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市场调查报告书
商品编码
1702689

2025年先进晶片封装全球市场报告

Advanced Chip Packaging Global Market Report 2025
出版日期: | 出版商: The Business Research Company | 英文 200 Pages | 商品交期: 2-10个工作天内

价格
简介目录

预计未来几年先进晶片封装的市场规模将快速成长。到 2029 年，这一数字将成长至 286.9 亿美元，复合年增长率为 18.2%。预测期内的成长可归因于 5G 技术的广泛采用、物联网 (IoT) 设备的成长、人工智慧 (AI) 和机器学习的兴起以及穿戴式技术的扩展。预测期内先进封装趋势包括 3D 封装技术的日益普及、先进的温度控管、高密度互连技术的进步、扇出晶圆层次电子构装技术的扩展以及柔性和伸缩性封装技术的发展。

家用电子电器需求的成长预计将推动先进晶片封装市场的成长。家用电子电器包括智慧型手机、平板电脑、笔记型电脑等。互联网和无线网路的扩张大大增加了对这些设备的需求。先进的晶片封装技术有助于将多种功能整合到紧凑的设计中，这对于高性能家用电子电器至关重要。这些技术提高了处理能力、效率和散热性，从而能够创造出功能丰富、紧凑的设备。例如，根据日本电子情报技术产业协会2023年5月发布的报告，消费性电子产品的产值达到2.095亿美元，与前一年同期比较成长127%。因此，家用电子电器需求的不断增长刺激了先进晶片封装市场的扩张。

先进晶片封装市场的关键参与者正专注于晶片规模封装 (CSP) 技术的开发，以提高半导体装置的性能、小型化和可靠性。 CSP技术涉及封装尺寸与半导体晶片本身大致相同的封装。 2022 年 9 月，美国LED 创新公司 Bridgelux Inc. 推出了晶片级封装 (CSP) LED，提供 1800K 至 6500K 的温度、70 至 95 的 CRI 值以及全光谱的 RGB 颜色。这款 LED 采用磷光体涂层覆晶技术，无需接合线和塑胶成型，从而改善了温度控管并提高了流明产量。 CSP2727 车型拥有业界领先的功效，350 mA 时为 209 lm/W，700 mA 时为 190 lm/W，适用于商业照明应用。 CSP LED 有利于平滑、灵活的基板组装，从而为商业、娱乐、工业和户外等各种照明应用创建客户特定的板上晶片 (COB) 模组。

目录

第一章执行摘要

第二章 市场特征

第三章 市场趋势与策略

第四章 市场 - 宏观经济情景，包括利率、感染疾病、地缘政治、新冠疫情、经济復苏对市场的影响

第五章 全球成长分析与策略分析框架

  • 全球先进晶片封装PESTEL分析（政治、社会、技术、环境、法律因素、驱动因素与限制因素）
  • 最终用途产业分析
  • 全球先进晶片封装市场：成长率分析
  • 全球先进晶片封装市场表现：规模与成长，2019-2024
  • 全球先进晶片封装市场预测：规模与成长，2024-2029 年，2034 年
  • 全球先进晶片封装总目标市场（TAM）

第六章市场区隔

  • 全球先进晶片封装市场（依封装类型、效能及预测）：2019-2024 年、2024-2029 年、2034 年
  • 球栅阵列（BGA）
  • 四方扁平封装（QFP）
  • 晶片级封装（CSP）
  • 晶圆级晶片尺寸封装 (WLCSP)
  • 全球先进晶片封装市场技术、效能及预测（2019-2024 年、2024-2029 年及 2034 年）
  • 5D包装
  • 3D（3D）包装
  • 扇出型晶圆级封装
  • 覆晶构装
  • 系统级封装解决方案
  • 全球先进晶片封装市场依终端用途产业、绩效及预测，2019-2024 年、2024-2029 年、2034 年
  • 电子产品
  • 车
  • 通讯
  • 产业
  • 卫生保健
  • 航太和国防
  • 全球先进晶片封装市场球栅阵列（BGA）细分（按类型）、绩效及预测，2019-2024 年、2024-2029 年、2034 年
  • 微型BGA
  • 带状BGA
  • 塑胶球栅阵列 (PBGA)
  • 陶瓷球栅阵列 (CBGA)
  • 全球先进晶片封装市场，以四方扁平封装 (QFP) 类型细分，效能与预测，2019-2024 年、2024-2029 年、2034 年
  • 薄型QFP（TQFP）
  • 塑胶QFP（PQFP）
  • Low profileQFP（LQFP）
  • 散热器QFP（HQFP）
  • 全球先进晶片封装市场按晶片级封装 (CSP) 类型细分，实际状况及预测，2019-2024 年、2024-2029 年、2034 年
  • 覆晶CSP
  • 晶圆级晶片尺寸封装
  • 扇入 CSP
  • 扇出型CSP
  • 全球先进晶片封装市场，按晶圆级晶片规模封装 (WLCSP) 类型细分，性能和预测，2019-2024 年、2024-2029 年、2034 年
  • 覆晶WLCSP
  • 线路重布(RDL) WLCSP
  • 扇出型WLCSP
  • 凸块WLCSP

第七章 区域和国家分析

  • 全球先进晶片封装市场：依地区、绩效及预测，2019-2024 年、2024-2029 年、2034 年
  • 全球先进晶片封装市场：依国家/地区、业绩及预测，2019-2024 年、2024-2029 年、2034 年

第八章 亚太市场

第九章：中国市场

第十章 印度市场

第十一章 日本市场

第十二章 澳洲市场

第十三章 印尼市场

第十四章 韩国市场

第十五章 西欧市场

第十六章英国市场

第十七章 德国市场

第十八章 法国市场

第十九章：义大利市场

第20章：西班牙市场

第21章 东欧市场

第22章 俄罗斯市场

第23章 北美市场

第24章美国市场

第25章：加拿大市场

第26章 南美洲市场

第27章：巴西市场

第28章 中东市场

第29章：非洲市场

第30章竞争格局与公司概况

  • 先进晶片封装市场：竞争格局
  • 先进晶片封装市场：公司简介
    • Samsung Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • Advanced Micro Devices Inc. Overview, Products and Services, Strategy and Financial Analysis
    • Advanced Semiconductor Engineering Inc Overview, Products and Services, Strategy and Financial Analysis
    • Henkel Group Overview, Products and Services, Strategy and Financial Analysis
    • Texas Instruments Incorporated Overview, Products and Services, Strategy and Financial Analysis

第31章 其他大型创新企业

  • Lam Research Corporation
  • NXP Semiconductors
  • Onsemi
  • Amkor Technology
  • Nordson Corporation
  • Siliconware Precision Industries Co. Ltd.
  • Kulicke and Soffa Industries Inc.
  • ChipMOS Technologies Inc.
  • SUSS MicroTec SE
  • EV Group
  • Indium Corporation
  • Palomar Technologies
  • Brewer Science Inc.
  • MacDermid Alpha Electronics Solutions
  • Universal Instruments Corporation

第 32 章全球市场竞争基准化分析与仪表板

第33章 重大併购

第34章近期市场趋势

第 35 章 高市场潜力国家、细分市场与策略

  • 2029年先进晶片封装市场：提供新机会的国家
  • 2029年先进晶片封装市场：细分领域带来新机会
  • 2029年先进晶片封装市场：成长策略
    • 基于市场趋势的策略
    • 竞争对手的策略

第36章 附录

简介目录
Product Code: r29341

Advanced chip packaging refers to advanced processes and technologies used to encase and connect semiconductor devices (chips) to their external environments, commonly found within electronic devices. This method offers design flexibility, allowing for the creation of tailored solutions for specific applications and performance requirements.

The main types of advanced chip packaging include ball grid array (BGA), quad flat package (QFP), chip scale package (CSP), and wafer-level chip scale package (WLCSP). A ball grid array is an integrated circuit packaging type that employs an array of solder balls on the bottom of the package to provide electrical connections to the printed circuit board. This design facilitates higher pin counts, enhanced thermal performance, and more compact designs compared to traditional pin-based packages. Technologies such as five-dimensional (5D) packaging, three-dimensional (3D) packaging, fan-out wafer-level packaging, flip-chip packaging, and system-in-package solutions are utilized in various industries, including electronics, automotive, telecommunications, industrial, healthcare, aerospace, and defense.

The advanced chip packaging market research report is one of a series of new reports from The Business Research Company that provides advanced chip packaging market statistics, including the advanced chip packaging industry global market size, regional shares, competitors with the advanced chip packaging market share, detailed advanced chip packaging market segments, market trends, and opportunities, and any further data you may need to thrive in the advanced chip packaging industry. These advanced chip packaging market research reports deliver a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.

The advanced chip packaging market size has grown rapidly in recent years. It will grow from $12.41 billion in 2024 to $14.71 billion in 2025 at a compound annual growth rate (CAGR) of 18.5%. The growth in the historic period can be attributed to the demand for smaller, more powerful consumer electronics, the rise of mobile devices and smartphones, the growth of high-speed data networks, increasing automotive electronics, and the evolution of computing needs.

The advanced chip packaging market size is expected to see rapid growth in the next few years. It will grow to $28.69 billion in 2029 at a compound annual growth rate (CAGR) of 18.2%. The growth in the forecast period can be attributed to the proliferation of 5G technology, the growth of the Internet of Things (IoT) devices, the rise of artificial intelligence (AI) and machine learning, the expansion of wearable technology. Major trends in the forecast period include the growing adoption of 3D packaging technologies, advanced thermal management, advancements in high-density interconnect technologies, expansion of fan-out wafer-level packaging technologies, and development of flexible and stretchable packaging technologies.

The rising demand for consumer electronic devices is anticipated to drive the growth of the advanced chip packaging market. Consumer electronic devices, which are designed for everyday use in private homes, include smartphones, tablets, and laptops. The expansion of internet and wireless networks has significantly increased the demand for these devices. Advanced chip packaging technologies facilitate the integration of multiple functions into compact designs, which are essential for high-performance consumer electronics. These technologies improve processing power, efficiency, and heat dissipation, enabling the creation of feature-rich, compact devices. For instance, a report published by the Japan Electronics and Information Technology Industries Association in May 2023 indicated that consumer electronics production reached $209.50 million, representing a 127% increase compared to the previous year. Consequently, the growing demand for consumer electronic devices is fueling the expansion of the advanced chip packaging market.

Major players in the advanced chip packaging market are focusing on the development of chip-scale package (CSP) technology to enhance semiconductor device performance, miniaturization, and reliability. CSP technology involves packaging where the package dimensions are nearly the same as the semiconductor chip itself. In September 2022, Bridgelux Inc., a US-based LED innovation company, introduced its Chip Scale Package (CSP) LEDs, which range from 1800K to 6500K, with CRI values from 70 to 95, and offer RGB color to full spectrum. Utilizing flip-chip technology with a phosphor coating, these LEDs eliminate the need for bond wires and plastic molds, resulting in improved heat management and increased luminous flux production. The CSP2727 model boasts an industry-leading efficacy of 209 lm/W at 350 mA and 190 lm/W at 700 mA, making it well-suited for commercial lighting applications. The CSP LEDs facilitate smooth and flexible board assembly, allowing for the creation of customer-specific Chip-on-Board (COB) modules for various lighting applications including commercial, entertainment, industrial, and outdoor settings.

In November 2022, Lam Research Corporation, a US-based semiconductor company, acquired SEMSYSCO GmbH for an undisclosed amount. This acquisition expands Lam Research's capabilities in innovative packaging solutions, particularly for advanced logic chips and chipset-based systems. The acquisition includes a state-of-the-art research and development facility located in Austria, which enhances Lam Research's expertise in next-generation substrates and heterogeneous packaging. SEMSYSCO GmbH, an Austria-based provider of wet-processing semiconductor equipment, will contribute to Lam Research's advanced chip packaging efforts.

Major companies operating in the advanced chip packaging market are Samsung Electronics Co. Ltd., Advanced Micro Devices Inc., Advanced Semiconductor Engineering Inc, Henkel Group, Texas Instruments Incorporated, Lam Research Corporation, NXP Semiconductors, Onsemi, Amkor Technology, Nordson Corporation, Siliconware Precision Industries Co. Ltd., Kulicke and Soffa Industries Inc., ChipMOS Technologies Inc., SUSS MicroTec SE, EV Group, Indium Corporation, Palomar Technologies, Brewer Science Inc., MacDermid Alpha Electronics Solutions, Universal Instruments Corporation, CHIPBOND Technology Corporation

Asia-Pacific was the largest region in the advanced chip packaging market in 2024. The regions covered in the advanced chip packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the advanced chip packaging market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The advanced chip packaging market consists of revenues earned by entities by providing services such as multi-chip modules, through-silicon vias, lead frame packages, and embedded die packaging. The market value includes the value of related goods sold by the service provider or included within the service offering. The advanced chip packaging market also includes sales of wire bonders, encapsulation equipment, die-attach equipment, and test and inspection equipment. Values in this market are 'factory gate' values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Advanced Chip Packaging Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on advanced chip packaging market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for advanced chip packaging ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The advanced chip packaging market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

  • Markets Covered:1) By Packaging: Ball Grid Array (BGA); Quad Flat Package (QFP); Chip Scale Package (CSP); Wafer-Level Chip Scale Package (WLCSP)
  • 2) By Technology: Five-Dimensional (5D) Packaging; Three-Dimensional (3D) Packaging; Fan-Out Wafer-Level Packaging; Flip-Chip Packaging; System-In-Package Solutions
  • 3) By End-Use Industry: Electronics; Automotive; Telecommunications; Industrial; Healthcare; Aerospace And Defense
  • Subsegments:
  • 1) By Ball Grid Array (BGA): Micro BGA; Tape BGA; Plastic BGA (PBGA); Ceramic BGA (CBGA)
  • 2) By Quad Flat Package (QFP): Thin QFP (TQFP); Plastic QFP (PQFP); Low-Profile QFP (LQFP); Heat Sink QFP (HQFP)
  • 3) By Chip Scale Package (CSP): Flip-Chip CSP; Wafer-Level CSP; Fan-In CSP; Fan-Out CSP
  • 4) By Wafer-Level Chip Scale Package (WLCSP): Flip-Chip WLCSP; Redistribution Layer (RDL) WLCSP; Fan-Out WLCSP; Bumped WLCSP
  • Companies Mentioned: Samsung Electronics Co. Ltd.; Advanced Micro Devices Inc.; Advanced Semiconductor Engineering Inc; Henkel Group; Texas Instruments Incorporated
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Advanced Chip Packaging Market Characteristics

3. Advanced Chip Packaging Market Trends And Strategies

4. Advanced Chip Packaging Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Covid And Recovery On The Market

5. Global Advanced Chip Packaging Growth Analysis And Strategic Analysis Framework

  • 5.1. Global Advanced Chip Packaging PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
  • 5.2. Analysis Of End Use Industries
  • 5.3. Global Advanced Chip Packaging Market Growth Rate Analysis
  • 5.4. Global Advanced Chip Packaging Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
  • 5.5. Global Advanced Chip Packaging Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
  • 5.6. Global Advanced Chip Packaging Total Addressable Market (TAM)

6. Advanced Chip Packaging Market Segmentation

  • 6.1. Global Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Ball Grid Array (BGA)
  • Quad Flat Package (QFP)
  • Chip Scale Package (CSP)
  • Wafer-Level Chip Scale Package (WLCSP)
  • 6.2. Global Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Five-Dimensional (5D) Packaging
  • Three-Dimensional (3D) Packaging
  • Fan-Out Wafer-Level Packaging
  • Flip-Chip Packaging
  • System-In-Package Solutions
  • 6.3. Global Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Electronics
  • Automotive
  • Telecommunications
  • Industrial
  • Healthcare
  • Aerospace And Defence
  • 6.4. Global Advanced Chip Packaging Market, Sub-Segmentation Of Ball Grid Array (BGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Micro BGA
  • Tape BGA
  • Plastic BGA (PBGA)
  • Ceramic BGA (CBGA)
  • 6.5. Global Advanced Chip Packaging Market, Sub-Segmentation Of Quad Flat Package (QFP), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Thin QFP (TQFP)
  • Plastic QFP (PQFP)
  • Low-Profile QFP (LQFP)
  • Heat Sink QFP (HQFP)
  • 6.6. Global Advanced Chip Packaging Market, Sub-Segmentation Of Chip Scale Package (CSP), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Flip-Chip CSP
  • Wafer-Level CSP
  • Fan-In CSP
  • Fan-Out CSP
  • 6.7. Global Advanced Chip Packaging Market, Sub-Segmentation Of Wafer-Level Chip Scale Package (WLCSP), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Flip-Chip WLCSP
  • Redistribution Layer (RDL) WLCSP
  • Fan-Out WLCSP
  • Bumped WLCSP

7. Advanced Chip Packaging Market Regional And Country Analysis

  • 7.1. Global Advanced Chip Packaging Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 7.2. Global Advanced Chip Packaging Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Advanced Chip Packaging Market

  • 8.1. Asia-Pacific Advanced Chip Packaging Market Overview
  • Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.3. Asia-Pacific Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.4. Asia-Pacific Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Advanced Chip Packaging Market

  • 9.1. China Advanced Chip Packaging Market Overview
  • 9.2. China Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.3. China Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.4. China Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Advanced Chip Packaging Market

  • 10.1. India Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.2. India Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.3. India Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Advanced Chip Packaging Market

  • 11.1. Japan Advanced Chip Packaging Market Overview
  • 11.2. Japan Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.3. Japan Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.4. Japan Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Advanced Chip Packaging Market

  • 12.1. Australia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.2. Australia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.3. Australia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Advanced Chip Packaging Market

  • 13.1. Indonesia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.2. Indonesia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.3. Indonesia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Advanced Chip Packaging Market

  • 14.1. South Korea Advanced Chip Packaging Market Overview
  • 14.2. South Korea Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.3. South Korea Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.4. South Korea Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Advanced Chip Packaging Market

  • 15.1. Western Europe Advanced Chip Packaging Market Overview
  • 15.2. Western Europe Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.3. Western Europe Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.4. Western Europe Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Advanced Chip Packaging Market

  • 16.1. UK Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.2. UK Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.3. UK Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Advanced Chip Packaging Market

  • 17.1. Germany Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.2. Germany Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.3. Germany Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Advanced Chip Packaging Market

  • 18.1. France Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.2. France Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.3. France Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Advanced Chip Packaging Market

  • 19.1. Italy Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.2. Italy Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.3. Italy Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Advanced Chip Packaging Market

  • 20.1. Spain Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.2. Spain Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.3. Spain Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Advanced Chip Packaging Market

  • 21.1. Eastern Europe Advanced Chip Packaging Market Overview
  • 21.2. Eastern Europe Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.3. Eastern Europe Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.4. Eastern Europe Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Advanced Chip Packaging Market

  • 22.1. Russia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.2. Russia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.3. Russia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Advanced Chip Packaging Market

  • 23.1. North America Advanced Chip Packaging Market Overview
  • 23.2. North America Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.3. North America Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.4. North America Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Advanced Chip Packaging Market

  • 24.1. USA Advanced Chip Packaging Market Overview
  • 24.2. USA Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.3. USA Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.4. USA Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Advanced Chip Packaging Market

  • 25.1. Canada Advanced Chip Packaging Market Overview
  • 25.2. Canada Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.3. Canada Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.4. Canada Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Advanced Chip Packaging Market

  • 26.1. South America Advanced Chip Packaging Market Overview
  • 26.2. South America Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.3. South America Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.4. South America Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Advanced Chip Packaging Market

  • 27.1. Brazil Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.2. Brazil Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.3. Brazil Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Advanced Chip Packaging Market

  • 28.1. Middle East Advanced Chip Packaging Market Overview
  • 28.2. Middle East Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.3. Middle East Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.4. Middle East Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Advanced Chip Packaging Market

  • 29.1. Africa Advanced Chip Packaging Market Overview
  • 29.2. Africa Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.3. Africa Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.4. Africa Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Advanced Chip Packaging Market Competitive Landscape And Company Profiles

  • 30.1. Advanced Chip Packaging Market Competitive Landscape
  • 30.2. Advanced Chip Packaging Market Company Profiles
    • 30.2.1. Samsung Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.2. Advanced Micro Devices Inc. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.3. Advanced Semiconductor Engineering Inc Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.4. Henkel Group Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.5. Texas Instruments Incorporated Overview, Products and Services, Strategy and Financial Analysis

31. Advanced Chip Packaging Market Other Major And Innovative Companies

  • 31.1. Lam Research Corporation
  • 31.2. NXP Semiconductors
  • 31.3. Onsemi
  • 31.4. Amkor Technology
  • 31.5. Nordson Corporation
  • 31.6. Siliconware Precision Industries Co. Ltd.
  • 31.7. Kulicke and Soffa Industries Inc.
  • 31.8. ChipMOS Technologies Inc.
  • 31.9. SUSS MicroTec SE
  • 31.10. EV Group
  • 31.11. Indium Corporation
  • 31.12. Palomar Technologies
  • 31.13. Brewer Science Inc.
  • 31.14. MacDermid Alpha Electronics Solutions
  • 31.15. Universal Instruments Corporation

32. Global Advanced Chip Packaging Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Advanced Chip Packaging Market

34. Recent Developments In The Advanced Chip Packaging Market

35. Advanced Chip Packaging Market High Potential Countries, Segments and Strategies

  • 35.1 Advanced Chip Packaging Market In 2029 - Countries Offering Most New Opportunities
  • 35.2 Advanced Chip Packaging Market In 2029 - Segments Offering Most New Opportunities
  • 35.3 Advanced Chip Packaging Market In 2029 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer