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市场调查报告书
商品编码
1857119
碳化硅抛光耗材:全球市占率排名、总销售额及需求预测(2025-2031年)SiC Polishing Consumables - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
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2024 年全球 SiC 磨料耗材市场规模预计为 1.34 亿美元,预计到 2031 年将达到 4.72 亿美元,在 2025-2031 年预测期内复合年增长率为 19.6%。
碳化硅 (SiC) 是宽能带隙半导体,能够在更高的温度、功率和电压下工作。这使得功率元件、LED 照明和通讯的能源效率得以提升。 SiC 的独特性能使其成为众多应用领域的首选材料,包括混合动力汽车、电力电子开关和 LED 照明技术。
本报告考察了SiC抛光耗材,包括SiC CMP浆料和SiC CMP垫片。
全球碳化硅抛光耗材的主要企业包括杜邦、恩特格里斯、富士美株式会社、圣戈班、富士博、上海新安纳等。到2024年,这四家全球主要企业的销售收入将占全球市场份额的约82%。
SiC CMP 浆料市场的主要参与者包括 Entegris、富士美株式会社、圣戈班、上海新浪等。到 2024 年,这三大主要企业将占据约 82.4% 的市场份额(按销售额计)。
SiC CMP 抛光垫垫片的主要参与者包括杜邦、Entegris、Fujibo 等。杜邦在全球 SiC CMP垫片市场占据主导地位,市占率超过 75%。
碳化硅 (SiC) 化学机械抛光 (CMP) 耗材市场,包括抛光液和垫片,正处于关键阶段,反映了 SiC 晶圆产业本身的快速成长。目前,该市场高度集中,少数几家主要企业主导供应链。 Entegris 和 Fujimi Corporation 是 SiC CMP 抛光液领域的领导者企业,凭藉其在材料科学方面的深厚专业知识,开发出满足 SiC 抛光严苛要求的专有配方。同样,杜邦和 Fujibo 在 SiC CMP垫片市场中占据主导地位。虽然供应商数量有限确保了产品的高品质和高效能,但也可能成为未来产能扩张的瓶颈。目前,市场活动主要集中在 6 吋 SiC 晶圆上,这种晶圆已成为电力电子产业的标准,对汽车和能源产业至关重要。然而,对 8 吋晶圆的需求也正在兴起并不断增长,有望实现规模经济,并成为晶圆製造商和意法半导体等主要 SiC 製造商的重点领域。这些耗材的性能直接影响最终装置的产量比率和质量,因此它们的开发是整个碳化硅生态系统面临的关键挑战。
推动碳化硅 (SiC) 化学机械抛光 (CMP) 耗材市场发展的几个强劲趋势正在显现。首先,SiC 在电动车 (EV) 中的应用正在加速。与传统的硅基解决方案相比,SiC 功率元件具有更高的效率、功率密度和导热性,因此对电动车逆变器、车载充电器和直流-直流转换器至关重要。随着全球电动车产量的扩大,对 SiC 晶圆的需求也随之成长,进而带动了抛光耗材的需求。其次,全球对可再生能源的大力发展是关键驱动因素。 SiC 组件是太阳能逆变器和风力发电机系统不可或缺的组件,有助于最大限度地提高能量转换效率。第三个因素是晶圆尺寸从 6 英吋到 8 英吋的转变。这项转变是由半导体产业不断追求降低晶片晶粒所驱动的。随着主要 SiC 製造商对 8 吋生产线进行大量投资,对适用于这些更大尺寸晶圆的高性能 CMP 抛光液和垫片的需求也随之激增。这项转变要求耗材製造商进行大量的研发投资,以应对与较大基板上的抛光均匀性和缺陷相关的新技术挑战。
儘管市场需求强劲,碳化硅化学机械抛光 (CMP) 耗材产业仍面临许多挑战。主要障碍在于碳化硅极高的硬度和化学惰性,使得抛光过程本身就十分困难且耗时。这就要求使用高效且经济的抛光液和耐用的垫片。开发能够在提高材料去除率 (MRR) 的同时最大限度地减少表面缺陷的新配方,仍然是一项重大的技术难题。第二个主要挑战是原料成本高且供应有限,尤其是抛光液中使用的专用磨料和化学品。市场集中度高也是一个令人担忧的问题,如果主要供应商出现生产问题,可能会导致供应链脆弱。此外,不同碳化硅元件製造商之间缺乏标准化的抛光製程也增加了复杂性。每个製造商都有自己的专有配方,迫使耗材供应商开发种类繁多的产品,或与各个客户紧密合作,开发客製化解决方案。这种分散化可能会减缓整个产业的成熟度,并阻碍通用、高产量比率抛光製程的开发。
本报告旨在全面概述全球 SiC 抛光耗材市场,重点关注总销售收入、主要企业份额和排名,并按地区/国家、类型和晶圆尺寸进行分析。
本报告对碳化硅抛光耗材市场规模进行了估算和预测,提供了2020年至2031年的历史数据和预测数据,单位为销售收入(百万美元),以2024年为基准年。定量和定性分析有助于读者制定业务/成长策略、评估市场竞争格局、分析公司在当前市场中的地位,并就碳化硅抛光耗材做出明智的商业决策。
The global market for SiC Polishing Consumables was estimated to be worth US$ 134 million in 2024 and is forecast to a readjusted size of US$ 472 million by 2031 with a CAGR of 19.6% during the forecast period 2025-2031.
Silicon Carbide (SiC) is a wide band gap semiconductor that can operate at higher temperature, power level, and voltage. This enables improved energy efficiency in power devices, LED lighting, and telecommunications. Because of its unique properties, SiC is the material of choice for diverse applications such as Hybrid Electric vehicles, power electronic switches, and LED lighting technology.
This report studies the SiC Polishing Consumables, include the SiC CMP Slurry and SiC CMP Pad.
The global key players of SiC polishing consumables include DuPont, Entegris, Fujimi Corporation, Saint-Gobain, Fujibo and Shanghai Xinanna, etc. In 2024, the global top four players occupied for a share approximately 82% in terms of revenue.
The key players of SiC CMP slurry include Entegris, Fujimi Corporation, Saint-Gobain, and Shanghai Xinanna, etc. In 2024, the global top three players occupied for a share approximately 82.4% in terms of revenue.
The key players of SiC CMP pads include DuPont, Entegris, and Fujibo, etc. DuPont is domaing the global SiC CMP pads market, holds a share over 75%.
The market for silicon carbide (SiC) chemical mechanical polishing (CMP) consumables, including slurries and pads, is at a pivotal stage, reflecting the rapid growth of the SiC wafer industry itself. Currently, the market is highly concentrated, with a small number of key players dominating the supply chain. Entegris and Fujimi Corporation are the established leaders in SiC CMP slurries, leveraging their deep expertise in materials science to develop proprietary formulations that meet the stringent demands of SiC polishing. Similarly, DuPont and Fujibo hold a commanding position in the SiC CMP pads market. This limited number of suppliers, while ensuring high quality and performance, also presents a potential bottleneck for future capacity expansion. Most of the market activity today is focused on 6-inch SiC wafers, which have become the industry standard for power electronics and are critical for the automotive and energy sectors. However, there is a nascent but growing demand for 8-inch wafers, which promises economies of scale and is a key focus for leading SiC manufacturers like Wolfspeed and STMicroelectronics. The performance of these consumables directly impacts the final device yield and quality, making their development a critical path item for the entire SiC ecosystem.
Several powerful trends are acting as tailwinds for the SiC CMP consumables market. First and foremost is the accelerated adoption of SiC in electric vehicles (EVs). SiC power devices are crucial for EV inverters, on-board chargers, and DC-DC converters due to their superior efficiency, power density, and thermal conductivity compared to traditional silicon-based solutions. As EV production scales up globally, so does the demand for SiC wafers and, by extension, the consumables used to polish them. Second, the global push for renewable energy is a significant driver. SiC components are essential for solar inverters and wind turbine systems, where they help maximize energy conversion efficiency. The third factor is the transition from 6-inch to 8-inch wafers. This shift is driven by the semiconductor industry's constant quest for lower costs per die. As major SiC manufacturers invest heavily in 8-inch fabrication lines, the demand for high-performance CMP slurries and pads specifically optimized for these larger wafers will surge. This transition will require significant R&D investment from consumables suppliers to address new technical challenges related to polishing uniformity and defectivity on larger substrates.
Despite the robust growth drivers, the SiC CMP consumables industry faces significant challenges. The primary obstacle is the extreme hardness and chemical inertness of SiC, which makes polishing an inherently difficult and slow process. This necessitates the use of abrasive slurries and durable pads that are both effective and cost-effective. Developing new formulations that can achieve higher material removal rates (MRR) while minimizing surface defects remains a major technical hurdle. A second major challenge is the high cost and limited supply of raw materials, particularly the specialized abrasives and chemicals used in slurries. The concentrated nature of the market could also be a point of concern, as it could lead to potential supply chain vulnerabilities if a key supplier faces production issues. Furthermore, the lack of a standardized polishing process across different SiC device manufacturers adds complexity. Each manufacturer has its own proprietary recipes, requiring consumables suppliers to develop a wide range of products or work closely with individual customers on tailored solutions. This fragmentation can slow down the overall maturation of the industry and hinder the development of universal, high-yield polishing processes.
This report aims to provide a comprehensive presentation of the global market for SiC Polishing Consumables, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of SiC Polishing Consumables by region & country, by Type, and by Wafer Size.
The SiC Polishing Consumables market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Polishing Consumables.
Market Segmentation
By Company
Segment by Type
Segment by Wafer Size
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of SiC Polishing Consumables company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Wafer Size, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of SiC Polishing Consumables in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of SiC Polishing Consumables in country level. It provides sigmate data by Type, and by Wafer Size for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.