 DRAM晶粒和逻辑晶粒之间的通讯。 Micron Technology 的 HMC Gen2资料将其描述为单一封装，包含使用 TSV 技术堆迭的四个 DRAM晶粒和一个逻辑晶粒。

介绍：

混合储存立方体市场涉及 HMC 技术的开发、製造和销售。 HMC 是一种垂直堆迭而不是水平堆迭的 3D 记忆体。与传统 DRAM 相比，这可实现更高的储存密度和频宽。 HMC 可用于多种应用，包括高效能运算、网路和人工智慧。儘管混合储存立方体（HMC）市场仍处于起步阶段，但预计未来几年将快速成长。这是由各种应用程式对高效能记忆体不断增长的需求所推动的。 HMC 市场的主要驱动因素包括高效能运算市场的成长、人工智慧的日益普及以及网路应用对高频宽记忆体的需求。 HMC 市场的主要参与企业包括 Micron Technologies、Intel Corporation、Fujitsu Limited、Semtech Corporation 和 OpenSilicon Corporation。这些公司正在大力投资 HMC 技术的开发和商业化。

促进因素

  • 对高频宽、低功耗和可扩展记忆体的需求不断增长：HMC 技术提供了高效能运算、网路和资料中心所需的高频宽和低功耗。对高频宽、低功耗和可扩展记忆体不断增长的需求预计将推动 HMC 市场的成长。
  • 云端服务影响力日益增强：HMC技术有望在需要高效能运算和高频宽记忆体的云端服务中发挥重要作用。
  • 对行动性的需求不断增加：HMC技术预计将在需要高效能运算和高频宽记忆体的行动装置中采用。由于行动需求的增加，HMC 市场预计将成长。
  • 与产业参与企业的新合作：为了将 HMC 产品推向市场，公司正在专注于与能够采用 HMC 技术并将其整合到其产品中的行业参与企业建立新的合作伙伴关係。例如，美光科技和英特尔公司在记忆体产品的开发和製造方面有着长期的合作关係。此次合作最显着的成果之一是混合记忆体立方体 (HMC)，这是一项突破性记忆体技术，将 DRAM 的速度与快闪记忆体的密度结合在一起。

主要企业提供的产品

  • 富士通超级电脑「PRIMEHPC FX100」采用尖端的3D堆迭混合储存立方体（HMC）技术，实现480GB/s的高储存频宽。
  • 三星的 HBM2（高频宽记忆体）技术是一种用于显示卡、高效能运算和网路应用的 HMC。
  • 英特尔的 Stratix 10 现场可程式闸阵列 (FPGA) 使用 HMC 技术来提供高效能运算和网路所需的高频宽和低功耗。

混合储存立方体市场中 GPU（图形处理单元）部分显着成长：

在HMC（混合储存立方体）市场中，GPU（图形处理单元）领域的成长引人注目。 GPU 对于高效能运算、游戏和人工智慧应用至关重要，这些应用需要高频宽和低延迟记忆体解决方案。 HMC 技术采用 3D 堆迭架构和直通孔 (TSV) 技术，提供 GPU 实现最佳效能所需的高频宽和低功耗。随着对高阶图形和人工智慧驱动应用程式的需求持续成长，HMC 市场的 GPU 部分预计将显着成长。

预计亚太地区将在混合储存立方体市场中占据主要份额：

预计亚太地区将占据混合储存立方体（HMC）市场的主要份额。这是由多种因素推动的，包括该地区在电子和半导体行业的强大影响力，以及中国、日本和韩国等国家对高效能运算、游戏和人工智慧应用不断增长的需求。此外，亚太地区是 HMC 技术的主要市场，因为云端服务的快速成长和先进技术的采用正在推动对高频宽、低功耗、高可扩展性记忆体解决方案的需求。

主要进展：

  • 2021年11月，三星电子宣布开发出混合基板立方体（H-Cube）技术。它是最新的 2.5D 捆绑方案，专门用于 HPC、基于电脑的智慧、伺服器群和半导体，适合需要高效能和大面积捆绑技术的组织。

目录

第一章简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表

第二章调查方法

  • 调查资料
  • 调查过程

第三章执行摘要

  • 研究亮点

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析

第五章混合储存立方体市场：依产品

  • 介绍
  • 2GB
  • 4GB
  • 8GB

第六章混合储存立方体市场：依应用分类

  • 介绍
  • 图形处理单元（GPU）
  • 中央处理器（CPU）
  • 高速处理单元（APU）
  • 现场可程式闸阵列(FPGA)
  • 专用积体电路 (ASIC)

第七章混合储存立方体市场：依最终用途产业

  • 介绍
  • 企业储存
  • 电讯和网路
  • 其他的

第 8 章混合记忆体立方体：按区域

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他的
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 西班牙
    • 其他的
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 以色列
    • 其他的
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 韩国
    • 印尼
    • 泰国
    • 其他的

第九章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作

第十章 公司简介

  • Achronix Semiconductor Corporation
  • Arira Design Inc.
  • Fujitsu Limited
  • Intel Corporation
  • Micron Technology Inc.
  • Open-Silicon Inc.（SiFive Inc.）
  • Samsung Electronics Co. Ltd.
简介目录
Product Code: KSI061616135

The hybrid memory cube market was valued at US$1,233.443 million in 2022.

The Hybrid Memory Cube (HMC) is a superior presentation PC irregular access memory (Slam) interface for through-silicon vias (TSV)- based stacked Measure memory. It was co-developed by Samsung Electronics and Micron Technology in 2011 and promised a 15 times speed improvement over DDR3. The HMC is competing with the incompatible rival interface High Bandwidth Memory (HBM). HMC is a high-performance memory technology that combines DRAM and logic on a single chip. This is achieved by stacking multiple DRAM dies on top of a logic die using through-silicon via (TSV) technology. TSVs are tiny electrical connections that pass through the silicon substrate, allowing the DRAM dies to communicate with the logic die. The HMC Gen2 data sheet by Micron Technology explains that it is a single package containing four DRAM dies and one logic die, all stacked together using TSV technology.

Introduction:

The hybrid memory cube market deals in the development, manufacturing, and sale of HMC technology. HMC is a type of 3D memory that is stacked vertically, rather than horizontally. This allows for higher memory density and bandwidth than traditional DRAM. HMC is used in a variety of applications, including high-performance computing, networking, and artificial intelligence. The hybrid memory cube (HMC) market is still in its infancy, but it is poised for rapid growth in the years to come. This is driven by the growing demand for high-performance memory in a wide range of applications. The main drivers of the HMC market are mainly attributed to the growth of the high-performance computing market, the increasing adoption of artificial intelligence, and the need for high-bandwidth memory in networking applications. The major players in the HMC market are Micron Technologies, Intel Corporation, Fujitsu Ltd., Semtech Corporation, and Open Silicon Inc. These companies are investing heavily in the development and commercialization of HMC technology.

Drivers:

  • Growing need for high bandwidth, low power consumption, and highly scalable memories: The HMC technology provides high bandwidth and low power consumption, which is essential for high-performance computing, networking, and data centers. The HMC market is expected to grow due to the increasing demand for high-bandwidth, low-power-consuming, and scalable memories.
  • Rising impact of cloud services: The HMC technology is expected to play a significant role in cloud services, which require high-performance computing and high-bandwidth memory. The HMC market is expected to grow due to the rising impact of cloud services.
  • Increasing demand for mobility: The HMC technology is expected to be used in mobile devices, which require high-performance computing and high-bandwidth memory. The HMC market is expected to grow due to the increasing demand for mobility.
  • New collaborations with industry players: To launch HMC products in the market, companies focus on new collaborations with industry players who could use and integrate HMC technology into their products. For example, Micron Technology and Intel Corporation have a long-standing partnership in the development and manufacturing of memory products. One of the most notable outcomes of this partnership is the Hybrid Memory Cube (HMC), a revolutionary memory technology that combines the speed of DRAM with the density of flash memory.

Products offered by key companies:

  • Fujitsu's PRIMEHPC FX100 supercomputer uses the state-of-the-art 3D-stacked Hybrid Memory Cube (HMC) technology, achieving a high memory bandwidth of 480 GB/s.
  • Samsung's HBM2 (High Bandwidth Memory) technology is a type of HMC that is used in graphics cards, high-performance computing, and networking applications. HBM2 provides high bandwidth and low power consumption, which is essential for high-performance computing and high-bandwidth memory.
  • Intel's Stratix 10 FPGA (Field Programmable Gate Array) uses HMC technology to provide high bandwidth and low power consumption, which is essential for high-performance computing and networking.

Prominent growth in the Graphics Processing Unit (GPU) segment within the hybrid memory cube market:

The Graphics Processing Unit (GPU) segment is experiencing prominent growth within the Hybrid Memory Cube (HMC) market. GPUs are essential for high-performance computing, gaming, and artificial intelligence applications, which require high bandwidth and low latency memory solutions. The HMC technology, with its 3D-stacked architecture and through-silicon via (TSV) technology, provides the necessary high bandwidth and low power consumption for GPUs to deliver optimal performance. As the demand for advanced graphics and AI-driven applications continues to rise, the GPU segment within the HMC market is expected to witness significant growth.

The Asia Pacific region is expected to hold a significant share of the hybrid memory cube market:

The Asia Pacific region is expected to hold a significant share of the Hybrid Memory Cube (HMC) market. This can be attributed to several factors, including the region's strong presence in the electronics and semiconductor industries, as well as the increasing demand for high-performance computing, gaming, and artificial intelligence applications in countries like China, Japan, and South Korea. Additionally, the rapid growth of cloud services and the adoption of advanced technologies in the Asia Pacific region are driving the need for high-bandwidth, low-power consuming, and highly scalable memory solutions, making it a key market for HMC technology.

Key development:

  • In November 2021, Samsung Electronics declared that it has created Hybrid-Substrate Cube (H-Cube) technology, its most recent 2.5D bundling arrangement specific for semiconductors for HPC, computer-based intelligence, server farm and organization items that require high-execution and enormous region bundling technology.

Segments

By Product

  • 2 GB
  • 4 GB
  • 8 GB

By Application

  • Graphics Processing Unit (GPU)
  • Central Processing Unit (CPU)
  • Accelerated Processing Unit (APU)
  • Field-programmable Gate Array (FPGA)
  • Application-specific Integrated Circuit (ASIC)

By End Use Industry

  • Enterprise Storage
  • Telecommunications and Networking
  • Others

By Geography

  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Others
  • Asia Pacific
  • Japan
  • China
  • India
  • South Korea
  • Indonesia
  • Thailand
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

  • 2.1. Research Data
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Research Highlights

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Force Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. HYBRID MEMORY CUBE MARKET, BY PRODUCT

  • 5.1. Introduction
  • 5.2. 2 GB
  • 5.3. 4 GB
  • 5.4. 8 GB

6. HYBRID MEMORY CUBE MARKET, BY APPLICATION

  • 6.1. Introduction
  • 6.2. Graphics Processing Unit (GPU)
  • 6.3. Central Processing Unit (CPU)
  • 6.4. Accelerated Processing Unit (APU)
  • 6.5. Field-programmable Gate Array (FPGA)
  • 6.6. Application-specific Integrated Circuit (ASIC)

7. HYBRID MEMORY CUBE MARKET, BY END-USE INDUSTRY

  • 7.1. Introduction
  • 7.2. Enterprise Storage
  • 7.3. Telecommunications and Networking
  • 7.4. Others

8. HYBRID MEMORY CUBE, BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. United States
    • 8.2.2. Canada
    • 8.2.3. Mexico
  • 8.3. South America
    • 8.3.1. Brazil
    • 8.3.2. Argentina
    • 8.3.3. Others
  • 8.4. Europe
    • 8.4.1. United Kingdom
    • 8.4.2. Germany
    • 8.4.3. France
    • 8.4.4. Spain
    • 8.4.5. Others
  • 8.5. The Middle East and Africa
    • 8.5.1. Saudi Arabia
    • 8.5.2. UAE
    • 8.5.3. Israel
    • 8.5.4. Others
  • 8.6. Asia Pacific
    • 8.6.1. Japan
    • 8.6.2. China
    • 8.6.3. India
    • 8.6.4. South Korea
    • 8.6.5. Indonesia
    • 8.6.6. Thailand
    • 8.6.7. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations

10. COMPANY PROFILES

  • 10.1. Achronix Semiconductor Corporation
  • 10.2. Arira Design Inc.
  • 10.3. Fujitsu Limited
  • 10.4. Intel Corporation
  • 10.5. Micron Technology Inc.
  • 10.6. Open-Silicon Inc. (SiFive Inc.)
  • 10.7. Samsung Electronics Co. Ltd.

Not an exhaustive list