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市场调查报告书
商品编码
1745801
全球基板市场:市场占有率和排名、总销售额和需求预测(至 2025 年)Molded Interconnect Substrate (MIS) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025 |
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全球基板市场规模预计将从 2024 年的 9,754 万美元成长到 2031 年的 2.97 亿美元,2025 年至 2031 年的复合年增长率为 15.78%。
2024 年北美 MIS基板市场规模价值 2,440 万美元。预计到 2031 年该市场规模将达到 6,980 万美元,预测期内(2025-2031 年)的复合年增长率为 14.73%。
2024 年亚太地区 MIS基板市场规模价值 5,645 万美元。预计到 2031 年,该市场规模将达到 1.8984 亿美元,预测期内(2025-2031 年)的复合年增长率为 17.22%。
2024 年欧洲 MIS基板市场规模价值 1,513 万美元。预计到 2031 年,该市场规模将达到 3,394 万美元,预测期内(2025-2031 年)的复合年增长率为 11.43%。
从数量来看,2024年全球MIS基板出货量将达到354.5万片,2031年将达到1,180.4万片。
目前全球生产MIS基板的公司仅有三家:台湾的PPt、中国的MiSpak Technology、马来西亚的QDOS。
PPt目前可提供1层、2层、3层、4层、6层MIS基板。 MiSpak Technology可提供1层、2层MIS基板。 QDOS可提供1层、2层、3层MIS基板。
MIS产品在基板应用市场的成长潜力来自于伺服器、资料中心等网路通讯产品、电动车和汽车智慧化驱动的汽车电子控制装置,以及5G、AIoT等领域。随着这些相关产品的推出,对半导体封装用基板的要求也将大幅提升,要求具有较高的设计自由度、更佳的性能和高可靠性。
在先进的导线架产品方面,MIS厂商(PPt、MiSpak、QDOS)主要供应的产品不仅限于单层基板,PPt还可以提供用于多晶片封装的多层基板捲绕导线架产品,这是传统导线架厂商难以提供的。
目前MIS基板主要应用于电源/PMIC/模拟、汽车电子产品、RF/5G、光学防手震(OIS)、指纹辨识、第三代半导体、LED等领域,其中MIS基板大部分应用于电源领域,在第三代半导体中,MIS基板主要用于GaN元件。
随着技术不断更新,5G需要高速率、低延迟、稳定的讯号。随着电脑化、智慧化的需求,家用电子电器和工业市场不断涌现新的应用。因此,对半导体晶片的性能要求正朝着高速运算、高性能、低损耗等方向发展。
此外,受此发展趋势带动,对IC构装基板的要求也不断提升,如精细化、窄间距化、高散热性等。 MIS基板厂商深耕产品生产技术力已久,目前正在开发窄间距、捲绕、多层基板生产技术,预计将应用于5G、物联网、电动车等领域。
此外,在家用电子电器智慧型手机的应用领域,全球知名品牌行动电话厂商在市场上占有较大的份额,随着新款行动电话的上市,相机模组的规格也不断提升,高规格相机模组不断涌现。此外,受中美贸易战影响,新行动电话的渗透加速了中国各大行动电话厂商的发展,MIS基板厂商透过引进本土原料供应,在行动电话相机模组应用领域展开多项布局。随着新款行动电话陆续上市,预计MIS基板厂商产品的市场渗透率将会提升。
本报告旨在全面概述全球 MIS基板市场,重点关注总销售量、销售收益、价格、市场占有率和主要企业的排名,并按地区、国家、细分市场和应用对 MIS基板进行分析。
本文提供MIS基板市场规模、估值和预测,涵盖2020年至2031年的历史及预测数据,包括销售量(千台)及销售收益(百万美元),并以2024年为基准年。定量和定性分析有助于读者制定业务/成长策略,评估市场竞争格局,分析公司在当前市场中的地位,并就MIS基板做出明智的业务决策。
The global Molded Interconnect Substrate (MIS) market is projected to reach US$ 297 million by 2031 from an estimated US$ 97.54 million in 2024, at a CAGR of 15.78% during 2025 and 2031.
North American market for MIS Substrates was valued at $ 24.4 million in 2024 and will reach $ 69.8 million by 2031, at a CAGR of 14.73 % during the forecast period of 2025 through 2031.
Asia-Pacific market for MIS Substrates was valued at $ 56.45 million in 2024 and will reach $ 189.84 million by 2031, at a CAGR of 17.22 % during the forecast period of 2025 through 2031.
Europe market for MIS Substrates was valued at $ 15.13 million in 2024 and will reach $ 33.94 million by 2031, at a CAGR of 11.43 % during the forecast period of 2025 through 2031.
In terms of volume, in 2024 the global MIS substrates shipments were 3,545 kk pieces, and will reach 11,804 kk pieces in 2031.
Currently, there are currently only three companies in the world that manufacture MIS substrates, China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.
PPt now can supply 1 layer, 2 layer, 3 layer, 4 layer and 6 layer MIS substrates. MiSpak Technology supplies 1 layer and 2 layer MIS substrates. QDOS supplies 1 layer, 2 layer and 3 layer MIS substrates
The growth potential of MIS products in the substrate application market will come from network communication products such as servers and data centers, automotive electronic control equipment driven by electric vehicles and automotive intelligence, as well as 5G, AIoT and other applications. With the launch of these related products, the requirements for substrates used in semiconductor packaging will also increase significantly, requiring a high degree of design flexibility, improved performance and high reliability.
In terms of advanced lead frame products, MIS manufacturers (PPt, MiSpak and QDOS) mainly supply products that are not limited to single-layer boards. PPt can also provide multi-layer board windable lead frame products for multi-chip packaging, which are products that are difficult for traditional lead frame suppliers to provide.
Currently the MIS substrates are mainly used in power/PMIC/analog, automotive electronics, RF/5G, Optical Image Stabilization (OIS), fingerprint recognition, third generation semiconductor, and LED, etc. Most of MIS substrates are used in power segment. For third generation semiconductor, MIS substrates are mainly used in GaN devices.
As technology continues to update, 5G applications require high speed, low latency technology and stable signals. With the demand for electronicization and intelligence, new applications continue to emerge in the consumer electronics and Industrial markets. This drives the performance requirements of Semiconductor chips to continue, towards high-speed computing, high performance, low loss, etc.
The development direction has also increased the demand for IC packaging substrates to have fine, narrow spacing, high heat dissipation and other characteeristics. The MIS substrates manufacturers have be cultivating its product production Technology capabilities for a long time and has currently developed Narrow pitch, winding, multi-layer board production technologies will be used in 5G, a lot, electric vehicles, etc.
In addition, in terms of consumer electronic smartphone applications, global well-known brand mobile phone manufacturers have a large presence in the market. When launching new mobile phones, the specifications of camera modules are continuously improved, and high-specification camera modules are constantly being. The penetration into new mobile phones has also accelerated the development of major Chinese mobile phone manufacturers due to theimpact of the Sino-US trade war. By introducing local raw Material supply, The MIS substrates manufacturers have laid out multiple plans in the field of mobile phone camera module applications. As new mobile phones are launched in the market one after another, it is expected that the market penetration rate of MIS substrates manufacturers products will increase.
This report aims to provide a comprehensive presentation of the global market for MIS Substrates, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of MIS Substrates by region & country, by Layer, and by Application.
The MIS Substrates market size, estimations, and forecasts are provided in terms of sales volume (KK pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding MIS Substrates.
Market Segmentation
By Company
Segment by Layer
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of MIS Substrates manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Layer, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of MIS Substrates in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of MIS Substrates in country level. It provides sigmate data by Layer, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.