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市场调查报告书
商品编码
1700077
2032 年无线电频率积体电路市场预测:按产品类型、材料类型、运作频率、应用和地区进行的全球分析Radio Frequency Integrated Circuit Market Forecasts to 2032 - Global Analysis By Product Type, Material Type, Operating Frequency, Application and By Geography |
根据 Stratistics MRC 的数据,全球无线电频率积体电路市场预计在 2025 年达到 279 亿美元,到 2032 年将达到 504 亿美元,预测期内的复合年增长率为 8.8%。
无线电频率积体电路(RFIC) 是专门设计用于在射频下运作的半导体装置。它将放大器、搅拌机和振盪器等各种射频元件整合到单一晶片上,从而为无线通讯系统、雷达和广播应用提供高效的讯号处理。 RFIC 可提高效能、降低功耗并最大限度地缩小无线设备的尺寸。
根据世界半导体贸易统计(WSTS)组织的数据,预计2024年全球半导体市场规模将与前一年同期比较增19.0%,达到6,270亿美元。
无线通讯需求不断成长
5G 网路、物联网设备和智慧技术的快速普及正在推动对实现高速资料传输和连接的 RFIC 的需求。随着消费者和产业越来越依赖通讯、医疗保健、工业自动化等领域的无线解决方案,RFIC 对于支援进阶应用至关重要。此外,6G研究和卫星通讯系统的部署正在进一步扩大成长机会,使无线通讯成为市场扩张的主要驱动力。这一趋势凸显了广泛应用对高效能、低延迟射频组件的需求。
设计和製造成本高
开发RFIC需要专门的材料、先进的製造流程和严格的品质标准,这会导致更高的製造成本。将类比和数位组件整合到紧凑设计中的复杂性进一步增加了研发成本。此外,为了跟上不断发展的无线标准,需要不断创新,这给预算带来了压力,尤其是对于中小型企业而言。这些经济壁垒限制了新参与企业的市场,降低了利润率,并阻碍了采用。因此,在成本敏感的行业中,RFIC 整合可能会很慢,从而对市场扩充性带来挑战。
车载连线需求不断成长
汽车产业向联网汽车和自动驾驶汽车的转变正在推动车对车对一切 (V2X)通讯、资讯娱乐和高级驾驶辅助系统 (ADAS) 等应用程式对 RFIC 的需求。由于汽车製造商优先考虑即时资料交换和车载连接,RFIC 对于实现可靠的 5G 导航、远端资讯处理和安全功能至关重要。此外,政府要求加强车辆通讯系统以及电动车的兴起正在创造尚未开发的机会,使车载连接成为 RFIC 製造商的高成长途径。
网路安全威胁风险
随着 RFIC 在关键基础设施、汽车系统和物联网网路中的普及,它面临着针对设备资料完整性和功能的网路攻击风险的增加。无线通讯协定或韧体中的漏洞可能会使系统遭受骇客攻击,从而导致资料外洩和业务中断。这种威胁可能会削弱消费者的信任,并需要昂贵的安全升级,减缓市场采用。遵守网路安全标准的监管压力进一步加剧了资源紧张,并给相关人员带来了复杂的挑战。
疫情扰乱了全球供应链,由于工厂关闭和材料短缺,射频积体电路(RFIC)的生产和研发活动放缓。但远距工作和远端医疗的激增增加了对强大无线基础设施的需求,部分抵消了损失。通讯和消费性电子等行业的数位化加速,推动了射频积体电路 (RFIC) 在 5G 设备和物联网解决方案中的应用。儘管最初遭遇挫折,但市场已证明具有韧性,疫情后对下一代连接技术的投资有助于推动復苏。
预计功率放大器(PA)部分在预测期内将占据最大份额。
功率放大器 (PA) 部分预计将在预测期内占据最大的市场占有率,因为它在增强 5G基地台、智慧型手机和整体无线基础设施的讯号强度方面发挥关键作用。 5G 网路向高频率的过渡需要高效的 PA 来最大限度地减少功率损耗并延长设备电池寿命。此外,毫米波技术的广泛采用以及需要高功率射频系统的国防应用进一步巩固了我们的市场领先地位。 GaN(氮化镓)和GaAs(砷化镓)材料的创新也推动了PA的进步,确保了持续的需求。
预计 30+ GHz 部分在预测期内将达到最高的复合年增长率。
受 5G 网路和卫星通讯系统中毫米波频谱部署的推动,预计 30 GHz 以上频段将在预测期内实现最高成长率。这些高频率频宽实现超快的资料传输速率和低延迟,这对于自动驾驶汽车和 AR/VR 等应用至关重要。此外,政府努力分配毫米波频谱用于商业用途并扩大太空探勘计划,正在加速其应用。儘管存在讯号衰减等挑战,但随着波束成形和天线技术的进步缓解了这些限制,该领域正在呈指数级增长。
在预测期内,预计亚太地区将占据最大的市场占有率,这得益于大规模的5G基础设施投资、中国、韩国和台湾的半导体製造地以及对家用电子电器的需求快速增长。政府大力推动智慧城市和工业自动化,增强了该地区的优势。此外,三星和华为等主要企业的存在,加上具有成本效益的生产能力,增强了我们的竞争地位。可支配收入的增加和都市化的快速发展将进一步推动成长,使亚太地区成为 RFIC 应用的关键市场。
在预测期内,由于 5G 商业化加速、车载电子领域的扩张以及对人工智慧驱动技术的投资,预计亚太地区将呈现最高的复合年增长率。由于智慧型手机普及率的提高和数位转型倡议,印度和东南亚国家等国家正成为高成长市场。此外,政府与私人公司合作开发先进的通讯基础设施和电动车生态系统也推动了对 RFIC 的需求。作为最大和成长最快的市场的双重角色凸显了亚太地区在全球 RFIC 格局中的战略重要性。
According to Stratistics MRC, the Global Radio Frequency Integrated Circuit Market is accounted for $27.9 billion in 2025 and is expected to reach $50.4 billion by 2032 growing at a CAGR of 8.8% during the forecast period. A Radio Frequency Integrated Circuit (RFIC) is a specialized semiconductor device designed to operate at radio frequencies. It integrates various RF components, such as amplifiers, mixers, and oscillators, into a single chip, enabling efficient signal processing for wireless communication systems, radar, and broadcasting applications. RFICs enhance performance, reduce power consumption, and minimize the size of wireless devices.
According to the World Semiconductor Trade Statistics (WSTS) organization, the global semiconductor market is projected to grow by 19.0% year-over-year in 2024, reaching a value of $627 billion.
Growing demand for wireless communication
The surging adoption of 5G networks, IoT devices, and smart technologies is propelling the demand for RFICs, as they are critical for enabling high-speed data transmission and connectivity. With consumers and industries increasingly reliant on wireless solutions for communication, healthcare, and industrial automation, RFICs are integral to supporting advanced applications. Additionally, the rollout of 6G research and satellite communication systems further amplifies growth opportunities, positioning wireless communication as a primary driver for market expansion. This trend underscores the need for efficient, low-latency RF components across diverse sectors.
High design and manufacturing costs
RFIC development requires specialized materials, advanced fabrication processes, and stringent quality standards, leading to elevated production costs. The complexity of integrating analog and digital components into compact designs further escalates R&D expenses. Moreover, the need for continuous innovation to meet evolving wireless standards strains budgets, particularly for smaller players. These financial barriers limit market entry for new competitors and reduce profit margins, hindering widespread adoption. Consequently, cost-sensitive industries may delay RFIC integration, creating a challenge for market scalability.
Rising demand for automotive connectivity
The automotive sector's shift toward connected and autonomous vehicles is driving demand for RFICs in applications like V2X (vehicle-to-everything) communication, infotainment, and ADAS (Advanced Driver Assistance Systems). With automakers prioritizing real-time data exchange and in-vehicle connectivity, RFICs are essential for enabling reliable 5G-enabled navigation, telematics, and safety features. Furthermore, government mandates for enhanced vehicular communication systems and the rise of electric vehicles present untapped opportunities, positioning automotive connectivity as a high-growth avenue for RFIC manufacturers.
Risk of cybersecurity threats
As RFICs become ubiquitous in critical infrastructure, automotive systems, and IoT networks, they face escalating risks of cyberattacks targeting data integrity and device functionality. Vulnerabilities in wireless protocols or firmware can expose systems to hacking, leading to data breaches or operational disruptions. This threat undermines consumer trust and necessitates costly security upgrades, potentially slowing market adoption. Regulatory pressures to comply with cybersecurity standards further strain resources, creating a complex challenge for stakeholders.
The pandemic disrupted global supply chains, delaying RFIC production and R&D activities due to factory closures and material shortages. However, the surge in remote work and telehealth amplified demand for robust wireless infrastructure, partially offsetting losses. Industries like telecommunications and consumer electronics witnessed accelerated digitization, driving RFIC adoption for 5G devices and IoT solutions. Despite initial setbacks, the market demonstrated resilience, with recovery bolstered by post-pandemic investments in next-gen connectivity technologies.
The power amplifiers (PAs) segment is expected to be the largest during the forecast period
The power amplifiers (PAs) segment is expected to account for the largest market share during the forecast period due to their critical role in enhancing signal strength across 5G base stations, smartphones, and wireless infrastructure. The transition to high-frequency bands in 5G networks necessitates efficient PAs to minimize power loss and extend device battery life. Additionally, the proliferation of mmWave technology and defense applications requiring high-power RF systems further solidifies their market leadership. Innovations in GaN (gallium nitride) and GaAs (gallium arsenide) materials are also driving PA advancements, ensuring sustained demand.
The above 30 GHz segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the above 30 GHz segment is predicted to witness the highest growth rate fueled by the deployment of mmWave spectrum in 5G networks and satellite communication systems. These high-frequency bands enable ultra-fast data transfer rates and low latency, critical for applications like autonomous vehicles and AR/VR. Moreover, government initiatives to allocate mmWave spectrum for commercial use and the expansion of space exploration projects are accelerating adoption. Despite challenges like signal attenuation, advancements in beamforming and antenna technologies are mitigating limitations, positioning this segment for exponential growth.
During the forecast period, the Asia Pacific region is expected to hold the largest market share driven by massive 5G infrastructure investments, semiconductor manufacturing hubs in China, South Korea, and Taiwan, and booming consumer electronics demand. The region's dominance is reinforced by government initiatives promoting smart cities and industrial automation. Additionally, the presence of key players like Samsung and Huawei, coupled with cost-effective production capabilities, strengthens its competitive edge. Rising disposable incomes and rapid urbanization further amplify growth, making Asia Pacific a pivotal market for RFIC adoption.
Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR owing to accelerating 5G commercialization, expanding automotive electronics sectors, and investments in AI-driven technologies. Countries like India and Southeast Asian nations are emerging as high-growth markets due to increasing smartphone penetration and digital transformation initiatives. Furthermore, partnerships between governments and private entities to develop advanced telecom infrastructure and EV ecosystems are propelling RFIC demand. This dual role as both the largest and highest-growing market underscores Asia Pacific's strategic importance in the global RFIC landscape.
Key players in the market
Some of the key players in Radio Frequency Integrated Circuit Market include Qualcomm Incorporated, Broadcom Inc., Intel Corporation, Skyworks Solutions Inc., Qorvo Inc., Analog Devices Inc., Texas Instruments, NXP Semiconductors, Infineon Technologies AG, STMicroelectronics, MediaTek Inc., Samsung Electronics, Murata Manufacturing Co., Ltd., MACOM Technology Solutions, Renesas Electronics Corporation, onsemi and Tower Semiconductor.
In March 2025, Broadcom Inc. introduced VeloSky, a converged networking solution that enables Communications Service Providers (CSPs) to offer integrated fiber, cellular, and satellite connectivity through a single appliance. VeloSky helps service providers drive adoption and utilization of their 5G and satellite offerings, unlocking new revenue streams and diversifying business models. The new VeloSky solution is built on the VeloRAIN (Robust AI Networking) architecture which features unprecedented visibility, prioritization, and automation for enterprise networks-allowing organizations to operate more efficiently and deliver superior user experiences.
In October 2024, Analog Devices, Inc. a global semiconductor leader launched a suite of developer-centric offerings that unite cross-device, cross-market hardware, software and services to help customers deliver innovations for the Intelligent Edge with enhanced speed and security. Central to this launch is CodeFusion Studio(TM), a new, comprehensive embedded software development environment based on Microsoft's Visual Studio code. This environment is ADI's first-ever fully integrated suite of software and security solutions.
In June 2024, Skyworks is pleased to introduce Si82Ax/Bx/Cx/Dx/Ex/Fx Value and Performance Isolated Gate Drivers. The entry-level Value Driver offers backward compatibility and a traditional voltage-controlled design paradigm, utilizing Skyworks' advanced, proprietary silicon isolation technology with support for 6 kVRMS for one minute isolation voltage.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.