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2031 年欧洲 3D 堆迭市场预测 - 按互连技术、设​​备类型和最终用户进行的区域分析
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1764908

2031 年欧洲 3D 堆迭市场预测 - 按互连技术、设​​备类型和最终用户进行的区域分析

Europe 3D Stacking Market Forecast to 2031 - Regional Analysis by Interconnecting Technology, Device Type, and End User
出版日期: | 出版商: The Insight Partners | 英文 179 Pages | 订单完成后即时交付

价格

2023 年欧洲 3D 堆迭市场价值为 3.9861 亿美元，预计到 2031 年将达到 12.577 亿美元；预计 2023 年至 2031 年的复合年增长率为 15.4%。

异质整合和组件优化的日益普及推动了欧洲 3D 堆迭市场的发展

异质整合和组件优化在改进电子元件製造流程方面的应用日益广泛，这是推动 3D 堆迭市场发展的主要因素。这种方法允许将晶片堆迭在基板上，从而在更小、更节能的封装中创建晶片。 3D 堆迭技术允许使用各种方法和晶圆类型来创建电路层，从而实现异质整合。与单晶圆生产相比，这种巨大的灵活性使製造商能够显着优化单个组件。这支援製造商设计出满足特定要求的电子元件，并实现精确度和客製化，这在以前是无法实现的。异质整合和组件最佳化涉及将多种技术整合到一个复合设备中，其中可能包括晶片和封装的堆迭；使用多种半导体材料；以及采用各种电气布线技术，例如球栅阵列、硅通孔 (TSV)、中介层和引线键合。

欧洲3D堆迭市场概览

晶片对于各种科技和数位产品至关重要，例如家用电器、智慧汽车和消费性电子产品。 《欧盟晶片法案》旨在增强欧洲半导体生态系统。该法案旨在促进欧洲半导体产业与亚太地区和北美公司之间的竞争。该地区的半导体产业需要提升规模并增强创新能力，才能获得竞争优势。此外，该地区各国政府正在投资半导体研发。例如，2024年2月，半导体联合计画（Chips JU）宣布启动2.16亿美元的计画征集，以支持半导体领域的创新和研究计画。 3D堆迭技术广泛应用于半导体和记忆体製造。 3D混合键结代表了半导体技术的重大进步，在电气性能、机械强度、设计灵活性和空间效率方面具有显着优势。欧洲的电子设备（包括笔记型电脑、智慧型手机和其他穿戴式装置）正在快速普及。欧洲大多数人口拥有并使用这些设备。随着人们越来越依赖科技来完成多项任务，对智慧型手机和笔记型电脑的需求也持续成长。笔记型电脑主要用于存取互联网、参与线上活动以及执行日常任务。欧洲众多市场参与者正在增加这些设备的产量。宏碁于2023年1月推出了搭载第13代英特尔酷睿处理器的新款Acer Aspire 5笔记型电脑。该处理器与NVIDIA GeForce RTX 2050显示卡搭配使用，可提高影片编辑等任务或其他可从额外GPU效能中受益的任务的效率。 2022年2月，诺基亚在欧洲推出了G11和G21智慧型手机。 3D堆迭记忆体用于满足现代行动装置的高容量和效能要求。智慧手錶、健身追踪器和其他穿戴式装置受益于3D堆迭技术，因为它将多种功能整合在一个紧凑的外形中，包括感测器、处理器和记忆体。因此，随着电子产业的蓬勃发展，该地区对3D堆迭的需求正在增长。

欧洲 3D 堆迭市场收入及预测（至 2031 年）（百万美元）

欧洲3D堆迭市场细分

欧洲 3D 堆迭市场分为互连技术、设​​备类型、最终用户和国家。

根据互连技术，欧洲3D堆迭市场细分为硅通孔互连、单晶片3D整合和3D混合键结。硅通孔互连在2023年占据了最大的市场。

按设备类型划分，欧洲3D堆迭市场细分为储存设备、微机电系统/感测器、LED、成像和光电子装置以及其他。储存设备领域在2023年占据了最大的市场份额。

从终端用户来看，欧洲3D堆迭市场细分为消费性电子、电信、汽车、製造、医疗保健等。消费性电子领域在2023年占据了最大的市场。

按国家/地区划分，欧洲 3D 堆迭市场分为英国、德国、法国、义大利、俄罗斯和欧洲其他地区。 2023 年，德国占据了欧洲 3D 堆迭市场份额的主导地位。

台湾半导体製造有限公司、三星电子有限公司、英特尔公司、联发科技公司、德州仪器公司、安靠科技公司、日月光科技控股有限公司、超微半导体公司、3M 公司和格芯公司是欧洲 3D 堆迭市场的一些领先公司。

目录

第一章：简介

第二章：执行摘要

  • 关键见解
  • 市场吸引力

第三章：研究方法

  • 二次研究
  • 初步研究
    • 假设表述：
    • 宏观经济因素分析：
    • 显影基数：
    • 数据三角测量：
    • 国家级资料：

第四章：3D堆迭市场格局

  • 概述
  • PEST分析
  • 生态系分析
    • 价值链中的供应商列表

第五章：欧洲 3D 堆迭市场 - 主要市场动态

  • 3D堆迭市场－关键市场动态
  • 市场驱动因素
    • 消费性电子产品需求不断成长
    • 异质整合和组件优化的使用日益增多
  • 市场限制
    • 3D堆迭技术的复杂性
  • 市场机会
    • 高频宽记忆体需求激增
  • 未来趋势
    • 用于游戏的快速处理器
  • 驱动因素和限制因素的影响：

第六章：3D堆迭市场 - 欧洲分析

  • 欧洲3D堆迭市场概览-
  • 2021-2031年欧洲3D堆迭市场收入
  • 欧洲3D堆迭市场预测分析

第七章：欧洲3D堆迭市场分析-按互连技术

  • 硅通孔
  • 单晶片3D集成
  • 3D混合键合

第八章：欧洲 3D 堆迭市场分析 - 按设备类型

  • 储存装置
  • MEMS/感测器
  • 发光二极体
  • 成像与光电子学
  • 其他的

第九章：欧洲 3D 堆迭市场分析 - 按最终用户

  • 消费性电子产品
  • 电信
  • 汽车
  • 製造业
  • 卫生保健
  • 其他的

第十章：欧洲 3D 堆迭市场 - 国家分析

  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 俄罗斯
    • 欧洲其他地区

第 11 章：竞争格局

  • 关键参与者的热图分析
  • 公司定位与集中度

第 12 章：产业格局

  • 概述
  • 市场倡议
  • 产品开发

第十三章：公司简介

  • Taiwan Semiconductor Manufacturing Co Ltd
  • Samsung Electronics Co Ltd
  • Intel Corp
  • MediaTek Inc
  • Texas Instruments Inc
  • Amkor Technology Inc
  • ASE Technology Holding Co Ltd
  • Advanced Micro Devices Inc
  • 3M Co
  • Globalfoundries Inc

第 14 章：附录

Product Code: BMIRE00031568

The Europe 3D stacking market was valued at US$ 398.61 million in 2023 and is expected to reach US$ 1,257.70 million by 2031; it is expected to record a CAGR of 15.4% from 2023 to 2031.

Increasing Use of Heterogeneous Integration and Component Optimization Drives Europe 3D Stacking Market

The increasing use of heterogeneous integration and component optimization to improve the manufacturing of electronic components is a major factor driving the 3D stacking market. This approach allows for the stacking of dies on a substrate, creating chips in packages that are smaller and more energy-efficient. 3D stacking technology allows heterogeneous integration by allowing circuit layers to be created using various methods and wafer types. This tremendous flexibility allows manufacturers to significantly optimize individual components when compared to single-wafer production. This supports manufacturers in designing electrical components that meet specific requirements with precision and customization, which was previously unattainable. Heterogeneous integration and component optimization involve integrating diverse technologies into a composite device, which might include stacking of chips and packages; using multiple semiconductor materials; and employing various electrical routing techniques such as ball grid arrays, through-silicon vias (TSVs), interposers, and wire bonding.

Europe 3D Stacking Market Overview

Chips are critical for a wide range of technological and digital products, such as household appliances, smart cars, and consumer electronics. The EU Chips Act aims to boost the ecosystem for semiconductors in Europe. The act supports the target to promote competition between the semiconductor industry in Europe with companies from APAC and North America. The semiconductor industry in the region needs to upscale and become more innovative to gain a competitive edge. Also, governments of various countries in the region are investing in research and development in semiconductors. For instance, in February 2024, the Semiconductor Joint Undertaking (Chips JU) announced the launch of US$ 216 million in calls for proposals to support innovation and research initiatives in the fields of semiconductors. 3D stacking technology is widely utilized in semiconductor and memory manufacturing. 3D hybrid bonding represents a significant advancement in semiconductor technology, providing substantial benefits in terms of electrical performance, mechanical strength, design flexibility, and space efficiency. Europe is experiencing a high penetration rate of electronic devices, including laptops, smartphones, and other wearable devices. A majority portion of the population in European countries owns and uses these devices. The need for smartphones and laptops continues to rise as people increasingly rely on technology for multiple tasks. Laptops are primarily used to access the internet, engage in online activities, and perform daily tasks. Numerous market players in Europe are increasing the production of these devices. Acer launched a new Acer Aspire 5 laptop, powered by a 13th-generation Intel Core processor, in January 2023. The processor is paired with Nvidia GeForce RTX 2050 graphics to boost the productivity of tasks such as video editing or other tasks that can benefit from the extra GPU power. In February 2022, Nokia launched the G11 and G21 smartphones in Europe. 3D stacked memory is used to meet the high capacity and performance requirements of modern mobile devices. Smartwatches, fitness trackers, and other wearables benefit from 3D stacking by integrating multiple functionalities in a compact form factor, including sensors, processors, and memory. Therefore, the demand for 3D stacking is increasing in the region, with the presence of a growing electronic industry.

Europe 3D Stacking Market Revenue and Forecast to 2031 (US$ Million)

Europe 3D Stacking Market Segmentation

The Europe 3D stacking market is categorized into interconnecting technology, device type, end user, and country.

Based on interconnecting technology, the Europe 3D stacking market is segmented into through-silicon via, monolithic 3D integration, and 3D hybrid bonding. The through-silicon via segment held the largest market share in 2023.

By device type, the Europe 3D stacking market is segmented into memory devices, mems/sensors, LEDs, imaging & optoelectronics, and others. The memory devices segment held the largest market share in 2023.

In the terms of end user, the Europe 3D stacking market is segmented into consumer electronics, telecommunication, automotive, manufacturing, healthcare, and others. The consumer electronics segment held the largest market share in 2023.

By country, the Europe 3D stacking market is segmented into the UK, Germany, France, Italy, Russia, and the Rest of Europe. Germany dominated the Europe 3D stacking market share in 2023.

Taiwan Semiconductor Manufacturing Co Ltd; Samsung Electronics Co Ltd; Intel Corp; MediaTek Inc.; Texas Instruments Inc; Amkor Technology Inc; ASE Technology Holding Co Ltd; Advanced Micro Devices Inc.; 3M Co.; and Globalfoundries Inc are some of the leading companies operating in the Europe 3D stacking market.

Table Of Contents

1. Introduction

  • 1.1 The Insight Partners Research Report Guidance
  • 1.2 Market Segmentation

2. Executive Summary

  • 2.1 Key Insights
  • 2.2 Market Attractiveness

3. Research Methodology

  • 3.1 Secondary Research
  • 3.2 Primary Research
    • 3.2.1 Hypothesis formulation:
    • 3.2.2 Macro-economic factor analysis:
    • 3.2.3 Developing base number:
    • 3.2.4 Data Triangulation:
    • 3.2.5 Country level data:

4. 3D Stacking Market Landscape

  • 4.1 Overview
  • 4.2 PEST Analysis
  • 4.3 Ecosystem Analysis
    • 4.3.1 List of Vendors in the Value Chain

5. Europe 3D Stacking Market - Key Market Dynamics

  • 5.1 3D Stacking Market - Key Market Dynamics
  • 5.2 Market Drivers
    • 5.2.1 Rising Demand for Consumer Electronics
    • 5.2.2 Increasing Use of Heterogeneous Integration and Component Optimization
  • 5.3 Market Restraints
    • 5.3.1 Complexity Associated with 3D Stacking Technology
  • 5.4 Market Opportunities
    • 5.4.1 Surge in Demand for High-Bandwidth Memory
  • 5.5 Future Trends
    • 5.5.1 Fast Processors for Gaming Purposes
  • 5.6 Impact of Drivers and Restraints:

6. 3D Stacking Market - Europe Analysis

  • 6.1 Europe 3D Stacking Market Overview-
  • 6.2 Europe 3D Stacking Market Revenue (US$ Million), 2021-2031
  • 6.3 Europe 3D Stacking Market Forecast Analysis

7. Europe 3D Stacking Market Analysis - by Interconnecting Technology

  • 7.1 Through-Silicon Via
    • 7.1.1 Overview
    • 7.1.2 Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 7.2 Monolithic 3D Integration
    • 7.2.1 Overview
    • 7.2.2 Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 7.3 3D Hybrid Bonding
    • 7.3.1 Overview
    • 7.3.2 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

8. Europe 3D Stacking Market Analysis - by Device Type

  • 8.1 Memory Devices
    • 8.1.1 Overview
    • 8.1.2 Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.2 MEMS/Sensors
    • 8.2.1 Overview
    • 8.2.2 MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.3 LEDs
    • 8.3.1 Overview
    • 8.3.2 LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.4 Imaging and Optoelectronics
    • 8.4.1 Overview
    • 8.4.2 Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.5 Others
    • 8.5.1 Overview
    • 8.5.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

9. Europe 3D Stacking Market Analysis - by End User

  • 9.1 Consumer Electronics
    • 9.1.1 Overview
    • 9.1.2 Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.2 Telecommunication
    • 9.2.1 Overview
    • 9.2.2 Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.3 Automotive
    • 9.3.1 Overview
    • 9.3.2 Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.4 Manufacturing
    • 9.4.1 Overview
    • 9.4.2 Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.5 Healthcare
    • 9.5.1 Overview
    • 9.5.2 Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.6 Others
    • 9.6.1 Overview
    • 9.6.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

10. Europe 3D Stacking Market -Country Analysis

  • 10.1 Europe
    • 10.1.1 Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
    • 10.1.2 Europe: 3D Stacking Market - Revenue and Forecast Analysis - by Country
      • 10.1.2.1 Europe: 3D Stacking Market - Revenue and Forecast Analysis - by Country
      • 10.1.2.2 United Kingdom: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.2.1 United Kingdom: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.2.2 United Kingdom: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.2.3 United Kingdom: 3D Stacking Market Breakdown, by End User
      • 10.1.2.3 Germany: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.3.1 Germany: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.3.2 Germany: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.3.3 Germany: 3D Stacking Market Breakdown, by End User
      • 10.1.2.4 France: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.4.1 France: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.4.2 France: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.4.3 France: 3D Stacking Market Breakdown, by End User
      • 10.1.2.5 Italy: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.5.1 Italy: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.5.2 Italy: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.5.3 Italy: 3D Stacking Market Breakdown, by End User
      • 10.1.2.6 Russia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.6.1 Russia: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.6.2 Russia: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.6.3 Russia: 3D Stacking Market Breakdown, by End User
      • 10.1.2.7 Rest of Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.7.1 Rest of Europe: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.7.2 Rest of Europe: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.7.3 Rest of Europe: 3D Stacking Market Breakdown, by End User

11. Competitive Landscape

  • 11.1 Heat Map Analysis by Key Players
  • 11.2 Company Positioning & Concentration

12. Industry Landscape

  • 12.1 Overview
  • 12.2 Market Initiative
  • 12.3 Product Development

13. Company Profiles

  • 13.1 Taiwan Semiconductor Manufacturing Co Ltd
    • 13.1.1 Key Facts
    • 13.1.2 Business Description
    • 13.1.3 Products and Services
    • 13.1.4 Financial Overview
    • 13.1.5 SWOT Analysis
    • 13.1.6 Key Developments
  • 13.2 Samsung Electronics Co Ltd
    • 13.2.1 Key Facts
    • 13.2.2 Business Description
    • 13.2.3 Products and Services
    • 13.2.4 Financial Overview
    • 13.2.5 SWOT Analysis
    • 13.2.6 Key Developments
  • 13.3 Intel Corp
    • 13.3.1 Key Facts
    • 13.3.2 Business Description
    • 13.3.3 Products and Services
    • 13.3.4 Financial Overview
    • 13.3.5 SWOT Analysis
    • 13.3.6 Key Developments
  • 13.4 MediaTek Inc
    • 13.4.1 Key Facts
    • 13.4.2 Business Description
    • 13.4.3 Products and Services
    • 13.4.4 Financial Overview
    • 13.4.5 SWOT Analysis
    • 13.4.6 Key Developments
  • 13.5 Texas Instruments Inc
    • 13.5.1 Key Facts
    • 13.5.2 Business Description
    • 13.5.3 Products and Services
    • 13.5.4 Financial Overview
    • 13.5.5 SWOT Analysis
    • 13.5.6 Key Developments
  • 13.6 Amkor Technology Inc
    • 13.6.1 Key Facts
    • 13.6.2 Business Description
    • 13.6.3 Products and Services
    • 13.6.4 Financial Overview
    • 13.6.5 SWOT Analysis
    • 13.6.6 Key Developments
  • 13.7 ASE Technology Holding Co Ltd
    • 13.7.1 Key Facts
    • 13.7.2 Business Description
    • 13.7.3 Products and Services
    • 13.7.4 Financial Overview
    • 13.7.5 SWOT Analysis
    • 13.7.6 Key Developments
  • 13.8 Advanced Micro Devices Inc
    • 13.8.1 Key Facts
    • 13.8.2 Business Description
    • 13.8.3 Products and Services
    • 13.8.4 Financial Overview
    • 13.8.5 SWOT Analysis
    • 13.8.6 Key Developments
  • 13.9 3M Co
    • 13.9.1 Key Facts
    • 13.9.2 Business Description
    • 13.9.3 Products and Services
    • 13.9.4 Financial Overview
    • 13.9.5 SWOT Analysis
    • 13.9.6 Key Developments
  • 13.10 Globalfoundries Inc
    • 13.10.1 Key Facts
    • 13.10.2 Business Description
    • 13.10.3 Products and Services
    • 13.10.4 Financial Overview
    • 13.10.5 SWOT Analysis
    • 13.10.6 Key Developments

14. Appendix

  • 14.1 About The Insight Partners
  • 14.2 Word Index

List Of Tables

  • Table 1. 3D Stacking Market Segmentation
  • Table 2. List of Vendors
  • Table 3. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Table 4. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 5. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 6. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 7. Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Country
  • Table 8. United Kingdom: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 9. United Kingdom: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 10. United Kingdom: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 11. Germany: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 12. Germany: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 13. Germany: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 14. France: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 15. France: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 16. France: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 17. Italy: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 18. Italy: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 19. Italy: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 20. Russia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 21. Russia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 22. Russia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 23. Rest of Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 24. Rest of Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 25. Rest of Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 26. List of Abbreviation

List Of Figures

  • Figure 1. 3D Stacking Market Segmentation, by Country
  • Figure 2. PEST Analysis
  • Figure 3. Impact Analysis of Drivers and Restraints
  • Figure 4. 3D Stacking Market Revenue (US$ Million), 2021-2031
  • Figure 5. 3D Stacking Market Share (%) - by Interconnecting Technology (2023 and 2031)
  • Figure 6. Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 7. Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 8. 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 9. 3D Stacking Market Share (%) - by Device Type (2023 and 2031)
  • Figure 10. Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 11. MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 12. LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 13. Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 14. Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 15. 3D Stacking Market Share (%) - by End User (2023 and 2031)
  • Figure 16. Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 17. Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 18. Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 19. Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 20. Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 21. Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 22. Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 23. Europe: 3D Stacking Market Breakdown, by Key Countries, 2023 and 2031 (%)
  • Figure 24. United Kingdom: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 25. Germany: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 26. France: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 27. Italy: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 28. Russia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 29. Rest of Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 30. Heat Map Analysis by Key Players
  • Figure 31. Company Positioning & Concentration