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市场调查报告书
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HBM（高频宽记忆体）：市场占有率分析、产业趋势与统计、成长预测（2024-2029）

High Bandwidth Memory - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

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简介目录

HBM（高频宽记忆体）市场规模预计到 2024 年为 25.2 亿美元，预计到 2029 年将达到 79.5 亿美元，在预测期内（2024-2029 年）复合年增长率为 25.86%。

HBM市场

推动 HBM 市场成长的主要因素包括对高频宽、低功耗和高度扩充性记忆体的需求不断增长，人工智慧的采用不断增加，以及电子设备小型化的趋势日益明显。

主要亮点

  • HBM 是一种用于 3D 堆迭 SDRAM 的高速电脑记忆体接口，通常用于高效能图形加速器、网路设备和超级电脑。
  • 透过在电路上堆迭多达 8 个 DRAM晶粒并将它们与 TSV 互连，HBM 提供了显着更高的频宽，同时以相对较小的外形尺寸降低了功耗。此外，HBM 具有 128 位元通道，总合8 个通道，提供 1024 位元介面。因此，具有 4 个 HBM 堆迭的 GPU 提供 4096 位元记忆体汇流排。
  • 随着图形应用程式的成长，对更快的资讯传输（频宽）的需求也在增长。因此，HBM内存在性能和功效方面将优于先前使用的GDDR5，为HBM市场创造成长机会。
  • 此外，由于 COVID-19 在全球蔓延，主要半导体供应商的产能业务减少。此外，由于劳动力短缺，中国许多包装和检验工厂已经减少或关闭业务。对于依赖此类后端封装和测试能力的晶片公司来说，这一直是一个瓶颈。
  • 然而，推动市场成长的因素包括人工智慧的日益普及，对低功耗、高频宽和高度扩充性记忆体的需求不断增加，以及电子设备小型化的趋势日益增强。

HBM 市场趋势

汽车及其他应用领域预计将显着成长

  • HBM 应用正在扩展到汽车领域，尤其是随着自动驾驶汽车和 ADAS 整合的兴起。汽车行业的进步正在推动高性能记忆体的采用并支持 HBM 的成长。
  • HBM 透过使用 2.5D 技术改进传统 DRAM、降低驱动讯号所需的功耗并使讯号更接近 CPU，同时最大限度地减少 RC 延迟来取得进步。自动驾驶市场正在扩大，并广泛使用资料集来解释和分析环境。资料处理速度非常快，以防止事故和即将发生的灾难。对快速、强大 GPU 的需求增加了对系统中安装的 HBM 的需求。
  • 先进的驾驶员辅助技术以及自动驾驶在汽车行业中变得非常普及。以前的 ADAS 设计使用 DDR4 和 LPDDR4 等记忆体晶片，因为它们在当时很容易获得。然而，随着汽车产业从成本效益转向更好的性能参数，ADAS 製造商正在将 HBM 技术纳入其设计架构中。
  • 汽车技术的快速进步以及汽车中边缘技术的使用增加预计将增加该领域的 HBM 和 DDRAM 销售。

北美占最大市场份额

  • HBM 内存在北美的高采用率主要​​是由于高效能运算 (HPC) 应用程式的成长，这些应用程式需要高频宽记忆体解决方案来进行高速资料处理。人工智慧、机器学习和云端运算市场的扩大正在增加北美对 HPC 的需求。
  • 各行业技术的快速变化和大量资料的产生需要更有效率的处理系统。这些也是推动该地区 HBM 市场需求的一些因素。
  • 此外，美国政府也启动了资料中心优化倡议（DCOI），以整合全国众多资料中心，为公民提供更好的服务，同时增加纳税人的投资收益。整合过程包括建置超大型资料中心和关闭表现不佳的资料中心。根据 Cloudscene 的数据，截至 2022 年 1 月，美国约有 2,701 个资料中心。
  • 此外，北美记忆体製造商正在寻求扩大生产的机会。例如，英特尔宣布推出采用 HBM 的新一代 Sapphire Rapids (SPR) Xeon 可扩充处理器。 Sapphire Rapids 支援的 DDR5 有望取代目前伺服器记忆体趋势的 DDR4，并支援 HBM，从而显着扩展了 CPU 可用的记忆体频宽。

HBM行业概况

HBM 市场竞争激烈且高度分散，由多家大型企业组成。该产业竞争对手之间的竞争主要取决于透过创新、市场渗透和竞争策略所获得的可持续竞争优势。由于该市场是资金集中的，退出障碍也很高。该市场的主要参与者包括英特尔公司、东芝公司、富士通有限公司等。市场近期的主要发展包括：

  • 2022 年 2 月 - Advanced Micro Devices Inc. 宣布收购 Xilinx。该公司预计此次收购将在第一年增加非公认会计准则利润率、非公认会计准则每股收益和自由现金流的产生。此外，收购赛灵思汇集了AMD高度互补的产品、客户和市场，以及差异化的IP和世界一流的人才，使AMD成为业界高性能、适应性强的计算组织之一。 。
  • 2022 年 11 月—英特尔公司发布了两款针对高效能运算 (HPC) 和人工智慧 (AI) 的尖端解决方案，作为英特尔 Max 系列产品家族的一部分。英特尔至强CPU Max系列（代号Sapphire Rapids）HBM和英特尔资料中心GPU Max系列（代号Ponte Vecchio），这些新产品将为计画在阿贡国家实验室建造的「Aurora」超级电脑供电。

其他福利

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业价值链分析
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 买家/消费者的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争公司之间敌对关係的强度
  • COVID-19 市场影响评估
  • 市场驱动因素
    • 对高频宽、低功耗和高度扩充性记忆体的需求不断增长
    • 人工智慧的采用率不断提高
    • 电子设备小型化趋势日益明显
  • 市场挑战
    • 与 HBM 相关的高成本和设计复杂性
  • 记忆体市场
    • DRAM收益与需求预测（2023-2028）
    • 按地区分類的 DRAM 销售额（与 HBM 市场相同的地区）
    • DDR5 RAM 产品的当前价格
    • DDR5产品厂商名单

第五章市场区隔

  • 按申请
    • 伺服器
    • 联网
    • 消费者
    • 汽车和其他应用
  • 按地区
    • 北美洲
      • 美国
      • 加拿大
    • 欧洲
      • 德国
      • 法国
      • 英国
      • 其他欧洲国家
    • 亚太地区
      • 印度
      • 中国
      • 日本
      • 其他亚太地区
    • 世界其他地区

第六章 竞争形势

  • 公司简介
    • 主要 HBM 内存晶粒供应商
      • Micron Technology Inc.
      • Samsung Electronics Co. Ltd
      • SK Hynix Inc.
    • 主要相关人员简介
      • Intel Corporation
      • Fujitsu Limited
      • Advanced Micro Devices Inc.
      • Xilinx Inc.
      • Nvidia Corporation
      • Open Silicon Inc.

第七章 投资分析

第八章 市场机会及未来趋势

简介目录
Product Code: 69589

The High Bandwidth Memory Market size is estimated at USD 2.52 billion in 2024, and is expected to reach USD 7.95 billion by 2029, growing at a CAGR of 25.86% during the forecast period (2024-2029).

High Bandwidth Memory - Market

Major factors driving the growth of the high bandwidth memory (HBM) market include the growing need for high-bandwidth, low power consumption, and highly scalable memories, increasing adoption of artificial intelligence, and a rising trend of miniaturization of electronic devices.

Key Highlights

  • High Bandwidth Memory (HBM) is a high-speed computer memory interface for 3D-stacked SDRAM, usually used with high-performance graphics accelerators, network devices, and supercomputers.
  • By stacking up to 8 DRAM dies on the circuit and interconnecting them by TSVs, HBM offers a substantially higher bandwidth while using less power in a relatively more minor form factor. Also, with 128-bit channels and a total of 8 channels, the HBM offers a 1024-bit interface; a GPU with four HBM stacks would therefore provide a memory bus with 4096 bits.
  • With the growing graphics application, the appetite for fast information delivery (bandwidth) has also increased. Therefore HBM memory performs better than a GDDR5, which was used earlier in terms of performance and power efficiency, resulting in growth opportunities for the high bandwidth memory market.
  • Moreover, the major semiconductor vendors are working with reduced capacity owing to the spread of COVID-19 worldwide. Additionally, due to the shortage of laborers, many packages and testing plants in China reduced or even stopped operations. This created a bottleneck for chip companies that rely on such back-end packages and testing capacity.
  • However, some factors driving the market's growth include the increasing adoption of artificial intelligence, increasing demand for low power consumption, high bandwidth, highly scalable memories, and a rising trend of miniaturization of electronic devices.

High Bandwidth Memory (HBM) Market Trends

Automotive and Other Applications Segment is Expected to Grow Significantly

  • The applications of high bandwidth memory are spanning in the automotive sector due to the rise of self-driving cars and ADAS integration, among others. The advancement in the automotive industry has driven the adoption of high-performance memory, which supports the growth of high-bandwidth memory.
  • HBM has evolved by improving upon conventional DRAM using 2.5D technology, bringing it closer to the CPU while requiring less power to drive a signal and minimizing RC latency. The autonomous driving market is expanding, extensively using data sets to interpret and analyze the environment. To prevent mishaps and impending catastrophes, data processing is carried out at a very rapid pace. The demand for quick and potent GPUs has increased the demand for high-bandwidth memory to be included in the systems.
  • Advanced driver-assistance technologies have become quite popular in the car industry alongside autonomous driving. Earlier ADAS designs use memory chips like DDR4 and LPDDR4 since they were readily available at the time. However, the automobile industry's transition from cost-effectiveness to better performance parameters pushes ADAS makers to incorporate HBM technology into their design architecture.
  • The rapid advancement of technology in automobiles and increasing usage of edge technologies in cars will boost the sales of High Bandwidth Memory and DDRAM in the sector.

North America to Hold the Largest Share in the Market

  • The high adoption of HBM memories in North America is primarily due to the growth in high-performance computing (HPC) applications that require high-bandwidth memory solutions for fast data processing. HPC demand in North America is growing due to the increasing market for AI, machine learning, and cloud computing.
  • The rapidly changing technologies and high data generation across industries create a need for more efficient processing systems. These are also some of the factors driving the demand for the high bandwidth memory market in the region.
  • Additionally, the US government has started the Data Center Optimization Initiative (DCOI) to deliver better services to the public while increasing return on investment to taxpayers by consolidating many data centers in the country. The consolidation process includes the process of building hyper-scale data centers and shut-off the underperforming ones. According to Cloudscene, the country has around 2,701 data centers in the United States as of January 2022.
  • Moreover, memory manufacturing companies in North America seek production expansions opportunities. For instance, Intel announced the launch of the next generation Sapphire Rapids (SPR) Xeon Scalable processor with high-bandwidth memory (HBM). DDR5, supported by Sapphire Rapids, is expected to replace DDR4, the current trend in server memory, with high-bandwidth memory (HBM) support that significantly expands the memory bandwidth available to the CPU.

High Bandwidth Memory (HBM) Industry Overview

The high bandwidth memory market is highly fragmented as the market is highly competitive and consists of several major players. This industry's competitive rivalry primarily depends on sustainable competitive advantage through innovation, market penetration, and competitive strategy power. Since the market is capital-intensive, the barriers to exit are also high. Some of the key players in the market are Intel Corporation, Toshiba Corporation, Fujitsu Ltd, etc. Some of the key recent developments in the market are -

  • February 2022 - Advanced Micro Devices Inc. announced the acquisition of Xilinx. The company expects the purchase to boost non-GAAP margins, non-GAAP EPS, and free cash flow generation in the first year. Furthermore, AMD claims that the Xilinx acquisition brings together a highly complementary collection of products, customers, and markets, as well as differentiated IP and world-class personnel, to build the industry's high-performance and adaptive computing organization.
  • November 2022 - Two cutting-edge solutions for high-performance computing (HPC) and artificial intelligence (AI) have been released by Intel Corporation as part of the Intel Max Series product family: the Intel Xeon CPU Max Series (code-named Sapphire Rapids HBM) and the Intel Data Centre GPU Max Series (code-named Ponte Vecchio). The new items will power the forthcoming Aurora supercomputer at Argonne National Laboratory.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.3.1 Bargaining Power of Suppliers
    • 4.3.2 Bargaining Power of Buyers/Consumers
    • 4.3.3 Threat of New Entrants
    • 4.3.4 Threat of Substitutes
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Assessment of the impact of COVID-19 on the Market
  • 4.5 Market Drivers
    • 4.5.1 Growing Need for High-bandwidth, Low Power Consuming, and Highly Scalable Memories
    • 4.5.2 Increasing Adoption of Artificial Intelligence
    • 4.5.3 Rising Trend of Miniaturization of Electronic Devices
  • 4.6 Market Challenges
    • 4.6.1 Exorbitant Costs and Design Complexities associated with HBM
  • 4.7 DRAM MARKET
    • 4.7.1 DRAM Revenue and Demand Forecast (2023-2028)
    • 4.7.2 DRAM Revenue by Geography (Same geographical regions as in the HBM Market)
    • 4.7.3 Current Pricing of DDR5 RAM Products
    • 4.7.4 List of DDR5 Product Manufacturers

5 MARKET SEGMENTATION

  • 5.1 By Application
    • 5.1.1 Servers
    • 5.1.2 Networking
    • 5.1.3 Consumer
    • 5.1.4 Automotive and Other Applications
  • 5.2 By Geography
    • 5.2.1 North America
      • 5.2.1.1 United States
      • 5.2.1.2 Canada
    • 5.2.2 Europe
      • 5.2.2.1 Germany
      • 5.2.2.2 France
      • 5.2.2.3 United Kingdom
      • 5.2.2.4 Rest of Europe
    • 5.2.3 Asia Pacific
      • 5.2.3.1 India
      • 5.2.3.2 China
      • 5.2.3.3 Japan
      • 5.2.3.4 Rest of Asia Pacific
    • 5.2.4 Rest of the World

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Key HBM Memory Die Suppliers
      • 6.1.1.1 Micron Technology Inc.
      • 6.1.1.2 Samsung Electronics Co. Ltd
      • 6.1.1.3 SK Hynix Inc.
    • 6.1.2 Key Stakeholders Profiles
      • 6.1.2.1 Intel Corporation
      • 6.1.2.2 Fujitsu Limited
      • 6.1.2.3 Advanced Micro Devices Inc.
      • 6.1.2.4 Xilinx Inc.
      • 6.1.2.5 Nvidia Corporation
      • 6.1.2.6 Open Silicon Inc.

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS