亚太地区 HMC(混合记忆体立方体)和 HBM(宽频记忆体)市场:按应用、最终用户、记忆体类型、容量和国家进行分析和预测(2023-2033 年)
市场调查报告书
商品编码
1503256

亚太地区 HMC(混合记忆体立方体)和 HBM(宽频记忆体)市场:按应用、最终用户、记忆体类型、容量和国家进行分析和预测(2023-2033 年)

Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market: Focus on Application, End Use, Memory Type, Capacity, and Country - Analysis and Forecast, 2023-2033

出版日期: | 出版商: BIS Research | 英文 63 Pages | 商品交期: 1-5个工作天内

价格

亚太地区HMC(混合储存立方体)和HBM(宽频储存)市场规模预计将从2023年的约11.072亿美元增长到2033年的123.286亿美元,预测期内复合年增长率为27.25%。与美元相当的规模。

人工智慧、巨量资料分析和高效能运算的使用正在迅速增加各个领域产生的资料量,推动对高频宽、大容量储存解决方案的需求。这些先进的记忆体解决方案对于有效管理大型资料集至关重要,特别是在人工智慧加速器和物联网/自动化系统的边缘运算应用中,从而推动市场成长。

主要市场统计数据
预测期 2023-2033
2023年评估 11.072 亿美元
2033年预测 123.286 亿美元
复合年增长率 27.25%

在以资料为中心的应用程式兴起的推动下,亚太地区 HMC(混合记忆体立方体)和 HBM(高频宽记忆体)市场正在经历显着成长。该地区的通讯、汽车和消费性电子产品等行业正在快速采用人工智慧、物联网和高效能运算,推动了对先进记忆体解决方案的需求。 HMC 和 HBM 技术提供卓越的频宽、效率和效能,使其成为管理大型资料集和提高运算能力的理想选择。中国、日本和韩国等国家在技术和基础设施方面进行了大量投资,在市场上处于领先地位。

本报告调查了亚太地区HMC(混合储存立方体)和HBM(高频宽储存)市场,提供了行业趋势、技术和专利趋势、市场成长促进和限制因素、市场规模趋势和预测等信息,它总结了各个类别和主要国家的详细分析、竞争状况、主要企业概况等。

市场分类

第 1 部分:按应用

  • GPU
  • ASIC
  • CPU
  • APU
  • 其他的

第 2 部分:最终用户

  • 高效能运算
  • 网路/通讯
  • 资料中心
  • 图形渲染游戏
  • 其他的

第 3 部分:按记忆体类型

  • 混合储存立方体 (HMC)
  • 高频宽记忆体 (HBM)

第 4 部分:按产能

  • 2GB~8GB
  • 8GB~16GB
  • 16GB以上

第 5 部分:按国家划分

  • 中国
  • 印度
  • 日本
  • 韩国
  • 其他的

目录

执行摘要

第一章 市场

  • 趋势:当前和未来的影响评估
    • 趋势分析:HMC和HBM市场
    • 资料中心应用的进步
    • 记忆体产业越来越关注节能技术解决方案
  • 供应链概览
    • 价值链分析
    • 市场地图
  • 研发回顾
    • 专利申请趋势(按国家/公司)
  • 全球重大事件影响分析
  • 市场动态概览
    • 市场驱动因素
    • 市场挑战
    • 市场机会

第二章 区域

  • 区域概况
  • 亚太地区
    • 区域概况
    • 市场成长推进因素
    • 市场问题
    • 目的
    • 产品
    • 中国
    • 印度
    • 日本
    • 韩国
    • 其他的

第三章市场:竞争基准化分析/公司简介

  • 竞争格局
    • Samsung Electronics Co., Ltd.
    • Fujitsu Ltd.
    • SK HYNIX INC.
    • Renesas Electronics Corporation

第四章调查方法

Product Code: ESS2161SS

Introduction to Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market

The Asia-Pacific memory cube and high-bandwidth memory market was valued at around $1,107.2 million in 2023 and is expected to reach $12,328.6 million by 2033, at a CAGR of 27.25% from 2023 to 2033. The rapid increase in data generation across multiple sectors, spurred by the use of AI, big data analytics, and high-performance computing, is driving the need for high-bandwidth and high-capacity memory solutions. These advanced memory solutions are essential for managing large datasets effectively, particularly in AI accelerators and edge computing applications for IoT and autonomous systems, thereby propelling market growth.

KEY MARKET STATISTICS
Forecast Period2023 - 2033
2023 Evaluation$1,107.2 Million
2033 Forecast$12,328.6 Million
CAGR27.25%

Market Introduction

The APAC Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) market is witnessing significant growth driven by increasing data-centric applications. The region's rapid adoption of AI, IoT, and high-performance computing in industries such as telecommunications, automotive, and consumer electronics fuels the demand for advanced memory solutions. HMC and HBM technologies provide superior bandwidth, efficiency, and performance, making them ideal for managing large datasets and enhancing computational capabilities. Countries like China, Japan, and South Korea are leading the market, backed by substantial investments in technology and infrastructure. According to Market Research Future, the APAC region is expected to dominate the HMC and HBM market due to these technological advancements and growing industry applications.

Market Segmentation:

Segmentation 1: by Application

  • Graphics Processing Unit (GPU)
  • Application-Specific Integrated Circuit (ASIC)
  • Central Processing Unit (CPU)
  • Accelerated Processing Unit (APU)
  • Others

Segmentation 2: by End Use

  • High-Performance Computing
  • Networking and Telecommunications
  • Data Centers
  • Graphics Rendering and Gaming
  • Others

Segmentation 3: by Memory Type

  • Hybrid Memory Cube (HMC)
  • High-Bandwidth Memory (HBM)

Segmentation 4: by Capacity

  • 2GB to 8GB
  • 8GB to 16GB
  • Above 16GB

Segmentation 5: by Country

  • China
  • India
  • Japan
  • South Korea
  • Rest-of-Asia-Pacific

Key Market Players and Competition Synopsis

The companies that are profiled in the market have been selected based on inputs gathered from primary experts and analyzing company coverage, product portfolio, and market penetration.

Some of the prominent names in the market are:

  • Samsung Electronics Co., Ltd.
  • Fujitsu Ltd.
  • SK HYNIX INC.
  • Renesas Electronics Corporation

Table of Contents

Executive Summary

Scope and Definition

1 Markets

  • 1.1 Trends: Current and Future Impact Assessment
    • 1.1.1 Trend Analysis: Hybrid Memory Cube and High-Bandwidth Memory Market
    • 1.1.2 Advancements in Data Center Applications
    • 1.1.3 Increasing Focus on Energy-Efficient Technology Solutions in the Memory Industry
  • 1.2 Supply Chain Overview
    • 1.2.1 Value Chain Analysis
    • 1.2.2 Market Map
      • 1.2.2.1 Hybrid Memory Cube and High-Bandwidth Memory Market - Product (by Memory Type)
        • 1.2.2.1.1 Hybrid Memory Cube (HMC)
        • 1.2.2.1.2 High-Bandwidth Memory (HBM)
  • 1.3 Research and Development Review
    • 1.3.1 Patent Filing Trend (by Country, Company)
  • 1.4 Impact Analysis for Key Global Events
  • 1.5 Market Dynamics Overview
    • 1.5.1 Market Drivers
      • 1.5.1.1 Massive Growth of Artificial Intelligence (AI)
      • 1.5.1.2 Increasing Use of Augmented Reality (AR) and Virtual Reality (VR)
    • 1.5.2 Market Challenges
      • 1.5.2.1 Higher Cost than Other Standard DRAMs
      • 1.5.2.2 Heat Dissipation Problems due to Integrated 3D Architectures
    • 1.5.3 Market Opportunities
      • 1.5.3.1 Growing Applications of Edge-Based Technologies
      • 1.5.3.2 Increasing Adoption of Autonomous Driving

2 Regions

  • 2.1 Regional Summary
  • 2.2 Asia-Pacific
    • 2.2.1 Regional Overview
    • 2.2.2 Driving Factors for Market Growth
    • 2.2.3 Factors Challenging the Market
    • 2.2.4 Application
    • 2.2.5 Product
    • 2.2.6 China
    • 2.2.7 India
    • 2.2.8 Japan
    • 2.2.9 South Korea
    • 2.2.10 Rest-of-Asia-Pacific

3 Markets - Competitive Benchmarking & Company Profiles

  • 3.1 Competitive Landscape
    • 3.1.1 Samsung Electronics Co., Ltd.
      • 3.1.1.1 Overview
      • 3.1.1.2 Top Products/Product Portfolio
      • 3.1.1.3 Top Competitors
      • 3.1.1.4 Target Customers
      • 3.1.1.5 Key Personnel
      • 3.1.1.6 Analyst View
      • 3.1.1.7 Market Share (2022)
    • 3.1.2 Fujitsu Ltd.
      • 3.1.2.1 Overview
      • 3.1.2.2 Top Products/Product Portfolio
      • 3.1.2.3 Top Competitors
      • 3.1.2.4 Target Customers
      • 3.1.2.5 Key Personnel
      • 3.1.2.6 Analyst View
      • 3.1.2.7 Market Share (2022)
    • 3.1.3 SK HYNIX INC.
      • 3.1.3.1 Overview
      • 3.1.3.2 Top Products/Product Portfolio
      • 3.1.3.3 Top Competitors
      • 3.1.3.4 Target Customers
      • 3.1.3.5 Key Personnel
      • 3.1.3.6 Analyst View
      • 3.1.3.7 Market Share (2022)
    • 3.1.4 Renesas Electronics Corporation
      • 3.1.4.1 Overview
      • 3.1.4.2 Top Products/Product Portfolio
      • 3.1.4.3 Top Competitors
      • 3.1.4.4 Target Customers
      • 3.1.4.5 Key Personnel
      • 3.1.4.6 Analyst View
      • 3.1.4.7 Market Share (2022)

4 Research Methodology

  • 4.1 Data Sources
    • 4.1.1 Primary Data Sources
    • 4.1.2 Secondary Data Sources
    • 4.1.3 Data Triangulation
  • 4.2 Market Estimation and Forecast

List of Figures

  • Figure 1: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), 2022, 2026, and 2033
  • Figure 2: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), 2022, 2026, and 2033
  • Figure 3: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), 2022, 2026, and 2033
  • Figure 4: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), 2022, 2026, and 2033
  • Figure 5: Hybrid Memory Cube and High-Bandwidth Memory, Recent Developments
  • Figure 6: Supply Chain Analysis for Hybrid Memory Cube and High-Bandwidth Memory Market
  • Figure 7: Patent Filed (by Company), January 2020-December 2023
  • Figure 8: Patent Filed (by Country), January 2020-December 2023
  • Figure 9: Impact Analysis of Market Navigating Factors, 2022-2033
  • Figure 10: Strategic Initiatives, 2020-2023
  • Figure 11: Share of Strategic Initiatives
  • Figure 12: Data Triangulation
  • Figure 13: Top-Down and Bottom-Up Approach
  • Figure 14: Assumptions and Limitations

List of Tables

  • Table 1: Market Snapshot
  • Table 2: Hybrid Memory Cube and High-Bandwidth Memory Market, Regional Opportunities
  • Table 3: Hybrid Memory Cube and High-Bandwidth Memory Market (by Region), $Million, 2022-2033
  • Table 4: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
  • Table 5: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
  • Table 6: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
  • Table 7: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
  • Table 8: China Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
  • Table 9: China Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
  • Table 10: China Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
  • Table 11: China Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
  • Table 12: India Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
  • Table 13: India Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
  • Table 14: India Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
  • Table 15: India Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
  • Table 16: Japan Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
  • Table 17: Japan Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
  • Table 18: Japan Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
  • Table 19: Japan Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
  • Table 20: South Korea Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
  • Table 21: South Korea Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
  • Table 22: South Korea Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
  • Table 23: South Korea Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
  • Table 24: Rest-of-Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
  • Table 25: Rest-of-Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
  • Table 26: Rest-of-Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
  • Table 27: Rest-of-Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
  • Table 28: Market Share