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市场调查报告书
商品编码
1965365

被动式和互连式电子元件市场－全球产业规模、份额、趋势、机会、预测：按类型、应用、地区和竞争格局划分，2021-2031年

Passive & Interconnecting Electronic Components Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Type, By Application, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 182 Pages | 商品交期: 2-3个工作天内

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简介目录

全球被动和连接电子元件市场预计将从 2025 年的 1967.2 亿美元增长到 2031 年的 2,745.1 亿美元，复合年增长率为 5.71%。

这些元件是电路的基本硬体；电阻器和电容器等被动元件无需外部电源即可控制讯号，而印刷基板和连接器等互连元件则连接各种系统元素。推动成长的关键因素包括电动车产量增加、工业自动化普及以及先进通讯基础设施的发展。正如电子元件工业协会 (ECIA) 指出，全球排名前 50 名的授权分销商在 2024 年实现了总合% 的销售额增长，这主要得益于亚洲市场的强劲增长势头。

市场概览
预测期 2027-2031
市场规模：2025年 1967.2亿美元
市场规模：2031年 2745.1亿美元
复合年增长率：2026-2031年 5.71%
成长最快的细分市场 医疗保健
最大的市场 亚太地区

儘管市场呈现上升趋势，但由于地缘政治贸易分歧导致全球供应链持续波动，市场仍面临许多重大障碍。这些波动造成了关键原料供应和物流路线的不确定性，进而导致生产成本不稳定。这种不稳定性会扰乱生产计划，限制各行业充分利用不断增长的需求的能力。因此，供应链的复杂性成为市场进一步扩张的持续障碍，阻碍了相关人员充分发挥当前产业和技术趋势所带来的潜力。

市场驱动因素

电动车和自动驾驶汽车的激增正成为被动式和连接式电子元件市场的主要驱动力，催生了对能够承受高电压和热应力的高可靠性硬体的需求。现代电动驱动系统显着增加了对多层陶瓷电容器和功率电阻器的需求，以高效管理车载充电器和电池系统。根据国际能源总署（IEA）于2024年4月发布的《2024年全球电动车展望》，2023年电动车销量将达到约1,400万辆，引发了对汽车级零件需求的激增。汽车产业的这项转型正在直接强化零件生态系统，IPC数据显示，2024年8月北美印刷基板总出货量年增35%，也印证了这一点。

同时，5G通讯基础设施的部署显着增加了对高频互连和高频被动元件的需求。小型基地台和高密度天线阵列的部署需要小型化的滤波器和电感器，以便在不增加基地台尺寸的情况下，在更宽的频宽内保持讯号完整性。为了满足消费者对网路连接的需求，这项基础设施正在迅速扩展。根据爱立信2024年6月发布的《行动报告》，光是2024年第一季，全球服务供应商就新增了1.6亿5G用户，这推动了对网路密度所需的专用连接器和被动元件的持续采购。

市场挑战

地缘政治贸易分散化导致全球供应链持续波动，这是全球被动和互连电子元件市场成长的主要障碍。这种碎片化正在扰乱现有的物流网络，并破坏成品互连件和关键原材料的供应。随着关税和贸易壁垒的增加，製造商面临采购成本大幅上升和前置作业时间延长的双重压力，导致定价模式不稳定，关键生产计划延迟。因此，供应商难以维持满足工业自动化和电动车产业日益增长的需求所需的产量，被迫缩减潜在市场份额。

此次衝击的严重性已在近期整个产业的商业风险评估中得到体现。根据IPC 2024年8月的数据，44%的电子产品製造商表示「非常担忧」或「极度担忧」关税和贸易政策对其营运的影响。这项数据凸显了地缘政治不稳定如何迫使企业将重点放在风险规避而非扩大产能上。这些贸易趋势为製造业生态系统带来了巨大的不确定性，直接限制了该行业掌握需求成长机会的能力，并有效地减缓了整体市场成长动能。

市场趋势

在高效能运算丛集和人工智慧加速器对更高密度需求的推动下，元件尺寸缩小至极小体积的趋势正在加速发展。随着资料中心架构不断演进以应对海量处理负载，製造商正在扩大超小型多层陶瓷电容器（MLCC）的生产，电容器能够在不占用过多基板空间的情况下实现高容量。这种向高密度被动元件的结构性转变也反映在主要供应商的收入结构中。根据《朝鲜日报》2025年11月发表的题为《AI伺服器和电动汽车需求驱动MLCC超级週期》的报导报道，三星电子机械公司报告称，其用于AI伺服器的MLCC销售占比将从2023年的3%增长到2024年的9%，这凸显了行业向更小、更高附加值元件的转型。

同时，随着我们适应循环经济原则和全球脱碳需求，环保永续材料成分的转型正在重新定义製造业的优先事项。供应商正逐步重新设计产品线，利用回收材料和生物基聚合物，同时提高组件效率，以减少终端用户营运中的碳足迹。这种对环境管理的承诺正在显着减少温室气体排放。例如，根据TDK公司于2025年8月发布的《2025年永续发展报告》，该公司产品在截至2025年3月的财年中减少了703.8万吨二氧化碳排放，比上年度增加了35.2%。这显示环保电子解决方案的影响力日益增强。

目录

第一章概述

第二章：调查方法

第三章执行摘要

第四章：客户心声

第五章：全球被动和互连电子元件市场展望

  • 市场规模及预测
    • 按金额
  • 市占率及预测
    • 依类型（被动元件、连接元件）
    • 依应用领域（家用电子电器、汽车、医疗、IT/电信、工业、航太/国防）
    • 按地区
    • 按公司（2025 年）
  • 市场地图

第六章：北美被动和互连电子元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 北美洲：国别分析
    • 我们
    • 加拿大
    • 墨西哥

第七章：欧洲被动和互连电子元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 欧洲：国别分析
    • 德国
    • 法国
    • 英国
    • 义大利
    • 西班牙

第八章：亚太地区被动及互连电子元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 亚太地区：国别分析
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲

第九章：中东和非洲被动及互连电子元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 中东与非洲：国别分析
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 南非

第十章：南美被动及互连电子元件市场展望

  • 市场规模及预测
  • 市占率及预测
  • 南美洲：国别分析
    • 巴西
    • 哥伦比亚
    • 阿根廷

第十一章 市场动态

  • 促进因素
  • 任务

第十二章 市场趋势与发展

  • 併购
  • 产品发布
  • 近期趋势

第十三章 全球被动及互连电子元件市场：SWOT分析

第十四章：波特五力分析

  • 产业竞争
  • 新进入者的潜力
  • 供应商的议价能力
  • 顾客权力
  • 替代品的威胁

第十五章 竞争格局

  • Murata Manufacturing Co., Ltd.
  • TDK Corporation
  • Yageo Corporation
  • Vishay Intertechnology, Inc.
  • KYOCERA AVX Components Corporation
  • TE Connectivity Ltd.
  • Panasonic Corporation
  • Samsung Electronics Co., Ltd.
  • Littelfuse, Inc.
  • Rohm Co. Ltd

第十六章 策略建议

第十七章：关于研究公司及免责声明

简介目录
Product Code: 24518

The Global Passive & Interconnecting Electronic Components Market is projected to expand from USD 196.72 Billion in 2025 to USD 274.51 Billion by 2031, reflecting a compound annual growth rate of 5.71%. These components serve as the fundamental hardware for electrical circuits, with passive devices like resistors and capacitors regulating signals independent of external power, while interconnects such as printed circuit boards and connectors bridge various system elements. Growth is largely underpinned by the rising production of electric vehicles, the widespread adoption of industrial automation, and the development of advanced telecommunications infrastructure. As noted by the Electronic Components Industry Association (ECIA), the top 50 global authorized distributors realized a collective sales increase of 4.8 percent in 2024, a performance significantly bolstered by strong market activity in Asia.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 196.72 Billion
Market Size 2031USD 274.51 Billion
CAGR 2026-20315.71%
Fastest Growing SegmentHealthcare
Largest MarketAsia Pacific

Despite this upward trajectory, the market faces substantial obstacles stemming from ongoing global supply chain volatility triggered by geopolitical trade fragmentation. These disruptions introduce uncertainty regarding the availability of essential raw materials and logistical routes, resulting in unstable production costs. Such instability can disrupt manufacturing timelines and limit the industry's capacity to fully leverage growing demand. Consequently, these supply chain complications present a persistent barrier to broader market expansion, preventing stakeholders from maximizing the potential offered by current industrial and technological trends.

Market Driver

The surge in electric and autonomous vehicles serves as a primary driver for the passive and interconnecting electronic components market, creating a need for highly reliable hardware that can withstand elevated voltages and thermal stress. Modern electric drivetrains demand a significantly higher volume of multilayer ceramic capacitors and power resistors to efficiently manage on-board chargers and battery systems. According to the International Energy Agency's 'Global EV Outlook 2024' released in April 2024, electric car sales reached approximately 14 million units in 2023, triggering a spike in demand for automotive-grade components. This shift in the automotive sector directly bolsters the component ecosystem, a trend highlighted by IPC data showing that total North American printed circuit board shipments rose by 35 percent in August 2024 compared to the same month the prior year.

Simultaneously, the rollout of 5G telecommunications infrastructure is generating substantial demand for radio frequency interconnects and high-frequency passive devices. The installation of small cells and dense antenna arrays requires miniaturized filters and inductors that maintain signal integrity across broader bandwidths without expanding the physical size of base stations. This infrastructure development is expanding rapidly to satisfy consumer connectivity requirements. As reported in the June 2024 'Ericsson Mobility Report', service providers added 160 million 5G subscriptions globally in the first quarter of 2024 alone, driving the ongoing acquisition of specialized connectors and passive elements necessary for network densification.

Market Challenge

Persistent volatility within the global supply chain, fueled by geopolitical trade fragmentation, stands as a primary impediment to the growth of the Global Passive & Interconnecting Electronic Components Market. This fragmentation disrupts established logistical networks, leading to irregular availability of finished interconnects and essential raw materials. As tariffs and trade barriers increase, manufacturers face sudden escalations in procurement costs and prolonged lead times, which destabilize pricing models and delay crucial production schedules. Consequently, suppliers often struggle to sustain the output levels required to meet the escalating demands of the industrial automation and electric vehicle sectors, forcing a reduction in potential market throughput.

The severity of these disruptions is reflected in recent industry assessments of operational risk. According to IPC data from August 2024, 44 percent of electronics manufacturers expressed being very or extremely concerned regarding the effects of tariffs and trade policies on their business operations. This statistic highlights how geopolitical instability compels companies to focus on risk mitigation rather than capacity expansion. By injecting substantial unpredictability into the manufacturing ecosystem, these trade dynamics directly constrain the industry's ability to take advantage of rising demand, effectively slowing overall market momentum.

Market Trends

The trend toward miniaturizing component footprints to ultra-small case sizes is accelerating, propelled by the increasing density demands of high-performance computing clusters and artificial intelligence accelerators. As data center architectures advance to manage immense processing workloads, manufacturers are ramping up production of ultra-compact multilayer ceramic capacitors that provide high capacitance without occupying excessive board space. This structural pivot toward high-density passive components is reflected in the revenue composition of key suppliers; according to a November 2025 Chosun article titled 'AI server and EV demand drives MLCC supercycle', Samsung Electro-Mechanics noted that the portion of its MLCC sales attributed to AI servers grew from 3 percent in 2023 to 9 percent in 2024, emphasizing the industry's shift toward miniaturized, high-value components.

Simultaneously, the transition toward eco-friendly and sustainable material compositions is redefining manufacturing priorities as the industry adapts to circular economy principles and global decarbonization mandates. Suppliers are progressively re-engineering their product lines to utilize recycled materials and bio-based polymers, while also enhancing component efficiency to reduce operational carbon footprints for end-users. This dedication to environmental stewardship is producing tangible reductions in greenhouse gas emissions. For instance, TDK Corporation's 'Sustainability Report 2025', released in August 2025, revealed that the CO2 reduction contribution from its products totaled 7.038 million tons for the fiscal year ending March 2025, a 35.2 percent increase over the prior year, highlighting the expanding impact of eco-efficient electronic solutions.

Key Market Players

  • Murata Manufacturing Co., Ltd.
  • TDK Corporation
  • Yageo Corporation
  • Vishay Intertechnology, Inc.
  • KYOCERA AVX Components Corporation
  • TE Connectivity Ltd.
  • Panasonic Corporation
  • Samsung Electronics Co., Ltd.
  • Littelfuse, Inc.
  • Rohm Co. Ltd

Report Scope

In this report, the Global Passive & Interconnecting Electronic Components Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Passive & Interconnecting Electronic Components Market, By Type

  • Passive
  • Interconnecting

Passive & Interconnecting Electronic Components Market, By Application

  • Consumer Electronics
  • Automotive
  • Healthcare
  • IT & Telecom
  • Industrial
  • Aerospace & defense

Passive & Interconnecting Electronic Components Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Passive & Interconnecting Electronic Components Market.

Available Customizations:

Global Passive & Interconnecting Electronic Components Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Passive & Interconnecting Electronic Components Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Type (Passive, Interconnecting)
    • 5.2.2. By Application (Consumer Electronics, Automotive, Healthcare, IT & Telecom, Industrial, Aerospace & defense)
    • 5.2.3. By Region
    • 5.2.4. By Company (2025)
  • 5.3. Market Map

6. North America Passive & Interconnecting Electronic Components Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Type
    • 6.2.2. By Application
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Passive & Interconnecting Electronic Components Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Type
        • 6.3.1.2.2. By Application
    • 6.3.2. Canada Passive & Interconnecting Electronic Components Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Type
        • 6.3.2.2.2. By Application
    • 6.3.3. Mexico Passive & Interconnecting Electronic Components Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Type
        • 6.3.3.2.2. By Application

7. Europe Passive & Interconnecting Electronic Components Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Type
    • 7.2.2. By Application
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Passive & Interconnecting Electronic Components Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Type
        • 7.3.1.2.2. By Application
    • 7.3.2. France Passive & Interconnecting Electronic Components Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Type
        • 7.3.2.2.2. By Application
    • 7.3.3. United Kingdom Passive & Interconnecting Electronic Components Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Type
        • 7.3.3.2.2. By Application
    • 7.3.4. Italy Passive & Interconnecting Electronic Components Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Type
        • 7.3.4.2.2. By Application
    • 7.3.5. Spain Passive & Interconnecting Electronic Components Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Type
        • 7.3.5.2.2. By Application

8. Asia Pacific Passive & Interconnecting Electronic Components Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Type
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Passive & Interconnecting Electronic Components Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Type
        • 8.3.1.2.2. By Application
    • 8.3.2. India Passive & Interconnecting Electronic Components Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Type
        • 8.3.2.2.2. By Application
    • 8.3.3. Japan Passive & Interconnecting Electronic Components Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Type
        • 8.3.3.2.2. By Application
    • 8.3.4. South Korea Passive & Interconnecting Electronic Components Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Type
        • 8.3.4.2.2. By Application
    • 8.3.5. Australia Passive & Interconnecting Electronic Components Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Type
        • 8.3.5.2.2. By Application

9. Middle East & Africa Passive & Interconnecting Electronic Components Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Type
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Passive & Interconnecting Electronic Components Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Type
        • 9.3.1.2.2. By Application
    • 9.3.2. UAE Passive & Interconnecting Electronic Components Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Type
        • 9.3.2.2.2. By Application
    • 9.3.3. South Africa Passive & Interconnecting Electronic Components Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Type
        • 9.3.3.2.2. By Application

10. South America Passive & Interconnecting Electronic Components Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Type
    • 10.2.2. By Application
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Passive & Interconnecting Electronic Components Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Type
        • 10.3.1.2.2. By Application
    • 10.3.2. Colombia Passive & Interconnecting Electronic Components Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Type
        • 10.3.2.2.2. By Application
    • 10.3.3. Argentina Passive & Interconnecting Electronic Components Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Type
        • 10.3.3.2.2. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Passive & Interconnecting Electronic Components Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Murata Manufacturing Co., Ltd.
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. TDK Corporation
  • 15.3. Yageo Corporation
  • 15.4. Vishay Intertechnology, Inc.
  • 15.5. KYOCERA AVX Components Corporation
  • 15.6. TE Connectivity Ltd.
  • 15.7. Panasonic Corporation
  • 15.8. Samsung Electronics Co., Ltd.
  • 15.9. Littelfuse, Inc.
  • 15.10. Rohm Co. Ltd

16. Strategic Recommendations

17. About Us & Disclaimer