混合储存立方体市场：现况分析与预测（2023-2030）

由于人工智慧应用的普及，混合储存立方体市场预计将以约26.50%的复合年增长率成长。此外，人工智慧的日益普及也是成长的一个因素。该技术本身正在以前所未有的速度发展和被采用。这种向人工智慧的转变增加了对高效能 GPU 的需求，为 HMC 创造了有利的需求环境。例如，2024 年 2 月，全球最大的 GPU 製造商Nvidia宣布，随着全球人工智慧蓬勃发展，资料中心晶片和 GPU 的需求增加，其季度收入将增长两倍。此外，企业正在将其营运转移到云端。这种向云端的倾斜增加了对资料中心的需求，从而增加了对 HMC（一种更有效率、更省电的储存技术）的需求。此外，由于训练AI模型对高功率运算的需求不断增加，高效能电脑的普及程度也不断提高，促使市场对HMC的需求激增。

根据产品类型，混合储存立方体市场分为 GPU、CPU、APU、FPGA 和 ASIC。在市场上，GPU 领域对 HMC 的需求最高。这种扩张主要是由生成式人工智慧的扩散所推动的。此外，Amazon和 Meta 等大公司云端基础设施的快速发展为 GPU 需求增加提供了有利的环境，因为对支援 AI 专案的运算能力有巨大的需求，我们正在为 HMC 需求的扩展做出贡献。例如，2024年1月，Meta执行长宣布将在2024年底前投资10亿美元购买35万片Nvidia H100图形晶片，用于开发公司的运算基础设施。

依应用划分，市场分为图形、人工智慧、高效能运算、网路和资料中心。人工智慧和 HPC 推动了 HMC 的大部分需求。需求激增主要是由生成式人工智慧近年来呈指数级增长所推动的。大量的运算能力用于训练这些模型来处理大量资料。这种转变促使对 HMC 整合 GPU 的需求激增，这些 GPU 可以处理支援这些大规模语言模型 (LLM) 所需的运算能力。此外，各种工业设置中越来越多地采用高效能运算来进行密集资料处理，也推动了对高效能记忆体的需求。

混合储存立方体市场依最终用户细分为企业储存、通讯和网路、人工智慧开发人员等。人工智慧开发人员正在主导 HCM 的需求。这种需求主要是由数据密集型应用程式的快速成长所驱动的，特别是人工智慧和超级运算。此外，ChatGPT 等大规模人工智慧模型的使用不断增加，促使 HBM1 的需求激增。这些模型需要快速的资料处理和资料传输，而这只能透过高频宽记忆体来实现。此外，HBM 在需要频宽的应用程式中很受欢迎。每个堆迭的速度约为 1.2 TB/s，任何传统记忆体都无法在频宽方面击败 HBM3E2。这种高频宽对于人工智慧应用程式的高效运作至关重要。

为了更瞭解混合储存立方体的市场介绍，我们在北美（美国、加拿大、北美其他地区）、欧洲（德国、英国、法国、西班牙、义大利、欧洲其他地区）、亚太地区（中国）进行了研究、日本、印度，根据其在韩国、台湾和世界其他地区（韩国、台湾和亚太地区其他地区）的全球影响力来分析市场。北美占据了很大的占有率。北美混合储存立方体市场预计在未来几年将快速成长。这种需求的成长在很大程度上是由需要高速资料处理的资料密集型应用程式的快速成长所推动的，特别是人工智慧和超级运算，而这反过来又需要高频宽记忆体。此外，对人工智慧新创企业的资助增加正在加快该地区人工智慧技术开发和应用的步伐。此外，该地区政府对人工智慧发展的有利政策也鼓励各行业采用人工智慧技术，对成长做出了巨大贡献。生成式人工智慧的快速崛起正在推动资料中心市场对高速 HBM 技术的需求。人工智慧工作负载正在推动对更高频宽的需求，以提高设备和处理单元之间的资料传输速度。超大规模企业和原始设备製造商 (OEM) 正在增加伺服器容量，并需要更多 AI 加速器来支援模型训练和推理。因此，我们正在推动与这些加速器相关的 HBM 的强劲成长。

市场上的主要公司包括Micron Technology, Inc.; Samsung; SK HYNIX INC.; Intel Corporation; NVIDIA Corporation; Global Unichip Corp; Cambricon; Huawei Technologies Co.,; IBM; and Advanced Micro Devices, Inc.等

目录

第一章 市场介绍

• 市场定义
• 主要目标
• 利益相关者
• 限制

第二章 研究方法或前提条件

• 调查过程
• 调查方法
• 受访者简介

第三章市场总结

第 4 章执行摘要

第五章 COVID-19 对混合储存立方体市场的影响

第六章 2020-2030年混合储存立方体市场收入

第七章 依产品类型划分的市场分析

• GPU（图形处理单元）
• CPU（中央处理单元）
• APU（加速处理单元）
• FPGA（现场可程式化闸阵列）
• ASIC（专用集成电路）

第八章 应用市场分析

• 图形
• 人工智慧和高效能运算
• 联网
• 数据中心

第 9 章最终用户的市场分析

• 企业存储
• 通讯和网路
• 人工智慧开发商
• 其他（加密货币矿工、个人设备等）

第十章区域市场分析

• 北美
  • 美国
  • 加拿大
  • 其他北美
• 欧洲
  • 德国
  • 英国
  • 法国
  • 义大利
  • 欧洲其他地区
• 亚太地区
  • 中国
  • 印度
  • 日本
  • 韩国
  • 台湾
  • 亚太其他地区
• 世界其他地区

第十一章混合储存立方体市场动态

• 市场驱动力
• 市场课题
• 影响分析

第十二章混合储存立方体市场机会

第十三章混合储存立方体市场趋势

第十四章供需分析

• 需求面分析
• 供给侧分析

第十五章价值链分析

第16章 竞争场景

• 竞争格局
  • 波特五力分析

第十七章 公司简介

• Micron Technology, Inc.
• Samsung
• SK HYNIX INC.
• Intel Corporation
• NVIDIA Corporation
• Global Unichip Corp
• Cambricon
• Huawei Technologies Co.,
• IBM
• Advanced Micro Devices, Inc.

第18章 免责声明

The Hybrid Memory Cube (HMC) is a high-performance computer random-access memory (RAM) interface for through-silicon via (TSV)-based stacked DRAM memory. It was co-developed by Samsung Electronics and Micron Technology in 2011. HMC uses standard DRAM cells but it has more data banks than classic DRAM memory of the same size. The memory controller is integrated as a separate die. It promised a 15 times speed improvement over DDR3. Though, Micron discontinued the HMC product in 2018 when it failed to achieve market adoption, however shifting market dynamics towards Artificial Intelligence is boosting the demand for Hybrid memory cubes in the market and encouraging manufacturers to mass produce the HMCs, with the demand exceeding the supply.

The Hybrid Memory Cube Market is expected to grow at a strong CAGR of around 26.50% owing to the growing widespread adoption of Artificial Intelligence applications. Furthermore, the growth can be attributed to the rising proliferation of artificial intelligence. The technology itself is experiencing an unprecedented rate of development and adoption. This shift towards AI increased demand for high-performance GPUs, creating a favorable demand environment for HMCs. For instance, in February 2024, Nvidia, the world's largest producer of GPUs, presented a forecast of a three-fold increase in its quarterly revenue with boosted demand for data center chips and GPUs amid the AI boom the world is witnessing. Furthermore, organizations shifting their operations to the cloud. This inclination towards cloud has increased demand for data centers, consequently driving up the need for HMCs, a more efficient and less power-consuming storage technology. Additionally, the popularity of high-performance computers is also rising due to the increased need for high-power computations to train AI models, further leading to a surge in demand for HMCs in the markets.

Based on product type, the hybrid memory cube market is categorized into GPU, CPU, APU, FPGA, and ASIC. The GPU segment is generating maximum demand for HMCs in the markets. The increasing prevalence of generative AI primarily drives this expansion. Furthermore, the rapid advancement in the development of cloud infrastructure, by large corporations such as Amazon, and Meta, amid the enormous demand for computing power to support AI projects, is creating a favorable environment of growth in demand for GPUs, subsequently benefitting the increasing need for HMCs. For instance, in Jan 2024, Meta CEO announced an investment of a billion dollars in purchasing 350,000 units of Nvidia's H100 graphic chips, for developing its computing infrastructure by the end of 2024.

Based on application the market is segmented into graphics, AI and high-performance computing, networking, and data centers. AI and HPC generate most of the demand for HMC. This surge in demand is primarily driven by the exponential growth witnessed by generative AI in the recent past. A considerable amount of computing power for massive data processing goes into training these models. This shift has led to a surge in demand for GPUs integrated with HMCs, that can match the potential necessary for computing power to support these large language models (LLMs). Furthermore, the growing adoption of high-performance computing in various industrial setups for intensive data processing further elevates the need for high-performance memory.

Based on end-users, the hybrid memory cube market is segmented into enterprise storage, telecommunication and networking, artificial intelligence developers, and others. The AI developers are dominating the demand for HCMs. The demand is primarily driven by the rapid growth of data-intensive applications, particularly in artificial intelligence and supercomputing. Furthermore, the increasing use of large AI models, such as ChatGPT, has led to a surge in demand for HBM1. These models require high-speed data processing and transfer, which can only be achieved with high-bandwidth memories. Additionally, HBM is popular among bandwidth-hungry applications. At around 1.2 TB/s per stack, no conventional memory can beat HBM3E in terms of bandwidth2. This high bandwidth is crucial for the efficient functioning of AI applications.

For a better understanding of the market adoption of Hybrid Memory Cubes, the market is analyzed based on its worldwide presence in countries such as North America (The U.S., Canada, and the Rest of North America), Europe (Germany, The U.K., France, Spain, Italy, Rest of Europe), Asia-Pacific (China, Japan, India, South Korea, Taiwan, Rest of Asia-Pacific), Rest of World. North America holds a prominent share of the market. The North American hybrid memory cube market is poised for rapid growth in the coming years. This rise in demand is primarily driven by the rapid growth of data-intensive applications, particularly in artificial intelligence and supercomputing, which require high-speed data processing, which necessitates high-bandwidth memories. Furthermore, The increased funding for AI startups has accelerated the pace of development and application of AI technologies in the region. Moreover, the favorable government policies of the region regarding AI development have also encouraged the industries to adopt AI technology and have significantly contributed towards the growth. This rapid rise of generative AI has boosted the demand for high-speed HBM technologies in the data center market. AI workloads are driving the need for higher bandwidth to increase data transfer rates between devices and processing units. Hyperscalers and original equipment manufacturers (OEMs) are increasing their server capacity to support model training and inference, requiring more AI accelerators. This is in turn driving strong growth in HBMs associated with these accelerators.

Some of the major players operating in the market include Micron Technology, Inc.; Samsung; SK HYNIX INC.; Intel Corporation; NVIDIA Corporation; Global Unichip Corp; Cambricon; Huawei Technologies Co.,; IBM; and Advanced Micro Devices, Inc.

TABLE OF CONTENTS

1MARKET INTRODUCTION

• 1.1.Market Definitions
• 1.2.Main Objective
• 1.3.Stakeholders
• 1.4.Limitation

2RESEARCH METHODOLOGY OR ASSUMPTION

• 2.1.Research Process of the Hybrid Memory Cube Market
• 2.2.Research Methodology of the Hybrid Memory Cube Market
• 2.3.Respondent Profile

3MARKET SYNOPSIS

4EXECUTIVE SUMMARY

5IMPACT OF COVID-19 ON THE HYBRID MEMORY CUBE MARKET

6HYBRID MEMORY CUBE MARKET REVENUE (USD BN), 2020-2030F.

7MARKET INSIGHTS BY PRODUCT TYPE

• 7.1.GPU (Graphics Processing Unit)
• 7.2.CPU (Central Processing Unit)
• 7.3.APU (Accelerated Processing Unit)
• 7.4.FPGA (Field Programmable Gate Array)
• 7.5.ASIC (Application Specific Integrated Circuit)

8MARKET INSIGHTS BY APPLICATION

• 8.1.Graphics
• 8.2.AI and High-Performance Computing
• 8.3.Networking
• 8.4.Data Centres

9MARKET INSIGHTS BY END-USERS

• 9.1.Enterprise Storage
• 9.2.Telecommunications and Networking
• 9.3.Artificial Intelligence Developers
• 9.4.Others (Cryptocurrency Miners, Personal Devices, etc.)

10MARKET INSIGHTS BY REGION

• 10.1.North America
  • 10.1.1.The U.S.
  • 10.1.2.Canada
  • 10.1.3.Rest of North America
• 10.2.Europe
  • 10.2.1.Germany
  • 10.2.2.The U.K.
  • 10.2.3.France
  • 10.2.4.Italy
  • 10.2.5.Rest of Europe
• 10.3.Asia-Pacific
  • 10.3.1.China
  • 10.3.2.India
  • 10.3.3.Japan
  • 10.3.4.South Korea
  • 10.3.5.Taiwan
  • 10.3.6.Rest of Asia-Pacific
• 10.4.Rest of the World

11HYBRID MEMORY CUBE MARKET DYNAMICS

• 11.1.Market Drivers
• 11.2.Market Challenges
• 11.3.Impact Analysis

12HYBRID MEMORY CUBE MARKET OPPORTUNITIES

13HYBRID MEMORY CUBE MARKET TRENDS

14DEMAND AND SUPPLY-SIDE ANALYSIS

• 14.1.Demand Side Analysis
• 14.2.Supply Side Analysis

15VALUE CHAIN ANALYSIS

16COMPETITIVE SCENARIO

• 16.1.Competitive Landscape
  • 16.1.1.Porters Fiver Forces Analysis

17COMPANY PROFILED

• 17.1.Micron Technology, Inc.
• 17.2.Samsung
• 17.3.SK HYNIX INC.
• 17.4.Intel Corporation
• 17.5.NVIDIA Corporation
• 17.6.Global Unichip Corp
• 17.7.Cambricon
• 17.8.Huawei Technologies Co.,
• 17.9.IBM
• 17.10.Advanced Micro Devices, Inc.

18DISCLAIMER