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2031年亚太地区3D堆迭市场预测－依互连技术、设​​备类型和最终用户进行的区域分析
市场调查报告书
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1764902

2031年亚太地区3D堆迭市场预测－依互连技术、设​​备类型和最终用户进行的区域分析

Asia Pacific 3D Stacking Market Forecast to 2031 - Regional Analysis by Interconnecting Technology, Device Type, and End User
出版日期: | 出版商: The Insight Partners | 英文 179 Pages | 订单完成后即时交付

价格

2023 年亚太 3D 堆迭市场价值为 6.9932 亿美元，预计到 2031 年将达到 23.5245 亿美元；预计 2023 年至 2031 年的复合年增长率为 16.4%。

高频宽记忆体需求激增推动亚太3D堆迭市场发展

高频宽记忆体 (HBM) 透过垂直堆迭大量动态随机存取记忆体 (DRAM) 达到极高的密度，具有快速资料处理和低功耗的特性。它在高效能运算 (HPC) 中至关重要，例如生成式人工智慧，这需要以极快的速度处理大量资料。三星电子 12 层堆迭 HBM 采用新一代 3D 堆迭封装技术来提高效能和产量。 HBM3 的处理速度为 6.4Gbps，频宽为 819 GB/s，比上一代 DRAM 快 1.8 倍，同时功耗降低 10%。高效能运算应用对 HBM 的需求鼓励市场参与者增加产量。例如，2024 年 3 月，SK 海力士公司开始量产最新的超高性能人工智慧记忆体产品 HBM3E1。 HBM3E 专为快速处理大量资料的人工智慧系统而设计。高频宽记忆体被电信、汽车、医疗保健和製造业等各行业用于高速资料处理。

HBM 采用 3D 堆迭技术，允许使用称为硅通孔 (TSV) 的垂直通道堆迭多层晶片。这使得更多的记忆体晶片能够被封装到更小的空间内，从而最大限度地缩短了资料在记忆体和处理器之间传输的距离。 HBM 可以为使用者带来可持续的益处，从而延长电池寿命并降低能耗。这有助于用户减少在记忆体和处理器之间传输资料所需的功率。因此，高速资料处理和低功耗记忆体需求的激增预计将在预测期内为 3D 堆迭市场的成长创造丰厚的商机。

亚太地区3D堆迭市场概览

在亚太地区，中国是最大的消费性电子设备製造商。根据日经新闻报道，我国政府已投资3,270亿美元，计画于2023年扩大国内电子市场。印度政府也计划扩大其电子市场。此外，亚太地区的电子产业占亚太地区出口总额的20-50%。智慧音箱、家庭助理和智慧相机利用3D堆迭记忆体和处理器来增强效能和功能，同时保持较小的占用空间。由于亚太地区是最大的电子产品製造商，预计预测期内对3D堆迭的需求将会上升。

亚太地区 3D 堆迭市场收入及预测（2031 年）（百万美元）

亚太地区3D堆迭市场细分

亚太 3D 堆迭市场分为互连技术、设​​备类型、最终用户和国家。

根据互连技术，亚太地区3D堆迭市场细分为硅通孔技术、单晶片3D整合技术及3D混合键结技术。 2023年，硅通孔技术占据了最大的市场。

按设备类型划分，亚太地区3D堆迭市场细分为储存设备、微机电系统/感测器、LED、成像和光电子装置以及其他。储存设备领域在2023年占据了最大的市场份额。

从终端用户来看，亚太地区3D堆迭市场细分为消费性电子、电信、汽车、製造、医疗保健等。消费电子领域在2023年占据了最大的市场。

依国家划分，亚太地区 3D 堆迭市场分为印度、中国大陆、日本、韩国、台湾、澳洲和亚太其他地区。 2023 年，台湾占据了亚太地区 3D 堆迭市场份额的主导地位。

台湾半导体製造有限公司、三星电子有限公司、英特尔公司、联发科技公司、德州仪器公司、安靠科技公司、日月光科技控股有限公司、超微半导体公司、3M 公司和格芯公司是亚太地区 3D 堆迭市场的一些领先公司。

目录

第一章：简介

第二章：执行摘要

  • 关键见解
  • 市场吸引力

第三章：研究方法

  • 二次研究
  • 初步研究
    • 假设表述：
    • 宏观经济因素分析：
    • 显影基数：
    • 数据三角测量：
    • 国家级资料：

第四章：亚太地区 3D 堆迭市场格局

  • 概述
  • PEST分析
  • 生态系分析
    • 价值链中的供应商列表

第五章：亚太地区 3D 堆迭市场 - 主要市场动态

  • 3D堆迭市场－关键市场动态
  • 市场驱动因素
    • 消费性电子产品需求不断成长
    • 异质整合和组件优化的使用日益增多
  • 市场限制
    • 3D堆迭技术的复杂性
  • 市场机会
    • 高频宽记忆体需求激增
  • 未来趋势
    • 用于游戏的快速处理器
  • 驱动因素和限制因素的影响：

第六章：3D堆迭市场 - 亚太市场分析

  • 亚太地区 3D 堆迭市场概览
  • 2021-2031年亚太地区3D堆迭市场收入
  • 亚太地区3D堆迭市场预测分析

第七章：亚太地区 3D 堆迭市场分析 - 按互连技术

  • 硅通孔
  • 单晶片3D集成
  • 3D混合键合

第八章：亚太地区 3D 堆迭市场分析 - 按设备类型

  • 储存装置
  • MEMS/感测器
  • 发光二极体
  • 成像和光电子学
  • 其他的

第九章：亚太地区 3D 堆迭市场分析 - 按最终用户

  • 消费性电子产品
  • 电信
  • 汽车
  • 製造业
  • 卫生保健
  • 其他的

第十章：亚太地区 3D 堆迭市场 - 国家分析

  • 亚太地区
    • 印度
    • 中国
    • 日本
    • 韩国
    • 台湾
    • 澳洲
    • 亚太其他地区

第 11 章：竞争格局

  • 关键参与者的热图分析
  • 公司定位与集中度

第 12 章：产业格局

  • 概述
  • 市场倡议
  • 产品开发

第十三章：公司简介

  • Taiwan Semiconductor Manufacturing Co Ltd
  • Samsung Electronics Co Ltd
  • Intel Corp
  • MediaTek Inc
  • Texas Instruments Inc
  • Amkor Technology Inc
  • ASE Technology Holding Co Ltd
  • Advanced Micro Devices Inc
  • 3M Co
  • Globalfoundries Inc

第 14 章：附录

Product Code: BMIRE00031569

The Asia Pacific 3D stacking market was valued at US$ 699.32 million in 2023 and is expected to reach US$ 2,352.45 million by 2031; it is expected to record a CAGR of 16.4% from 2023 to 2031.

Surge in Demand for High-Bandwidth Memory Fuels Asia Pacific 3D Stacking Market

High-bandwidth memory (HBM), which reaches extremely high density by stacking numerous dynamic random-access memory (DRAMs) vertically, is distinguished by rapid data processing and low power consumption. It is essential in high-performance computing (HPC), such as generative AI, which requires processing enormous amounts of data at significantly fast speeds. Samsung Electronics 12-layer stacked HBM uses next-generation 3D stacking packaging technique to boost performance and yield. With a processing speed of 6.4Gbps and a bandwidth of 819 GB/s, HBM3 is 1.8 times faster than the previous-generation DRAM while using 10% less power. The demand for HBM in high-performance computing applications encourages market players to increase their production. For instance, in March 2024, SK HYNIX INC started volume production of HBM3E1, the newest AI memory product with ultra-high performance. HBM3E is designed for an AI system that processes a huge amount of data quickly. The high-bandwidth memory is used by various industries, including telecommunication, automotive, healthcare, and manufacturing, for high-speed data processing.

HBM utilizes 3D stacking technology, allowing the stacking of multiple layers of chips using vertical channels known as through-silicon vias (TSVs). This enables a greater number of memory chips to be packed into a smaller space, minimizing the distance data must travel between the memory and processor. HBM can help lengthen battery life and reduce energy consumption by offering sustainable benefits to users. This supports users in decreasing the amount of power required to transmit data between memory and processor. Therefore, the surge in demand for high-speed data processing and low-power consumption memories is expected to create lucrative opportunities for the 3D stacking market growth during the forecast period.

Asia Pacific 3D Stacking Market Overview

In Asia Pacific, China is the largest manufacturer of consumer electronic devices. According to Nikkei Inc., the Government of China expanded the country's domestic electronic market by investing US$ 327 billion till 2023. The Government of India also aims to expand the electronics market in the country. Furthermore, the electronics sector in Asia Pacific accounts for 20-50% of Asia Pacific's total value of exports. Smart speakers, home assistants, and smart cameras utilize 3D stacked memory and processors to enhance performance and features while maintaining a small footprint. As Asia Pacific is the largest electronic manufacturer, the demand for 3D stacking is expected to rise during the forecast period.

Asia Pacific 3D Stacking Market Revenue and Forecast to 2031 (US$ Million)

Asia Pacific 3D Stacking Market Segmentation

The Asia Pacific 3D stacking market is categorized into interconnecting technology, device type, end user, and country.

Based on interconnecting technology, the Asia Pacific 3D stacking market is segmented into through-silicon via, monolithic 3d integration, and 3d hybrid bonding. The through-silicon via segment held the largest market share in 2023.

By device type, the Asia Pacific 3D stacking market is segmented into memory devices, mems/sensors, LEDs, imaging & optoelectronics, and others. The memory devices segment held the largest market share in 2023.

In the terms of end user, the Asia Pacific 3D stacking market is segmented into consumer electronics, telecommunication, automotive, manufacturing, healthcare, and others. The consumer electronics segment held the largest market share in 2023.

By country, the Asia Pacific 3D stacking market is segmented into India, China, Japan, South Korea, Taiwan, Australia, and the Rest of Asia Pacific. Taiwan dominated the Asia Pacific 3D stacking market share in 2023.

Taiwan Semiconductor Manufacturing Co Ltd; Samsung Electronics Co Ltd; Intel Corp; MediaTek Inc.; Texas Instruments Inc; Amkor Technology Inc; ASE Technology Holding Co Ltd; Advanced Micro Devices Inc.; 3M Co.; and Globalfoundries Inc are some of the leading companies operating in the Asia Pacific 3D stacking market.

Table Of Contents

1. Introduction

  • 1.1 The Insight Partners Research Report Guidance
  • 1.2 Market Segmentation

2. Executive Summary

  • 2.1 Key Insights
  • 2.2 Market Attractiveness

3. Research Methodology

  • 3.1 Secondary Research
  • 3.2 Primary Research
    • 3.2.1 Hypothesis formulation:
    • 3.2.2 Macro-economic factor analysis:
    • 3.2.3 Developing base number:
    • 3.2.4 Data Triangulation:
    • 3.2.5 Country level data:

4. Asia Pacific 3D Stacking Market Landscape

  • 4.1 Overview
  • 4.2 PEST Analysis
  • 4.3 Ecosystem Analysis
    • 4.3.1 List of Vendors in the Value Chain

5. Asia Pacific 3D Stacking Market - Key Market Dynamics

  • 5.1 3D Stacking Market - Key Market Dynamics
  • 5.2 Market Drivers
    • 5.2.1 Rising Demand for Consumer Electronics
    • 5.2.2 Increasing Use of Heterogeneous Integration and Component Optimization
  • 5.3 Market Restraints
    • 5.3.1 Complexity Associated with 3D Stacking Technology
  • 5.4 Market Opportunities
    • 5.4.1 Surge in Demand for High-Bandwidth Memory
  • 5.5 Future Trends
    • 5.5.1 Fast Processors for Gaming Purposes
  • 5.6 Impact of Drivers and Restraints:

6. 3D Stacking Market - Asia Pacific Market Analysis

  • 6.1 Asia Pacific 3D Stacking Market Overview-
  • 6.2 Asia Pacific 3D Stacking Market Revenue (US$ Million), 2021-2031
  • 6.3 Asia Pacific 3D Stacking Market Forecast Analysis

7. Asia Pacific 3D Stacking Market Analysis - by Interconnecting Technology

  • 7.1 Through-Silicon Via
    • 7.1.1 Overview
    • 7.1.2 Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 7.2 Monolithic 3D Integration
    • 7.2.1 Overview
    • 7.2.2 Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 7.3 3D Hybrid Bonding
    • 7.3.1 Overview
    • 7.3.2 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

8. Asia Pacific 3D Stacking Market Analysis - by Device Type

  • 8.1 Memory Devices
    • 8.1.1 Overview
    • 8.1.2 Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.2 MEMS/Sensors
    • 8.2.1 Overview
    • 8.2.2 MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.3 LEDs
    • 8.3.1 Overview
    • 8.3.2 LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.4 Imaging and Optoelectronics
    • 8.4.1 Overview
    • 8.4.2 Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.5 Others
    • 8.5.1 Overview
    • 8.5.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

9. Asia Pacific 3D Stacking Market Analysis - by End User

  • 9.1 Consumer Electronics
    • 9.1.1 Overview
    • 9.1.2 Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.2 Telecommunication
    • 9.2.1 Overview
    • 9.2.2 Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.3 Automotive
    • 9.3.1 Overview
    • 9.3.2 Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.4 Manufacturing
    • 9.4.1 Overview
    • 9.4.2 Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.5 Healthcare
    • 9.5.1 Overview
    • 9.5.2 Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.6 Others
    • 9.6.1 Overview
    • 9.6.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

10. Asia Pacific 3D Stacking Market -Country Analysis

  • 10.1 Asia Pacific
    • 10.1.1 Asia Pacific 3D Stacking Market, by Key Countries - Revenue (2023) (US$ Million)
    • 10.1.2 Asia Pacific 3D Stacking Market - Revenue and Forecast Analysis - by Country
      • 10.1.2.1 Asia Pacific: 3D Stacking Market - Revenue and Forecast Analysis - by Country
      • 10.1.2.2 India: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.2.1 India: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.2.2 India: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.2.3 India: 3D Stacking Market Breakdown, by End User
      • 10.1.2.3 China: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.3.1 China: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.3.2 China: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.3.3 China: 3D Stacking Market Breakdown, by End User
      • 10.1.2.4 Japan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.4.1 Japan: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.4.2 Japan: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.4.3 Japan: 3D Stacking Market Breakdown, by End User
      • 10.1.2.5 South Korea: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.5.1 South Korea: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.5.2 South Korea: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.5.3 South Korea: 3D Stacking Market Breakdown, by End User
      • 10.1.2.6 Taiwan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.6.1 Taiwan: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.6.2 Taiwan: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.6.3 Taiwan: 3D Stacking Market Breakdown, by End User
      • 10.1.2.7 Australia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.7.1 Australia: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.7.2 Australia: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.7.3 Australia: 3D Stacking Market Breakdown, by End User
      • 10.1.2.8 Rest of Asia Pacific: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.8.1 Rest of Asia Pacific: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.8.2 Rest of Asia Pacific: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.8.3 Rest of Asia Pacific: 3D Stacking Market Breakdown, by End User

11. Competitive Landscape

  • 11.1 Heat Map Analysis by Key Players
  • 11.2 Company Positioning & Concentration

12. Industry Landscape

  • 12.1 Overview
  • 12.2 Market Initiative
  • 12.3 Product Development

13. Company Profiles

  • 13.1 Taiwan Semiconductor Manufacturing Co Ltd
    • 13.1.1 Key Facts
    • 13.1.2 Business Description
    • 13.1.3 Products and Services
    • 13.1.4 Financial Overview
    • 13.1.5 SWOT Analysis
    • 13.1.6 Key Developments
  • 13.2 Samsung Electronics Co Ltd
    • 13.2.1 Key Facts
    • 13.2.2 Business Description
    • 13.2.3 Products and Services
    • 13.2.4 Financial Overview
    • 13.2.5 SWOT Analysis
    • 13.2.6 Key Developments
  • 13.3 Intel Corp
    • 13.3.1 Key Facts
    • 13.3.2 Business Description
    • 13.3.3 Products and Services
    • 13.3.4 Financial Overview
    • 13.3.5 SWOT Analysis
    • 13.3.6 Key Developments
  • 13.4 MediaTek Inc
    • 13.4.1 Key Facts
    • 13.4.2 Business Description
    • 13.4.3 Products and Services
    • 13.4.4 Financial Overview
    • 13.4.5 SWOT Analysis
    • 13.4.6 Key Developments
  • 13.5 Texas Instruments Inc
    • 13.5.1 Key Facts
    • 13.5.2 Business Description
    • 13.5.3 Products and Services
    • 13.5.4 Financial Overview
    • 13.5.5 SWOT Analysis
    • 13.5.6 Key Developments
  • 13.6 Amkor Technology Inc
    • 13.6.1 Key Facts
    • 13.6.2 Business Description
    • 13.6.3 Products and Services
    • 13.6.4 Financial Overview
    • 13.6.5 SWOT Analysis
    • 13.6.6 Key Developments
  • 13.7 ASE Technology Holding Co Ltd
    • 13.7.1 Key Facts
    • 13.7.2 Business Description
    • 13.7.3 Products and Services
    • 13.7.4 Financial Overview
    • 13.7.5 SWOT Analysis
    • 13.7.6 Key Developments
  • 13.8 Advanced Micro Devices Inc
    • 13.8.1 Key Facts
    • 13.8.2 Business Description
    • 13.8.3 Products and Services
    • 13.8.4 Financial Overview
    • 13.8.5 SWOT Analysis
    • 13.8.6 Key Developments
  • 13.9 3M Co
    • 13.9.1 Key Facts
    • 13.9.2 Business Description
    • 13.9.3 Products and Services
    • 13.9.4 Financial Overview
    • 13.9.5 SWOT Analysis
    • 13.9.6 Key Developments
  • 13.10 Globalfoundries Inc
    • 13.10.1 Key Facts
    • 13.10.2 Business Description
    • 13.10.3 Products and Services
    • 13.10.4 Financial Overview
    • 13.10.5 SWOT Analysis
    • 13.10.6 Key Developments

14. Appendix

  • 14.1 About The Insight Partners
  • 14.2 Word Index

List Of Tables

  • Table 1. 3D Stacking Market Segmentation
  • Table 2. List of Vendors
  • Table 3. Asia Pacific 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Table 4. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 5. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 6. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 7. Asia Pacific: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Country
  • Table 8. India: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 9. India: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 10. India: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 11. China: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 12. China: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 13. China: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 14. Japan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 15. Japan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 16. Japan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 17. South Korea: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 18. South Korea: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 19. South Korea: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 20. Taiwan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 21. Taiwan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 22. Taiwan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 23. Australia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 24. Australia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 25. Australia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 26. Rest of Asia Pacific: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 27. Rest of Asia Pacific: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 28. Rest of Asia Pacific: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 29. List of Abbreviation

List Of Figures

  • Figure 1. 3D Stacking Market Segmentation, by Country
  • Figure 2. PEST Analysis
  • Figure 3. Impact Analysis of Drivers and Restraints
  • Figure 4. Asia Pacific 3D Stacking Market Revenue (US$ Million), 2021-2031
  • Figure 5. 3D Stacking Market Share (%) - by Interconnecting Technology (2023 and 2031)
  • Figure 6. Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 7. Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 8. 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 9. 3D Stacking Market Share (%) - by Device Type (2023 and 2031)
  • Figure 10. Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 11. MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 12. LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 13. Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 14. Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 15. 3D Stacking Market Share (%) - by End User (2023 and 2031)
  • Figure 16. Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 17. Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 18. Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 19. Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 20. Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 21. Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 22. Asia Pacific 3D Stacking Market, by Key Countries - Revenue (2023) (US$ Million)
  • Figure 23. Asia Pacific 3D Stacking Market Breakdown, by Key Countries, 2023 and 2031 (%)
  • Figure 24. India: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 25. China: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 26. Japan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 27. South Korea: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 28. Taiwan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 29. Australia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 30. Rest of Asia Pacific: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 31. Heat Map Analysis by Key Players
  • Figure 32. Company Positioning & Concentration