ToF 3D 相机 IC 市场报告：2030 年趋势、预测与竞争分析

ToF 3D相机IC趋势与预测

预计2024年至2030年，全球ToF 3D相机IC市场将以32.1%的复合年增长率成长。该市场的主要驱动力是人们对具有复杂拍摄功能的智慧型手机的兴趣不断增长，对生物识别和脸部辨识系统不断增长的需求，以及ToF相机感测器尺寸、精度和分辨率的开拓。电路。全球ToF 3D相机IC市场前景广阔，受惠于家用电子电器市场与汽车市场的机会。

ToF 3D 相机 IC 市场洞察

根据 Lucintel 的预测，间接 ToF 感测器领域预计将在预测期内实现最高成长，因为它具有更高的精度和更低的功耗。

预计亚太地区在预测期内将出现最高成长。

常问问题

Q1.市场成长预测如何？

A1. 2024年至2030年，全球ToF 3D相机IC市场预计将以32.1%的复合年增长率成长。

Q2.影响市场成长的主要驱动因素有哪些？

A2. 该市场的主要驱动力包括对具有先进摄影功能的智慧型手机的兴趣不断增长，对生物识别和脸部认证系统的需求不断增长，以及感测器尺寸、精度和分辨率的改进、集成ToF相机的持续技术开拓和创新电路。

Q3.市场的主要细分市场有哪些？

A3. 全球ToF 3D相机IC市场前景广阔，家用电子电器与汽车市场蕴含机会。

Q4.市场上主要企业有哪些？

A4.主要ToF 3D相机IC公司如下。

• ams OSRAM
• Infineon & PMD
• Melexis
• STMicroelectronics
• Texas Instruments
• Nuvoton
• Toppan

Q5.未来最大的细分市场是什么？

A5.Lucintel 预测，间接 ToF 感测器领域预计将在预测期内实现最高成长，因为它具有更高的精度和消耗更少的功耗。

Q6. 未来五年预计哪个地区将成为最大的市场？

预计 A6.APAC 在预测期内将出现最高成长。

Q7. 可以客製化报告吗？

A7. 是的，Lucintel 提供 10% 的客製化服务，无需额外费用。

目录

第一章执行摘要

第二章全球ToF 3D相机IC市场：市场动态

• 简介、背景、分类
• 供应链
• 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

• 宏观经济趋势（2018-2023）与预测（2024-2030）
• 全球ToF 3D相机IC市场趋势（2018-2023）与预测（2024-2030）
• 全球 ToF 3D 相机 IC 市场（按类型）
  • 直接 ToF 感测器
  • 间接ToF感测器
• 全球 ToF 3D 相机 IC 市场（按应用）
  • 家用电器产品
  • 车
  • 其他的

第四章 2018-2030年区域市场趋势及预测分析

• 全球ToF 3D相机IC市场区域分布
• 北美ToF 3D相机IC市场
• 欧洲ToF 3D相机IC市场
• 亚太地区 ToF 3D 相机 IC 市场
• 其他地区ToF 3D相机IC市场

第五章 竞争分析

• 产品系列分析
• 营运整合
• 波特五力分析

第六章 成长机会与策略分析

• 成长机会分析
  • 全球 ToF 3D 相机 IC 市场成长机会（按类型）
  • 全球 ToF 3D 相机 IC 市场成长机会（按应用）
  • 全球ToF 3D相机IC市场成长机会（按地区）
• 全球ToF 3D相机IC市场新趋势
• 战略分析
  • 新产品开发
  • 全球ToF 3D相机IC市场产能扩张
  • 全球ToF 3D相机IC市场併购及合资
  • 认证和许可

第七章主要企业概况

• ams OSRAM
• Infineon & PMD
• Melexis
• STMicroelectronics
• Texas Instruments
• Nuvoton
• Toppan

ToF 3D Camera IC Trends and Forecast

The future of the global ToF 3D camera IC market looks promising with opportunities in the consumer electronic and automobile markets. The global ToF 3D camera IC market is expected to grow with a CAGR of 32.1% from 2024 to 2030. The major drivers for this market are rising interest in smartphones with sophisticated photography features, growing demand for biometric and facial recognition systems, as well as, continuous technological development and innovation in ToF camera integrated circuits, including enhanced size, precision, and resolution of the sensor.

A more than 150-page report is developed to help in your business decisions.

ToF 3D Camera IC by Segment

The study includes a forecast for the global ToF 3D camera IC by type, application, and region.

ToF 3D Camera IC Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Direct ToF Sensor
• Indirect ToF Sensor

ToF 3D Camera IC Market by Application [Shipment Analysis by Value from 2018 to 2030]:

• Consumer Electronic
• Automobile
• Others

ToF 3D Camera IC Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of ToF 3D Camera IC Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies ToF 3D camera IC companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the ToF 3D camera IC companies profiled in this report include-

• ams OSRAM
• Infineon & PMD
• Melexis
• STMicroelectronics
• Texas Instruments
• Nuvoton
• Toppan

ToF 3D Camera IC Market Insights

Lucintel forecasts that indirect ToF sensor segment is expected to witness highest growth over the forecast period because it shows higher accuracy and consumes less power.

APAC is expected to witness highest growth over the forecast period.

Features of the Global ToF 3D Camera IC Market

Market Size Estimates: ToF 3D camera IC market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: ToF 3D camera IC market size by type, application, and region in terms of value ($B).

Regional Analysis: ToF 3D camera IC market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the ToF 3D camera IC market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the ToF 3D camera IC market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for ToF 3D camera IC market?

Answer: The global ToF 3D camera IC market is expected to grow with a CAGR of 32.1% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the ToF 3D camera IC market?

Answer: The major drivers for this market are rising interest in smartphones with sophisticated photography features, growing demand for biometric and facial recognition systems, as well as, continuous technological development and innovation in ToF camera integrated circuits, including enhanced size, precision, and resolution of the sensor.

Q3. What are the major segments for ToF 3D camera IC market?

Answer: The future of the global ToF 3D camera IC market looks promising with opportunities in the consumer electronic and automobile markets.

Q4. Who are the key ToF 3D camera IC market companies?

Answer: Some of the key ToF 3D camera IC companies are as follows.

• ams OSRAM
• Infineon & PMD
• Melexis
• STMicroelectronics
• Texas Instruments
• Nuvoton
• Toppan

Q5. Which ToF 3D camera IC market segment will be the largest in future?

Answer: Lucintel forecasts that indirect ToF sensor segment is expected to witness highest growth over the forecast period because it shows higher accuracy and consumes less power.

Q6. In ToF 3D camera IC market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the ToF 3D camera IC market by type (direct ToF sensor and indirect ToF sensor), application (consumer electronic, automobile, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global ToF 3D Camera IC Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global ToF 3D Camera IC Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global ToF 3D Camera IC Market by Type
  • 3.3.1: Direct ToF Sensor
  • 3.3.2: Indirect ToF Sensor
• 3.4: Global ToF 3D Camera IC Market by Application
  • 3.4.1: Consumer Electronic
  • 3.4.2: Automobile
  • 3.4.3: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global ToF 3D Camera IC Market by Region
• 4.2: North American ToF 3D Camera IC Market
  • 4.2.2: North American ToF 3D Camera IC Market by Application: Consumer Electronic, Automobile, and Others
• 4.3: European ToF 3D Camera IC Market
  • 4.3.1: European ToF 3D Camera IC Market by Type: Direct ToF Sensor and Indirect ToF Sensor
  • 4.3.2: European ToF 3D Camera IC Market by Application: Consumer Electronic, Automobile, and Others
• 4.4: APAC ToF 3D Camera IC Market
  • 4.4.1: APAC ToF 3D Camera IC Market by Type: Direct ToF Sensor and Indirect ToF Sensor
  • 4.4.2: APAC ToF 3D Camera IC Market by Application: Consumer Electronic, Automobile, and Others
• 4.5: ROW ToF 3D Camera IC Market
  • 4.5.1: ROW ToF 3D Camera IC Market by Type: Direct ToF Sensor and Indirect ToF Sensor
  • 4.5.2: ROW ToF 3D Camera IC Market by Application: Consumer Electronic, Automobile, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global ToF 3D Camera IC Market by Type
  • 6.1.2: Growth Opportunities for the Global ToF 3D Camera IC Market by Application
  • 6.1.3: Growth Opportunities for the Global ToF 3D Camera IC Market by Region
• 6.2: Emerging Trends in the Global ToF 3D Camera IC Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global ToF 3D Camera IC Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global ToF 3D Camera IC Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: ams OSRAM
• 7.2: Infineon & PMD
• 7.3: Melexis
• 7.4: STMicroelectronics
• 7.5: Texas Instruments
• 7.6: Nuvoton
• 7.7: Toppan