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市场调查报告书
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1836405

光学积体电路市场预测（至 2032 年）：按产品类型、组件、整合类型、原材料、应用、最终用户和地区进行的全球分析

Photonic Integrated Circuits Market Forecasts to 2032 - Global Analysis By Product Type, Component, Integration Type, Raw Material, Application, End User, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球光学积体电路 (PIC) 市场规模预计在 2025 年达到 177 亿美元，到 2032 年将达到 619 亿美元，预测期内的复合年增长率为 19.6%。

光子积体电路 (PIC) 市场专注于将多种光子功能（例如雷射、调製器和检测器）整合到单一晶片上。 PIC 可实现高速资料传输、低功耗以及光学系统的小型化，使其成为通讯、资料中心和感测应用的关键。高速光纤网路、云端运算和新兴 5G/6G 基础设施日益增长的需求推动了市场的成长。硅光电的进步、製造扩充性以及政府对下一代通讯技术的支持，正在加速全球市场的普及。

高速资料传输的需求

高速资料传输需求的不断增长是推动光积体电路 (PIC) 市场成长的主要因素。通讯、资料中心和云端运算等行业需要高速、低延迟的通讯系统来处理日益增长的资料流量。利用光进行资料传输的 PIC 相比传统电子电路具有显着优势，包括更高的频宽和更低的功耗。 5G 网路的广泛应用和人工智慧应用的快速成长进一步扩大了这一需求，因为这些应用需要先进的光互连来实现高效的数据处理和通讯。

製造成本高

製造光积体电路需要复杂的製程和专用材料，导致製造成本高。混合整合和单晶片整合等技术需要精确的製造方法，并且可能需要大量资金。此外，对无尘室环境和精密设备的需求也增加了整体成本。这些高成本可能会限制光积体电路的广泛应用，尤其是在中小企业中。此外，製造流程缺乏标准化会导致不一致和产量比率问题，进一步增加製造成本。

5G和资料中心的成长

5G 网路的扩展和资料中心需求的不断增长为光积体电路市场带来了巨大的机会。 5G 技术需要高速、低延迟的通讯系统，而 PIC 可以有效率地实现这一点。同样，资料中心需要高频宽互连来管理不断增长的资料流量。 PIC 提供的解决方案能够实现更快的资料传输，同时降低功耗。人工智慧和机器学习在资料中心的整合进一步推动了对先进光互连的需求，使 PIC 成为通讯和资料基础设施发展的关键组成部分。

监管挑战

有关环境影响、材料使用和製造流程的严格法规可能会阻碍PIC的开发和部署。遵守这些法规通常需要在研发和现有生产设施的改造方面投入大量资金。此外，不同地区缺乏标准化法规可能会造成市场准入壁垒，并使国际贸易复杂化。这些监管障碍可能会减缓PIC的采用，并增加整体生产成本。

COVID-19的影响：

新冠疫情对光积体电路市场产生了多方面的影响。它带来了供应链中断、生产设施暂时关闭等挑战，但也加速了对数位通讯的需求以及光积体电路（PIC）等先进技术的采用。远端办公、线上服务以及对数位基础设施的日益依赖，凸显了对快速高效通讯系统的需求，从而推动了光积体电路市场的成长。随着各行各业逐渐适应后疫情时代，在通讯基础设施和数位转型持续投入的支持下，光积体电路市场的长期前景依然乐观。

预测期内，收发器市场预计将成为最大的市场

预计在预测期内，收发器领域将占据最大的市场份额。收发器将发送器和接收器整合到一个模组中，是光纤通讯系统的重要组成部分，有助于实现高速资料传输。资料中心、5G 网路和人工智慧应用日益增长的需求需要高效、大容量的收发器。基于 PIC 的收发器具有尺寸更小、低耗电量、性能更佳等优势，使其成为现代通讯系统的首选。预计这一趋势将在未来几年推动收发器领域的成长。

混合整合领域预计将在预测期内实现最高的复合年增长率

混合整合领域预计将在预测期内实现最高成长率。混合整合涉及组合不同的材料和技术，以创建充分利用每个组件优势的光子电路。这种方法可以将雷射、调製器和检测器等各种功能整合到单一晶片上，从而提高性能并实现小型化。 IT和通讯、资料中心和人工智慧系统等应用领域对更小、更高效能设备的需求日益增长，这推动了混合整合的普及，预计该领域将以较高的复合年增长率成长。

占比最大的地区：

预计北美将在预测期内占据最大的市场份额。这种主导地位得益于半导体和光电产业主要参与者的存在、对研发的大量投资以及先进技术的快速应用等因素。该地区强大的基础设施，加上政府支持技术创新和数位转型的倡议，进一步巩固了其在市场上的主导地位。此外，通讯、医疗保健和国防等领域对高速通讯系统日益增长的需求也推动了北美PIC市场的成长。

复合年增长率最高的地区：

预计亚太地区在预测期内的复合年增长率最高。这一成长主要得益于中国、日本和韩国等国家快速的工业化和数数位化，这导致对先进通讯技术的需求不断增长。该地区强大的製造能力，加上政府推动创新和技术应用的倡议，为光积体电路市场的成长创造了有利的环境。此外，对资料中心、5G基础设施和人工智慧研究的投资不断增加，也进一步推动了亚太地区对光积体电路的需求。

提供免费客製化：

此报告的订阅者可以使用以下免费自订选项之一：

  • 公司简介
    • 全面分析其他市场参与者（最多 3 家公司）
    • 主要企业的SWOT分析（最多3家公司）
  • 区域细分
    • 根据客户兴趣对主要国家进行的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究材料
    • 主要研究资料
    • 次级研究资讯来源
    • 先决条件

第三章市场走势分析

  • 驱动程式
  • 抑制因素
  • 机会
  • 威胁
  • 产品分析
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

5. 全球光子积体电路（PIC）市场（依产品类型）

  • 收发器
  • 可变光衰减器（VOA）
  • 数据机
  • 感应器
  • 其他产品类型

6. 全球光子积体电路（PIC）市场（按组件）

  • 雷射
  • 数据机
  • 检测器
  • 多工器/解多工器（MUX/DEMUX）
  • 光放大器
  • 衰减器
  • 波导
  • 其他被动元件

7. 全球光子积体电路（PIC）市场（依整合类型）

  • 单晶片集成
  • 混合整合
  • 模组级集成

8. 全球光子积体电路（PIC）市场（按原始材料）

  • 磷化铟（InP）
  • 绝缘体上硅（SOI）/硅光电
  • 氮化硅（SiN）
  • 砷化镓（GaAs）
  • 铌酸锂（LiNbO3）
  • 其他成分

9. 全球光子积体电路（PIC）市场应用

  • 光纤通讯
    • 资料中心互连 (DCI)
    • 通讯
    • 连贯光收发器
  • 感测
    • 自动驾驶汽车的雷射雷达
    • 光纤感测
    • 生物/化学感
    • 量子感测
  • 讯号处理
    • 光学运算
    • 类比射频讯号处理
  • 生物医学
    • 实验室晶片设备
    • 医疗图像（OCT）
  • 量子计算
  • 其他应用

10. 全球光子积体电路（PIC）市场（依最终用户）

  • 电讯和资料通讯
  • IT与资料中心
  • 医疗保健和生命科学
  • 汽车和运输
  • 航太和国防
  • 家电
  • 工业/製造业
  • 其他最终用户

11. 全球光子积体电路（PIC）市场（按地区）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十二章 重大进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第十三章：企业概况

  • Intel Corporation
  • Cisco Systems, Inc.
  • Infinera Corporation
  • Lumentum Holdings Inc.
  • Coherent Corp.
  • Broadcom Inc.
  • MACOM Technology Solutions Holdings, Inc.
  • Ciena Corporation
  • NeoPhotonics Corporation
  • Rockley Photonics Holdings Limited
  • Marvell Technology, Inc.
  • STMicroelectronics NV
  • LIGENTEC SA
  • SMART Photonics BV
  • PHIX Photonics Assembly BV
  • Enablence Technologies Inc.
  • GlobalFoundries Inc.
  • Advanced Micro Devices, Inc.
Product Code: SMRC31529

According to Stratistics MRC, the Global Photonic Integrated Circuits (PIC) Market is accounted for $17.7 billion in 2025 and is expected to reach $61.9 billion by 2032 growing at a CAGR of 19.6% during the forecast period. Photonic Integrated Circuits (PIC) Market focuses on integrating multiple photonic functions, such as lasers, modulators, and detectors, onto a single chip. PICs enable faster data transmission, lower power consumption, and miniaturized optical systems, making them critical for telecommunications, data centers, and sensing applications. Growth is driven by increasing demand for high-speed optical networks, cloud computing, and emerging 5G/6G infrastructure. Advancements in silicon photonics, manufacturing scalability, and government support for next-generation communication technologies are accelerating market adoption globally.

Market Dynamics:

Driver:

Demand for High-Speed Data Transmission

The escalating need for rapid data transfer is a primary driver for the growth of the photonic integrated circuit (PIC) market. Industries such as telecommunications, data centers, and cloud computing require high-speed, low-latency communication systems to handle the increasing volume of data traffic. PICs, leveraging light for data transmission, offer significant advantages over traditional electronic circuits, including higher bandwidth and lower power consumption. This demand is further amplified by the proliferation of 5G networks and the surge in AI applications, necessitating advanced optical interconnects for efficient data processing and communication.

Restraint:

High Manufacturing Costs

The production of photonic integrated circuits involves complex processes and specialized materials, leading to high manufacturing costs. Techniques such as hybrid integration and monolithic integration require precise fabrication methods, which can be capital-intensive. Additionally, the need for cleanroom environments and advanced equipment adds to the overall expenses. These high costs can limit the widespread adoption of PICs, particularly among small and medium-sized enterprises. Furthermore, the lack of standardization in manufacturing processes can lead to inconsistencies and yield issues, further escalating production costs.

Opportunity:

Growth in 5G and Data Centers

The expansion of 5G networks and the increasing demand for data centers present significant opportunities for the photonic integrated circuit market. 5G technology requires high-speed, low-latency communication systems, which can be efficiently achieved using PICs. Similarly, data centers require high-bandwidth interconnects to manage the growing volume of data traffic. PICs offer a solution by enabling faster data transmission with reduced power consumption. The integration of AI and machine learning in data centers further drives the need for advanced optical interconnects, positioning PICs as a critical component in the evolution of telecommunications and data infrastructure.

Threat:

Regulatory Challenges

Stringent regulations concerning environmental impact, material usage, and manufacturing processes can hinder the development and deployment of PICs. Compliance with these regulations often requires significant investment in research and development, as well as modifications to existing manufacturing facilities. Additionally, the lack of standardized regulations across different regions can create barriers to market entry and complicate international trade. These regulatory hurdles can delay the adoption of PICs and increase the overall cost of production.

Covid-19 Impact:

The COVID-19 pandemic had a mixed impact on the photonic integrated circuit market. While it caused challenges such as supply chain disruptions and temporary shutdowns of manufacturing facilities, it also accelerated the demand for digital communication and the adoption of advanced technologies like PICs. The increased reliance on remote work, online services, and digital infrastructure highlighted the need for high-speed, efficient communication systems, thereby driving the growth of the PIC market. As industries adapt to the post-pandemic landscape, the long-term outlook for the PIC market remains positive, supported by ongoing investments in telecommunications infrastructure and digital transformation initiatives.

The transceivers segment is expected to be the largest during the forecast period

The transceivers segment is expected to account for the largest market share during the forecast period. Transceivers, which combine transmitters and receivers in a single module, are essential components in optical communication systems, facilitating high-speed data transmission. The increasing demand for data centers, 5G networks, and AI applications necessitates efficient and high-capacity transceivers. PIC-based transceivers offer advantages such as reduced size, lower power consumption, and improved performance, making them a preferred choice for modern communication systems. This trend is expected to drive the growth of the transceivers segment in the coming years.

The hybrid integration segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the hybrid integration segment is predicted to witness the highest growth rate. Hybrid integration involves combining different materials and technologies to create photonic circuits that leverage the strengths of each component. This approach allows for the integration of various functionalities, such as lasers, modulators, and detectors, onto a single chip, enhancing performance and reducing size. The increasing demand for compact, high-performance devices in applications like telecommunications, data centers, and AI systems is driving the adoption of hybrid integration, leading to its projected high CAGR.

Region with largest share:

During the forecast period, the North America region is expected to hold the largest market share. This dominance is attributed to factors such as the presence of major players in the semiconductor and photonics industries, significant investments in research and development, and the rapid adoption of advanced technologies. The region's robust infrastructure, coupled with government initiatives supporting innovation and digital transformation, further contributes to its leading position in the market. Additionally, the increasing demand for high-speed communication systems in sectors like telecommunications, healthcare, and defense bolsters the growth of the PIC market in North America.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR. This growth is driven by the rapid industrialization and digitalization in countries like China, Japan, and South Korea, leading to increased demand for advanced communication technologies. The region's strong manufacturing capabilities, coupled with government initiatives promoting innovation and technology adoption, create a favorable environment for the growth of the PIC market. Moreover, the rising investments in data centers, 5G infrastructure, and AI research further propel the demand for photonic integrated circuits in the Asia Pacific region.

Key players in the market

Some of the key players in Photonic Integrated Circuits (PIC) Market include Intel Corporation, Cisco Systems, Inc., Infinera Corporation, Lumentum Holdings Inc., Coherent Corp., Broadcom Inc., MACOM Technology Solutions Holdings, Inc., Ciena Corporation, NeoPhotonics Corporation, Rockley Photonics Holdings Limited, Marvell Technology, Inc., STMicroelectronics N.V., LIGENTEC SA, SMART Photonics B.V., PHIX Photonics Assembly B.V., Enablence Technologies Inc., GlobalFoundries Inc., and Advanced Micro Devices, Inc.

Key Developments:

In September 2025, Ciena the global leader in high-speed connectivity announced that it has entered into a definitive agreement to acquire Nubis Communications, a privately-held company headquartered in New Providence, New Jersey. The addition of Nubis, which specializes in high-performance, ultra-compact, low-power optical and electrical interconnects tailored to support AI workloads, will expand Ciena's portfolio and add critical talent to address a wider range of opportunities inside the data center.

In October 2024, The Department of Commerce has provisionally agreed to provide up to $93 million in direct funding to optical networking vendor Infinera. The proposed funding, awarded under the CHIPS and Science Act, would support the construction of a new fab in San Jose, California, and a new advanced test and packaging facility in Bethlehem, Pennsylvania. In a statement, the Department of Commerce said the projects would increase Infinera's existing domestic manufacturing capacity by an estimated factor of 10 and would create up to approximately 500 manufacturing jobs and 1,200 construction jobs across the two states.

In September 2024, Lumentum Holdings Inc. ("Lumentum"), a market-leading designer and manufacturer of innovative optical and photonic products, announced today its participation in the European Conference on Optical Communication (ECOC) 2024 in Frankfurt, Germany, from September 23 - 25. At Stand #A24, Lumentum will showcase its latest photonic solutions, reinforcing its commitment to powering the artificial intelligence (AI) revolution through unparalleled speed, scalability, and energy efficiency.

Product Types Covered:

  • Transceivers
  • Variable Optical Attenuators (VOAs)
  • Modulators
  • Sensors
  • Other Product Types

Components Covered:

  • Lasers
  • Modulators
  • Photodetectors
  • Multiplexers/De-multiplexers (MUX/DEMUX)
  • Optical Amplifiers
  • Attenuators
  • Waveguides
  • Other Passive Components

Integration Types Covered:

  • Monolithic Integration
  • Hybrid Integration
  • Module-Level Integration

Raw Materials Covered:

  • Indium Phosphide (InP)
  • Silicon-on-Insulator (SOI) / Silicon Photonics
  • Silicon Nitride (SiN)
  • Gallium Arsenide (GaAs)
  • Lithium Niobate (LiNbO3)
  • Other Raw Materials

Applications Covered:

  • Optical Communication
  • Sensing
  • Signal Processing
  • Biomedical
  • Quantum Computing
  • Other Applications

End Users Covered:

  • Telecommunications & Data Communication
  • IT & Data Centers
  • Healthcare & Life Sciences
  • Automotive & Transportation
  • Aerospace & Defense
  • Consumer Electronics
  • Industrial & Manufacturing
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Photonic Integrated Circuits (PIC) Market, By Product Type

  • 5.1 Introduction
  • 5.2 Transceivers
  • 5.3 Variable Optical Attenuators (VOAs)
  • 5.4 Modulators
  • 5.5 Sensors
  • 5.6 Other Product Types

6 Global Photonic Integrated Circuits (PIC) Market, By Component

  • 6.1 Introduction
  • 6.2 Lasers
  • 6.3 Modulators
  • 6.4 Photodetectors
  • 6.5 Multiplexers/De-multiplexers (MUX/DEMUX)
  • 6.6 Optical Amplifiers
  • 6.7 Attenuators
  • 6.8 Waveguides
  • 6.9 Other Passive Components

7 Global Photonic Integrated Circuits (PIC) Market, By Integration Type

  • 7.1 Introduction
  • 7.2 Monolithic Integration
  • 7.3 Hybrid Integration
  • 7.4 Module-Level Integration

8 Global Photonic Integrated Circuits (PIC) Market, By Raw Material

  • 8.1 Introduction
  • 8.2 Indium Phosphide (InP)
  • 8.3 Silicon-on-Insulator (SOI) / Silicon Photonics
  • 8.4 Silicon Nitride (SiN)
  • 8.5 Gallium Arsenide (GaAs)
  • 8.6 Lithium Niobate (LiNbO3)
  • 8.7 Other Raw Materials

9 Global Photonic Integrated Circuits (PIC) Market, By Application

  • 9.1 Introduction
  • 9.2 Optical Communication
    • 9.2.1 Data Center Interconnects (DCI)
    • 9.2.2 Telecommunication
    • 9.2.3 Coherent Optical Transceivers
  • 9.3 Sensing
    • 9.3.1 LiDAR for Autonomous Vehicles
    • 9.3.2 Fiber Optic Sensing
    • 9.3.3 Bio/Chemical Sensing
    • 9.3.4 Quantum Sensing
  • 9.4 Signal Processing
    • 9.4.1 Optical Computing
    • 9.4.2 Analog RF Signal Processing
  • 9.5 Biomedical
    • 9.5.1 Lab-on-a-Chip Devices
    • 9.5.2 Medical Imaging (OCT)
  • 9.6 Quantum Computing
  • 9.7 Other Applications

10 Global Photonic Integrated Circuits (PIC) Market, By End User

  • 10.1 Introduction
  • 10.2 Telecommunications & Data Communication
  • 10.3 IT & Data Centers
  • 10.4 Healthcare & Life Sciences
  • 10.5 Automotive & Transportation
  • 10.6 Aerospace & Defense
  • 10.7 Consumer Electronics
  • 10.8 Industrial & Manufacturing
  • 10.9 Other End Users

11 Global Photonic Integrated Circuits (PIC) Market, By Geography

  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 Germany
    • 11.3.2 UK
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia Pacific
    • 11.4.1 Japan
    • 11.4.2 China
    • 11.4.3 India
    • 11.4.4 Australia
    • 11.4.5 New Zealand
    • 11.4.6 South Korea
    • 11.4.7 Rest of Asia Pacific
  • 11.5 South America
    • 11.5.1 Argentina
    • 11.5.2 Brazil
    • 11.5.3 Chile
    • 11.5.4 Rest of South America
  • 11.6 Middle East & Africa
    • 11.6.1 Saudi Arabia
    • 11.6.2 UAE
    • 11.6.3 Qatar
    • 11.6.4 South Africa
    • 11.6.5 Rest of Middle East & Africa

12 Key Developments

  • 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 12.2 Acquisitions & Mergers
  • 12.3 New Product Launch
  • 12.4 Expansions
  • 12.5 Other Key Strategies

13 Company Profiling

  • 13.1 Intel Corporation
  • 13.2 Cisco Systems, Inc.
  • 13.3 Infinera Corporation
  • 13.4 Lumentum Holdings Inc.
  • 13.5 Coherent Corp.
  • 13.6 Broadcom Inc.
  • 13.7 MACOM Technology Solutions Holdings, Inc.
  • 13.8 Ciena Corporation
  • 13.9 NeoPhotonics Corporation
  • 13.10 Rockley Photonics Holdings Limited
  • 13.11 Marvell Technology, Inc.
  • 13.12 STMicroelectronics N.V.
  • 13.13 LIGENTEC SA
  • 13.14 SMART Photonics B.V.
  • 13.15 PHIX Photonics Assembly B.V.
  • 13.16 Enablence Technologies Inc.
  • 13.17 GlobalFoundries Inc.
  • 13.18 Advanced Micro Devices, Inc.

List of Tables

  • Table 1 Global Photonic Integrated Circuits (PIC) Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Photonic Integrated Circuits (PIC) Market Outlook, By Product Type (2024-2032) ($MN)
  • Table 3 Global Photonic Integrated Circuits (PIC) Market Outlook, By Transceivers (2024-2032) ($MN)
  • Table 4 Global Photonic Integrated Circuits (PIC) Market Outlook, By Variable Optical Attenuators (VOAs) (2024-2032) ($MN)
  • Table 5 Global Photonic Integrated Circuits (PIC) Market Outlook, By Modulators (2024-2032) ($MN)
  • Table 6 Global Photonic Integrated Circuits (PIC) Market Outlook, By Sensors (2024-2032) ($MN)
  • Table 7 Global Photonic Integrated Circuits (PIC) Market Outlook, By Other Product Types (2024-2032) ($MN)
  • Table 8 Global Photonic Integrated Circuits (PIC) Market Outlook, By Component (2024-2032) ($MN)
  • Table 9 Global Photonic Integrated Circuits (PIC) Market Outlook, By Lasers (2024-2032) ($MN)
  • Table 10 Global Photonic Integrated Circuits (PIC) Market Outlook, By Modulators (2024-2032) ($MN)
  • Table 11 Global Photonic Integrated Circuits (PIC) Market Outlook, By Photodetectors (2024-2032) ($MN)
  • Table 12 Global Photonic Integrated Circuits (PIC) Market Outlook, By Multiplexers/De-multiplexers (MUX/DEMUX) (2024-2032) ($MN)
  • Table 13 Global Photonic Integrated Circuits (PIC) Market Outlook, By Optical Amplifiers (2024-2032) ($MN)
  • Table 14 Global Photonic Integrated Circuits (PIC) Market Outlook, By Attenuators (2024-2032) ($MN)
  • Table 15 Global Photonic Integrated Circuits (PIC) Market Outlook, By Waveguides (2024-2032) ($MN)
  • Table 16 Global Photonic Integrated Circuits (PIC) Market Outlook, By Other Passive Components (2024-2032) ($MN)
  • Table 17 Global Photonic Integrated Circuits (PIC) Market Outlook, By Integration Type (2024-2032) ($MN)
  • Table 18 Global Photonic Integrated Circuits (PIC) Market Outlook, By Monolithic Integration (2024-2032) ($MN)
  • Table 19 Global Photonic Integrated Circuits (PIC) Market Outlook, By Hybrid Integration (2024-2032) ($MN)
  • Table 20 Global Photonic Integrated Circuits (PIC) Market Outlook, By Module-Level Integration (2024-2032) ($MN)
  • Table 21 Global Photonic Integrated Circuits (PIC) Market Outlook, By Raw Material (2024-2032) ($MN)
  • Table 22 Global Photonic Integrated Circuits (PIC) Market Outlook, By Indium Phosphide (InP) (2024-2032) ($MN)
  • Table 23 Global Photonic Integrated Circuits (PIC) Market Outlook, By Silicon-on-Insulator (SOI) / Silicon Photonics (2024-2032) ($MN)
  • Table 24 Global Photonic Integrated Circuits (PIC) Market Outlook, By Silicon Nitride (SiN) (2024-2032) ($MN)
  • Table 25 Global Photonic Integrated Circuits (PIC) Market Outlook, By Gallium Arsenide (GaAs) (2024-2032) ($MN)
  • Table 26 Global Photonic Integrated Circuits (PIC) Market Outlook, By Lithium Niobate (LiNbO3) (2024-2032) ($MN)
  • Table 27 Global Photonic Integrated Circuits (PIC) Market Outlook, By Other Raw Materials (2024-2032) ($MN)
  • Table 28 Global Photonic Integrated Circuits (PIC) Market Outlook, By Application (2024-2032) ($MN)
  • Table 29 Global Photonic Integrated Circuits (PIC) Market Outlook, By Optical Communication (2024-2032) ($MN)
  • Table 30 Global Photonic Integrated Circuits (PIC) Market Outlook, By Data Center Interconnects (DCI) (2024-2032) ($MN)
  • Table 31 Global Photonic Integrated Circuits (PIC) Market Outlook, By Telecommunication (2024-2032) ($MN)
  • Table 32 Global Photonic Integrated Circuits (PIC) Market Outlook, By Coherent Optical Transceivers (2024-2032) ($MN)
  • Table 33 Global Photonic Integrated Circuits (PIC) Market Outlook, By Sensing (2024-2032) ($MN)
  • Table 34 Global Photonic Integrated Circuits (PIC) Market Outlook, By LiDAR for Autonomous Vehicles (2024-2032) ($MN)
  • Table 35 Global Photonic Integrated Circuits (PIC) Market Outlook, By Fiber Optic Sensing (2024-2032) ($MN)
  • Table 36 Global Photonic Integrated Circuits (PIC) Market Outlook, By Bio/Chemical Sensing (2024-2032) ($MN)
  • Table 37 Global Photonic Integrated Circuits (PIC) Market Outlook, By Quantum Sensing (2024-2032) ($MN)
  • Table 38 Global Photonic Integrated Circuits (PIC) Market Outlook, By Signal Processing (2024-2032) ($MN)
  • Table 39 Global Photonic Integrated Circuits (PIC) Market Outlook, By Optical Computing (2024-2032) ($MN)
  • Table 40 Global Photonic Integrated Circuits (PIC) Market Outlook, By Analog RF Signal Processing (2024-2032) ($MN)
  • Table 41 Global Photonic Integrated Circuits (PIC) Market Outlook, By Biomedical (2024-2032) ($MN)
  • Table 42 Global Photonic Integrated Circuits (PIC) Market Outlook, By Lab-on-a-Chip Devices (2024-2032) ($MN)
  • Table 43 Global Photonic Integrated Circuits (PIC) Market Outlook, By Medical Imaging (OCT) (2024-2032) ($MN)
  • Table 44 Global Photonic Integrated Circuits (PIC) Market Outlook, By Quantum Computing (2024-2032) ($MN)
  • Table 45 Global Photonic Integrated Circuits (PIC) Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 46 Global Photonic Integrated Circuits (PIC) Market Outlook, By End User (2024-2032) ($MN)
  • Table 47 Global Photonic Integrated Circuits (PIC) Market Outlook, By Telecommunications & Data Communication (2024-2032) ($MN)
  • Table 48 Global Photonic Integrated Circuits (PIC) Market Outlook, By IT & Data Centers (2024-2032) ($MN)
  • Table 49 Global Photonic Integrated Circuits (PIC) Market Outlook, By Healthcare & Life Sciences (2024-2032) ($MN)
  • Table 50 Global Photonic Integrated Circuits (PIC) Market Outlook, By Automotive & Transportation (2024-2032) ($MN)
  • Table 51 Global Photonic Integrated Circuits (PIC) Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 52 Global Photonic Integrated Circuits (PIC) Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 53 Global Photonic Integrated Circuits (PIC) Market Outlook, By Industrial & Manufacturing (2024-2032) ($MN)
  • Table 54 Global Photonic Integrated Circuits (PIC) Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.