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市场调查报告书
商品编码
1628713

亚太地区LED构装：市场占有率分析、产业趋势、成长预测（2025-2030 年）

Asia Pacific LED Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

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简介目录

亚太LED构装市场预计在预测期内复合年增长率为 6.7%

亚太区LED封装-市场-IMG1

主要亮点

  • LED 技术透过为广大消费者提供紧凑、高效的照明解决方案并提高效率，正在激发照明产业的想像力。本产业创新饱和状态，同时市场产能过剩。对于电视显示器应用，业界正在从 OLED 转向 QLED（量子点发光二极体），这是最新的创新。预计这将进一步渗透市场。
  • QLED显示器的生产成本相对较低，因为固定成本（设备）较低，而变动成本也较低，因为可以在给定时间内生产许多单位。公司专注于透过规模经济进行营运。因此， LED构装公司和製造商之间正在经历行业整合。
  • 未来几年， LED构装应用的快速发展预计将推动创新和消费，进而推动LED构装市场的发展。另一方面，高饱和状态可能会限制产品的接受度，进而限制市场的成长。
  • 该市场与三星电子、欧司朗和工业等公司竞争激烈，随着价格不断下降以获取市场占有率，利润率有限。
  • 此外，政府措施预计也将推动市场成长。例如，印度政府计划在多个行业引入具有成本效益的LED。该国正在用 LED 取代所有路灯，交通号誌也采用智慧 LED。此举预计将增加当地LED製造商的需求并扩大LED构装市场。

亚太LED构装市场趋势

对能源效率的需求不断增长正在显着推动市场发展

  • 随着 LED 照明系统效率的显着提高，亚太地区的照明系统部署正在发生根本性转变，该地区的公司在各个领域都采用了 LED。
  • 多项政府和私人倡议正在推动该地区基础设施现代化和智慧城市等市场发展对智慧高效照明系统的需求，这将直接推动该地区的LED构装市场。
  • 亚太地区政府的能源效率措施对LED构装市场的发展做出了重大贡献。印度和中国等国家正在实施多项旨在提高能源效率的政府计画和计画。印度政府于 2015 年启动的 Unnat Jyoti by Affordable LEDs for All (UJALA)倡议旨在提高该国的能源效率，截至 2021 年 8 月已生产了超过 36 兆个 LED 灯泡。
  • 此外，穿戴式装置和智慧型手机等高阶家电在中国、日本和印度等国家越来越受欢迎，对Micro LED和闪光灯LED构装的需求预计将显着高于上一代显示器的效率，也在显着增加。

晶片级封装（CSP）预计在预测期内显着成长

  • 晶片级封装（CSP） LED构装LED晶片的体积与LED构装总体积的比例接近。基本上，磷光体层涂在裸露 LED晶粒的顶部，晶粒的下侧透过 P 和 N 触点进行金属化，以形成电连接和热路径。
  • 由于最新的覆晶LED 的出现，对 CSP LED 架构的需求不断增加，该技术透过在 P 型 GaN 层顶部实施电极垫片来提高传热效率和封装可靠性，同时增加光发射，以防止损耗。
  • 市场上的供应商正在推出新产品以保持竞争优势。例如，三星推出了CSP LED“LM101B”，该产品在转换层中使用薄膜磷光体，以减少表面粗糙度并实现均匀的薄膜厚度控制，同时减少颜色变化。此外，FEC（圆角增强型 CSP）技术在晶片表面周围形成 TiO2（二氧化钛）墙，并将光输出向上反射，使这款中功率CSP 的光通量高达 205 lm/W（65 mA，业界领先）效率（CRI 80+，5000K）。
  • 此外，一些供应商也为特定应用提供晶片级封装 (CSP) LED。例如，欧司朗为品牌时尚精品店和珠宝店的高端零售照明设计 CSP LED。客製化CoB和小型灯具的专门设计是CSP支援的主要应用。

亚太地区LED构装产业概况

亚太LED构装市场竞争激烈，多家主要厂商进入该市场。从市场占有率来看，目前几家大公司占据市场主导地位。这些市场份额突出的龙头企业正致力于透过策略合作措施扩大海外客户群，以提高市场占有率和盈利。

  • 2021 年 7 月 欧司朗使用欧司朗的 Ostar Projection Power LED 作为 ViewSonic LS600W 的光源，可提供高达 3,000 ANSI 流明的亮度，在各种使用案例中展示出卓越的性能，并促进 LED 投影机的开发。

其他好处：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场动态

  • 市场概况
  • 产业吸引力－波特五力分析
    • 新进入者的威胁
    • 买方议价能力
    • 供应商的议价能力
    • 替代品的威胁
    • 竞争公司之间的敌对关係
  • 产业价值链分析
  • 评估 COVID-19 对产业的影响
  • 市场驱动因素
    • 对智慧照明解决方案的需求增加
    • 对能源效率的需求不断增加
  • 市场限制因素
    • 缺乏意识和增加资本投入

第五章市场区隔

  • 按类型
    • 板载晶片(COB)
    • 表面黏着型元件(SMD)
    • 晶片级封装 (CSP)
  • 按行业分类
    • 住宅
    • 商业的
    • 其他行业
  • 按国家/地区
    • 中国
    • 日本
    • 印度
    • 澳洲
    • 其他亚太地区

第六章 竞争状况

  • 公司简介
    • Samsung Electronics Co. Ltd
    • OSRAM Litch AG
    • Cree, Inc.
    • Nichia Corporation
    • Seoul Semiconductor Co. Ltd
    • Stanley Electric Co. Ltd
    • Everlight Electronics Co. Ltd
    • Toyoda Gosei Co.
    • Citizen Electronics Co. Ltd

第七章 投资分析

第八章市场的未来

简介目录
Product Code: 51751

The Asia Pacific LED Packaging Market is expected to register a CAGR of 6.7% during the forecast period.

Asia Pacific LED Packaging - Market - IMG1

Key Highlights

  • The LED technology has been capturing the imagination of the lighting industry by offering small and efficient lighting solutions to a diverse set of consumers with enhanced efficiency. Innovations in the industry are saturated, and at the same time, the market has overcapacity. For TV display applications, the industry is moving from OLED to QLED (Quantum dot Light-emitting diode), which is the latest innovation. This is expected to penetrate more into the market.
  • The production costs of QLED displays will be decreased since fixed costs (equipment) are less, and variable costs are relatively less as more units can be produced within a given time. Companies are focusing on operating through economies of scale. As such, the industry is witnessing the consolidation of players/manufacturers of LED packaging.
  • In the coming years, rapid advancements in LED package applications are projected to boost innovation and consumption, propelling the LED packaging market. On the other hand, high saturation may limit product acceptance, which, in turn, limits market growth.
  • The high competition in the market with players such as Samsung Electronics, Osram, and Nichia is restricting the margin, as there is a continuous decline in prices by players to gain market share.
  • Moreover, governmental initiatives are also anticipated to drive the market's growth. For instance, the Indian government's planned to deploy cost-effective LEDs across multiple sectors. The country is on the verge of replacing all its street lamps with LEDs and adopting smart LEDs for traffic signals as well. This move is likely to increase the demand for local LED manufacturers, resulting in the growth of the LED packaging market.

APAC LED Packaging Market Trends

Increasing Demand for Energy-efficiency Significantly Drives the Market

  • Owing to the sheer increasing efficiency of LED lighting systems, the Asia-Pacific region has been experiencing a fundamental transition in its deployed lighting systems, with firms in the regions embracing LEDs in multiple sectors.
  • Multiple governmental and private initiatives have been driving the need for smart and efficient lighting systems in the modernization and development of infrastructure such as smart cities across the region, which directly boosts the market for LED packages in the region.
  • Government initiatives for energy efficiency in the Asia Pacific region immensely contribute to the development of the LED packaging market. Several Government schemes and plans are in progress in countries such as India and China to promote energy efficiency. Unnat Jyoti by Affordable LEDs for All (UJALA) initiative by the Indian Government to encourage energy efficiency in the country launched in 2015 has already distributed more than 36 crores LED light bulbs as of August 2021.
  • The increase in the adoption of high-end consumer electronics, like wearable and smartphones in China, Japan, Inda, among others, also significantly increases the demand for micro-LED and flash LED packages, which tend to be significantly efficient as compared to previous generation displays.

Chip Scale Package (CSP) is Expected to Grow Significantly Over the Forecast Period

  • A chip scale package (CSP) LED package has a close-ratio between the volume of the LED chip and the total volume of the LED package. It is essentially a bare LED die on which a phosphor layer is coated, with the underside of the die metalized with the P and N contacts to form the electrical connection and thermal path.
  • The growing demand for CSP LED architecture is the latest incarnation of flip-chip LEDs and prevents light loss due to the mounting of electrode pad on the upside of the P-type GaN layer while improving heat transfer efficiency and package reliability.
  • Vendors in the market are introducing new products to maintain their competitive advantage. For instance, Samsung introduced LM101B CSP LEDs that use a film phosphor in the conversion layer to reduce surface roughness and enable uniform control of thickness with small color dispersion. The fillet-enhanced CSP (FEC) technology forms TiO2 (Titanium dioxide) walls around the chip surface to reflect its light output toward the top, enabling the mid-power CSP to deliver an industry-leading efficacy of up to 205 lm/W (65mA, CRI 80+, 5000K).
  • Moreover, some of the vendors offer Chip Scale Package (CSP) LEDs to a specific application. For instance, OSRAM designs CSP LEDs for high-class retail lighting in brand fashion boutiques and jewelry stores. Professional designs for customized CoB and small luminaires are the main applications being supported by CSP.

APAC LED Packaging Industry Overview

The Asia Pacific LED packaging market is competitive and consists of several major players. In terms of market share, few of the major players currently dominate the market. These major players with prominent shares in the market are focusing on expanding their customer base across foreign countries as well by leveraging strategic collaborative initiatives to increase their market share and profitability.

  • July 2021: OSRAM partnered with ViewSonic for more possibilities in developing LED projectors by using OSRAM's Ostar Projection Power LED as a light source for ViewSonic LS600W and achieving a brightness of up to 3,000 ANSI lumens, providing exceptional performance in different use cases.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Threat of New Entrants
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Bargaining Power of Suppliers
    • 4.2.4 Threat of Substitutes
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Assessment of Impact of COVID-19 on the Industry
  • 4.5 Market Drivers
    • 4.5.1 Increasing Demand for Smart Lighting Solutions
    • 4.5.2 Increasing Demand for Energy-efficiency
  • 4.6 Market Restraints
    • 4.6.1 Lack of Awareness and Higher Capital Investment

5 MARKET SEGMENTATION

  • 5.1 By Type
    • 5.1.1 Chip-on-board (COB)
    • 5.1.2 Surface-mount Device (SMD)
    • 5.1.3 Chip Scale Package (CSP)
  • 5.2 By End-user Vertical
    • 5.2.1 Residential
    • 5.2.2 Commercial
    • 5.2.3 Other End-user Verticals
  • 5.3 By Country
    • 5.3.1 China
    • 5.3.2 Japan
    • 5.3.3 India
    • 5.3.4 Australia
    • 5.3.5 Rest of Asia Pacific

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Samsung Electronics Co. Ltd
    • 6.1.2 OSRAM Litch AG
    • 6.1.3 Cree, Inc.
    • 6.1.4 Nichia Corporation
    • 6.1.5 Seoul Semiconductor Co. Ltd
    • 6.1.6 Stanley Electric Co. Ltd
    • 6.1.7 Everlight Electronics Co. Ltd
    • 6.1.8 Toyoda Gosei Co.
    • 6.1.9 Citizen Electronics Co. Ltd

7 INVESTMENT ANALYSIS

8 FUTURE OF THE MARKET