市场调查报告书
商品编码
1442003
先进封装市场 - 按封装类型(倒装晶片、扇入晶圆级封装、嵌入式晶片、扇出、2.5 维/3 维)、按应用(消费电子、汽车、工业、医疗保健、A&D)和预测, 2024 - 2032Advanced Packaging Market - By Packaging Type (Flip-chip, Fan-in Wafer Level Packaging, Embedded-die, Fan-out, 2.5 Dimensional/3 Dimensional), By Application (Consumer Electronics, Automotive, Industrial, Healthcare, A&D) & Forecast, 2024 - 2032 |
由于越来越多的公司在领先的行业活动中推出,全球先进封装市场在 2024 年至 2032 年间的CAGR将超过 10%。这些活动为该公司提供了展示其最新包装技术创新的平台,包括先进材料、设计和製造流程。
例如,2024 年 2 月,领先的专用先进封装 (ASAP) 服务供应商 Sarcina Technology 宣布将在 Chiplet 峰会上推出其 WIPO 服务。 WIPO(晶圆输入、产品输出)简化了封装、测试和生产流程,降低了与维护专用硬体团队相关的成本。 WIPO涵盖晶圆凸点、封装设计、晶片组装和最终测试等各个阶段,成为半导体产业新兴的专用高级封装(ASAP)服务的基石。
这些创新着重于永续性、效率和产品保护,满足食品和饮料、医疗保健和电子等各行业不断变化的需求。随着公司竞相在竞争激烈的市场中保持领先地位,对先进封装解决方案的需求持续成长,推动市场成长和创新。
先进封装市场的整体份额根据封装类型、医疗保健和地区进行分类。
嵌入式晶片细分市场从 2024 年到 2032 年将经历重大发展。嵌入式晶片封装将半导体晶片直接整合到基板或封装中,为各种应用提供紧凑、高性能的解决方案。随着智慧型手机、物联网设备和汽车电子产品的激增,需要小型高效组件,嵌入式晶片封装成为关键解决方案。其优点包括提高效能、减少占地面积和增强热管理。随着各行业寻求优化电子设备的空间和功能,对嵌入式晶片封装解决方案的需求持续成长,推动市场扩张和创新。
2024年至2032年,医疗保健领域的先进封装市场规模将出现显着的CAGR。随着医疗设备变得更加复杂和紧凑,先进封装技术在确保可靠性、小型化和性能方面发挥着至关重要的作用。先进的封装解决方案可满足各种医疗保健应用的需求,包括植入式设备、诊断设备和药物传输系统。随着医疗电子产品精度和可靠性的关注,对先进封装的需求持续增长,推动创新和市场成长,以满足医疗保健行业不断变化的需求。
欧洲先进封装产业从 2024 年到 2032 年将呈现出值得称讚的CAGR。汽车、医疗保健和电子等众多行业都在寻求先进封装解决方案,欧洲提供了一个利润丰厚的市场机会。该地区对永续性和效率的重视进一步刺激了对先进封装技术的需求,这些技术可优化空间、提高性能并减少对环境的影响。
随着欧洲工业继续优先考虑创新,对先进包装解决方案的需求仍然强劲,推动了市场的成长和发展。例如,2023年12月,Amkor Technology计划在亚利桑那州皮奥里亚建造一座尖端封装和测试设施,投资约20亿美元,建成后将僱用约2,000名员工。 Amkor 预计将成为美国最大的外包先进封装厂,旨在增强美国的半导体供应链。
Global Advanced Packaging Market will witness over 10% CAGR between 2024 and 2032 as a result of rising company launches at leading industry events. These events serve as platforms for companies to showcase their latest innovations in packaging technology, including advanced materials, designs, and manufacturing processes.
For instance, in February 2024, Sarcina Technology, a leading provider of Application Specific Advanced Packaging (ASAP) Services, announced that it is set to introduce its WIPO service at the Chiplet Summit. WIPO, or wafer-in, product-out, streamlined packaging, testing, and production processes, reducing costs associated with maintaining dedicated hardware teams. WIPO encompassed various stages, including wafer bumping, package design, chip assembly, and final test, serving as the cornerstone for the emerging Application Specific Advanced Package (ASAP) Service in the semiconductor industry.
With a focus on sustainability, efficiency, and product protection, these innovations cater to the evolving needs of various sectors, such as food and beverage, healthcare, and electronics. As companies vie to stay ahead in a competitive market, the demand for advanced packaging solutions continues to rise, driving market growth and innovation.
The overall Advanced Packaging Market share is classified based on the packaging type, healthcare, and region.
Embedded-die segment will undergo significant development from 2024 to 2032. Embedded-die packaging integrates semiconductor chips directly into substrates or packages, offering compact, high-performance solutions for various applications. With the proliferation of smartphones, IoT devices, and automotive electronics requiring miniaturized and efficient components, embedded-die packaging emerges as a key solution. Its advantages include improved performance, reduced footprint, and enhanced thermal management. As industries seek to optimize space and functionality in electronic devices, the demand for embedded-die packaging solutions continues to grow, driving market expansion and innovation.
Advanced packaging market size from the healthcare segment will register a noteworthy CAGR from 2024 to 2032. As medical devices become more complex and compact, advanced packaging technologies play a crucial role in ensuring reliability, miniaturization, and performance. Advanced packaging solutions cater to the needs of various healthcare applications, including implantable devices, diagnostic equipment, and drug delivery systems. With a focus on precision and reliability in medical electronics, the demand for advanced packaging continues to rise, driving innovation and market growth to meet the evolving needs of the healthcare industry.
Europe advanced packaging industry will showcase a commendable CAGR from 2024 to 2032. With a diverse range of industries, including automotive, healthcare, and electronics, seeking advanced packaging solutions, Europe presents a lucrative market opportunity. The region's emphasis on sustainability and efficiency further fuels demand for advanced packaging technologies that optimize space, enhance performance and reduce environmental impact.
As European industries continue to prioritize innovation, the demand for advanced packaging solutions remains strong, driving market growth and development. For instance, in December 2023, Amkor Technology planned to build a cutting-edge packaging and testing facility in Peoria, Arizona, investing approximately US$2 billion and hiring about 2,000 employees upon completion. Expected to be the largest outsourced advanced packaging facility in the US, Amkor aimed to enhance America's semiconductor supply chain.