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市场调查报告书
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1530751

2030 年高频宽记忆体 (HBM) 市场预测：按产品类型、介面类型、记忆体容量、应用、最终用户和地区进行的全球分析

High Bandwidth Memory Market Forecasts to 2030 - Global Analysis By Product Type, Interface Type (HBM Stacked DRAM Interface, Open Compute Networking Interface and Other Interface Types), Memory Capacity, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，2024 年全球高频宽记忆体 (HBM) 市场规模将达到 25 亿美元，预计到 2030 年将达到 92 亿美元，预测期内复合年增长率为 24.2%。

高频宽内存 (HBM) 是一种电脑内存，与传统 DRAM 相比，它可提供更快的资料传输速率。这是透过垂直堆迭多个 DRAM晶粒并将它们与硅穿孔电极(TSV) 连接来实现的。 HBM 主要用于高效能运算应用、显示卡和人工智慧加速器，其中海量资料吞吐量至关重要。 HBM 能够提供大量频宽，同时消耗更少的功耗，非常适合资料中心、科学模拟和高级游戏系统等要求苛刻的任务。

据美光科技称，其即将推出的 HBM3E 记忆体将提供超过 1.2TB/s 的频宽，并且与竞争产品相比功耗降低 30%。美光计画于 2024 年第二季推出 Nvidia H200 Tensor Core GPU 的 24GB 容量 HBM3E 晶片。

对高效能运算日益增长的需求

由于对更快资料处理和增强记忆体频宽的需求不断增加，对高效能运算 (HPC) 不断增长的需求正在推动高频宽记忆体 (HBM) 市场的发展。 HBM 提供卓越速度和效率的能力对于人工智慧 (AI)、资料中心和进阶图形等应用至关重要。巨量资料分析和复杂模拟的兴起进一步推动了这一需求，推动了 HBM 在各种高效能运算环境中的采用。

产能有限

需要先进技术和精度的复杂製造流程限制了可以有效生产的单元数量。这套瓶颈可能会影响 HBM 的可用性，导致潜在的供不应求和价格上涨，并阻碍 HBM 解决方案在各行业的采用。

HBM 技术的进步

HBM 技术的进步代表着市场成长的重大机会。 HBM2E 和即将推出的 HBM3 等创新提供了更高的频宽、更高的能源效率和更大的储存容量，以满足下一代运算应用不断增长的需求。这些技术突破将提高人工智慧、机器学习和虚拟实境的效能，开拓新的细分市场，并加速 HBM 在新的高效能应用中的采用。

与替代技术的竞争

高频宽快取 (HBC)、混合记忆体立方体 (HMC) 等新兴解决方案以及传统 DRAM 和 GDDR 技术的进步有可能以更低的成本提供可比的效能。随着这些替代技术的发展，它们有可能在某些应用中获得市场占有率，在这些应用中，成本/效能权衡比 HBM 更有利。此外，对新记忆体架构和材料的研究增加可能会产生颠覆性技术，挑战 HBM 在高效能运算应用中的地位，限制长期市场成长和采用率。

COVID-19 的影响：

由于供应链问题和製造能力下降，COVID-19 大流行最初扰乱了 HBM 的生产。但数位转型工作也在加速，推动了医疗保健、远距工作和电子商务等领域对高效能运算解决方案的需求。这导致资料中心扩张和人工智慧实施迅速增加，最终推动中长期对 HBM 的需求。

HBM2E 细分市场预计将在预测期内成为最大的细分市场

与前几代产品相比，HBM2E 细分市场由于其卓越的性能特性提供更​​高的频宽和更高的能源效率，预计将主导市场。 HBM2E 满足了人工智慧、机器学习和高效能运算领域对资料密集型应用不断增长的需求。 HBM2E 具有更高的容量和速度，是图形处理单元 (GPU) 和资料中心加速器的理想选择。 5G 基础设施、自动驾驶汽车和高级分析等最尖端科技的采用进一步推动了该细分市场的成长，使 HBM2E 成为满足各行业高频宽记忆体需求的理想解决方案。

预计 16GB 细分市场在预测期内复合年增长率最高

由于需要大量记忆体的资料密集型应用程式的复杂性不断增加，16GB 段的复合年增长率最高。这种容量最佳点平衡了许多高阶运算应用程式的效能需求和成本考量。 16GB HBM 模组对于记忆体频宽和容量至关重要的人工智慧训练、科学模拟和进阶图形渲染特别有吸引力。随着越来越多的行业采用人工智慧和巨量资料分析，对 16GB HBM 解决方案的需求预计将激增。

占比最大的地区：

北美地区由于其在高效能运算、人工智慧和资料中心产业的强大影响力，在高频宽记忆体（HBM）市场占据主导地位。该地区拥有推动 HBM 应用创新的领先技术公司和研究机构。对人工智慧、云端运算和进阶分析的大量投资进一步推动了对高频宽记忆体解决方案的需求。北美在最尖端科技开发方面的领先地位以及在多个领域较早采用HBM，使得北美在HBM实施和技术进步方面引领了全球趋势，建立了压倒性的市场地位。

复合年增长率最高的地区：

由于快速工业化和技术基础设施投资的增加，亚太地区预计高频宽记忆体（HBM）市场的复合年增长率最高。该地区半导体产业不断发展，中国、日本和韩国等国家对高效能运算不断增长的需求也推动了市场成长。资料中心的扩张以及人工智慧和虚拟实境应用的进步将进一步加速 HBM 在该地区的采用。

提供免费客製化：

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 产品分析
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球高频宽记忆体（HBM）市场：依产品类型

  • HBM1
  • HBM2
  • HBM2E
  • HBM3
  • 其他产品类型

第六章全球高频宽记忆体（HBM）市场：依介面类型

  • HBM 堆迭 DRAM 介面 (HBI)
  • 开放运算网路 (OCN) 介面
  • 其他介面类型

第七章全球高频宽记忆体（HBM）市场：依记忆体容量划分

  • 2GB
  • 4GB
  • 8GB
  • 16GB
  • 其他内存容量

第八章全球高频宽记忆体 (HBM) 市场：按应用分类

  • 图形处理单元（GPU）
  • 专用积体电路 (ASIC)
  • 中央处理器（CPU）
  • 加速处理单元 (APU)
  • 其他用途

第 9 章 全球高频宽记忆体 (HBM) 市场：依最终用户分类

  • 高效能运算 (HPC)
  • 人工智慧（AI）
  • 网路装置
  • 通讯
  • 图形渲染和游戏
  • 资料中心
  • 其他最终用户

第 10 章全球高频宽记忆体 (HBM) 市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第十一章 主要进展

  • 合约、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十二章 公司概况

  • Samsung Electronics Co., Ltd.
  • SK Hynix Inc.
  • Micron Technology, Inc.
  • Advanced Micro Devices, Inc.（AMD）
  • NVIDIA Corporation
  • Intel Corporation
  • Xilinx, Inc.
  • Fujitsu Limited
  • IBM Corporation
  • Broadcom Inc.
  • MediaTek Inc.
  • Renesas Electronics Corporation
  • NXP Semiconductors NV
  • Texas Instruments Incorporated
  • Cadence Design Systems, Inc.
  • Arm Holdings plc
  • Marvell Technology Group Ltd.
  • InnoGrit Corporation
Product Code: SMRC26863

According to Stratistics MRC, the Global High Bandwidth Memory (HBM) Market is accounted for $2.5 billion in 2024 and is expected to reach $9.2 billion by 2030 growing at a CAGR of 24.2% during the forecast period. High-bandwidth memory (HBM) is a type of computer memory that offers significantly faster data transfer rates compared to traditional DRAM. It achieves this by stacking multiple DRAM dies vertically and connecting them with through-silicon vias (TSVs). HBM is primarily used in high-performance computing applications, graphics cards, and AI accelerators where massive data throughput is crucial. Its ability to provide substantial bandwidth while consuming less power makes it ideal for demanding tasks in data centers, scientific simulations, and advanced gaming systems.

According to Micron Technology, their upcoming HBM3E memory will offer over 1.2 TB/s bandwidth and 30% lower power consumption compared to competing products. Micron plans to launch 24GB capacity HBM3E chips in Q2 2024 for use in Nvidia's H200 Tensor Core GPUs.

Market Dynamics:

Driver:

Growing need for high-performance computing

The growing need for high-performance computing (HPC) drives the High Bandwidth Memory (HBM) market by increasing demand for faster data processing and enhanced memory bandwidth. HBM's ability to deliver exceptional speed and efficiency is crucial for applications in artificial intelligence (AI), data centers, and advanced graphics. This demand is further fueled by the rise in big data analytics and complex simulations, pushing the adoption of HBM in various high-performance computing environments.

Restraint:

Limited production capacity

The complex manufacturing process, requiring advanced technology and precision, restricts the number of units that can be produced efficiently. This bottleneck affects the availability of HBM, leading to potential supply shortages and increased prices, which can hinder the widespread adoption of HBM solutions across different industries.

Opportunity:

Advancements in HBM technology

Advancements in HBM technology present significant opportunities for market growth. Innovations such as HBM2E and upcoming HBM3 offer higher bandwidth, improved energy efficiency, and greater storage capacity, meeting the rising demands of next-generation computing applications. These technological breakthroughs enable enhanced performance in AI, machine learning, and virtual reality, opening new market segments and driving the adoption of HBM in emerging high-performance applications.

Threat:

Competition from alternative technologies

Emerging solutions like High Bandwidth Cache (HBC), Hybrid Memory Cube (HMC), and advancements in traditional DRAM and GDDR technologies could potentially offer comparable performance at lower costs. As these alternatives evolve, they may capture market share in certain applications where the cost-performance trade-off favors them over HBM. Additionally, ongoing research into novel memory architectures and materials could lead to disruptive technologies that challenge HBM's position in high-performance computing applications, potentially limiting its long-term market growth and adoption rates.

Covid-19 Impact:

The COVID-19 pandemic initially disrupted HBM production due to supply chain issues and reduced manufacturing capacity. However, it also accelerated digital transformation efforts, increasing demand for high-performance computing solutions in sectors like healthcare, remote work, and e-commerce. This led to a surge in data center expansions and AI implementations, ultimately driving demand for HBM in the medium to long term.

The HBM2E segment is expected to be the largest during the forecast period

The HBM2E segment is expected to dominate the market due to its superior performance characteristics, offering higher bandwidth and improved power efficiency compared to previous generations. HBM2E addresses the growing demands of data-intensive applications in AI, machine learning, and high-performance computing. Its increased capacity and speed make it ideal for graphics processing units (GPUs) and data center accelerators. The segment's growth is further fueled by its adoption of cutting-edge technologies like 5G infrastructure, autonomous vehicles, and advanced analytics, positioning HBM2E as the go-to solution for high-bandwidth memory requirements in various industries.

The 16GB segment is expected to have the highest CAGR during the forecast period

The 16GB segment is experiencing the highest CAGR due to the increasing complexity of data-intensive applications requiring larger memory capacities. This capacity sweet spot balances performance needs with cost considerations for many high-end computing applications. The 16GB HBM modules are particularly attractive for AI training, scientific simulations, and advanced graphics rendering, where memory bandwidth and capacity are crucial. As more industries adopt AI and big data analytics, the demand for 16GB HBM solutions is expected to surge.

Region with largest share:

The North America region is positioned to dominate the High Bandwidth Memory (HBM) Market due to its strong presence in high-performance computing, artificial intelligence, and data center industries. The region hosts major technology companies and research institutions driving innovation in HBM applications. Substantial investments in AI, cloud computing, and advanced analytics further fuel demand for high-bandwidth memory solutions. North America's leadership in developing cutting-edge technologies and its early adoption of HBM in various sectors contribute to its dominant market position, setting trends for global HBM adoption and technological advancements.

Region with highest CAGR:

The Asia Pacific region anticipates the highest CAGR in the High Bandwidth Memory (HBM) market owing to rapid industrialization and increasing investments in technology infrastructure. The region's growing semiconductor industry, coupled with rising demand for high-performance computing in countries like China, Japan, and South Korea, fuels market growth. Expanding data centers and advancements in AI and VR applications further accelerate HBM adoption in the region.

Key players in the market

Some of the key players in High Bandwidth Memory (HBM) market include Samsung Electronics, SK Hynix, Micron Technology, AMD, NVIDIA, Intel, Xilinx, Fujitsu, IBM, Broadcom, MediaTek, Renesas Electronics, NXP Semiconductors, Texas Instruments, Cadence Design Systems, Arm Holdings, Marvell Technology Group, and InnoGrit Corporation.

Key Developments:

In February 2024, Samsung Electronics, a world leader in advanced memory technology announced that it has developed HBM3E 12H, the industry's first 12-stack HBM3E DRAM and the highest-capacity HBM product to date. Samsung's HBM3E 12H provides an all-time high bandwidth of up to 1,280 gigabytes per second (GB/s) and an industry-leading capacity of 36 gigabytes (GB). In comparison to the 8-stack HBM3 8H, both aspects have improved by more than 50%.

In December 2023, Nvidia has paid hundreds of millions of dollars in advance to SK Hynix and Micron to ensure a stable supply of High Bandwidth Memory (HBM). Recently, Samsung Electronics completed product testing and signed an HBM product supply contract with Nvidia. According to industry sources cited by Chosun Biz, SK Hynix, and Micron each received between KRW700 billion and KRW1 trillion (approximately US$540 million to US$770 million) in advance payments from Nvidia for the supply of advanced memory products. Although the details are not disclosed, the industry believes this is a measure by Nvidia to secure the supply of HBM3e for its new GPU products in 2024.

In November 2023, Nvidia announced the H200 and GH200 product line at Supercomputing 23 this morning. These are the most powerful chips Nvidia has ever created, building on the existing Hopper H100 architecture but adding more memory and more compute. These are set to power the future generation of AI supercomputers, with over 200 exaflops of AI compute set to come online during 2024.

Product Types Covered:

  • HBM1
  • HBM2
  • HBM2E
  • HBM3
  • Other Product Types

Interface Types Covered:

  • HBM Stacked DRAM Interface (HBI)
  • Open Compute Networking (OCN) Interface
  • Other Interface Types

Memory Capacities Covered:

  • 2GB
  • 4GB
  • 8GB
  • 16GB
  • Other Memory Capacities

Applications Covered:

  • Graphics Processing Unit (GPU)
  • Application-Specific Integrated Circuit (ASIC)
  • Central Processing Unit (CPU)
  • Accelerated Processing Unit (APU)
  • Other Applications

End Users Covered:

  • High-Performance Computing (HPC)
  • Artificial Intelligence (AI)
  • Networking Equipment
  • Telecommunications
  • Graphics Rendering and Gaming
  • Data Centers
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global High Bandwidth Memory (HBM) Market, By Product Type

  • 5.1 Introduction
  • 5.2 HBM1
  • 5.3 HBM2
  • 5.4 HBM2E
  • 5.5 HBM3
  • 5.6 Other Product Types

6 Global High Bandwidth Memory (HBM) Market, By Interface Type

  • 6.1 Introduction
  • 6.2 HBM Stacked DRAM Interface (HBI)
  • 6.3 Open Compute Networking (OCN) Interface
  • 6.4 Other Interface Types

7 Global High Bandwidth Memory (HBM) Market, By Memory Capacity

  • 7.1 Introduction
  • 7.2 2GB
  • 7.3 4GB
  • 7.4 8GB
  • 7.5 16GB
  • 7.6 Other Memory Capacities

8 Global High Bandwidth Memory (HBM) Market, By Application

  • 8.1 Introduction
  • 8.2 Graphics Processing Unit (GPU)
  • 8.3 Application-Specific Integrated Circuit (ASIC)
  • 8.4 Central Processing Unit (CPU)
  • 8.5 Accelerated Processing Unit (APU)
  • 8.6 Other Applications

9 Global High Bandwidth Memory (HBM) Market, By End User

  • 9.1 Introduction
  • 9.2 High-Performance Computing (HPC)
  • 9.3 Artificial Intelligence (AI)
  • 9.4 Networking Equipment
  • 9.5 Telecommunications
  • 9.6 Graphics Rendering and Gaming
  • 9.7 Data Centers
  • 9.8 Other End Users

10 Global High Bandwidth Memory (HBM) Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Samsung Electronics Co., Ltd.
  • 12.2 SK Hynix Inc.
  • 12.3 Micron Technology, Inc.
  • 12.4 Advanced Micro Devices, Inc. (AMD)
  • 12.5 NVIDIA Corporation
  • 12.6 Intel Corporation
  • 12.7 Xilinx, Inc.
  • 12.8 Fujitsu Limited
  • 12.9 IBM Corporation
  • 12.10 Broadcom Inc.
  • 12.11 MediaTek Inc.
  • 12.12 Renesas Electronics Corporation
  • 12.13 NXP Semiconductors N.V.
  • 12.14 Texas Instruments Incorporated
  • 12.15 Cadence Design Systems, Inc.
  • 12.16 Arm Holdings plc
  • 12.17 Marvell Technology Group Ltd.
  • 12.18 InnoGrit Corporation

List of Tables

  • Table 1 Global High Bandwidth Memory (HBM) Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global High Bandwidth Memory (HBM) Market Outlook, By Component (2022-2030) ($MN)
  • Table 3 Global High Bandwidth Memory (HBM) Market Outlook, By Hardware (2022-2030) ($MN)
  • Table 4 Global High Bandwidth Memory (HBM) Market Outlook, By Base Stations (2022-2030) ($MN)
  • Table 5 Global High Bandwidth Memory (HBM) Market Outlook, By Antennas (2022-2030) ($MN)
  • Table 6 Global High Bandwidth Memory (HBM) Market Outlook, By Routers (2022-2030) ($MN)
  • Table 7 Global High Bandwidth Memory (HBM) Market Outlook, By Switches (2022-2030) ($MN)
  • Table 8 Global High Bandwidth Memory (HBM) Market Outlook, By Other Hardware (2022-2030) ($MN)
  • Table 9 Global High Bandwidth Memory (HBM) Market Outlook, By Software (2022-2030) ($MN)
  • Table 10 Global High Bandwidth Memory (HBM) Market Outlook, By Network Management Software (2022-2030) ($MN)
  • Table 11 Global High Bandwidth Memory (HBM) Market Outlook, By Security Solutions (2022-2030) ($MN)
  • Table 12 Global High Bandwidth Memory (HBM) Market Outlook, By Other Software (2022-2030) ($MN)
  • Table 13 Global High Bandwidth Memory (HBM) Market Outlook, By Deployment Type (2022-2030) ($MN)
  • Table 14 Global High Bandwidth Memory (HBM) Market Outlook, By On-premises (2022-2030) ($MN)
  • Table 15 Global High Bandwidth Memory (HBM) Market Outlook, By Cloud-based (2022-2030) ($MN)
  • Table 16 Global High Bandwidth Memory (HBM) Market Outlook, By Organization Size (2022-2030) ($MN)
  • Table 17 Global High Bandwidth Memory (HBM) Market Outlook, By Small and Medium-sized Enterprises (SMEs) (2022-2030) ($MN)
  • Table 18 Global High Bandwidth Memory (HBM) Market Outlook, By Large Enterprises (2022-2030) ($MN)
  • Table 19 Global High Bandwidth Memory (HBM) Market Outlook, By Technology (2022-2030) ($MN)
  • Table 20 Global High Bandwidth Memory (HBM) Market Outlook, By LTE (2022-2030) ($MN)
  • Table 21 Global High Bandwidth Memory (HBM) Market Outlook, By 5G (2022-2030) ($MN)
  • Table 22 Global High Bandwidth Memory (HBM) Market Outlook, By Wi-Fi (2022-2030) ($MN)
  • Table 23 Global High Bandwidth Memory (HBM) Market Outlook, By Other Technologies (2022-2030) ($MN)
  • Table 24 Global High Bandwidth Memory (HBM) Market Outlook, By Application (2022-2030) ($MN)
  • Table 25 Global High Bandwidth Memory (HBM) Market Outlook, By Manufacturing (2022-2030) ($MN)
  • Table 26 Global High Bandwidth Memory (HBM) Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 27 Global High Bandwidth Memory (HBM) Market Outlook, By Transportation and Logistics (2022-2030) ($MN)
  • Table 28 Global High Bandwidth Memory (HBM) Market Outlook, By Energy and Utilities (2022-2030) ($MN)
  • Table 29 Global High Bandwidth Memory (HBM) Market Outlook, By Emergency Services (2022-2030) ($MN)
  • Table 30 Global High Bandwidth Memory (HBM) Market Outlook, By Other Applications (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.