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2031 年北美 3D 堆迭市场预测 - 按互连技术、设​​备类型和最终用户进行的区域分析
市场调查报告书
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1764901

2031 年北美 3D 堆迭市场预测 - 按互连技术、设​​备类型和最终用户进行的区域分析

North America 3D Stacking Market Forecast to 2031 - Regional Analysis by Interconnecting Technology, Device Type, and End User
出版日期: | 出版商: The Insight Partners | 英文 110 Pages | 订单完成后即时交付

价格

2023 年北美 3D 堆迭市场价值为 5.3848 亿美元，预计到 2031 年将达到 19.0441 亿美元；预计 2023 年至 2031 年复合年增长率将达到 17.1%。

消费性电子产品需求成长推动北美3D堆迭市场

随着智慧型手机、平板电脑、智慧型手錶和便携式设备等外观时尚、功能丰富且节能的电子产品需求日益增长，製造商面临着提供紧凑型高性能解决方案的巨大压力。例如，据估计，2023年第四季智慧型手机的初步出货量为3.28亿部，较2022年第四季成长8.6%，成为自2021年第二季以来首次大幅成长的季度。全球消费者正广泛使用智慧型手机进行购物、通讯、娱乐和其他用途。这些设备采用3D堆迭晶片封装，这正在彻底改变其设计和功能。 3D堆迭晶片封装能够在不影响效能的情况下显着缩小尺寸。透过垂直堆迭多层积体电路，该技术能够在紧凑的空间内平滑整合各种组件。这种整合不仅简化了设计和组装流程，还使製造商能够打造更轻薄、更美观的设备，以满足消费者不断变化的偏好。

透过 3D 堆迭晶片封装实现的增强性能在满足现代消费性电子产品日益增长的性能需求方面发挥着重要作用。从智慧型手机的高级影像处理到智慧型手錶的即时资料分析，对高效且强大的半导体解决方案的需求至关重要。透过利用 3D 堆迭技术，製造商可以以垂直互连的方式整合记忆体、逻辑和感测器组件，从而在保持紧凑外形的同时增强处理能力。因此，对采用 3D 堆迭技术的消费性电子产品的需求不断增长，正在推动北美 3D 堆迭市场规模的不断增长。

北美3D堆迭市场概览

消费性电子产业的蓬勃发展是北美 3D 堆迭市场的重要驱动力。随着消费者追求更小巧、更便携的电子设备，对记忆体等紧凑高效电源的需求也显着增长。此外，物联网和智慧型装置的普及是推动北美 3D 堆迭市场发展的另一个关键因素。物联网设备（包括穿戴式装置、感测器和连网装置）依赖小巧可靠的电源。智慧手錶、健身追踪器和其他穿戴式装置受益于 3D 堆迭技术，因为它将感测器、处理器和记忆体等多种功能整合在一个紧凑的外形中。 3D 堆迭组件降低的功耗延长了穿戴式装置的电池寿命。

物联网设备在医疗保健和汽车等各行各业的日益普及，为3D堆迭供应商创造了巨大的机会。此外，北美对MEMS和感测器需求的成长也为从事晶片、晶圆和倒装晶片键合机製造的市场领导者创造了机会，从而推动了3D堆迭的需求。汽车和电子设备使用率的提高刺激了对MEMS感测器的需求，预计这将在预测期内推动北美3D堆迭市场的发展。

北美 3D 堆迭市场收入及预测（至 2031 年）（百万美元）

北美3D堆迭市场细分

北美 3D 堆迭市场分为互连技术、设​​备类型、最终用户和国家。

根据互连技术，北美3D堆迭市场细分为硅通孔互连、单晶片3D整合和3D混合键结。硅通孔互连在2023年占据了最大的市场。

按设备类型划分，北美3D堆迭市场细分为储存设备、微机电系统/感测器、LED、成像和光电子装置以及其他。储存设备领域在2023年占据了最大的市场份额。

从终端用户来看，北美3D堆迭市场细分为消费性电子、电信、汽车、製造、医疗保健等。消费性电子领域在2023年占据了最大的市场。

按国家/地区划分，北美 3D 堆迭市场分为美国、加拿大和墨西哥。 2023 年，美国占据了北美 3D 堆迭市场份额的主导地位。

台湾半导体製造有限公司、三星电子有限公司、英特尔公司、联发科技公司、德州仪器公司、安靠科技公司、日月光科技控股有限公司、超微半导体公司、3M 公司和格芯公司是北美 3D 堆迭市场的一些领先公司。

目录

第一章：简介

第二章：执行摘要

  • 关键见解
  • 市场吸引力

第三章：研究方法

  • 二次研究
  • 初步研究
    • 假设表述：
    • 宏观经济因素分析：
    • 显影基数：
    • 数据三角测量：
    • 国家级资料：

第四章：北美 3D 堆迭市场格局

  • 概述
  • PEST分析
  • 生态系分析
    • 价值链中的供应商列表

第五章：北美 3D 堆迭市场 - 主要市场动态

  • 3D堆迭市场－关键市场动态
  • 市场驱动因素
    • 消费性电子产品需求不断成长
    • 异质整合和组件优化的使用日益增多
  • 市场限制
    • 3D堆迭技术的复杂性
  • 市场机会
    • 高频宽记忆体需求激增
  • 未来趋势
    • 用于游戏的快速处理器
  • 驱动因素和限制因素的影响：

第六章：3D堆迭市场-北美市场分析

  • 北美3D堆迭市场概况-
  • 2021-2031年北美3D堆迭市场收入
  • 北美3D堆迭市场预测分析

第七章：北美3D堆迭市场分析-按互连技术

  • 硅通孔
  • 单晶片3D集成
  • 3D混合键合

第八章：北美 3D 堆迭市场分析 - 按设备类型

  • 储存装置
  • MEMS/感测器
  • 发光二极体
  • 成像与光电子学
  • 其他的

第九章：北美 3D 堆迭市场分析 - 按最终用户

  • 消费性电子产品
  • 电信
  • 汽车
  • 製造业
  • 卫生保健
  • 其他的

第十章：北美 3D 堆迭市场 - 国家分析

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥

第 11 章：竞争格局

  • 关键参与者的热图分析
  • 公司定位与集中度

第 12 章：产业格局

  • 概述
  • 市场倡议
  • 产品开发

第十三章：公司简介

  • Taiwan Semiconductor Manufacturing Co Ltd
  • Samsung Electronics Co Ltd
  • Intel Corp
  • MediaTek Inc
  • Texas Instruments Inc
  • Amkor Technology Inc
  • ASE Technology Holding Co Ltd
  • Advanced Micro Devices Inc
  • 3M Co
  • Globalfoundries Inc

第 14 章：附录

Product Code: BMIRE00031567

The North America 3D stacking market was valued at US$ 538.48 million in 2023 and is expected to reach US$ 1,904.41 million by 2031; it is anticipated to reach a CAGR of 17.1% from 2023 to 2031.

Rising Demand for Consumer Electronics Fuels North America 3D Stacking Market

The proliferating demand for sleek, feature-rich, and power-efficient gadgets such as smartphones, tablets, smartwatches, and portable devices has led to immense pressure on manufacturers to deliver compact, high-performance solutions. For instance, according to estimates, the preliminary shipment of smartphones was 328 million units in the fourth quarter of 2023. This represents 8.6% gain over 4Q22, establishing 4Q23 as the first quarter to show major growth since 2Q21. Consumers across the globe are highly adopting smartphones for shopping, communication, entertainment, and other purposes. These devices use 3D stacked die packaging, which is revolutionizing their designs and functionality. 3D stacked die packaging is capable of significantly reducing form factors without compromising performance. By vertically stacking multiple layers of integrated circuits, this technology allows for the smooth integration of diverse components within a compact space. This consolidation not only streamlines the design and assembly processes but also enables manufacturers to create thin, more aesthetically appealing devices that align with the evolving preferences of consumers.

The enhanced performance achieved through 3D stacked die packaging plays a major role in meeting the escalating performance demands of modern consumer electronics. From advanced image processing in smartphones to real-time data analysis in smartwatches, the need for efficient and powerful semiconductor solutions is paramount. By leveraging 3D stacking technology, manufacturers can integrate memory, logic, and sensor components in a vertically interconnected manner, thereby enhancing processing capabilities while maintaining a compact form factor. Thus, the rising demand for consumer electronics that utilize 3D stacking technology is contributing to the growing North America 3D stacking market size.

North America 3D Stacking Market Overview

The rising consumer electronics industry is a significant driver for the 3D stacking market in North America. As consumers seek smaller and more portable electronic devices, the need for compact and efficient power sources, such as memories, has significantly grown. Furthermore, the proliferation of IoT and smart devices is another crucial factor propelling the 3D stacking market in North America. IoT devices, including wearables, sensors, and connected devices, rely on small and reliable power sources. Smartwatches, fitness trackers, and other wearables benefit from 3D stacking by integrating multiple functionalities in a compact form factor, including sensors, processors, and memory. The reduced power consumption from 3D stacked components extends the battery life of wearable devices.

The increasing adoption of IoT devices across various industries, such as healthcare and automotive, creates immense opportunities for 3D stacking providers. Moreover, the rise in demand for MEMS and sensors in North America has also created opportunities for market leaders engaged in the manufacturing of die, wafer, and flip-chip bonders, which boosts the requirement for 3D stacking. The rising utilization of vehicles and electronic devices fuels the demand for MEMS sensors, which is expected to fuel the 3D stacking market in North America during the forecast period.

North America 3D Stacking Market Revenue and Forecast to 2031 (US$ Million)

North America 3D Stacking Market Segmentation

The North America 3D stacking market is categorized into interconnecting technology, device type, end user, and country.

Based on interconnecting technology, the North America 3D stacking market is segmented into through-silicon via, monolithic 3D integration, and 3D hybrid bonding. The through-silicon via segment held the largest market share in 2023.

By device type, the North America 3D stacking market is segmented into memory devices, mems/sensors, LEDs, imaging & optoelectronics, and others. The memory devices segment held the largest market share in 2023.

In the terms of end user, the North America 3D stacking market is segmented into consumer electronics, telecommunication, automotive, manufacturing, healthcare, and others. The consumer electronics segment held the largest market share in 2023.

By country, the North America 3D stacking market is segmented into the US, Canada, and Mexico. The US dominated the North America 3D stacking market share in 2023.

Taiwan Semiconductor Manufacturing Co Ltd; Samsung Electronics Co Ltd; Intel Corp; MediaTek Inc.; Texas Instruments Inc; Amkor Technology Inc; ASE Technology Holding Co Ltd; Advanced Micro Devices Inc.; 3M Co.; and Globalfoundries Inc are some of the leading companies operating in the North America 3D stacking market.

Table Of Contents

1. Introduction

  • 1.1 The Insight Partners Research Report Guidance
  • 1.2 Market Segmentation

2. Executive Summary

  • 2.1 Key Insights
  • 2.2 Market Attractiveness

3. Research Methodology

  • 3.1 Secondary Research
  • 3.2 Primary Research
    • 3.2.1 Hypothesis formulation:
    • 3.2.2 Macro-economic factor analysis:
    • 3.2.3 Developing base number:
    • 3.2.4 Data Triangulation:
    • 3.2.5 Country level data:

4. North America 3D Stacking Market Landscape

  • 4.1 Overview
  • 4.2 PEST Analysis
  • 4.3 Ecosystem Analysis
    • 4.3.1 List of Vendors in the Value Chain

5. North America 3D Stacking Market - Key Market Dynamics

  • 5.1 3D Stacking Market - Key Market Dynamics
  • 5.2 Market Drivers
    • 5.2.1 Rising Demand for Consumer Electronics
    • 5.2.2 Increasing Use of Heterogeneous Integration and Component Optimization
  • 5.3 Market Restraints
    • 5.3.1 Complexity Associated with 3D Stacking Technology
  • 5.4 Market Opportunities
    • 5.4.1 Surge in Demand for High-Bandwidth Memory
  • 5.5 Future Trends
    • 5.5.1 Fast Processors for Gaming Purposes
  • 5.6 Impact of Drivers and Restraints:

6. 3D Stacking Market -North America Market Analysis

  • 6.1 North America 3D Stacking Market Overview-
  • 6.2 North America 3D Stacking Market Revenue (US$ Million), 2021-2031
  • 6.3 North America 3D Stacking Market Forecast Analysis

7. North America 3D Stacking Market Analysis - by Interconnecting Technology

  • 7.1 Through-Silicon Via
    • 7.1.1 Overview
    • 7.1.2 Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 7.2 Monolithic 3D Integration
    • 7.2.1 Overview
    • 7.2.2 Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 7.3 3D Hybrid Bonding
    • 7.3.1 Overview
    • 7.3.2 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

8. North America 3D Stacking Market Analysis - by Device Type

  • 8.1 Memory Devices
    • 8.1.1 Overview
    • 8.1.2 Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.2 MEMS/Sensors
    • 8.2.1 Overview
    • 8.2.2 MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.3 LEDs
    • 8.3.1 Overview
    • 8.3.2 LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.4 Imaging and Optoelectronics
    • 8.4.1 Overview
    • 8.4.2 Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.5 Others
    • 8.5.1 Overview
    • 8.5.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

9. North America 3D Stacking Market Analysis - by End User

  • 9.1 Consumer Electronics
    • 9.1.1 Overview
    • 9.1.2 Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.2 Telecommunication
    • 9.2.1 Overview
    • 9.2.2 Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.3 Automotive
    • 9.3.1 Overview
    • 9.3.2 Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.4 Manufacturing
    • 9.4.1 Overview
    • 9.4.2 Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.5 Healthcare
    • 9.5.1 Overview
    • 9.5.2 Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.6 Others
    • 9.6.1 Overview
    • 9.6.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

10. North America 3D Stacking Market -Country Analysis

  • 10.1 North America
    • 10.1.1 North America 3D Stacking Market, by Key Country- Revenue (2023) (US$ Million)
    • 10.1.2 North America 3D Stacking Market - Revenue and Forecast Analysis - by Country
      • 10.1.2.1 North America 3D Stacking Market - Revenue and Forecast Analysis - by Country
      • 10.1.2.2 United States: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.2.1 United States: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.2.2 United States: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.2.3 United States: 3D Stacking Market Breakdown, by End User
      • 10.1.2.3 Canada: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.3.1 Canada: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.3.2 Canada: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.3.3 Canada: 3D Stacking Market Breakdown, by End User
      • 10.1.2.4 Mexico: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.4.1 Mexico: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.4.2 Mexico: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.4.3 Mexico: 3D Stacking Market Breakdown, by End User

11. Competitive Landscape

  • 11.1 Heat Map Analysis by Key Players
  • 11.2 Company Positioning & Concentration

12. Industry Landscape

  • 12.1 Overview
  • 12.2 Market Initiative
  • 12.3 Product Development

13. Company Profiles

  • 13.1 Taiwan Semiconductor Manufacturing Co Ltd
    • 13.1.1 Key Facts
    • 13.1.2 Business Description
    • 13.1.3 Products and Services
    • 13.1.4 Financial Overview
    • 13.1.5 SWOT Analysis
    • 13.1.6 Key Developments
  • 13.2 Samsung Electronics Co Ltd
    • 13.2.1 Key Facts
    • 13.2.2 Business Description
    • 13.2.3 Products and Services
    • 13.2.4 Financial Overview
    • 13.2.5 SWOT Analysis
    • 13.2.6 Key Developments
  • 13.3 Intel Corp
    • 13.3.1 Key Facts
    • 13.3.2 Business Description
    • 13.3.3 Products and Services
    • 13.3.4 Financial Overview
    • 13.3.5 SWOT Analysis
    • 13.3.6 Key Developments
  • 13.4 MediaTek Inc
    • 13.4.1 Key Facts
    • 13.4.2 Business Description
    • 13.4.3 Products and Services
    • 13.4.4 Financial Overview
    • 13.4.5 SWOT Analysis
    • 13.4.6 Key Developments
  • 13.5 Texas Instruments Inc
    • 13.5.1 Key Facts
    • 13.5.2 Business Description
    • 13.5.3 Products and Services
    • 13.5.4 Financial Overview
    • 13.5.5 SWOT Analysis
    • 13.5.6 Key Developments
  • 13.6 Amkor Technology Inc
    • 13.6.1 Key Facts
    • 13.6.2 Business Description
    • 13.6.3 Products and Services
    • 13.6.4 Financial Overview
    • 13.6.5 SWOT Analysis
    • 13.6.6 Key Developments
  • 13.7 ASE Technology Holding Co Ltd
    • 13.7.1 Key Facts
    • 13.7.2 Business Description
    • 13.7.3 Products and Services
    • 13.7.4 Financial Overview
    • 13.7.5 SWOT Analysis
    • 13.7.6 Key Developments
  • 13.8 Advanced Micro Devices Inc
    • 13.8.1 Key Facts
    • 13.8.2 Business Description
    • 13.8.3 Products and Services
    • 13.8.4 Financial Overview
    • 13.8.5 SWOT Analysis
    • 13.8.6 Key Developments
  • 13.9 3M Co
    • 13.9.1 Key Facts
    • 13.9.2 Business Description
    • 13.9.3 Products and Services
    • 13.9.4 Financial Overview
    • 13.9.5 SWOT Analysis
    • 13.9.6 Key Developments
  • 13.10 Globalfoundries Inc
    • 13.10.1 Key Facts
    • 13.10.2 Business Description
    • 13.10.3 Products and Services
    • 13.10.4 Financial Overview
    • 13.10.5 SWOT Analysis
    • 13.10.6 Key Developments

14. Appendix

  • 14.1 About The Insight Partners
  • 14.2 Word Index

List Of Tables

  • Table 1. 3D Stacking Market Segmentation
  • Table 2. List of Vendors
  • Table 3. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Table 4. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 5. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 6. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 7. North America 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Country
  • Table 8. United States: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 9. United States: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 10. United States: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 11. Canada: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 12. Canada: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 13. Canada: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 14. Mexico: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 15. Mexico: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 16. Mexico: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 17. List of Abbreviation

List Of Figures

  • Figure 1. 3D Stacking Market Segmentation, by Country
  • Figure 2. PEST Analysis
  • Figure 3. Impact Analysis of Drivers and Restraints
  • Figure 4. 3D Stacking Market Revenue (US$ Million), 2021-2031
  • Figure 5. 3D Stacking Market Share (%) - by Interconnecting Technology (2023 and 2031)
  • Figure 6. Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 7. Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 8. 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 9. 3D Stacking Market Share (%) - by Device Type (2023 and 2031)
  • Figure 10. Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 11. MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 12. LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 13. Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 14. Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 15. 3D Stacking Market Share (%) - by End User (2023 and 2031)
  • Figure 16. Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 17. Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 18. Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 19. Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 20. Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 21. Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 22. North America: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 23. North America: 3D Stacking Market Breakdown, by Key Countries, 2023 and 2031 (%)
  • Figure 24. United States: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 25. Canada: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 26. Mexico: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 27. Heat Map Analysis by Key Players
  • Figure 28. Company Positioning & Concentration