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市场调查报告书
商品编码
1427223

全球半导体封装市场规模、份额、成长分析（按材料、按应用）- 2023-2030 年产业预测

Global Semiconductor Packaging Market Size, Share, Growth Analysis, By Material(Organic Packaging, Organic Packaging), By Application(Consumer Electronics, Automotive) - Industry Forecast 2023-2030
出版日期: | 出版商: SkyQuest | 英文 157 Pages | 商品交期: 3-5个工作天内

价格
简介目录

在预测期间（2024-2031年），全球半导体封装市场规模预计为269亿美元，从2023年的286.5亿美元成长到2031年的474.9亿美元，预计复合年增长率为6.52 %。

半导体封装市场受到人工智慧（AI）、机器学习（ML）和物联网（IoT）最尖端科技广泛采用的推动，并且正在向消费性电子、汽车、工业、医疗保健等领域，在半导体装置需求快速成长的推动下，取得了显着的成长。这些进步要求半导体装置具有更高的处理能力和储存容量。半导体封装在保持整体性能的同时降低封装成本，在增加半导体产品价值方面发挥关键作用。该技术越来越受到虚拟产品中使用的高性能晶片的青睐，各公司正在探索石墨烯和氧化锡等创新材料来製造晶片，市场正在不断增长，预计将有进一步的创新。由于各个最终用户行业的需求不断增长，以及利用封装来提高电子系统的性能、可靠性和成本效率，推动了半导体行业的全球扩张，该市场正在快速增长，是主要驱动因素。整合度、能源效率和产品特性的持续改善进一步加速了这一市场的扩张。

采用自上而下和自下而上的方法来估计和检验全球半导体封装市场的规模，并估计其他各个相关子市场的规模。用于估计市场规模的调查方法包括以下细节：透过二次研究确定市场的主要企业，并透过初步和二次研究确定每个地区的市场占有率。整个过程包括研究主要企业的年度和财务报告以及广泛的采访，以获得执行长、副总裁、董事和行销负责人等行业领导者的重要见解。所有股份比率和细分均使用二手资讯确定并使用主要资讯检验。本研究涵盖的所有可能影响市场的参数都经过了考虑、详细研究、初步研究检验和分析，以获得最终的定量和定性资料。

半导体封装全球细分市场分析

全球半导体封装市场根据材料、应用和地区进行细分。依材料划分，市场分为有机封装和化合物半导体封装。依材料划分，市场分为家电、汽车、工业、医疗保健等。依地区划分，分为北美、欧洲、亚太地区、中东/非洲、拉丁美洲。

全球半导体封装市场驱动因素

对越来越小的电子设备（例如智慧型手机、穿戴式装置和物联网设备）的需求推动了先进半导体封装方法的发展，以减少尺寸和重量，同时提高功能和性能。这就是我的目标。这些创新的封装技术可以更轻鬆地将多种功能和组件整合到更小的空间中，从而促进更精简、更有效率的电子产品的发展。

全球半导体封装市场的限制因素

半导体封装市场面临一个重大障碍：成本。先进封装技术的整合需要复杂的程序、专用机械和优质材料，这增加了製造成本。此外，对先进封装技术和设备的持续大量投资给製造商带来了财务障碍。此外，市场竞争和客户主导的价格限制进一步限制了报酬率并阻碍了先进封装解决方案的普及。

全球半导体封装市场趋势

随着资料密集型应用变得越来越普及，对提供高速和高频宽功能的半导体封装解决方案的需求不断增加。覆晶、晶圆级晶片级封装 (WLCSP) 和迭层封装 (PoP) 等封装创新可实现更快的资料传输、最大限度地减少讯号损失并提高整体电气性能。改进正在进行中。

目录

  • 执行摘要
  • 调查方法
  • 母市场分析
  • 主要市场考察
    • 技术分析
    • 价格分析
    • 供应链分析
    • 价值链分析
    • 市场生态系统
    • 智慧财产权分析
    • 贸易分析
    • Start-Ups分析
    • 原料分析
    • 创新矩阵
    • 研发线产品分析
    • 总体经济指标
    • 主要投资分析
    • 关键成功因素
    • 竞争程度
  • 市场动态及展望
    • 市场动态
      • 促进因素
      • 机会
      • 抑制因素
      • 任务
    • 监管形势
    • 波特的分析
    • 对未来中断的特殊考虑
  • 全球半导体封装市场：依材料分类
    • 市场概况
    • 有机包装
    • 化合物半导体封装
  • 全球半导体封装市场：依应用分类
    • 市场概况
    • 家用电器
    • 车
    • 产业
    • 卫生保健
    • 其他的
  • 全球半导体封装市场规模：依地区划分
    • 市场概况
    • 北美洲
      • 美国
      • 加拿大
    • 欧洲
      • 德国
      • 西班牙
      • 法国
      • 英国
      • 其他欧洲国家地区
    • 亚太地区
      • 中国
      • 印度
      • 日本
      • 韩国
      • 其他亚太地区
    • 拉丁美洲
      • 巴西
      • 其他拉丁美洲地区
    • 中东和非洲 (MEA)
      • 海湾合作委员会国家
      • 南非
      • 其他中东/非洲地区
  • 竞争形势
    • 前5名企业对比
    • 主要企业市场定位（2021年）
    • 主要市场参与者所采取的策略
    • 关键成功策略
    • 近期市集活动
    • 主要企业市场占有率（2021年）
  • 主要企业简介
    • ASE Technology Holding Co., Ltd.（Taiwan）
    • Amkor Technology, Inc.（United States）
    • Siliconware Precision Industries Co., Ltd.（Taiwan）
    • Powertech Technology Inc.（Taiwan）
    • STATS ChipPAC Pte. Ltd.（Singapore）
    • Samsung Electronics Co., Ltd.（South Korea）
    • UTAC Holdings Ltd.（Singapore）
    • ChipMOS Technologies Inc.（Taiwan）
    • Intel Corporation（United States）
    • Advanced Semiconductor Engineering, Inc.（Taiwan）
    • Siliconware Precision Industries Co., Ltd.（Taiwan）
    • Jiangsu Changjiang Electronics Technology（China）
    • Powertech Technology Inc.（Taiwan）
    • Amkor Technology, Inc.（United States）
    • STATS ChipPAC Pte. Ltd.（Singapore）
    • Samsung Electronics Co., Ltd.（South Korea）
    • Tongfu Microelectronics Co., Ltd.（China）
    • Unisem Group（Malaysia）
    • Nepes Corporation（South Korea）
简介目录
Product Code: SQMIG45O2022

Global Semiconductor Packaging Market size was valued at USD 26.90 billion in 2022 and is poised to grow from USD 28.65 billion in 2023 to USD 47.49 billion by 2031, growing at a CAGR of 6.52% during the forecast period (2024-2031).

The semiconductor packaging market is witnessing significant growth driven by the surging demand for semiconductor devices across diverse sectors like consumer electronics, automotive, industrial, and healthcare, propelled by the widespread adoption of cutting-edge technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT). These advancements necessitate semiconductor devices with heightened processing power and memory capacity. Semiconductor packaging plays a crucial role in enhancing semiconductor product value by maintaining overall performance while reducing package costs. This technology is increasingly favored for high-performance chips utilized in virtual products, with companies exploring innovative materials like graphene and tin oxide for chip creation, promising further market innovation. The global expansion of the semiconductor industry, spurred by growing demand across various end-user industries and the utilization of packaging to boost electronics system performance, reliability, and cost-effectiveness, is a key driver behind the market's rapid growth. Continuous enhancements in integration, energy efficiency, and product characteristics further contribute to this accelerated market expansion.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Semiconductor Packaging Market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Semiconductor Packaging Market Segmental Analysis

Global Semiconductor Packaging Market is segmented on the basis of material, application and region. By material, the market is segmented into organic packaging, compound semiconductor packaging. By application, market is segmented into consumer electronics, automotive, industrial, healthcare, others. By region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.

Drivers of the Global Semiconductor Packaging Market

The push for advanced semiconductor packaging methods stems from the need for increasingly compact electronic devices such as smartphones, wearables, and IoT gadgets, aiming to enhance functionality and performance while simultaneously reducing size and weight. These innovative packaging techniques facilitate the consolidation of multiple functions and components within a smaller space, thus driving the evolution towards more streamlined and efficient electronic products.

Restraints in the Global Semiconductor Packaging Market

The semiconductor packaging market faces a notable obstacle in the form of cost, where the integration of advanced packaging technologies brings forth intricate procedures, specialized machinery, and premium-grade materials, thereby escalating manufacturing expenses. Additionally, the ongoing requirement for substantial investment in advanced packaging technologies and equipment presents financial hurdles for manufacturers. Furthermore, market rivalry and customer-driven price constraints further constrain profit margins and hinder the widespread adoption of advanced packaging solutions.

Market Trends of the Global Semiconductor Packaging Market

As data-intensive applications become increasingly prevalent, there is an escalating demand for semiconductor packaging solutions that offer both high-speed and high-bandwidth capabilities. Innovations in packaging methods such as flip-chip, wafer-level chip-scale packaging (WLCSP), and package-on-package (PoP) are facilitating faster data transmission, minimizing signal losses, and improving overall electrical performance.

Table of Contents

  • Executive Summary
    • Market Overview
    • Wheel of Fortune
  • Research Methodology
    • Information Procurement
    • Secondary & Primary Data Sources
    • Market Size Estimation
    • Market Assumptions & Limitations
  • Parent Market Analysis
    • Market Overview
    • Market Size
    • Market Dynamics
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
  • Key Market Insights
    • Technology Analysis
    • Pricing Analysis
    • Supply Chain Analysis
    • Value Chain Analysis
    • Ecosystem of the Market
    • IP Analysis
    • Trade Analysis
    • Startup Analysis
    • Raw Material Analysis
    • Innovation Matrix
    • Pipeline Product Analysis
    • Macroeconomic Indicators
    • Top Investment Analysis
    • Key Success Factor
    • Degree of Competition
  • Market Dynamics & Outlook
    • Market Dynamics
      • Drivers
      • Opportunities
      • Restraints
      • Challenges
    • Regulatory Landscape
    • Porters Analysis
      • Competitive rivalry
      • Threat of Substitute Products
      • Bargaining Power of Buyers
      • Threat of New Entrants
      • Bargaining Power of Suppliers
    • Skyquest Special Insights on Future Disruptions
      • Political Impact
      • Economic Impact
      • Social Impact
      • Technical Impact
      • Environmental Impact
      • Legal Impact
  • Global Semiconductor Packaging Market by Material
    • Market Overview
    • Organic Packaging
    • Organic Packaging
    • Compound Semiconductor Packaging
  • Global Semiconductor Packaging Market by Application
    • Market Overview
    • Consumer Electronics
    • Automotive
    • Industrial
    • Healthcare
    • Others
  • Global Semiconductor Packaging Market Size by Region
    • Market Overview
    • North America
      • USA
      • Canada
    • Europe
      • Germany
      • Spain
      • France
      • UK
      • Rest of Europe
    • Asia Pacific
      • China
      • India
      • Japan
      • South Korea
      • Rest of Asia-Pacific
    • Latin America
      • Brazil
      • Rest of Latin America
    • Middle East & Africa (MEA)
      • GCC Countries
      • South Africa
      • Rest of MEA
  • Competitive Landscape
    • Top 5 Player Comparison
    • Market Positioning of Key Players, 2021
    • Strategies Adopted by Key Market Players
    • Top Winning Strategies
      • By Development
      • By Company
      • By Year
    • Recent Activities in the Market
    • Key Companies Market Share (%), 2021
  • Key Company Profiles
    • ASE Technology Holding Co., Ltd. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Amkor Technology, Inc. (United States)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Siliconware Precision Industries Co., Ltd. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Powertech Technology Inc. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • STATS ChipPAC Pte. Ltd. (Singapore)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Samsung Electronics Co., Ltd. (South Korea)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • UTAC Holdings Ltd. (Singapore)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • ChipMOS Technologies Inc. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Intel Corporation (United States)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Advanced Semiconductor Engineering, Inc. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Siliconware Precision Industries Co., Ltd. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Jiangsu Changjiang Electronics Technology (China)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Powertech Technology Inc. (Taiwan)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Amkor Technology, Inc. (United States)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • STATS ChipPAC Pte. Ltd. (Singapore)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Samsung Electronics Co., Ltd. (South Korea)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Tongfu Microelectronics Co., Ltd. (China)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Unisem Group (Malaysia)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments
    • Nepes Corporation (South Korea)
      • Company Overview
      • Business Segment Overview
      • Financial Updates
      • Key Developments