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市场调查报告书
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1637725

HMC（混合记忆体立方体）：市场占有率分析、产业趋势与统计、成长预测（2025-2030）

Hybrid Memory Cube - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

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简介目录

预计 2025 年 HMC（混合储存立方体）市场规模为 16.7 亿美元，预计到 2030 年将达到 33.7 亿美元，预测期内（2025-2030 年）的复合年增长率为 15.11%。

混合记忆立方体-市场-IMG1

HMC（混合记忆体立方体）是一项革命性的技术，代表了目前记忆体架构的模式转移。

主要亮点

  • 推动HMC（混合记忆体立方体）市场扩张的关键因素是伺服器场和员工数量的增加、商业设备出货量的增加以及企业库存和消费硬体领域的组装活动的增加。 2023年5月，美国工厂的商务用设备订单连续第二个月上涨，儘管借贷成本上升和经济不确定性增加，但企业仍在继续进行大规模投资。由于对高频宽的需求不断增长、人工智慧 (AI) 的使用日益增多以及电子设备小型化的趋势等因素，混合记忆体立方体 (HMC) 和高频宽记忆体 (HBM) 的市场正在不断扩大。
  • HMC 正在透过实现可以取代传统基于 DRAM 的系统的进步来重新定义记忆体。 HMC 准备在记忆体市场设立新的标准，以匹配现有系统（例如 CPU）实现的运算速度。
  • HMC 打破了记忆体障碍，大幅提高了频宽和效能。 HMC 的架构比目前的记忆体架构效率高出许多，每位消耗的能量比目前的 DRAM 技术少 70%。例如，新思科技 (Synopsys) 已宣布推出适用于美光混合记忆体立方体 (HMC) 架构的下一代检验IP (VIP)。这使得 Micron HMC 具有易用性、快速整合和最佳性能，从而加速了检验结束。
  • 预计不断增长的行动性需求和云端服务日益增长的影响力将进一步推动对 HMC 解决方案的需求。这是因为 HMC 的高频宽提高了网路系统的容量以匹配线速性能。
  • 新冠肺炎疫情影响到全球各产业，并对全球经济造成了不利影响。半导体、家电、旅游、汽车等多个产业都受到疫情的严重影响，对HMC（混合储存立方体）市场产生了负面影响。
  • 疫情过后，HMC（混合储存立方体）市场发生了显着的变化。远距工作和数位转型的需求不断增长，推动了对增强运算能力的需求。随着企业适应混合网路模型，资料密集型任务急剧增加，推动了对 HMC 等高效能记忆体解决方案的需求。疫情加速了技术的采用，凸显了高效资料处理和储存的重要性，对 HMC 市场产生了正面影响。

HMC（混合储存立方体）的市场趋势

通讯和网路产业预计将实现大幅成长

  • 由于这些领域对高速资料处理和传输的需求不断增加，HMC（混合储存立方体）市场的通讯和网路领域预计会出现成长。
  • 与传统记忆体解决方案相比，HMC 技术提供了更高的效能、频宽和能源效率，使其非常适合要求严格的 IT 和通讯应用。随着这些行业不断扩张并采用 5G 和边缘运算等先进技术，对 HMC 等高效能记忆体解决方案的需求预计将会增加，从而推动该领域的市场成长。
  • 随着基础设施建设向宽频和行动技术迈进，全球通讯产业正在不断转型。 HMC（混合记忆体立方体）越来越多地用于高效能运算（HPC）。 HPC 可以描述为一组分散式和平行化技术，用于连接计算单元以更快地执行更复杂的任务。
  • 边缘运算网路和传输技术支援透过连接的分散式通讯设备进行远距离资讯传输。传输、交换、处理、分析和搜寻资讯的快速技术创新对于各种新兴通讯技术的成功至关重要，这将在预测期内间接影响 HMC 市场的成长。 5G的出现可望推动HMC市场的发展。例如，GSMA 的一份报告称，到 2030年终，亚太地区将有约 14 亿个 5G 连线。

预计亚太地区复合年增长率最快

  • 由于消费群和资料流量的不断增加，该地区的零售、医疗保健、IT 和通讯行业需要先进的高速资料处理系统。此外，中国正寻求在通讯、物联网、巨量资料和云端运算等应用领域建立世界一流的积体电路设计单位，预计将进一步推动HMC市场的发展。
  • 透过连网设备产生的大量资料和巨量资料应用的出现给资料中心记忆体系统和容量带来了巨大的压力，企业正在寻找解决这个问题的解决方案。 HMC 不仅可以减少资料中心的工作量，而且还具有提高效能和降低功耗的巨大潜力。
  • 2023 年 5 月，美光科技宣布，计划在日本政府的支持下，未来几年在日本投资高达 5,000 亿日圆（36 亿美元），扩大其在下一代记忆体晶片领域的业务。这项战略措施体现了日本政府振兴半导体产业、强化日本晶片供应链的决心。这也恰逢将先进晶片技术引入日本的努力，尤其是在美国关係紧张加剧的背景下。
  • 亚太地区互联网基础设施的发展将推动该地区采用模组化资料中心。因此，亚太地区各种规模和产业的企业都在拥抱数位革命。这也推动资料中心供应商和使用者继续增加对模组化资料中心建置和服务的投资。由于这些关键倡议，预计亚太地区在预测期内将实现 58.57% 的最高成长率。

HMC（混合储存立方体）产业概况

HMC（混合储存立方体）市场上有许多主要公司，因此公司之间的竞争非常激烈。主要参与者包括美光科技、三星、英特尔和富士通。这些参与者在其产品中带来的创新以及他们预测消费者需求并在市场上推出新产品的能力使他们比其他参与者俱有竞争优势。在HMC领域的研发、策略伙伴关係和併购方面的大量投资使每家公司都占据了相当可观的市场占有率。

  • 2023 年 5 月 - 由于美国对中国半导体製造设备的禁令，DRAM 製造商SK 海力士决定迁往中国，而不是转向专注于DDR3 和DDR4 4Gb 产品的更先进的製造工艺。工艺。
  • 2023 年 1 月 - Aerospike 让企业能够借助现代资料平台扩展其数据，该平台可以处理全球弹性应用程序、以无限规模运行并提供可预测的性能和成本效益。

其他福利：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第 1 章 简介

  • 研究假设和市场定义
  • 研究范围

第二章调查方法

第三章执行摘要

第四章 市场动态

  • 市场概况
  • 市场驱动因素与限制因素简介
  • 市场驱动因素
    • 企业储存应用需求不断成长
  • 市场限制
    • 存在现有 DRAM
  • 产业吸引力-波特五力分析
    • 购买者/消费者的议价能力
    • 供应商的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争对手之间的竞争强度

第五章 市场区隔

  • 按最终用户产业
    • 企业储存
    • 通讯和网路
    • 其他最终用户产业
  • 按地区
    • 北美洲
      • 美国
      • 加拿大
    • 欧洲
      • 英国
      • 德国
      • 法国
      • 其他欧洲国家
    • 亚太地区
      • 中国
      • 日本
      • 韩国
      • 台湾
      • 其他亚太地区
    • 世界其他地区
      • 拉丁美洲
      • 中东和非洲

第六章 竞争格局

  • 公司简介
    • Micron Technologies Inc.
    • Intel Corporation
    • Xilinx Inc.
    • Fujitsu Ltd.
    • Semtech Corporation
    • Open Silicon Inc.
    • ARM Holdings PLC
    • Samsung Electronics Co. Ltd.
    • IBM Corporation
    • Altera Corporation

第七章投资分析

第八章 市场机会与未来趋势

简介目录
Product Code: 46357

The Hybrid Memory Cube Market size is estimated at USD 1.67 billion in 2025, and is expected to reach USD 3.37 billion by 2030, at a CAGR of 15.11% during the forecast period (2025-2030).

Hybrid Memory Cube - Market - IMG1

A hybrid memory cube (henceforth called HMC) is a revolutionary technology that signifies a paradigm shift from current memory architectures.

Key Highlights

  • The significant factors driving the Hybrid Memory Cube (HMC) market expansion are the rising number of server farms and employees, the increasing shipments of business equipment, and the rising number of assembling activities in the venture stockpiling and consumer hardware sectors. In May 2023, orders for business equipment from United States factories increased for a second consecutive month, suggesting that companies persist in making substantial investments despite elevated borrowing costs and economic uncertainties. The market for Hybrid Memory Cube (HMC) and High-bandwidth memory (HBM) is expanding due to factors like the increasing need for high bandwidth, rising artificial intelligence (AI) use, and developing trends in electronic device downsizing.
  • HMC is redefining memory by enabling advancements that can replace conventional DRAM-based systems. It is setting a new standard in the memory market that matches the computing speeds realized by existing systems (such as CPU).
  • HMC dramatically improves bandwidth and performance by breaking through the memory wall. The architecture of HMC is exponentially more efficient than current memory architectures, utilizing 70% less energy per bit than current DRAM technologies. For instance, Synopsys Inc. announced the availability of its next-generation Verification IP (VIP) for Micron's Hybrid Memory Cube (HMC) architecture. This can enable Micron's HMC with ease of use, fast integration, and optimum performance, resulting in accelerated verification closure.
  • The ever-increasing demand for mobility and the rising impact of cloud services are expected to further create demand for HMC solutions, owing to their higher bandwidth, which boosts the capability of networking systems to match line speed performance.
  • The COVID-19 pandemic impacted worldwide sectors and negatively impacted the global economy. Many industries, such as semiconductors, consumer electronics, travel, and automobiles, were severely affected due to the pandemic, which negatively impacted the hybrid memory cube market.
  • Post-COVID, the hybrid memory cube market experienced notable shifts; the increased demand for remote work and digital transformation fueled the need for enhanced computing capabilities. As businesses adapted to hybrid web models, there was a surge in data-intensive tasks driving the demand for high-performance memory solutions like HMC. The pandemic accelerated technology adoption, emphasizing the importance of efficient data processing and storage, positively influencing the HMC market.

Hybrid Memory Cube Market Trends

Telecommunications and Networking Segment is Expected to Register a Significant Growth

  • The telecommunications and networking segment's anticipated growth in the hybrid memory cube (HMC) market is likely due to increasing demand for high-speed data processing and transfer in these sectors.
  • HMC technology offers enhanced performance, bandwidth, and energy efficiency compared to traditional memory solutions, making it well-suited for meeting the demands of telecommunications and networking applications. As these industries continue to expand and adopt advanced technologies like 5G and edge computing, the need for efficient memory solutions like HMC is expected to rise, driving growth in this segment of the market.
  • The global telecommunication sector is continuously transitioning as infrastructure improvements to broadband and mobile technologies continue. Hybrid memory cubes are increasingly used for high-performance computing (HPC), which can be termed as the set of distributed and parallelization techniques used to connect computing units to perform more complex tasks faster.
  • Edge computing networks and telecommunication technologies support information transmission over distances via., connected and distributed communication devices. Rapid innovations in transmitting, switching, processing, analyzing, and retrieving information are essential for the success of various emerging telecommunication technologies, and this is likely to indirectly influence the growth of the HMC market over the forecast period. The advent of 5G is expected to boost the HMC market. For instance, according to the GSMA report, by the end of 2030, there will be around 1.4 billion 5G connections in Asia Pacific.

Asia-Pacific is Expected to Witness Fastest CAGR

  • The region's industries, such as retail, healthcare, IT, and telecommunication, need advanced and fast data processing systems due to the increasing consumer base and data traffic. Moreover, China wishes to establish a world-class IC design unit in applications, such as telecommunications, IoT, big data, and cloud computing industries, which is expected to further boost the HMC market.
  • The enormous amount of data generated through the connected devices and the emergence of Big Data applications have put intense pressure on the data center memory systems and capacity, making the companies look for solutions to the problem. HMCs have a huge potential that could reduce not only the workload but also increase the performance and reduce power consumption by the data centers.
  • In May 2023, Micron Technology has announced its intention to invest up to JPY 500 billion (USD 3.6 billion) in Japan over the next few years, with the support of the Japanese government to rise its business in next-generation memory chips. This strategic move reflects the Japanese government's determination to revitalize its semiconductor industry and enhance the country's chip supply chain. It also aligns with their efforts to introduce advanced chip technology to Japan, particularly in light of the growing tensions between the United States and China.
  • The development of internet infrastructure in Asia-Pacific leads to the employment of modular data centers in this region. Therefore, Asia-Pacific companies of all sizes and industries are embracing the digital revolution. It is also driving data center providers and users to continuously increase their investment in the construction and services of modular data centers. Due to these significant measures, Asia-Pacific is expected to account for the highest growth rate of 58.57% over the forecast period.

Hybrid Memory Cube Industry Overview

The competitive rivalry among the players in the hybrid memory cube market is high due to the presence of many major players. Some major players include Micron Technologies, Samsung, Intel, Fujitsu, and many more. The innovations brought about by these players in their products and their ability to introduce a new product in the market by forecasting the needs of their consumers has enabled them to gain a competitive advantage over other players. Hefty investments in research and development, strategic partnerships, and mergers and acquisitions in the field of HMC have enabled the companies to capture a significant market share.

  • May 2023 - SK hynix, a manufacturer of DRAMs, announced the expansion of its legacy processes in its Wuxi, China fab, instead of transitioning to more advanced production processes focusing on DDR3 and DDR4 4Gb products, due to the US ban imposed on semiconductor manufacturing equipment in the country.
  • January 2023 - Aerospike enabled businesses to make real-time or nearly real-time decisions with the help of its modern data platform, which can handle globally resilient applications, function at an infinite scale, and provide predictable performance and cost-effectiveness.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope Of The Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Introduction to Market Drivers and Restraints
  • 4.3 Market Drivers
    • 4.3.1 Increasing Demand for Enterprise Storage Application
  • 4.4 Market Restraints
    • 4.4.1 Strong Presence of Existing DRAMs
  • 4.5 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.5.1 Bargaining Power of Buyers/Consumers
    • 4.5.2 Bargaining Power of Suppliers
    • 4.5.3 Threat of New Entrants
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry

5 MARKET SEGMENTATION

  • 5.1 By End-user Industry
    • 5.1.1 Enterprise Storage
    • 5.1.2 Telecommunications and Networking
    • 5.1.3 Other End-user Industries
  • 5.2 Geography
    • 5.2.1 North America
      • 5.2.1.1 United States
      • 5.2.1.2 Canada
    • 5.2.2 Europe
      • 5.2.2.1 United Kingdom
      • 5.2.2.2 Germany
      • 5.2.2.3 France
      • 5.2.2.4 Rest of Europe
    • 5.2.3 Asia-Pacific
      • 5.2.3.1 China
      • 5.2.3.2 Japan
      • 5.2.3.3 South Korea
      • 5.2.3.4 Taiwan
      • 5.2.3.5 Rest of Asia-Pacific
    • 5.2.4 Rest of the World
      • 5.2.4.1 Latin America
      • 5.2.4.2 Middle-East & Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Micron Technologies Inc.
    • 6.1.2 Intel Corporation
    • 6.1.3 Xilinx Inc.
    • 6.1.4 Fujitsu Ltd.
    • 6.1.5 Semtech Corporation
    • 6.1.6 Open Silicon Inc.
    • 6.1.7 ARM Holdings PLC
    • 6.1.8 Samsung Electronics Co. Ltd.
    • 6.1.9 IBM Corporation
    • 6.1.10 Altera Corporation

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS