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市场调查报告书
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3D TSV 和 2.5D：市场占有率分析、产业趋势与统计、成长预测（2024-2029）

3D TSV And 2.5D - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 118 Pages | 商品交期: 2-3个工作天内

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简介目录

3D TSV和2.5D市场规模预计到2024年为460.6亿美元，预计到2029年将达到2233.3亿美元，在预测期内（2024-2029年）复合年增长率为30.10%。

3D TSV 和 2.5D 市场

半导体产业的封装正在经历不断的变革。随着半导体应用的成长，CMOS 尺寸缩小和价格上涨迫使该产业依赖IC封装的进步。 3D堆迭技术是满足AI、ML和资料中心等应用效能需求的解决方案。因此，在整个预测期内，对高效能运算应用的需求不断增长将主要推动 TSV（硅穿孔）市场。

主要亮点

  • 3D TSV封装技术也备受关注。这减少了晶片和当前焊线技术之间的资料传输时间，从而实现更快的速度并显着降低功耗。 2022 年 10 月，台积电推出创新3DFabric 联盟，这是对台积电开放创新平台 (OIP) 的重要介绍，该平台使客户能够克服半导体和系统级设计挑战中快速增加的障碍。它还可以帮助您使用 TSMC 的 3DFabric 技术快速整合下一代 HPC 和行动技术进步。
  • 消费者对电子产品的需求不断增长，推动了对能够实现各种新功能的先进半导体装置的需求。随着对半导体消费性电子产品的需求持续增长，先进的封装技术提供了当今数位化世界所需的外形尺寸和处理能力。例如，根据半导体产业协会的数据，2022年8月全球半导体产业销售额为474亿美元，较2021年8月的总合小幅成长0.1%。
  • 此外，根据 GSM 协会的数据，到 2025 年，美国预计将拥有世界上最高的智慧型手机普及（连线数的 49%）。根据美国物联网协会的数据，消费者每个家庭拥有智慧家庭设备的比例最高，并且最有可能拥有跨越两个或三个用例（能源、安全、电器）的设备。
  • 此外，拜登政府将于2022年9月将美国必不可少的全球最先进晶片的产量削减至零，并消耗其中的25%，并宣布将投资500亿美元用于研发安全。拜登总统于 2022 年 8 月签署了价值 2800 亿美元的 CHIPS 法案，旨在促进国内高科技製造业，作为其政府推动提高美国对华竞争力的一部分。对半导体产业的如此坚实的投资可能会为所研究市场的成长提供利润丰厚的机会。
  • MEMS 和感测器的成长是由于汽车、工业自动化等多种应用中对感测器和显示器的需求快速增长。 MEMS製造商和全球半导体产业的主要参与者意法半导体将于2022年8月推出第三代MEMS感测器，专为消费智慧产业、行动装置、医疗保健和零售业而设计。强大的晶片大小的动作感测器和环境感测器为当今智慧型手机的用户友好和情境感知功能提供动力，而穿戴式装置则采用 MEMS 技术製造。 ST 最新一代 MEMS 感测器突破了输出精度和功耗的技术界限，将性能提升到了新的水平。
  • 此外，製造 TSV 装置的高成本限制了市场的成长。这不仅包括设备的成本，还包括设备正常运作所需的配件和耗材的成本。此外，管理 TSV 装置製造的严格准则和法规也增加了成本。
  • 此外，全球半导体短缺促使企业在疫情后专注于扩大产能。例如，中芯国际宣布了雄心勃勃的计划，透过在多个城市建立自己的晶片製造工厂，到2025年将产能翻一番。此外，亚太地区许多地方政府正在透过长期计划为半导体产业提供资金，市场成长预计将恢復。例如，中国政府已为2030年国家积体电路投资基金第二期引入约230亿美元至300亿美元资金。
  • 此外，俄罗斯和乌克兰之间持续的衝突预计将对电子产业产生重大影响。这场衝突已经影响该行业一段时间，加剧了半导体供应链问题和晶片短缺。这种干扰可能以镍、钯、铜、钛、铝和铁矿石等关键原料的价格波动的形式出现，导致材料短缺。这给 3D 堆迭记忆体的製造带来了问题。

3D TSV 和 2.5D 市场趋势

LED构装预计将显着成长

  • LED 在产品中的使用越来越多，推动了高功率、高密度、低成本设备的发展。与 2D 封装不同，采用硅通孔 (TSV) 技术的3D(3D) 封装可实现高密度垂直互连。
  • TSV 积体电路减少了连接长度。因此，如果要有效地结合单晶片和多功能整合以提供高速、低功耗互连，则需要更小的寄生电容、电感和电阻。根据IEA预测，LED在国际照明市场的普及预计在2025年达到约76%，并在2030年进一步达到87.4%。
  • 此外，政府采用节能 LED 的措施和法规正在推动所研究的市场。根据国际能源总署（IEA）预测，2025年LED在照明市场的成长率预计为75.8%。
  • LED构装要求可能会进一步提高。如果LED晶片在封装内放置不准确，会直接影响整个封装治具的发光效率。任何偏离既定位置的情况都会导致LED光线无法从反光杯完全反射，进而影响LED的亮度。
  • 美国能源局最近宣布，将投资 6,100 万美元实施 10 个先导计画，利用尖端技术将数千个家庭和企业改造为最先进的节能网路。这也适用于更换白炽灯或卤素灯泡而采用更节能的 LED 照明时。因此，随着LED的扩张，美国对LED构装的需求预计在预测期内将会增加。
  • 此外，市场上的各个参与者正在研究的市场中开发新产品。 2022 年 5 月，Lumileds LLC 推出高功率CSP（晶片级封装）LED。 LUXEON HL1Z 是一款无圆顶单面发送器，可透过尺寸仅 1.4 平方毫米的小盒子提供高发光效率（超过 137 lm/W）。
  • LED构装应用的快速发展预计将在未来几年增加创新和消费，从而推动所研究市场的成长。另一方面，高饱和度会限制产品的接受度，进而限制市场的成长。

预计亚太地区将占据主要市场占有率

  • 亚太地区是所研究市场中成长最快的地区。主要由于人口演变和都市化加快，智慧型手机普及不断上升，使该地区成为世界主要行动市场之一。
  • 根据GSM协会统计，智慧型手机宽频网路覆盖亚太地区96%的人口，有12亿人使用行动网路服务。全部区域的5G 势头持续加速，目前已在 14 个市场提供者使用 5G 服务。包括印度和越南在内的其他几个国家预计也将在未来几年加入。到 2025 年，全部区域，占人口的 14% 以上。此外，工业4.0也是亚太地区最新兴的趋势之一。物联网设备和小型化是利用 3D TSV 的工业 4.0 的主要趋势。该地区正在大力投资物联网，以支援智慧城市基础设施。
  • 不断发展的技术促进了消费性电器产品、电讯、医疗设备、通讯设备和汽车的发展。随着5G福利在日本的推出，对智慧型手机和其他产品的需求不断增加。
  • 据工信部称，中国希望在2022年安装200万个5G基地台，以发展下一代行动网路。根据工信部统计，目前中国当地已安装5G基地台142.5万个，支援全国超过5亿用户，是全球网路最完善的国家。该地区 5G 部署的不断增加预计也将推动对 5G 设备的需求，从而增加对 2.5D 和 3D 半导体封装的需求。
  • 此外，根据中国资讯通信研究院的数据，5G智慧型手机出货量占国内出货的75.9%，高于全球平均40.7%。到2022年7月，5G智慧型手机预计将达到中国所有行动电话出货的74%。到2022年7月，5G行动电话出货总量将达到1,24mm，中国已推出121款最新5G行动电话。这些趋势将加速该地区对2.5D和3D半导体封装解决方案的需求。
  • 自动驾驶和电动车的使用不断增加也增加了全部区域对先进半导体的需求，进一步支持了所研究市场的成长。特斯拉计划于 2022 年 2 月在中国建造第二座电动车工厂，以满足国内和出口市场不断增长的需求。短期内，特斯拉打算将其在中国的产能提高到每年至少1毫米，并计划在上海临港自贸区目前的展厅周围建造第二家工厂。此外，中国政府的目标是到 2025 年电动车占汽车销售量的 20%，其中包括采用新能源车作为下一代政府用车。
  • 此外，增加对半导体製造和封装厂的投资也为所研究的市场创造了有利的成长前景。例如，领先的半导体晶片製造商英特尔最近宣布投资70亿美元在马来西亚建造先进的晶片封装工厂。同样，2022年11月，日月光半导体工程公司（ASE）宣布投资3亿美元扩大在马来西亚的生产基地。

3D TSV 和 2.5D 产业概述

3D TSV 和 2.5D 市场竞争激烈且多元化，由众多主要企业组成。市场上小型、大型和本地供应商的存在提供了极好的竞争。这些公司利用策略协作来扩大市场占有率并提高盈利。市场上的公司也正在收购致力于企业网路设备技术的新兴企业，以增强其产品能力。

2022 年 8 月，英特尔公布了独特的架构和封装突破，支援基于 2.5D 和 3D 的晶片设计，开创了晶片製造技术及其重要性的非凡时代。英特尔的系统晶圆代工厂模型采用增强型封装。该组织的目标是到 2030 年将封装上的电晶体数量从 1,000 亿个增加到 1 兆个。

2022 年 3 月，Apple 采用 2.5D 方法，促进了最新 M1 Ultra 设备的创建，这为未来基于小晶片的设计打开了大门。这种名为 UltraFusion 的封装架构将硅中介层上的两个 M1 Max 晶片的晶粒互连起来，创建了系统晶片(SoC)。它利用硅基基板和中介层支援两个具有 10,000 个互连的晶粒，具有低延迟和 2.5 TB/s 的晶片间频宽。这也将晶粒连接到以 800 GB/s 介面运行的 128 GB 低延迟统一记忆体。

其他福利

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 买方议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争公司之间敌对关係的强度
  • 产业价值链分析
  • 宏观经济走势对市场的影响

第五章市场动态

  • 市场驱动因素
    • 扩大高效能运算应用市场
    • 资料中心和储存设备的扩展
  • 市场挑战
    • IC封装单价较高

第 6 章 技术概览

第七章市场区隔

  • 按包装类型
    • 3D堆迭内存
    • 2.5D内插器
    • 带有 TSV 的 CIS
    • 3D SoC
    • 其他封装类型（LED、MEMS 和感测器等）
  • 按最终用户使用情况
    • 消费性电子产品
    • 车
    • 高效能运算 (HPC) 和网络
    • 其他最终用户用途
  • 按地区
    • 北美洲
      • 美国
      • 加拿大
    • 欧洲
      • 英国
      • 德国
      • 法国
      • 义大利
      • 其他欧洲国家
    • 亚太地区
      • 中国
      • 印度
      • 日本
      • 澳洲
      • 东南亚
      • 其他亚太地区
    • 世界其他地区

第八章 竞争形势

  • 公司简介
    • Toshiba Corp.
    • Samsung Electronics Co. Ltd.
    • ASE Group
    • Taiwan Semiconductor Manufacturing Company Limited
    • Amkor Technology, Inc.
    • Pure Storage Inc.
    • United Microelectronics Corp.
    • STMicroelectronics NV
    • Broadcom Ltd.
    • Intel Corporation
    • Jiangsu Changing Electronics Technology Co. Ltd.

第九章投资分析

第10章市场的未来

简介目录
Product Code: 66995

The 3D TSV And 2.5D Market size is estimated at USD 46.06 billion in 2024, and is expected to reach USD 223.33 billion by 2029, growing at a CAGR of 30.10% during the forecast period (2024-2029).

3D TSV And 2.5D - Market

Packaging in the semiconductor industry has noticed a continuous transformation. As the semiconductor applications are growing, the slowdown in CMOS scaling and escalating prices have forced the industry to rely on the advancement in IC packaging. 3D stacking technologies are the solution that meets the required performance of applications like AI, ML, and data centers. Therefore, the growing requirement for high-performance computing applications mainly drives the TSV (Through Silicon Via) market over the forecast period.

Key Highlights

  • The 3D TSV packaging technology is also achieving traction. It reduces data transmission time between chips and the current wire bonding technology, resulting in significantly lower power consumption with faster speed. In October 2022, TSMC announced the launch of the creative 3DFabric Alliance, a considerable introduction to TSMC's Open Innovation Platform (OIP) to help customers overcome the surging hurdles of semiconductor and system-level design challenges. It will also help in gaining rapid integration of advancements for next-generation HPC and mobile technologies using TSMC's 3DFabric technologies.
  • Increasing consumer demand for electronics has sparked the need for advanced semiconductor devices that enable various new capabilities. As the demands for semiconductor appliances intensify consistently, advanced packaging techniques deliver the form factor and processing power required for today's digitized world. For instance, according to the Semiconductor Industry Association, during August 2022, global semiconductor industry sales were USD 47.4 billion, a slight boost of 0.1% over the August 2021 total of USD 47.3 billion.
  • In addition, according to the GSM Association, by 2025, the United States is expected to have the highest smartphone adoption globally (49% of connections). As per the United States IoT Association, it has the highest smart home device ratio per household and the most significant consumer tendency to own appliances across two or three use cases (energy, security, and appliances).
  • Moreover, in September 2022, the Biden administration announced that it would invest USD 50 billion in building up the domestic semiconductor industry to counter dependency on China, as the US produces zero and consumes 25% of the world's leading-edge chips vital for its national security. President Joe Biden signed a USD 280 billion CHIPS bill in August 2022 to boost domestic high-tech manufacturing, part of his administration's push to increase US competitiveness over China. Such robust investments in the semiconductor sector would present lucrative opportunities for the growth of the studied market.
  • The growth of MEMS and Sensors is attributed to the rapidly increasing demand for sensors and displays in various applications such as automotive, industrial automation, and many others. In August 2022, STMicroelectronics, a maker of MEMS and a significant player in the worldwide semiconductor industry, launched its third generation of MEMS sensors designed for consumer smart industries, mobile devices, healthcare, and retail sectors. The robust, chip-sized motion and environmental sensors power the user-friendly, context-aware features of today's smartphones, and wearables are made on MEMS technology. ST's most recent MEMS sensor generation drives technical boundaries regarding output accuracy and power consumption, elevating performance to a new level.
  • Furthermore, the high costs associated with TSV device manufacturing restrict market growth. This includes not only the cost of devices but also the cost of accessories and consumables needed for their proper functioning. Moreover, the stringent guidelines and regulations governing TSV device manufacturing also add to the charges.
  • Furthermore, the worldwide semiconductor shortage encouraged players to focus on expanding production capacity during a post-pandemic. For instance, the SMIC announced aggressive plans to double its production capacity by 2025 by constructing unique chip fabrication plants in different cities. Also, many Asian-Pacific local governments have funded the semiconductor industry in a long-term program, hence anticipated to regain market growth. For instance, the Chinese government introduced roughly USD 23-30 billion to pay for the second stage of its National IC Investment Fund 2030.
  • Moreover, the ongoing conflict between Russia and Ukraine is expected to impact the electronics industry significantly. The conflict has already exacerbated the semiconductor supply chain issues and the chip shortage that have affected the industry for some time. The disruption may come in the form of volatile pricing for critical raw materials such as nickel, palladium, copper, titanium, aluminum, and iron ore, resulting in material shortages. This would obstruct the manufacturing of 3D Stacked Memory.

3D TSV And 2.5D Market Trends

LED Packaging Expected to Witness the Significant Growth

  • The increasing use of LED in products has promoted the expansion of higher power, greater density, and lower-cost devices. Using three-dimensional (3D) packaging through silicon via (TSV) technology authorizes a high density of vertical interconnects, unlike 2D packaging.
  • TSV integrated circuits reduce connection lengths; thus, smaller parasitic capacitance, inductance, and resistance are required where a combination of monolithic and multifunctional integration is done efficiently, providing high-speed, low-power interconnects. According to IEA, the penetration rate of LEDs into the international lighting market is expected to reach some 76% in 2025 and further to 87.4% in 2030.
  • Further, government initiatives and rules to adopt energy-efficient LEDs drive the studied Market. According to the International Energy Agency (IEA), the growth rate of LEDs in the lighting market is anticipated to be 75.8% in 2025.
  • The requirements for LED packaging could be much better. If LED chips are not positioned into the package precisely, the luminescence efficiency of the overall packaging appliance might be affected directly. Any deviation from the established position will prevent LED light from being fully reflected from the reflective cup, affecting the LED's brightness.
  • The US Department of Energy recently announced investing USD 61 million in 10 pilot projects using the latest technologies to turn thousands of homes and businesses into cutting-edge, energy-efficient networks. This applies to switching out incandescent and halogen bulbs for better energy-efficient LED lighting. As a result, with the expansion in LEDs, the LED packaging need in the United States will grow in the forecasted period.
  • Furthermore, various players in the market are developing new products in the studied Market. In May 2022, Lumileds LLC launched high-power CSP (chip-scale package) LED. The LUXEON HL1Z is an un-domed, single-sided emitter that delivers high luminous efficacy (137lm/W or more) from a tiny box, just 1.4mm square.
  • Rapid advancements in LED package applications are projected to raise innovation and consumption in the coming years, propelling the studied market growth. On the other hand, high saturation may limit product acceptance, which, in turn, limits market growth.

Asia-Pacific is Expected to Hold the Significant Market Share

  • Asia-Pacific is the significant-growing region in the Market studied. The rising smartphone adoption rates have made the region one of the major mobile markets in the world, primarily due to the increasing population evolution and urbanization.
  • As per the GSM Association, smartphone broadband networks cover 96% of the population of APAC, with 1.2 billion people accessing mobile internet services. 5G momentum continues revving across the region, with commercial 5G services currently available across 14 markets. Several others, including India and Vietnam, are expected to board in the coming years. By 2025, there will be 400 million 5G connections across the region, over 14% of the population. Further, industry 4.0 is also one of Asia-Pacific's most emerging trends. IoT devices and miniaturization are important trends in Industry 4.0, utilizing 3D TSV. The region is investing heavily in IoT to support smart city infrastructure.
  • Advancing technologies have contributed to the development of consumer electronics, telecom, medical devices, communication devices, and automotive. With the launch of 5G benefits in the country, the demand for smartphones, among other things, has been rising.
  • According to the MIIT, China desired 2 million installed 5G base stations in 2022 to develop the country's next-generation mobile network. The Chinese mainland presently has 1.425 million installed 5G base stations that support more than 500 million 5G users nationally, making it the most comprehensive network in the world, as per MIIT. The growing implementation of 5G in the region is also expected to promote the demand for 5G-enabled devices, thereby increasing the need for 2.5D and 3D semiconductor packaging.
  • Further, according to CAICT, 5G smartphone shipments are recorded for 75.9% of domestic shipments, more significant than a global average of 40.7%. By July 2022, 5G smartphones will have reached 74% of all cellphone shipments in China. The total number of 5G cell phone shipments by July 2022 was 124mm units, and China introduced 121 latest 5G mobile phone models. Such trends would accelerate the region's demand for 2.5D and 3D semiconductor packaging solutions.
  • The increasing use of autonomous and electric vehicles has also increased the demand for advanced semiconductors across the region, further supporting the studied Market's growth. In February 2022, Tesla plans to build a 2nd EV facility in China to keep up with rising demand locally and in export markets. In the short term, Tesla intends to increase capacity in China to at least 1mm cars yearly, with a second plant planned around its present exhibition in Shanghai's Lingang free trade zone. In addition, the Chinese government seeks 20% of all vehicle sales to be electric by 2025, including adopting NEVs as the next generation of government vehicles.
  • Moreover, the growing investments in semiconductor manufacturing and packaging plants also create a favorable growth scenario for the studied Market. For instance, Intel, a significant semiconductor chip manufacturer, recently announced a USD 7 billion investment to build an advanced chip packaging facility in Malaysia. Similarly, in November 2022, Advanced Semiconductor Engineering (ASE) announced a USD 300 million investment to expand its production site in Malaysia.

3D TSV And 2.5D Industry Overview

The 3D TSV and 2.5D market is highly competitive and consists of various significant performers as it is diversified. The existence of small, large, and local vendors in the Market creates excellent competition. These firms leverage strategic collaborative endeavors to expand their market share and increase profitability. The companies in the Market are also acquiring start-ups performing on enterprise network equipment technologies to strengthen their product capabilities.

In August 2022, Intel showcased the unique architectural and packaging breakthroughs that help 2.5D and 3D-based chip designs, ushering in a remarkable era in chipmaking technologies and their importance. Intel's system foundry model features enhanced packaging. The organization intends to improve the number of transistors on a package from 100 billion to 1 trillion by 2030.

In March 2022, Apple adopted a 2.5D approach to boost the enactment of its latest M1 Ultra device that unlocks the door to future designs utilizing chiplets. A packaging architecture called UltraFusion interconnects the die of two M1 Max chips on a silicon interposer to build a system on a chip (SoC) with 114bn transistors. This utilizes a silicon substrate and interposer that supports the two dies with 10,000 interconnects with 2.5 TB/s of low latency and inter-processor bandwidth between the die. This also connects the die to 128 GB of low-latency unified memory operating an 800 GB/s interface.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definitions
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Impact of Macroeconomic Trends on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Expanding Market for High Performance Computing Application
    • 5.1.2 Expanding Scope of Data Centers and Memory Devices
  • 5.2 Market Challenges
    • 5.2.1 High Unit Cost of IC Packages

6 TECHNOLOGICAL SNAPSHOT

7 MARKET SEGMENTATION

  • 7.1 By Packaging Type
    • 7.1.1 3D Stacked Memory
    • 7.1.2 2.5D Interposer
    • 7.1.3 CIS with TSV
    • 7.1.4 3D SoC
    • 7.1.5 Other Packaging Types ( LED, MEMS & Sensors, etc.)
  • 7.2 By End User Application
    • 7.2.1 Consumer Electronics
    • 7.2.2 Automotive
    • 7.2.3 High Performance Computing (HPC) and Networking
    • 7.2.4 Other End User Applications
  • 7.3 By Geography
    • 7.3.1 North America
      • 7.3.1.1 U.S.
      • 7.3.1.2 Canada
    • 7.3.2 Europe
      • 7.3.2.1 United Kingdom
      • 7.3.2.2 Germany
      • 7.3.2.3 France
      • 7.3.2.4 Italy
      • 7.3.2.5 Rest of Europe
    • 7.3.3 Asia-Pacific
      • 7.3.3.1 China
      • 7.3.3.2 India
      • 7.3.3.3 Japan
      • 7.3.3.4 Australia
      • 7.3.3.5 South East Asia
      • 7.3.3.6 Rest of Asia-Pacific
    • 7.3.4 Rest of the World

8 COMPETITIVE LANDSCAPE

  • 8.1 Company Profiles
    • 8.1.1 Toshiba Corp.
    • 8.1.2 Samsung Electronics Co. Ltd.
    • 8.1.3 ASE Group
    • 8.1.4 Taiwan Semiconductor Manufacturing Company Limited
    • 8.1.5 Amkor Technology, Inc.
    • 8.1.6 Pure Storage Inc.
    • 8.1.7 United Microelectronics Corp.
    • 8.1.8 STMicroelectronics NV
    • 8.1.9 Broadcom Ltd.
    • 8.1.10 Intel Corporation
    • 8.1.11 Jiangsu Changing Electronics Technology Co. Ltd.

9 INVESTMENT ANALYSIS

10 FUTURE OF THE MARKET