混合键合技术对于先进封装的发展至关重要

利用chiplet结合2.5D和3D先进封装技术将成为高端芯片必然的发展趋势之一，以按照摩尔定律不断提高芯片的计算性能。我确信这一点将要。 然而，现有的微凸块键合技术阻碍了高端芯片的全部性能，需要被混合键合所取代。 本报告分析了chiplet设计和先进封装技术的发展趋势，探讨了未来高端芯片发展对混合键合技术的需求和发展动力。

TRI涵盖广泛的主题，包括半导体、电信、物联网、汽车系统、人工智能、新兴技术应用以及主要区域市场（美国、欧洲、日本、韩国、中国）的最新趋势、台湾等）我们是一家一直致力于这个主题的研究公司。 成立于1996年，2015年併入集邦咨询旗下。 TRI的服务因对新兴科技行业和区域发展趋势的准确理解而受到各类组织的高度评价。

本报告提供了 TRI 对混合键合发展趋势的看法。

目录

第一章摩尔定律延续 - Chiplet 设计和先进封装技术相结合成为主流

第 2 章混合键合的重要结果

第 3 章高端 CIS 和 CPU 产品的混合键合产能预计将继续扩大：凸点键合对芯片堆迭的优势

第 4 章 TRI 的观点

The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation of computing performance for chips according to the Moore's Law. With that being said, the existing micro-bump bonding technology that could impede high-end chips from fully exerting their performance would have to be replaced by hybrid bonding. This report analyzes development trends of chiplet design and advanced packaging technology on the one hand, and probes into the necessity and development momentum of the hybrid bonding technology on future development of high-end chips on the other hand.

TABLE OF CONTENTS

1. Continuation of Moore's Law - Chiplet Designs Paired with Advanced Packaging Technology to Become Mainstream

2. Hybrid Bonding Exhibits Significant

3. Hybrid Bonding Content Expected to Climb Continuously for High-End CIS and CPU ProductsAdvantages over Bump Bonding Pertaining to Chip Stacking

4. TRI's View