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市场调查报告书
商品编码
1626573

全球先进封装技术市场规模（按类型、垂直产业、区域范围和预测）

Global Advanced Packaging Technologies Market Size By Type (3D Integrated Circuit, 2D Integrated Circuit), By Industrial Vertical (Automotive And Transport, Consumer Electronics), By Geographic Scope And Forecast
出版日期: | 出版商: Verified Market Research | 英文 202 Pages | 商品交期: 2-3个工作天内

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简介目录

先进封装技术的市场规模及预测

2020 年先进封装技术市场规模为 42.4 亿美元，预计到 2028 年将达到 92.8 亿美元，2021 年至 2028 年的复合年增长率为 10.29%。

先进封装技术市场正在经历显着成长，因为它们比传统封装方法更有效率、功耗更低，并且根据电子设备的尺寸有充足的要求。物联网的快速发展以及下一代行动晶片组对先进晶圆封装技术日益增长的需求正在推动先进封装技术市场的发展。此外，技术进步和研发活动的投资增加预计将推动市场成长。全球先进封装技术市场报告对市场进行了全面的评估。它对关键细分市场、趋势、市场推动因素、阻碍因素、竞争格局以及在市场中发挥关键作用的因素进行了全面分析。

先进封装技术的全球市场定义

先进封装是传统电子封装之前的元件的组合和互连。先进的封装允许整合多个设备（电气、机械和半导体）并将它们封装为单一电子设备。与传统电子封装不同，先进封装利用半导体製造设施的製程和技术。先进封装技术是2.5D、3D-IC、晶圆级封装等多种技术的结合。将积体电路封装在外壳中有助于保护金属零件免受腐蚀和物理损坏。

所采用的封装技术取决于功耗、操作条件、可测量尺寸和成本等各种参数。这些技术广泛应用于工业和汽车领域。先进封装改变了半导体的生产方式并带来了晶片设计的新范式。由于采用电子设计自动化程序的增多，代工厂越来越多地受益于先进封装流程的自动化。先进封装的开发是为了满足各种要求，包括功率耗散、现场操作，以及最重要的成本。

各种消费性电子产品对高性能半导体的需求正在推动先进封装技术市场的成长。这促使智慧型手机和其他行动装置中使用的半导体的 3D 和 2.5D 封装的需求增加。下一代半导体平台的采用正在加速先进封装技术的使用。各大半导体封装公司在过去几年开发了许多创新的系统级晶片设计。得益于整合晶片製造节点的新型异质整合技术，晶片製造商能够提出新的设计。

先进封装技术全球市场概览

先进封装技术市场正在经历显着成长，因为它比传统封装方法更有效率、功耗更低、能够满足电子设备的尺寸要求。2.5D 和 3D 玻璃以及硅中介层等先进封装晶片技术不断推动晶片封装技术的发展，以满足尺寸、功耗、产量和成本的行业标准。对于前端代工厂和后端封装供应商来说，这些将晶片粘合併整合到最终组装中的新颖而独特的步骤在沉积、蚀刻、光刻、检查、分割和清洁方面带来了新的课题。

物联网的快速发展以及下一代行动晶片组对先进晶圆封装技术日益增长的需求正在推动先进封装技术市场的发展。此外，技术进步和研发活动的投资增加预计将推动市场成长。人工智慧在工业自动化领域的应用日益广泛，可能会刺激对采用先进封装製造的高阶晶片的需求。光刻製造技术在先进封装技术市场中越来越受欢迎。

此外，异质整合解决方案在包装服务提供者中正在迅速发展。先进封装技术市场受到新兴市场中快速扩张的逻辑晶片产业所推动。近年来，晶圆製造服务供应商一直努力扩大其产品范围，以满足国际知名半导体製造商的需求。然而，设备发热问题日益严重以及缺乏标准化是限制市场成长的主要因素之一，并可能在未来继续阻碍先进封装技术市场的扩张。

此外，新兴经济体对高性能设备的需求不断增加、扇出型晶圆级封装市场发展趋势不断上升以及新兴经济体包装食品产业的扩张，可能会在 2021-2028 年的预测期内为先进封装技术市场提供新的机会。这将使先进封装解决方案供应商能够更好地提供创新的扇出型封装技术。此外，先进封装技术市场的主要参与者也在扩大半导体生产线。

目录

第 1 章：全球先进封装技术市场简介

  • 市场概况
  • 调查范围
  • 先决条件

第 2 章 执行摘要

第3章 VERIFIED MARKET RESEARCH研究方法

  • 数据挖掘
  • 验证
  • 一次资料
  • 数据源列表

第 4 章 先进封装技术全球市场展望

  • 概述
  • 市场动态
    • 促进因素
    • 阻碍因素
    • 机会
  • 波特的五力模型
  • 价值链分析

第5章 全球先进封装技术市场类型

  • 概述
  • 3D集成电路
  • 二维集成电路
  • 2.5D集成电路
  • 其他

第 6 章 全球先进封装技术市场（依垂直产业划分）

  • 概述
  • 汽车/运输设备
  • 消费类电子产品
  • 工业的
  • IT/通讯
  • 其他

第 7 章 全球先进封装技术市场（按地区）

  • 概述
  • 北美
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 日本
    • 印度
    • 亚太其他地区
  • 世界其他地区
    • 拉丁美洲
    • 中东/非洲

第8章全球先进封装技术市场竞争格局

  • 概述
  • 各公司市场排名
  • 主要发展策略

第9章 公司简介

  • Amkor Technology
  • STATS ChipPAC Pte. Ltd
  • Siliconware Precision Industries Co., Ltd.
  • SSS MicroTec AG
  • Jiangsu Changjiang Electronics Technology Co. Ltd
  • Intel Corporation
  • IBM Corporation
  • Qualcomm Technologies, Inc
  • Taiwan Semiconductor Manufacturing Company
  • ASE Group

第10章 附录

  • 相关研究
简介目录
Product Code: 26552

Advanced Packaging Technologies Market Size And Forecast

Advanced Packaging Technologies Market size was valued at USD 4.24 Billion in 2020 and is projected to reach USD 9.28 Billion by 2028, growing at a CAGR of 10.29% from 2021 to 2028.

The market for advanced packaging technologies is witnessing tremendous growth owing to its efficiency over the conventional packaging method, less power consumption, and satisfactory requirement as per the size of electronic devices. The growing need for advanced wafer packaging techniques for fast expanding IoT and next-generation mobile chipsets is driving the Advanced Packaging Technologies Market. Furthermore, advancement in technologies and increasing investments in R&D activities are expected to drive the growth of the market. The Global Advanced Packaging Technologies Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Advanced Packaging Technologies Market Definition

Advanced packaging is the combination and interconnection of components before traditional electronic packaging. Advanced packaging allows multiple devices (electrical, mechanical, or semiconductor) to be integrated and packaged as a single electronic device. Unlike traditional electronic packaging, advanced packaging makes use of semiconductor fabrication facilities' processes and techniques. Advanced Packaging Technologies is a combination of various techniques such as 2.5D, 3D-IC, wafer-level packaging, and many others. It facilitates the integrated circuits, to enclose in the case which prevents the corrosion of the metallic parts and physical damage.

The packaging techniques used rely on various parameters such as power consumption, operating conditions, measurable size, and cost. These technologies are widely used in the industrial and automotive sectors. Advanced packaging has changed semiconductor production methods and brought up a new paradigm in chip design. Foundries have benefited more and more from the automation of advanced packaging processes, which has been aided by increased electronic design automation programs. Advanced packaging is being developed to fulfill the various conditions of power dissipation, field operation, and, most importantly, cost.

The need for high-performance semiconductors in a variety of consumer electronics has fueled the growth of the Advanced Packaging Technologies Market. The demand for 3D and 2.5D packaging in semiconductors used in smartphones and other mobile devices has risen as a result. The adoption of next-generation semiconductor platforms is accelerating the use of advanced packaging techniques. Key semiconductor packaging companies have developed lots of new innovative system-level chip designs during the last few years. Chipmakers have been able to come up with new designs because of new heterogeneous integration techniques for merging nodes in chip manufacturing.

Global Advanced Packaging Technologies Market Overview

The market for advanced packaging technologies is witnessing tremendous growth owing to its efficiency over the conventional packaging method, less power consumption, and satisfactory requirement as per the size of electronic devices. With more advanced packaging chip technologies such as 2.5D and 3D glass and silicon interposers, chip packaging technology that fulfills industry standards for size, power, yield, and cost continues to evolve. For both front-end foundries and back-end packaging vendors, these novel and unique procedures to link and integrate chips into final assemblies create new challenges in deposition, etch, lithography, inspection, singulation, and clean.

The growing need for advanced wafer packaging techniques for fast expanding IoT and next-generation mobile chipsets is driving the Advanced Packaging Technologies Market. Furthermore, advancement in technologies and increasing investments in R&D activities are expected to drive the growth of the market. The rising use of artificial intelligence in industrial automation will boost demand for high-end chips made with advanced packaging. Lithography fabrication technologies have gained popularity in the Advanced Packaging Technologies Market.

Additionally, among packaging service providers, heterogeneous integration solutions are growing rapidly. The Advanced Packaging Technologies Market is being boosted by a rapidly increasing logic chip industry in developing regions. Wafer manufacturing service providers have worked diligently over the last several years to increase their product offerings and meet the demands of internationally recognized semiconductor manufacturers. However, an increase in the problem of device heating and a lack of standardization are among the primary factors restraining market growth and will continue to provide a hindrance to the expansion of the Advanced Packaging Technologies Market.

Furthermore, demand for high-performance devices has increased in developing nations, additionally, in the forecast period of 2021-2028, the rise in developing trends of fan-out wafer-level packaging, as well as the expansion in the packaged food sector in emerging economies, would provide new opportunities for the Advanced Packaging Technologies Market. This will make it much easier for advanced packaging solution providers to deliver innovative fan-out packaging technologies. Semiconductor lines are also being expanded by major players in the Advanced Packaging Technologies Markett.

Global Advanced Packaging Technologies Market Segmentation Analysis

The Global Advanced Packaging Technologies Market is Segmented on the basis of Type, Industrial Vertical, And Geography.

Advanced Packaging Technologies Market, By Type

  • 3D Integrated Circuit
  • 2D Integrated Circuit
  • 2.5D Integrated Circuit
  • Others

Based on Type, The market is classified into 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, and Others. Three-Dimensional Integrated Circuit (3DIC) is a packaging technique that collects and layers homogeneous or heterogeneous dies vertically into Multi-Chip-Module (MCM) with Through-Silicon-Via (TSV). It's a mono- or multi-functional integration platform. Two, four, or eight memories might be combined in a single package. CPU, GPU, DRAM, and main-broad may all be into one chip package in the future. 3DIC is a high-bandwidth, small-form-factor, multi-function integration solution.

Advanced Packaging Technologies Market, By Industrial Vertical

  • Automotive & Transport
  • Consumer Electronics
  • Industrial
  • IT & Telecommunication
  • Others

Based on Industrial Vertical, The market is classified into Automotive & Transport, Consumer Electronics, Industrial, IT & Telecommunication, and Others. FOWLP (fan-out wafer-level packaging) has emerged as a promising technology for meeting the ever-increasing needs of consumer electronics. Specific features such as substrate-less packaging, lower thermal resistance, and higher performance due to shorter interconnect combined with direct IC connection through the use of thin-film metallization instead of standard wire bonds or flip-chip bumps, as well as more moderate parasitic effects, are significant advantages of this type of packaging.

Advanced Packaging Technologies Market, By Geography

  • North America
  • Europe
  • Asia Pacific
  • Rest of the world
  • On the basis of Geography, The Global Advanced Packaging Technologies Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. In the Asia Pacific and North America, the global advanced packaging industry is producing significant revenue. A rapidly increasing semiconductor industry, particularly in the Asia Pacific, to meet a diverse range of customer demands for next-generation mobile devices. The IC industry has made tremendous progress in the region's key economies, raising income from the Asia Pacific Advanced Packaging Technologies Market.

Key Players

The "Global Advanced Packaging Technologies Market" study report will provide a valuable insight with an emphasis on global market including some of the major players such as Amkor Technology, STATS ChipPAC Pte. Ltd, ASE Group, Siliconware Precision Industries Co., Ltd., SSS MicroTec AG, Jiangsu Changjiang Electronics Technology Co. Ltd, Intel Corporation, IBM Corporation, Taiwan Semiconductor Manufacturing Company, Qualcomm Technologies, Inc.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight to the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share and market ranking analysis of the above-mentioned players globally.

Key Developments

  • On July 2020, Amkor Technology outlined its efforts and achievements in creating and qualifying wire bond and flip-chip packaging for devices made using TSMC's advanced low-k process technology. Amkor has also worked with a number of clients to qualify low-k products and anticipates a volume ramp-up for low-k packages.

TABLE OF CONTENTS

1 INTRODUCTION OF GLOBAL ADVANCED PACKAGING TECHNOLOGIES MARKET

  • 1.1 Overview of the Market
  • 1.2 Scope of Report
  • 1.3 Assumptions

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

  • 3.1 Data Mining
  • 3.2 Validation
  • 3.3 Primary Interviews
  • 3.4 List of Data Sources

4 GLOBAL ADVANCED PACKAGING TECHNOLOGIES MARKET OUTLOOK

  • 4.1 Overview
  • 4.2 Market Dynamics
    • 4.2.1 Drivers
    • 4.2.2 Restraints
    • 4.2.3 Opportunities
  • 4.3 Porters Five Force Model
  • 4.4 Value Chain Analysis

5 GLOBAL ADVANCED PACKAGING TECHNOLOGIES MARKET, BY TYPE

  • 5.1 Overview
  • 5.2 3D Integrated Circuit
  • 5.3 2D Integrated Circuit
  • 5.4 2.5D Integrated Circuit
  • 5.5 Others

6 GLOBAL ADVANCED PACKAGING TECHNOLOGIES MARKET, BY INDUSTRIAL VERTICAL

  • 6.1 Overview
  • 6.2 Automotive & Transport
  • 6.3 Consumer Electronics
  • 6.4 Industrial
  • 6.5 IT & Telecommunication
  • 6.6 Others

7 GLOBAL ADVANCED PACKAGING TECHNOLOGIES MARKET, BY GEOGRAPHY

  • 7.1 Overview
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
    • 7.2.3 Mexico
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 U.K.
    • 7.3.3 France
    • 7.3.4 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 Japan
    • 7.4.3 India
    • 7.4.4 Rest of Asia Pacific
  • 7.5 Rest of the World
    • 7.5.1 Latin America
    • 7.5.2 Middle East And Africa

8 GLOBAL ADVANCED PACKAGING TECHNOLOGIES MARKET COMPETITIVE LANDSCAPE

  • 8.1 Overview
  • 8.2 Company Market Ranking
  • 8.3 Key Development Strategies

9 COMPANY PROFILES

  • 9.1 Amkor Technology
    • 9.1.1 Overview
    • 9.1.2 Financial Performance
    • 9.1.3 Product Outlook
    • 9.1.4 Key Developments
  • 9.2 STATS ChipPAC Pte. Ltd
    • 9.2.1 Overview
    • 9.2.2 Financial Performance
    • 9.2.3 Product Outlook
    • 9.2.4 Key Developments
  • 9.3 Siliconware Precision Industries Co., Ltd.
    • 9.3.1 Overview
    • 9.3.2 Financial Performance
    • 9.3.3 Product Outlook
    • 9.3.4 Key Developments
  • 9.4 SSS MicroTec AG
    • 9.4.1 Overview
    • 9.4.2 Financial Performance
    • 9.4.3 Product Outlook
    • 9.4.4 Key Developments
  • 9.5 Jiangsu Changjiang Electronics Technology Co. Ltd
    • 9.5.1 Overview
    • 9.5.2 Financial Performance
    • 9.5.3 Product Outlook
    • 9.5.4 Key Developments
  • 9.6 Intel Corporation
    • 9.6.1 Overview
    • 9.6.2 Financial Performance
    • 9.6.3 Product Outlook
    • 9.6.4 Key Developments
  • 9.7 IBM Corporation
    • 9.7.1 Overview
    • 9.7.2 Financial Performance
    • 9.7.3 Product Outlook
    • 9.7.4 Key Developments
  • 9.8 Qualcomm Technologies, Inc
    • 9.8.1 Overview
    • 9.8.2 Financial Performance
    • 9.8.3 Product Outlook
    • 9.8.4 Key Developments
  • 9.9 Taiwan Semiconductor Manufacturing Company
    • 9.9.1 Overview
    • 9.9.2 Financial Performance
    • 9.9.3 Product Outlook
    • 9.9.4 Key Developments
  • 9.10 ASE Group
    • 9.10.1 Overview
    • 9.10.2 Financial Performance
    • 9.10.3 Product Outlook
    • 9.10.4 Key Developments

10 Appendix

  • 10.1 Related Research