拉丁美洲LED构装：市场占有率分析、产业趋势、成长预测（2025-2030 年）

拉丁美洲LED构装市场预计在预测期内复合年增长率为 5.3%

主要亮点

• LED构装在拉丁美洲正在经历显着成长。包装过程是劳力密集的，拉丁美洲由于人事费用结构降低的好处，已成为包装的竞争市场。具体来说，由于规模经济、现有基础设施优势、人事费用低以及许多大公司的存在，拉丁美洲已成为许多 LED 製造商的LED构装流程的重要中心。
• 随着住宅消费者继续使用 LED 类型来提高能源效率，普通照明应用将推动LED构装市场的成长。在拉丁美洲（例如巴西），各国政府正在重点开发和实施高效能能源技术，并为LED照明提供各种补贴，这可能会推动这些国家的LED构装市场的扩张。
• 封装技术的品质决定了封装的可靠性和装置的寿命。为了因应日益增长的照明需求，人们开发了多种技术来提高LED的输出功率，LED封装技术也从单晶片封装发展到多晶片封装。
• 随着晶片设计、封装以及大电流特性的发展，迫切需要LED的高功率封装。高功率会影响装置的散热性能，进而影响LED的寿命和发光性能。因此， LED构装的散热性能是现在需要考虑的重要因素。此外，越来越多的倡议和法规将 LED 作为环境效益和节能解决方案来推广，也正在推动市场成长。
• 板载晶片(COB) 和晶片级封装 (CSP) 是多晶片封装。 COB透过将晶片直接放置在基板上并涂上磷光黏合剂来实现更高的封装密度。 COB和CSP是市面上比较常见的LED构装。随着装置变得越来越小、越来越薄， LED构装的散热结构和技术也随之发展。
• 製造业受到了 COVID-19 大流行的影响，製造和供应链业务受到干扰，客户业务面临类似的威胁。此外，COVID-19影响市场成长的主要原因是离散製造业的停工。封锁限制和计划建设活动的延误对整个供应和分销链产生了严重影响，导致製造企业延误。

拉丁美洲LED构装市场趋势

晶片级封装技术占据主要市场占有率

• 随着拉丁美洲工业投资的增加，对智慧照明解决方案的需求不断增加，推动了LED构装市场的发展。随着LED构装变得更小、更薄，人们尝试透过将现有晶圆级 (WL) 升级到晶片级 (CS) 来节省製程和投资成本。 CSP（晶片级封装）是指使用晶圆级製程安装在半导体发光装置结构上的发光装置封装。
• CSP（晶片级封装）技术透过整合先进的覆晶技术和磷光体涂覆技术，显着缩小了传统LED构装的尺寸。这消除了金属线和塑胶模具，从而实现更通用和紧凑的设计，同时也降低了成本。 CSP产品可灵活地改变发光面的尺寸和亮度水平，以满足广泛的照明应用的要求。
• 不同的封装结构和材料可以提高LED的光提取效率和散热性能，减少光衰减，提高寿命。换句话说， LED构装的关键技术是在有限的成本范围内从晶片中提取尽可能多的光，同时降低封装的热阻并提高可靠性。
• LED构装技术是在半导体分立元件封装的基础上发展和演变的。封装的作用是为晶片提供足够的保护，防止其长期暴露在空气中，造成机械损伤和失效，从而提高其稳定性。封装材料和工艺占LED灯总成本的30%~60%。

快速成长的住宅产业

• 随着拉丁美洲工业化的快速发展，COB LED 在智慧照明中的采用不断增加，正在推动市场成长。最值得注意的是，COB 技术显着提高了 LED 阵列的封装密度，即照明工程师所说的流明密度。此外，透过使用 COB LED 技术，可以显着减少住宅领域 LED 阵列的占地面积和消费量，同时保持光输出恆定。
• 拉丁美洲国家对于LED构装有一定的标准。在住宅领域，无论是灯 LED 或表面贴装 LED (SMD-LED)，都必须使用高精度结晶固体机械进行封装。如果LED晶片封装不准确，将直接影响整个封装设备的发光效率。
• 各种场合使用的LED在尺寸、散热方式、发光效率等方面都有所不同，因此LED构装的类型也有所不同。製造商很快将集中精力开发高功率、高亮度的LED。封装是LED产业链前后端的纽带，必须重视。
• 在巴西和墨西哥等国家，住宅电力消耗不断增加，LED 普及率不断提高。 LED构装提供机械支撑，实现良好的电气连接（例如，借助贯穿封装的「通孔」或接合线），有助于散热，并允许 LED 晶片发光。 LED的封装形式取决于应用场景、外观、尺寸、散热方案和发光效果。

拉丁美洲LED构装产业概况

拉丁美洲LED构装市场竞争激烈，由多家製造商组成，包括三星电子、Lumileds Holding BV、Osram GmbH、LG Innotek、Mouser Electronics, Inc、TT Electronics和Everlight Electronics。公司透过建立多个伙伴关係关係、投资计划以及将新产品推向市场来增加市场占有率。

• 2021年5月－亿光正式成为ISELED联盟成员。本公司采用ISELED，推出内建IC的EL SMART LED（EL3534-RGBISE0391L-AM）。新款EL3534智慧型LED采用了Innova Semiconductors的红、蓝、绿三色晶片以及驱动IC，采用全新设计的封装结构。此驱动器 IC 会自动启用 LED 的直接记忆体校准，以补偿红色热降。它安装在导线架的下侧。将控制器 IC 和 LED 整合到一个封装中可以节省空间并在紧凑的内部空间中进行互连。

其他好处：

• Excel 格式的市场预测 (ME) 表
• 3 个月分析师支持

目录

第一章简介

• 研究假设和市场定义
• 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

• 市场概况
• 产业吸引力－波特五力分析
  • 供应商的议价能力
  • 消费者议价能力
  • 新进入者的威胁
  • 替代品的威胁
  • 竞争公司之间敌对关係的强度
• COVID-19 对市场的影响

第五章市场动态

• 市场驱动因素
  • 政府采用节能 LED 的措施和法规
  • 对智慧照明解决方案的需求增加
• 市场挑战
  • LED价格高

第六章 市场细分

• 按包装类型
  • 板载晶片(COB)
  • 表面黏着技术型（SMD）
  • 晶片级封装 (CSP)
• 按最终用户
  • 住宅
  • 商业的
• 按国家/地区
  • 巴西
  • 墨西哥
  • 其他拉丁美洲地区

第七章 竞争格局

• 公司简介
  • Samsung Electronics Co. Ltd
  • Lumileds Holding BV
  • Osram GmbH
  • LG Innotek
  • Mouser Electronics, Inc.
  • TT Electronics
  • Everlight Electronics Co., Ltd
  • Excelitas Technologies Corp.
  • Arrow Electronics, Inc

第八章投资分析

第9章市场的未来

The LA LED Packaging Market is expected to register a CAGR of 5.3% during the forecast period.

Key Highlights

• LED packaging has witnessed significant growth in Latin America. The packaging process is more labor-intensive, and the benefits of reduced labor cost structures in Latin America have made it a competitive marketplace for packaging. Specifically, due to economies of scale, existing infrastructure benefits, low labor costs, and the presence of many major players, Latin America has become an important center of LED packaging processes for many LED manufacturers.
• General lighting applications will drive growth in the LED packaging market as residential consumers continue to use the LED types in energy efficiency initiatives. The major focus of governments in Latin America (e.g., In Brazil) for developing and implementing efficient energy technology and various subsidies given for LED lighting will boost the market for LED packaging in these countries.
• Packaging technology's quality determines the package's reliability and the device's service life. To meet the increasing demand for lighting, the technology of larger output LEDs has been extensively developed, and the packaging technology of LEDs has evolved from single-chip packaging to multi-chip packaging.
• With the development of chip design, packaging, and high current characteristics, high-power LED packaging has become an urgent need. The increase in the power of the package affects the heat dissipation performance of the device, which also influences the life of the LED and its luminous performance. Therefore, the heat dissipation of LED packaging is currently an important factor to be considered. Additionally, increasing initiatives and regulations to promote LEDs for environmental benefits and energy-efficient solutions fuels the market's growth.
• Chip-on-board (COB), and chip-scale package (CSP) are multi-chip packages. COB assigns chips directly to the board and coats them with a phosphorescent glue at a higher packing density. COB and CSP are more popular LED packages on the market. With the development of devices toward miniaturization and thinning, the heat dissipation structure and technology of LED packages have also been developed accordingly.
• The manufacturing companies were grappling with the effect of the COVID-19 pandemic, as the manufacturing and supply chain operations were disrupted, and their customer operations faced similar threats. Further, COVID-19 has impacted the market growth, mainly due to stoppage in discrete manufacturing industry operations. Due to restrictions in lockdowns, delays in project construction activities exponentially affected the whole supply and distribution network, hitting the manufacturing companies with a lag.

Latin America LED Packaging Market Trends

Chip Scale Packaging Technology to Hold Significant Market Share

• With the growing industrial investments in Latin America, the demand for smart lighting solutions is increasing, which in turn is propelling the LED packaging market. As LED packages are made smaller and slimmer, there is an endeavor to save costs of process and investment by upgrading existing WL (Wafer Level) to CS (Chip Scale). A chip-scale package (CSP) denotes a package for the light-emitting device mounted on the semiconductor light-emitting device structure in a wafer-scale process.
• CSP (Chip Scale Packaging) technology drastically scales down the size of a conventional LED package by integrating sophisticated flip-chip technology with phosphor coating technology. This removes metal wires and plastic molds for more versatile and compact designs and lowers costs. CSP products allow flexibility in changing the size of the light-emitting surface and luminance level to address a broader base of lighting application requirements.
• Different packaging structures and materials can improve LED's light extraction efficiency and heat dissipation performance, reduce light decay and improve its service life. In short, the key technology of LED packaging is to extract as much light as possible from the chip within a limited cost range while reducing the thermal resistance of packaging and improving reliability.
• LED packaging technology is developed and evolved based on semiconductor discrete device packaging. The function of packaging is to provide adequate protection for the chip, and prevent the chip from long-term exposure to the air or mechanical damage and failure, to improve the stability of the chip. Packaging materials and processes account for 30% to 60% of the total cost of LED lamps.

Residential Sector to Witness Significant Growth

• With the rapid industrialization in Latin America, the growing adoption of COB LED in smart lighting has been instrumental in driving the market's growth. Most notably, COB technology allows for a much higher packing density of the LED array, or what light engineers refer to as improved lumen density. Alternatively, using COB LED technology can greatly reduce the footprint and energy consumption of the LED array in the residential sector while keeping light output constant.
• Certain standards are followed by the countries in Latin America regarding LED Packaging. In the residential sector, it is essential to use high-precision crystal solid machines to package, no matter Lamp-LED or Surface Mount Device LED (SMD-LED). If LED chips are not placed into the package precisely, the luminescence efficiency of the overall packaging device will be influenced directly.
• LEDs applied on different occasions, with different sizes, heat-dissipation methods, and luminescence efficiency will have different types of LED packages. Soon, manufacturers should focus on developing high-power, high-brightness LED. As Packaging links the preceding and the following parts in the LED industry chain, attention should be paid to it.
• In countries like Brazil and Mexico, electricity consumption in the residential sector has been increasing, resulting in increased LED penetration. LED packages to provide mechanical support, allow good electrical connections (for example, with the aid of "vias" through the package or bonding wires), help with heat dissipation, and improve the light emission efficiency from the LED chip. The package form of the LED varies according to the application scenario, the appearance, the size, the heat dissipation solution, and the light-emitting effect.

Latin America LED Packaging Industry Overview

Latin America LED Packaging Market is competitive and consists of several partakers like Samsung Electronics Co.Ltd, Lumileds Holding B.V, Osram GmbH, LG Innotek, Mouser Electronics, Inc., TT Electronics, Everlight Electronics Co., Ltd, and many more. The companies are increasing their market share by forming multiple partnerships, investing in projects, and launching new products in the market.

• May 2021 - Everlight has officially become a member of the ISELED Alliance. The company employed ISELED to release EL SMART LED (EL3534-RGBISE0391L-AM) with an embedded IC. The new EL3534 smart LED has installed a driver IC from Inova Semiconductors in the newly designed package structure in addition to the three color chips (red, blue, and green). The driver IC automatically enables the direct calibration of LED in the memory and compensates the thermal drop for the red color. It is mounted on the bottom side of the lead frame. Integrating controller IC and LEDs in one package saves space and interconnections in compact interior space.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power of Suppliers
  • 4.2.2 Bargaining Power of Consumers
  • 4.2.3 Threat of New Entrants
  • 4.2.4 Threat of Substitutes
  • 4.2.5 Intensity of Competitive Rivalry
• 4.3 Impact of COVID-19 on the Market

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Government Initiatives and Regulations to Adopt Energy-efficient LEDs
  • 5.1.2 Increasing Demand for Smart Lighting Solutions

• 5.2 Market Challenges
  • 5.2.1 High Prices of LED's

6 MARKET SEGMENTATION

• 6.1 By Packaging Type
  • 6.1.1 Chip-on-board (COB)
  • 6.1.2 Surface-mounted Device (SMD)
  • 6.1.3 Chip Scale Packaging (CSP)
• 6.2 By End-User
  • 6.2.1 Residential
  • 6.2.2 Commercial
• 6.3 By Country
  • 6.3.1 Brazil
  • 6.3.2 Mexico
  • 6.3.3 Rest of Latin America

7 COMPETITIVE LANDSCAPE

• 7.1 Company Profiles
  • 7.1.1 Samsung Electronics Co. Ltd
  • 7.1.2 Lumileds Holding B.V
  • 7.1.3 Osram GmbH
  • 7.1.4 LG Innotek
  • 7.1.5 Mouser Electronics, Inc.
  • 7.1.6 TT Electronics
  • 7.1.7 Everlight Electronics Co., Ltd
  • 7.1.8 Excelitas Technologies Corp.
  • 7.1.9 Arrow Electronics, Inc

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET